US20110230067A1 - Connector system having contact overlapping vias - Google Patents
Connector system having contact overlapping vias Download PDFInfo
- Publication number
- US20110230067A1 US20110230067A1 US12/728,879 US72887910A US2011230067A1 US 20110230067 A1 US20110230067 A1 US 20110230067A1 US 72887910 A US72887910 A US 72887910A US 2011230067 A1 US2011230067 A1 US 2011230067A1
- Authority
- US
- United States
- Prior art keywords
- electronic package
- contact
- connector assembly
- conductive
- interposer connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
Definitions
- the invention relates generally to connectors that electrically couple two or more other connectors or devices, and more specifically, to an interposer connector assembly.
- Interposer connectors may include a substrate with conductive contacts on both sides of a dielectric substrate. Conductive vias, or holes that are filled with a conductive material, extend through the substrate to electrically couple the contacts on opposite sides of the substrate. The contacts on each side of the substrate engage conductive members or terminals of different electronic packages, such as a processor and a circuit board, to electrically couple the electronic packages with each other.
- the density of the contacts and vias on each side of the substrate may increase.
- the contacts and vias may be located closer together.
- the data and/or power signals that are conveyed between the electronic packages using the contacts and vias may induce noise, crosstalk, and other electromagnetic interference on the data signals being carried by nearby or neighboring contacts and vias.
- an electronic connector system in one embodiment, includes an electronic package and an interposer connector assembly.
- the electronic package has a body with a conductive member disposed on a mating surface of the body.
- the conductive member is coupled with a conductive via that extends into the body and is oriented along a center axis.
- the interposer connector assembly includes a substrate with an elongated conductive pad mounted to the substrate and a contact joined to the conductive pad. The contact engages the conductive member when the electronic package mates with the interposer connector assembly such that the center axis extends through the contact.
- another electronic connector system in another embodiment, includes an electronic package and an interposer connector assembly.
- the electronic package has a body with a conductive member disposed on a mating surface of the body.
- the conductive member is coupled with a conductive via that extends into the body.
- the interposer connector assembly includes a substrate with a conductive pad mounted to the substrate and an elongated contact joined to the conductive pad.
- the contact has a footprint on the electronic package that is defined by a surface area on the mating surface of the electronic package over which the contact extends when the electronic package and the interposer connector assembly mate. At least a portion of the via is disposed within the footprint.
- FIG. 1 illustrates an electronic connector system having an interposer connector assembly formed in accordance with one embodiment.
- FIG. 2 is a perspective view of a contact of the interposer connector assembly shown in FIG. 1 in an uncompressed state in accordance with one embodiment.
- FIG. 3 is a perspective view the contact shown in FIG. 2 in a compressed state in accordance with one embodiment.
- FIG. 4 is a cross-sectional view of the portion of the interposer connector assembly shown in FIG. 2 taken along line 4 - 4 in FIG. 2 in accordance with one embodiment.
- FIG. 5 is a cross-sectional view of the portion of the interposer connector assembly shown in FIG. 3 taken along line 5 - 5 in FIG. 3 in accordance with one embodiment.
- FIG. 6 is a top view of the contact of the interposer connector assembly in accordance with one embodiment.
- FIG. 1 illustrates an electronic connector system 100 having an interposer connector assembly 102 formed in accordance with one embodiment.
- the interposer connector assembly 102 mates with and electrically interconnects first and second electronic packages 104 , 106 .
- the electronic packages 104 , 106 may be either circuit boards or electronic devices, such as land grid array (LGA) or ball grid array (BGA) devices.
- LGA or BGA devices may be a chip or module, such as, but not limited to, a central processing unit (CPU), microprocessor, or an application specific integrated circuit (ASIC), or the like.
- the interposer connector assembly 102 may be used to establish board-to-board, board-to-device, and/or device-to-device electrical connections.
- the interposer connector assembly 102 is a board-to-board interconnect system that electrically joins electronic packages 104 , 106 , such as circuit boards.
- a housing 108 is used to position the interposer connector assembly 102 with respect to the first and second electronic packages 104 , 106 .
- the housing 108 may completely surround the perimeter of the interposer connector assembly 102 , or alternatively, may have separate components provided at predetermined portions of the interposer connector assembly 102 , as shown in FIG. 1 .
- the interposer connector assembly 102 includes a dielectric substrate 118 having opposite sides 120 , 122 .
- Conductive contacts 110 are coupled to the sides 120 , 122 and arranged in a contact array 112 on each side 120 , 122 .
- the contacts 110 may be elongated conductive bodies that extend from the sides 120 , 122 as cantilevered beams.
- the first electronic package 104 has a mating surface 114 and the second electronic package 106 has a mating surface 116 that each includes conductive pads 200 (shown in FIG. 2 ).
- the conductive pads 416 engage the contacts 110 to electrically couple the first and second electronic packages 104 , 106 with the interposer connector assembly 102 .
- the contacts 110 may be joined to the sides 120 , 122 by one or more intervening components, such as one or more of a conductive pad 200 (shown in FIG. 2 ), dielectric layer, and the like.
- the first and second electronic packages 104 , 106 are loaded onto the opposite sides 120 , 122 of the interposer connector assembly 102 .
- the conductive pads 200 (shown in FIG. 2 ) of the first and second electronic packages 104 , 106 engage the contacts 110 of the interposer connector assembly 102 .
- the interposer connector assembly 102 may include conductive vias (not shown) or traces (not shown) that electrically join the first electronic package 104 with the second electronic package 106 by way of the contacts 110 .
