US20120012286A1 - Air jet active heat sink apparatus - Google Patents
Air jet active heat sink apparatus Download PDFInfo
- Publication number
- US20120012286A1 US20120012286A1 US12/835,375 US83537510A US2012012286A1 US 20120012286 A1 US20120012286 A1 US 20120012286A1 US 83537510 A US83537510 A US 83537510A US 2012012286 A1 US2012012286 A1 US 2012012286A1
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- United States
- Prior art keywords
- air
- plenum
- openings
- housing
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- The present application is related to U.S. patent application Ser. No. ______ (docket no. 807929) to Salamon, entitled, “A HEAT SINK WITH STAGGERED HEAT EXCHANGE ELEMENTS” (“Salamon”), and which is commonly assigned with the present application and is incorporated herein by reference in its entirety.
- The present disclosure is directed, in general, to an active heat dissipation apparatus and methods of manufacture thereof.
- This section introduces aspects that may be helpful to facilitating a better understanding of the inventions. Accordingly, the statements of this section are to be read in this light. The statements of this section are not to be understood as admissions about what is in the prior art or what is not in the prior art.
- Heat sinks are commonly used to increase the heat transfer area of an electronic device to decrease the thermal resistance between the device and cooling medium, e.g., air. There is a growing trend, however, for electronic devices to dissipate so much power that traditional heat sink designs are inadequate to sufficiently cool the device. Improved heat transfer efficiency from electronic devices would help extend the lifetime of such devices.
- One embodiment is an apparatus comprising a heat sink and a plenum. The heat sink includes a base and a plurality of heat exchange elements, connected to and raised above, a surface of the base. The plenum is located above the heat exchange elements. The plenum includes a housing configured to hold a positive air-pressure therein, and openings in a surface of the housing. The opening are positioned such that air exiting the plenum through the openings is directed to the heat sink.
- Another embodiment is a system that comprises the above-described apparatus a structure configured to produce heat, wherein the heat sink is thermally coupled to the structure.
- Another embodiment is a method of manufacturing an apparatus. The method comprises providing the above-described heat sink and plenum. The method also comprises positioning the plenum above the heat exchange elements, such that air exiting the plenum through the openings is directed to the heat sink.
- The embodiments of the disclosure are best understood from the following detailed description, when read with the accompanying FIGUREs. Some features in the figures may be described as “vertical” or “horizontal” for convenience in referring to those features. Such descriptions do not limit the orientation of such features with respect to the natural horizon or gravity. Various features may not be drawn to scale and may be arbitrarily increased or reduced in size for clarity of discussion. Reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
-
FIG. 1 presents a perspective view of an example embodiment of the apparatus of the disclosure; -
FIG. 2A presents a semitransparent plan view of the apparatus along view line 2-2 shown inFIG. 1 ; -
FIGS. 2B-2D present plan views of an alternative embodiments of the apparatus of the disclosure, analogous to the view presented inFIG. 2A ; -
FIG. 3A presents a sectional view of the apparatus along view line 3-3 shown inFIG. 1 ; and -
FIGS. 3B-3C present sectional views of an alternative embodiments of the apparatus of the disclosure, analogous to the view presented inFIG. 3A . -
FIG. 4 presents a flow diagram of selected steps in an example method of manufacturing an apparatus of the disclosure, e.g., such as presented inFIGS. 1A-1B . - The description and drawings merely illustrate the principles of the invention. It will thus be appreciated that those skilled in the art will be able to devise various arrangements that, although not explicitly described or shown herein, embody the principles of the invention and are included within its scope. Furthermore, all examples recited herein are principally intended expressly to be only for pedagogical purposes to aid the reader in understanding the principles of the invention and the concepts contributed by the inventor(s) to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions. Moreover, all statements herein reciting principles, aspects, and embodiments of the invention, as well as specific examples thereof, are intended to encompass equivalents thereof. Additionally, the term, “or,” as used herein, refers to a non-exclusive or, unless otherwise indicated. Also, the various embodiments described herein are not necessarily mutually exclusive, as some embodiments can be combined with one or more other embodiments to form new embodiments.