- FIG. 2 is a perspective view of one of the contacts 110 of the interposer connector assembly 102 in an uncompressed state prior to mating with a conductive pad 200 of the first electronic package 104 in accordance with one embodiment.
- FIG. 3 is a perspective view the contact 110 shown in FIG. 2 in a compressed state and mated with the conductive pad 200 in accordance with one embodiment.
- the discussion herein focuses on the contacts 110 joined to the side 120 (shown in FIG. 1 ) of the interposer connector assembly 102 (shown in FIG. 1 ) and the conductive pads 200 mounted to the mating side 114 of the first electronic package 104 , but may equally apply to the contacts 110 joined to the opposite side 122 (shown in FIG. 1 ) of the interposer connector assembly 102 and that mate with the conductive pads 200 of the second electronic package 106 (shown in FIG. 1 ).
- the electronic package 104 includes a body 124 , such as a circuit board or substrate, with conductive pads 200 mounted to the surface 114 of the body 124 .
- the electronic package 104 includes a conductive via 214 that extends into the body 124 from the mating surface 114 .
- the via 214 may be a cavity or opening into the first electronic package 104 that is plated or substantially filled with a conductive material.
- the via 214 is oriented along a center axis 222 .
- the conductive pad 200 is electrically joined with the via 214 .
- the conductive material of the conductive pad 200 may be coupled with the conductive material of the via 214 to provide an electrically conductive pathway between the conductive pad 200 and the via 214 .
- the via 214 may be electrically joined with conductive traces (not shown) and/or other conductive vias of the first electronic package 104 .
- the contact 110 engages the conductive pad 200 to electrically couple the contact 110 and the interposer connector assembly 102 (shown in FIG. 1 ) with the via 214 .
- the contacts 110 are elongated conductive bodies that extend between opposite edges 224 , 226 .
- the contact 110 includes a fixation end 204 and an outer end 202 with an interconnecting section 206 extending from the fixation end 204 to the outer end 202 .
- the fixation end 204 and the outer end 202 have width dimensions 208 , 210 (shown in FIG. 2 ) that are greater than a width dimension 212 (shown in FIG. 2 ) of the interconnecting section 206 throughout the entire interconnecting section 206 .
- one or more of the width dimensions 208 , 210 may be smaller than or approximately the same size as the width dimension 212 .
- the contacts 110 are joined to conductive members 402 (shown in FIG. 4 ) on opposite sides 120 , 122 (shown in FIG. 1 ) of the interposer connector assembly 102 (shown in FIG. 1 ).
- a mounting surface 228 of the fixation end 204 may be mounted to the conductive member 402 on the side 120 (shown in FIG. 1 ) of the interposer connector assembly 102 such that the contact 110 protrudes from the conductive member 402 as a cantilevered beam.
- the fixation end 204 has a planar shape while the outer end 202 has an arcuate shape.
- the fixation and/or outer ends 204 , 202 may have different shapes.
- the conductive pad 200 of the first electronic package 104 engages the outer end 202 of the contact 110 when the first electronic package 104 mates with the interposer connector assembly 102 .
- the contact 110 is shown in FIG. 2 in an uncompressed state such as, for example, when the first electronic package 104 is not mated with the interposer connector assembly 102 .
- the contact 110 is shown in FIG. 3 in a compressed state such as when the first electronic package 104 mates with the interposer connector assembly 102 and the conductive pad 200 engages the outer end 202 .
- the outer end 202 of the contact 110 is deflected toward the side 120 (shown in FIG. 1 ) of the interposer connector assembly 102 (shown in FIG. 1 ) when the conductive pad 200 engages the contact 110 .
- the conductive pad 200 may have an approximate dog-bone shape.
- the conductive pad 200 includes two generally circular portions 216 , 218 interconnected by a narrowed portion 220 .
- the portion 216 may be referred to as an engagement portion 216 as the contact 110 may abut the engagement portion 216 of the conductive pad 200 when the contact 110 mates with the conductive pad 200 .
- the portion 218 may be referred to as the framing portion 218 as the framing portion 218 extends around at least a portion of a periphery of the via 214 and/or the center axis 222 of the via 214 .
- the framing portion 218 includes an opening 214 extending through the conductive pad 200 .
- the via 214 may be at least partially encircled by the framing portion 218 .
- the engagement portion 216 and the framing portion 218 are spaced apart from one another and interconnected by the narrowed portion 220 .
- the portions 216 , 218 , 220 may be a unitary conductive body.
- the portions 216 , 218 , 220 may be plated onto the mating surface 114 of the first electronic package 104 as a single body.
- the narrowed portion 220 electrically interconnects the contact 110 and the mounting portion 216 with the framing portion 218 and the via 214 .
- the pad 200 may have a different shape or layout than what is shown in FIGS. 2 and 3 .
- FIG. 4 is a cross-sectional view of the portion of the interposer connector assembly 102 shown in FIG. 2 taken along line 4 - 4 in FIG. 2 in accordance with one embodiment.
- each of the first and second electronic packages 104 , 106 includes the conductive pad 200 and each side 120 , 122 of the interposer connector assembly 102 includes the contact 110 .
- the interposer connector assembly 102 may include conductive members 402 , such as conductive pads, on each of the sides 120 , 122 .
- the contacts 110 may be mounted to and electrically coupled with the conductive members 402 .
- a conductive via 400 may extend through the substrate 118 .
- Conductive interconnects 404 are provided between the via 400 and the conductive members 402 to electrically couple the conductive members 402 with each other.
- the interconnects 404 may be conductive bodies that are deposited on the sides 120 , 122 of the substrate 118 .
- the via 400 and the interconnects 404 electrically couple the conductive members 402 and contacts 110 on the sides 120 , 122 with each other. In the positions shown in FIG. 4 , the conductive pads 200 of the first and second electronic packages 104 , 106 are not engaged with the contacts 110 and are not electrically coupled by the interposer connector assembly 102 .
- the vias 214 of the first and second electronic packages 104 , 106 are oriented along respective center axes 222 .
- the contacts 110 of the interposer connector assembly 102 are oriented relative to the vias 214 and the conductive pads 200 such that the center axes 222 of the vias 214 extend through the contacts 110 .
- the contacts 110 may be oriented relative to the conductive pads 200 such that the center axis 222 intersects the contacts 110 .
- the center axis 222 extends through the interconnecting portion 206 of the contacts 110 , but alternatively may extend through a different part of the contacts 110 .
- FIG. 5 is a cross-sectional view of the portion of the interposer connector assembly 102 shown in FIG. 3 taken along line 5 - 5 in FIG. 3 in accordance with one embodiment.
- the conductive pads 200 of the first and second electronic packages 104 , 106 are engaged with the contacts 110 in the view shown in FIG. 5 .
- the contacts 110 are deflected toward the substrate 118 of the interposer connector assembly 102 by the engagement of the contacts 110 with the conductive pads 200 .
- the conductive pads 200 are electrically coupled with one another by the contacts 110 , the conductive members 402 , the interconnects 404 , and the via 400 .
- the contacts 110 are deflected toward the substrate 118 with the center axes 222 of the vias 214 in the first and second electronic packages 104 , 106 extending through the contacts 110 when the conductive pads 200 of the first and second electronic packages 104 , 106 engage the contacts 110 .
- Data and/or power signals may be conveyed between the first electronic package 104 and the second electronic package 106 by way of the contacts 110 , the conductive members 402 , the interconnects 404 , and the via 400 in the illustrated embodiment.
- the relative positions of the contacts 110 of the interposer connector assembly 102 and the vias 214 of the first and second electronic packages 104 , 106 such that the center axes 222 pass through the contacts 110 may reduce the amount or magnitude of the electrical noise or electromagnetic interference that is generated by the transfer of power and/or data through the interposer connector assembly 102 .
- positioning the contacts 110 such that the contacts 110 are located between the vias 214 of each of the first and second electronic packages 104 , 106 and the conductive members 402 to which the contacts 110 are mounted may reduce the noise that the signals being conveyed through the contacts 110 .
- FIG. 6 is a bottom view of one of the contacts 110 of the interposer connector assembly 102 (shown in FIG. 1 ) in accordance with one embodiment.
- the view shown in FIG. 6 is oriented along a direction extending from the side 120 (shown in FIG. 1 ) of the interposer connector assembly 102 (shown in FIG. 1 ) toward the first electronic package 104 . While the discussion herein focuses on the contacts 110 joined to the side 120 of the interposer connector assembly 102 and the conductive pad 200 of the first electronic package 104 , the discussion may equally apply to the contacts 110 on the side 122 (shown in FIG. 1 ) of the interposer connector assembly 102 and the conductive pads 200 of the second electronic package 106 (shown in FIG. 1 ).
- the contact 110 is shown in phantom view to more clearly illustrate how the contact 110 is oriented relative to the via 214 of the first electronic package 104 .
- the contact 110 may define a footprint 600 on the mating surface 114 of the first electronic package 104 .
- the footprint 600 is the surface area on the first electronic package 104 that is above the contact 110 in the view shown in FIG. 4 or 5 .
- the contact 110 may extend over a surface area of the first electronic package 104 that is defined by the footprint 600 .
- the footprint 600 of the contact 110 and the conductive pad 200 of the first electronic package 104 are elongated in a common direction 602 .
- the footprint 600 of the contact 110 is elongated between opposite edges 604 , 606 that are associated with the edges 224 , 226 of the contact 110 .
- the footprint 600 is elongated between the edges 604 , 606 along the direction 602 and the conductive pad 200 also is elongated along the direction 602 .
- the contact 110 may be oriented relative to the via 214 such that the footprint 600 at least partially overlaps or encompasses the via 214 .
- all of the via 214 is disposed within the footprint 600 .
- a surface area 608 of the via 214 may be entirely located within or may entirely overlap with the footprint 600 of the contact 110 .
- the surface area 608 is the two dimensional cross-sectional area of the via 214 .
- the surface area 608 may be represented by the area of the via 214 that is intersected by a plane that is perpendicular to the center axis 222 of the via 214 .
- the surface area 608 is the cross-sectional area of the opening or hole of the via 214 .
- the surface area 608 is the cross-sectional area of the conductive material in the via 214 .
- the via 214 may be partially disposed within the footprint 600 .
- the via 214 may be encompassed by the portion of the footprint 600 that is associated with the interconnecting portion 206 of the contact 110 .
- the via 214 may be encompassed by the portion of the footprint 600 that is associated by a different end 202 , 204 of the contact 110 , or by a combination of the ends 202 , 204 and/or section 206 of the contact 110 .
- the noise that is induced onto other contacts 110 may be reduced by positioning the contact 110 relative to the via 214 such that the footprint 600 encompasses the via 214 .
Abstract
Description
- The invention relates generally to connectors that electrically couple two or more other connectors or devices, and more specifically, to an interposer connector assembly.