- Embodiments of the disclosure benefit from the recognition that boundary layers develop along the surfaces of a heat sink. Consequently, efficient heat transfer from the heat sink to the surrounding air can be deterred because the primary means of heat transfer from the slow air flowing in the boundary layer at the surface and the faster moving cold air in the space farther away from the surface is thermal diffusion.
- The embodiments described herein improve heat transfer efficiency by increasing the turbulence (or mixing) of air located in the channels between the heat exchange elements of a heat sink. For instance, increased air turbulence helps mix the hotter air next to the heat exchange elements with the cooler air in the middle of channels, and thereby improve heat transfer. The increase in air turbulence (or mixing), achieved by forcing jets of air into the heat sink as described herein, are believed some cases to be capable of improving the cooling factor of a heat sink by up to three times as compared to an analogous heat sink design but without the jets of air.
- One embodiment of the disclosure is an apparatus.
FIG. 1 presents a perspective view of an example embodiment of the apparatus of the disclosure.FIG. 2A presents a semitransparent plan view of the apparatus along view line 2-2 shown inFIG. 1 .FIGS. 2B-2D present plan views of an alternative embodiments of the apparatus of the disclosure, analogous to the view presented inFIG. 2A .FIG. 3A presents a sectional view of the apparatus along view line 3-3 shown inFIG. 1 .FIGS. 3B-3C present sectional views of an alternative embodiments of the apparatus of the disclosure, analogous to the view presented inFIG. 3A . - Turning to
FIG. 1 , theapparatus 100 comprises aheat sink 102. Theheat sink 102 includes abase 105 and a plurality ofheat exchange elements 110, connected to and raised above, asurface 120 of thebase 105. Theapparatus 100 comprises aplenum 125 located above theheat exchange elements 110. Theplenum 125 includes ahousing 130 configured to hold a positive air-pressure therein.Openings 135 are in asurface 140 of thehousing 130. Theopenings 135 are positioned such that air exiting theplenum 125 through theopenings 135 is directed to theheat sink 102. In various embodiments, for instance, the air flowing through theopenings 135 can be directed to theelements 110 or tochannels 137 located between theelements 110. - The term, plenum, as used herein refers to any gas delivery system capable of delivering air (e.g., any gas) to the openings. The plenum could include chambers, hoses and tubes that supply the air to the heat sink, or, the there could be multiple plenums, e.g., configured as hoses and tubes.
- The term, positive air-pressure, as used herein means that, when the
apparatus 100 is in operation, the atmospheric pressure inside thehousing 130, at least for a period of time, is greater than the pressure outside of thehousing 130. For instance, when air is provided to the plenum via a net-zero mass flux devices, such as further described below, the plenum could have a positive, negative or neutral pressure modes at different periods of time during the apparatus's operation. - In some embodiments, air flow, e.g., from a remote fan, or other means of circulating air, can transfer air into the
plenum 125 and through theopenings 135. In some preferred embodiments, however, theapparatus 100 further includes one or more anair flow devices 145 coupled to the plenum (e.g., through one or more conduits 150) so as to provide the positive air-pressure to thehousing 130. - Some embodiments of the
air flow device 145 can be net-positive mass flux airflow devices. That is, there is a net positive mass flux of air out of the plenum'shousing 130 when theair flow device 145 is operating. - Non-limiting example embodiments of such net-positive
mass flux devices 145 can include air-driver mechanisms such as pressurized gas cylinders, mechanical compressors, diaphragm air pumps, (e.g., eccentric, vibrating, linear, rotating), piston air pumps or vane air pumps. For instance, in some cases theairflow device 145 can include one or more air compressor flow pumps or compressed gas cylinders. - For instance, as illustrated in
FIG. 2A theair flow device 145 can include apiston 210 that actuates amembrane 215 in acylinder 220. Thepiston 210 can be actuated electro-magnetically or mechanically, e.g., by an air-driver mechanism of the device (not shown) when thedevice 145 is operated. - Other embodiments of the
air flow devices 145 can be net-zero mass flux airflow devices. That is, there is a net zero mass flux of air out of the plenum'shousing 130 when theair flow device 145 is operating. - Non-limiting example embodiments of such net-zero