- The ongoing trend toward smaller, lighter, and higher performance electrical components and higher density electrical circuits has led to the development of surface mount technology in the design of printed circuit boards and electronic packages. Surface mountable packaging allows for the connection of a package, such as a computer processor, to pads on the surface of the circuit board rather than by contacts or pins soldered in plated holes going through the circuit board. Surface mount technology may allow for an increased component density on a circuit board, thereby saving space on the circuit board.
- One form of surface mount technology includes interposer connectors. Interposer connectors may include a substrate with conductive contacts on both sides of a dielectric substrate. Conductive vias, or holes that are filled with a conductive material, extend through the substrate to electrically couple the contacts on opposite sides of the substrate. The contacts on each side of the substrate engage conductive members or terminals of different electronic packages, such as a processor and a circuit board, to electrically couple the electronic packages with each other.
- As the need for smaller, lighter, and higher performance electrical components and higher density electrical circuits increases, the density of the contacts and vias on each side of the substrate may increase. For example, the contacts and vias may be located closer together. As the contacts and vias move closer together, the data and/or power signals that are conveyed between the electronic packages using the contacts and vias may induce noise, crosstalk, and other electromagnetic interference on the data signals being carried by nearby or neighboring contacts and vias.
- A need exists for an interposer connector assembly that enables a relatively high density of contacts while reducing noise and other interference on signals being transferred by the contacts.
- In one embodiment, an electronic connector system is provided. The system includes an electronic package and an interposer connector assembly. The electronic package has a body with a conductive member disposed on a mating surface of the body. The conductive member is coupled with a conductive via that extends into the body and is oriented along a center axis. The interposer connector assembly includes a substrate with an elongated conductive pad mounted to the substrate and a contact joined to the conductive pad. The contact engages the conductive member when the electronic package mates with the interposer connector assembly such that the center axis extends through the contact.
- In another embodiment, another electronic connector system is provided. The system includes an electronic package and an interposer connector assembly. The electronic package has a body with a conductive member disposed on a mating surface of the body. The conductive member is coupled with a conductive via that extends into the body. The interposer connector assembly includes a substrate with a conductive pad mounted to the substrate and an elongated contact joined to the conductive pad. The contact has a footprint on the electronic package that is defined by a surface area on the mating surface of the electronic package over which the contact extends when the electronic package and the interposer connector assembly mate. At least a portion of the via is disposed within the footprint.
-
FIG. 1 illustrates an electronic connector system having an interposer connector assembly formed in accordance with one embodiment. -
FIG. 2 is a perspective view of a contact of the interposer connector assembly shown inFIG. 1 in an uncompressed state in accordance with one embodiment. -
FIG. 3 is a perspective view the contact shown inFIG. 2 in a compressed state in accordance with one embodiment. -
FIG. 4 is a cross-sectional view of the portion of the interposer connector assembly shown inFIG. 2 taken along line 4-4 inFIG. 2 in accordance with one embodiment. -
FIG. 5 is a cross-sectional view of the portion of the interposer connector assembly shown inFIG. 3 taken along line 5-5 inFIG. 3 in accordance with one embodiment. -
FIG. 6 is a top view of the contact of the interposer connector assembly in accordance with one embodiment. -
FIG. 1 illustrates anelectronic connector system 100 having aninterposer connector assembly 102 formed in accordance with one embodiment. Theinterposer connector assembly 102 mates with and electrically interconnects first and secondelectronic packages electronic packages interposer connector assembly 102 may be used to establish board-to-board, board-to-device, and/or device-to-device electrical connections. - In the illustrated embodiment, the
interposer connector assembly 102 is a board-to-board interconnect system that electrically joinselectronic packages housing 108 is used to position theinterposer connector assembly 102 with respect to the first and secondelectronic packages housing 108 may completely surround the perimeter of theinterposer connector assembly 102, or alternatively, may have separate components provided at predetermined portions of theinterposer connector assembly 102, as shown inFIG. 1 . - The
interposer connector assembly 102 includes adielectric substrate 118 havingopposite sides Conductive contacts 110 are coupled to thesides contact array 112 on eachside contacts 110 may be elongated conductive bodies that extend from thesides electronic package 104 has amating surface 114 and the secondelectronic package 106 has amating surface 116 that each includes conductive pads 200 (shown inFIG. 2 ). The conductive pads 416 engage thecontacts 110 to electrically couple the first and secondelectronic packages interposer connector assembly 102. - The
contacts 110 may be joined to thesides FIG. 2 ), dielectric layer, and the like. The first and secondelectronic packages opposite sides interposer connector assembly 102. The conductive pads 200 (shown inFIG. 2 ) of the first and secondelectronic packages contacts 110 of theinterposer connector assembly 102. Theinterposer connector assembly 102 may include conductive vias (not shown) or traces (not shown) that electrically join the firstelectronic package 104 with the secondelectronic package 106 by way of thecontacts 110. -
FIG. 2 is a perspective view of one of thecontacts 110 of theinterposer connector assembly 102 in an uncompressed state prior to mating with aconductive pad 200 of the firstelectronic package 104 in accordance with one embodiment.FIG. 3 is a perspective view thecontact 110 shown inFIG. 2 in a compressed state and mated with theconductive pad 200 in accordance with one embodiment. The discussion herein focuses on thecontacts 110 joined to the side 120 (shown inFIG. 1 ) of the interposer connector assembly 102 (shown inFIG. 1 ) and theconductive pads 200 mounted to themating side 114 of the firstelectronic package 104, but may equally apply to thecontacts 110 joined to the opposite side 122 (shown inFIG. 1 ) of theinterposer connector assembly 102 and that mate with theconductive pads 200 of the second electronic package 106 (shown inFIG. 1 ). - The
electronic package 104 includes abody 124, such as a circuit board or substrate, withconductive pads 200 mounted to thesurface 114 of thebody 124. Theelectronic package 104 includes a conductive via 214 that extends into thebody 124 from themating surface 114. Thevia 214 may be a cavity or opening into the firstelectronic package 104 that is plated or substantially filled with a conductive material. Thevia 214 is oriented along acenter axis 222. Theconductive pad 200 is electrically joined with thevia 214. The conductive material of theconductive pad 200 may be coupled with the conductive material of thevia 214 to provide an electrically conductive pathway between theconductive pad 200 and thevia 214. Thevia 214 may be electrically joined with conductive traces (not shown) and/or other conductive vias of the firstelectronic package 104. As described herein, thecontact 110 engages theconductive pad 200 to electrically couple thecontact 110 and the interposer connector assembly 102 (shown inFIG. 1 ) with thevia 214. - The
contacts 110 are elongated conductive bodies that extend betweenopposite edges contact 110 includes afixation end 204 and anouter end 202 with aninterconnecting section 206 extending from thefixation end 204 to theouter end 202. In the illustrated embodiment, thefixation end 204 and theouter end 202 havewidth dimensions 208, 210 (shown inFIG. 2 ) that are greater than a width dimension 212 (shown inFIG. 2 ) of the interconnectingsection 206 throughout theentire interconnecting section 206. Alternatively, one or more of thewidth dimensions width dimension 212. - Although not shown in
FIGS. 2 and 3 , thecontacts 110 are joined to conductive members 402 (shown inFIG. 4 ) onopposite sides 120, 122 (shown inFIG. 1 ) of the interposer connector assembly 102 (shown inFIG. 1 ). For example, a mountingsurface 228 of thefixation end 204 may be mounted to theconductive member 402 on the side 120 (shown inFIG. 1 ) of theinterposer connector assembly 102 such that thecontact 110 protrudes from theconductive member 402 as a cantilevered beam. In the illustrated embodiment, thefixation end 204 has a planar shape while theouter end 202 has an arcuate shape. Alternatively, the fixation and/or outer ends 204, 202 may have different shapes. - The
conductive pad 200 of the firstelectronic package 104 engages theouter end 202 of thecontact 110 when the firstelectronic package 104 mates with theinterposer connector assembly 102. Thecontact 110 is shown inFIG. 2 in an uncompressed state such as, for example, when the firstelectronic package 104 is not mated with theinterposer connector assembly 102. Thecontact 110 is shown inFIG. 3 in a compressed state such as when the firstelectronic package 104 mates with theinterposer connector assembly 102 and theconductive pad 200 engages theouter end 202. Theouter end 202 of thecontact 110 is deflected toward the side 120 (shown inFIG. 1 ) of the interposer connector assembly 102 (shown inFIG. 1 ) when theconductive pad 200 engages thecontact 110. - As shown in
FIGS. 2 and 3 , theconductive pad 200 may have an approximate dog-bone shape. For example, theconductive pad 200 includes two generallycircular portions portion 220. Theportion 216 may be referred to as anengagement portion 216 as thecontact 110 may abut theengagement portion 216 of theconductive pad 200 when thecontact 110 mates with theconductive pad 200. Theportion 218 may be referred to as the framingportion 218 as the framingportion 218 extends around at least a portion of a periphery of the via 214 and/or thecenter axis 222 of thevia 214. The framingportion 218 includes anopening 214 extending through theconductive pad 200. The via 214 may be at least partially encircled by the framingportion 218. - The
engagement portion 216 and the framingportion 218 are spaced apart from one another and interconnected by the narrowedportion 220. Theportions portions mating surface 114 of the firstelectronic package 104 as a single body. The narrowedportion 220 electrically interconnects thecontact 110 and the mountingportion 216 with the framingportion 218 and thevia 214. Alternatively, thepad 200 may have a different shape or layout than what is shown inFIGS. 2 and 3 . -
FIG. 4 is a cross-sectional view of the portion of theinterposer connector assembly 102 shown inFIG. 2 taken along line 4-4 inFIG. 2 in accordance with one embodiment. As shown inFIG. 4 , each of the first and secondelectronic packages conductive pad 200 and eachside interposer connector assembly 102 includes thecontact 110. Theinterposer connector assembly 102 may includeconductive members 402, such as conductive pads, on each of thesides contacts 110 may be mounted to and electrically coupled with theconductive members 402. A conductive via 400 may extend through thesubstrate 118.Conductive interconnects 404 are provided between the via 400 and theconductive members 402 to electrically couple theconductive members 402 with each other. Theinterconnects 404 may be conductive bodies that are deposited on thesides substrate 118. The via 400 and theinterconnects 404 electrically couple theconductive members 402 andcontacts 110 on thesides FIG. 4 , theconductive pads 200 of the first and secondelectronic packages contacts 110 and are not electrically coupled by theinterposer connector assembly 102. - The
vias 214 of the first and secondelectronic packages FIG. 4 , thecontacts 110 of theinterposer connector assembly 102 are oriented relative to thevias 214 and theconductive pads 200 such that the center axes 222 of thevias 214 extend through thecontacts 110. For example, thecontacts 110 may be oriented relative to theconductive pads 200 such that thecenter axis 222 intersects thecontacts 110. In the illustrated embodiment, thecenter axis 222 extends through the interconnectingportion 206 of thecontacts 110, but alternatively may extend through a different part of thecontacts 110. -
FIG. 5 is a cross-sectional view of the portion of theinterposer connector assembly 102 shown inFIG. 3 taken along line 5-5 inFIG. 3 in accordance with one embodiment. In contrast to the view shown inFIG. 4 , theconductive pads 200 of the first and secondelectronic packages contacts 110 in the view shown inFIG. 5 . Thecontacts 110 are deflected toward thesubstrate 118 of theinterposer connector assembly 102 by the engagement of thecontacts 110 with theconductive pads 200. In the positions shown inFIG. 5 , theconductive pads 200 are electrically coupled with one another by thecontacts 110, theconductive members 402, theinterconnects 404, and thevia 400. - The
contacts 110 are deflected toward thesubstrate 118 with the center axes 222 of thevias 214 in the first and secondelectronic packages contacts 110 when theconductive pads 200 of the first and secondelectronic packages contacts 110. Data and/or power signals may be conveyed between the firstelectronic package 104 and the secondelectronic package 106 by way of thecontacts 110, theconductive members 402, theinterconnects 404, and the via 400 in the illustrated embodiment. The relative positions of thecontacts 110 of theinterposer connector assembly 102 and thevias 214 of the first and secondelectronic packages contacts 110 may reduce the amount or magnitude of the electrical noise or electromagnetic interference that is generated by the transfer of power and/or data through theinterposer connector assembly 102. For example, positioning thecontacts 110 such that thecontacts 110 are located between thevias 214 of each of the first and secondelectronic packages conductive members 402 to which thecontacts 110 are mounted may reduce the noise that the signals being conveyed through thecontacts 110. -
FIG. 6 is a bottom view of one of thecontacts 110 of the interposer connector assembly 102 (shown inFIG. 1 ) in accordance with one embodiment. The view shown inFIG. 6 is oriented along a direction extending from the side 120 (shown inFIG. 1 ) of the interposer connector assembly 102 (shown inFIG. 1 ) toward the firstelectronic package 104. While the discussion herein focuses on thecontacts 110 joined to theside 120 of theinterposer connector assembly 102 and theconductive pad 200 of the firstelectronic package 104, the discussion may equally apply to thecontacts 110 on the side 122 (shown inFIG. 1 ) of theinterposer connector assembly 102 and theconductive pads 200 of the second electronic package 106 (shown inFIG. 1 ). Thecontact 110 is shown in phantom view to more clearly illustrate how thecontact 110 is oriented relative to the via 214 of the firstelectronic package 104. - The
contact 110 may define afootprint 600 on themating surface 114 of the firstelectronic package 104. Thefootprint 600 is the surface area on the firstelectronic package 104 that is above thecontact 110 in the view shown inFIG. 4 or 5. For example, thecontact 110 may extend over a surface area of the firstelectronic package 104 that is defined by thefootprint 600. As shown inFIG. 6 , thefootprint 600 of thecontact 110 and theconductive pad 200 of the firstelectronic package 104 are elongated in acommon direction 602. For example, thefootprint 600 of thecontact 110 is elongated betweenopposite edges edges contact 110. Thefootprint 600 is elongated between theedges direction 602 and theconductive pad 200 also is elongated along thedirection 602. - The
contact 110 may be oriented relative to the via 214 such that thefootprint 600 at least partially overlaps or encompasses the via 214. In the illustrated embodiment, all of thevia 214 is disposed within thefootprint 600. For example, asurface area 608 of the via 214 may be entirely located within or may entirely overlap with thefootprint 600 of thecontact 110. Thesurface area 608 is the two dimensional cross-sectional area of thevia 214. By way of example only, thesurface area 608 may be represented by the area of the via 214 that is intersected by a plane that is perpendicular to thecenter axis 222 of thevia 214. In one embodiment, thesurface area 608 is the cross-sectional area of the opening or hole of thevia 214. In another embodiment, thesurface area 608 is the cross-sectional area of the conductive material in thevia 214. - Alternatively, the via 214 may be partially disposed within the
footprint 600. For example, less than all but at least a majority of the via 214 may be located within thefootprint 600. The via 214 may be encompassed by the portion of thefootprint 600 that is associated with the interconnectingportion 206 of thecontact 110. Alternatively, the via 214 may be encompassed by the portion of thefootprint 600 that is associated by adifferent end contact 110, or by a combination of theends section 206 of thecontact 110. As described above, the noise that is induced ontoother contacts 110 may be reduced by positioning thecontact 110 relative to the via 214 such that thefootprint 600 encompasses the via 214. - Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely example embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means-plus-function format and are not intended to be interpreted based on 35 U.S.C. §112, sixth paragraph, unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
Claims (18)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/728,879 US8007287B1 (en) | 2010-03-22 | 2010-03-22 | Connector system having contact overlapping vias |
TW100109507A TWI528646B (en) | 2010-03-22 | 2011-03-21 | Connector system having contact overlapping vias |
CN201110098694.3A CN102280789B (en) | 2010-03-22 | 2011-03-22 | There is the connector system of the overlapping through hole of touch panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/728,879 US8007287B1 (en) | 2010-03-22 | 2010-03-22 | Connector system having contact overlapping vias |
Publications (2)
Publication Number | Publication Date |
---|---|
US8007287B1 US8007287B1 (en) | 2011-08-30 |
US20110230067A1 true US20110230067A1 (en) | 2011-09-22 |
Family
ID=44486219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/728,879 Expired - Fee Related US8007287B1 (en) | 2010-03-22 | 2010-03-22 | Connector system having contact overlapping vias |
Country Status (3)
Country | Link |
---|---|
US (1) | US8007287B1 (en) |
CN (1) | CN102280789B (en) |
TW (1) | TWI528646B (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015023500A1 (en) * | 2013-08-14 | 2015-02-19 | Fci Asia Pte. Ltd | Mounting frame system |
US20150173183A1 (en) * | 2008-03-18 | 2015-06-18 | Metrospec Technology, Llc | Interconnectable circuit boards |
US9736946B2 (en) | 2008-02-14 | 2017-08-15 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
KR101913639B1 (en) * | 2017-08-31 | 2018-11-01 | 주식회사 헬릭스 | Electrical Connecting Apparatus |
US10334735B2 (en) | 2008-02-14 | 2019-06-25 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
US10849200B2 (en) | 2018-09-28 | 2020-11-24 | Metrospec Technology, L.L.C. | Solid state lighting circuit with current bias and method of controlling thereof |
US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8382487B2 (en) * | 2010-12-20 | 2013-02-26 | Tyco Electronics Corporation | Land grid array interconnect |
US8550825B2 (en) * | 2011-04-05 | 2013-10-08 | Tyco Electronics Corporation | Electrical interconnect device |
US8491315B1 (en) * | 2011-11-29 | 2013-07-23 | Plastronics Socket Partners, Ltd. | Micro via adapter socket |
US8641428B2 (en) * | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
US9306302B2 (en) * | 2012-04-30 | 2016-04-05 | Hewlett Packard Enterprise Development Lp | Socket with routed contacts |
US9076698B2 (en) * | 2012-10-23 | 2015-07-07 | Intel Corporation | Flexible package-to-socket interposer |
JP6194580B2 (en) * | 2012-12-03 | 2017-09-13 | 富士通株式会社 | Socket and electronic component mounting structure |
US9039425B2 (en) | 2013-01-21 | 2015-05-26 | Tyco Electronics Corporation | Electrical interconnect device |
TWM468808U (en) * | 2013-06-07 | 2013-12-21 | Kingston Digital Inc | Connector and electronic device |
US11209477B2 (en) | 2019-10-31 | 2021-12-28 | Nanya Technology Corporation | Testing fixture and testing assembly |
US11262398B2 (en) * | 2019-10-31 | 2022-03-01 | Nanya Technology Corporation | Testing fixture and testing assembly |
US11289835B2 (en) * | 2020-02-27 | 2022-03-29 | Motorola Solutions, Inc. | Printed circuit board (PCB) connector interface module with heat and scratch resistant coverlay and accessory system |
CN112736520B (en) * | 2020-12-18 | 2022-06-24 | 番禺得意精密电子工业有限公司 | Electric connector and manufacturing method thereof |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5173055A (en) * | 1991-08-08 | 1992-12-22 | Amp Incorporated | Area array connector |
US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
US6074219A (en) * | 1998-07-13 | 2000-06-13 | Unisys Corporation | Electromechanical subassembly including a carrier with springy contacts that exert large and small contact forces |
US6274820B1 (en) * | 1994-07-19 | 2001-08-14 | Tessera, Inc. | Electrical connections with deformable contacts |
US6302703B1 (en) * | 2000-10-11 | 2001-10-16 | Unisys Corporation | Connector for sending power to an IC-chip thru four pressed joints in series |
US20020055280A1 (en) * | 2000-11-08 | 2002-05-09 | Ko David Tso-Chin | EMI shell used with low profile cable end connector |
US6392301B1 (en) * | 1999-10-22 | 2002-05-21 | Intel Corporation | Chip package and method |
US20040072456A1 (en) * | 1993-11-16 | 2004-04-15 | Formfactor, Inc. | Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
US6905343B1 (en) * | 2001-07-02 | 2005-06-14 | Intercon Systems, Inc. | Interposer assembly |
US20060163715A1 (en) * | 2003-11-08 | 2006-07-27 | Chippac, Inc. | Flip chip interconnection pad layout |
US20060232301A1 (en) * | 2004-11-29 | 2006-10-19 | Fci Americas Technology, Inc. | Matched-impedance surface-mount technology footprints |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6888362B2 (en) | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
JP2006253348A (en) * | 2005-03-10 | 2006-09-21 | Tyco Electronics Amp Kk | Ic package, ic socket, and ic socket assembly |
EP2158642A1 (en) * | 2007-06-18 | 2010-03-03 | Tyco Electronics Nederland B.V. | Connector for interconnecting surface-mount devices and circuit substrates |
US7549871B2 (en) * | 2007-09-19 | 2009-06-23 | Tyco Electronics Corporation | Connector with dual compression polymer and flexible contact array |
-
2010
- 2010-03-22 US US12/728,879 patent/US8007287B1/en not_active Expired - Fee Related
-
2011
- 2011-03-21 TW TW100109507A patent/TWI528646B/en not_active IP Right Cessation
- 2011-03-22 CN CN201110098694.3A patent/CN102280789B/en not_active Expired - Fee Related
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5173055A (en) * | 1991-08-08 | 1992-12-22 | Amp Incorporated | Area array connector |
US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
US20040072456A1 (en) * | 1993-11-16 | 2004-04-15 | Formfactor, Inc. | Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
US6274820B1 (en) * | 1994-07-19 | 2001-08-14 | Tessera, Inc. | Electrical connections with deformable contacts |
US6074219A (en) * | 1998-07-13 | 2000-06-13 | Unisys Corporation | Electromechanical subassembly including a carrier with springy contacts that exert large and small contact forces |
US6392301B1 (en) * | 1999-10-22 | 2002-05-21 | Intel Corporation | Chip package and method |
US6302703B1 (en) * | 2000-10-11 | 2001-10-16 | Unisys Corporation | Connector for sending power to an IC-chip thru four pressed joints in series |
US20020055280A1 (en) * | 2000-11-08 | 2002-05-09 | Ko David Tso-Chin | EMI shell used with low profile cable end connector |
US6905343B1 (en) * | 2001-07-02 | 2005-06-14 | Intercon Systems, Inc. | Interposer assembly |
US20060163715A1 (en) * | 2003-11-08 | 2006-07-27 | Chippac, Inc. | Flip chip interconnection pad layout |
US20060232301A1 (en) * | 2004-11-29 | 2006-10-19 | Fci Americas Technology, Inc. | Matched-impedance surface-mount technology footprints |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9736946B2 (en) | 2008-02-14 | 2017-08-15 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
US10334735B2 (en) | 2008-02-14 | 2019-06-25 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
US10499511B2 (en) | 2008-02-14 | 2019-12-03 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
US11304308B2 (en) | 2008-02-14 | 2022-04-12 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
US11690172B2 (en) | 2008-02-14 | 2023-06-27 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
US20150173183A1 (en) * | 2008-03-18 | 2015-06-18 | Metrospec Technology, Llc | Interconnectable circuit boards |
US9357639B2 (en) * | 2008-03-18 | 2016-05-31 | Metrospec Technology, L.L.C. | Circuit board having a plated through hole through a conductive pad |
WO2015023500A1 (en) * | 2013-08-14 | 2015-02-19 | Fci Asia Pte. Ltd | Mounting frame system |
US9791649B2 (en) | 2013-08-14 | 2017-10-17 | FCI Asia Pte. Ltd. | Mounting frame system |
KR101913639B1 (en) * | 2017-08-31 | 2018-11-01 | 주식회사 헬릭스 | Electrical Connecting Apparatus |
US10849200B2 (en) | 2018-09-28 | 2020-11-24 | Metrospec Technology, L.L.C. | Solid state lighting circuit with current bias and method of controlling thereof |
Also Published As
Publication number | Publication date |
---|---|
US8007287B1 (en) | 2011-08-30 |
CN102280789A (en) | 2011-12-14 |
TWI528646B (en) | 2016-04-01 |
TW201212391A (en) | 2012-03-16 |
CN102280789B (en) | 2016-01-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8007287B1 (en) | Connector system having contact overlapping vias | |
US10348015B2 (en) | Socket connector for an electronic package | |
US10784603B2 (en) | Wire to board connectors suitable for use in bypass routing assemblies | |
US5876219A (en) | Board-to-board connector assembly | |
US7726976B2 (en) | Shielded electrical interconnect | |
US8727808B2 (en) | Electrical connector assembly for interconnecting an electronic module and an electrical component | |
US10027061B2 (en) | Socket with insert-molded terminal | |
US7780456B2 (en) | Electrical connector having reinforced contacts arrangement | |
US20120052699A1 (en) | Interposer assembly for electrically connecting electrical cables to an electronic module | |
US8446738B2 (en) | Motherboard assembly for interconnecting and distributing signals and power | |
US7722360B2 (en) | Electrical connector with reduced noise | |
TWI437777B (en) | Electric assembly and application thereof | |
US20070238324A1 (en) | Electrical connector | |
US8079849B2 (en) | Socket connector assembly with compressive contacts | |
US7537460B2 (en) | Electrical connector with a contact having at least two conductive paths | |
US7918668B1 (en) | Socket connector assembly with conductive posts | |
US8215966B2 (en) | Interposer connector assembly | |
US10403992B1 (en) | Socket assembly for an electrical system | |
WO2014061202A1 (en) | Connector | |
TWI506756B (en) | Chip module and circuit board | |
US10651583B1 (en) | Power supply for socket assembly | |
JP3701242B2 (en) | Connection system | |
US20050186808A1 (en) | Via grid array sockets for electronics applications |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: TYCO ELECTRONICS CORPORATION, PENNSYLVANIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHAMPION, BRUCE ALLEN;MILLARD, STEVEN JAY;LIN, BIN;REEL/FRAME:024117/0410 Effective date: 20100318 |
|
AS | Assignment |
Owner name: TYCO ELECTRONICS CORPORATION, PENNSYLVANIA Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE DOCKET NUMBER IN THE 03/18/2010 ASSIGNMENT. ASSIGNORS INTENDED TO ASSIGN PATENT APPLICATION ATTORNEY DOCKET NO. CS-01106 PREVIOUSLY RECORDED ON REEL 024117 FRAME 0410. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT EXECUTED BY ASSIGNORS ON 3/18/2010 ASSIGNMENT INCORRECTLY IDENTIFIED DOCKET NUMBER AS CS-01107;ASSIGNORS:CHAMPION, BRUCE ALLEN;MILLARD, STEVEN JAY;LIN, BIN;REEL/FRAME:024168/0876 Effective date: 20100331 |
|
ZAAA | Notice of allowance and fees due |
Free format text: ORIGINAL CODE: NOA |
|
ZAAB | Notice of allowance mailed |
Free format text: ORIGINAL CODE: MN/=. |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
AS | Assignment |
Owner name: TE CONNECTIVITY CORPORATION, PENNSYLVANIA Free format text: CHANGE OF NAME;ASSIGNOR:TYCO ELECTRONICS CORPORATION;REEL/FRAME:041350/0085 Effective date: 20170101 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 8 |
|
FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20230830 |