mass flux devices 145 can include a piezo-electric element coupled to a driver and a membrane coupled to the driver, such that when the membrane is oscillated, air is transferred into thehousing 150. In other embodiments, however, piezo-electric elements can be used in positive-mass flux air-flow devices 145. - Some embodiments of the
air flow device 145 can be configured to deliver an oscillating flow of air to theplenum 125. - For instance, in some cases, the
airflow device 145, such as depicted inFIG. 2A , can be repeatedly turned off and on to deliver the oscillating flow of air to thehousing 130 of theplenum 125. - For instance, in some cases, the
airflow device 145 such as depicted inFIG. 2B , theplenum 125 further includes one ormore flow valves 225 situated over one or more of theopenings 135. For instance, in some applications, such as when theheat sink 102 is used to cool a micro-electronic device, theflow valves 225 can be a MEMS device. The embodiment depicted inFIG. 2B depicts anindividual valve 225 for each one of theopenings 135. In other embodiments, however, a valve could be configured and situated to cover and uncoveropenings 135 to modulate air flow from more than one opening 135 (e.g., a row or column of openings 135). - The
valves 225 can be configured to cover or uncover theopenings 135, when actuated, so as to provide a selected flow of air out of theopenings 135. In some cases, the selected flow of air can be an oscillatory flow of air out of theopenings 135. In other cases, the selected flow can be a sequential operation of thevalves 220 to drive air flow in a selected direction through the heat sink 102 (e.g., a direction parallel to thelong dimension 155 ofelements 110 depicted inFIG. 1 ). In such cases, theairflow device 145 may simply deliver a constant flow of air to said housing to maintain a positive air-pressure in thehousing 130 while thevalves 225 are repeatedly actuated open and closed. In other cases, the selected flow can be a sequential operation of thevalves 220 in a selected direction through the heat sink 102 (e.g., a direction parallel to thelong dimension 155 ofelements 110 depicted inFIG. 1 ) to ensure effective and thorough mixing of air that is traversing the heat sink with the aid of an external source, such as a fan or air blower. In still other cases, however, theairflow device 145 can also be turned on and off while thevalves 225 are actuated, e.g., to produce more complex patterns of air flow through theopenings 135. - In some embodiments, as illustrated in
FIG. 2C , to facilitate the transfer of air through selectedopenings 135, thehousing 130 can be divided into two ormore chambers - As further illustrated in
FIG. 2C , theapparatus 100 can include air-flow devices 145 that are individually coupled to each one of the chambers (e.g., one ofchambers chambers conduits 150 that direct air-flow from one of the air-flow devices 145 to one of thechambers housing 130, or, in some embodiments to separate chambers (e.g., hoses or tubes) that are considered as being individually housed. - When one of the
chambers 230 is provided with the positive air-pressure, air is selectively directed through one or more of theopenings 135 that are within the onechamber 230. In some instances, by providing the positive air-pressure to the chambers in sequence (e.g.,chamber 230,chamber 232 and then chamber 234) air flow through theopenings 135 can be driven in a selected direction through theheat sink 102. In some instances, by providing the positive air-pressure to the chambers in sequence (e.g.,chamber 230,chamber 232 and then chamber 234) air flow through theopenings 135 can be driven so as to ensure effective and thorough mixing of air that is traversing the heat sink in corporation with an external air-circulating source (e.g., a fan or air blower). In some cases, the flow of air to theindividual chambers flow devices 145 on and off) to provide an oscillatory air flow to one or more of thechambers openings 135. - In some embodiments, to facilitate the transfer of air through selected
openings 135 of thehousing 130, the air flow through amulti-chambered housing 130 can be controlled using flow valves coupled to a plurality ofconduits 150. For instance, as illustrated inFIG. 2D , flow valves 240 (e.g., solenoid valves) can be coupled to one or more of the conduits 150 (e.g., fed from a central conduit 245) that are each coupled to one of thechambers valves 240 can be configured to open and close theconduits 150 so as to provide a selected flow of air to one or more of thechambers FIGS. 2B and 2C , thevalves 240 can be opened and closed repeatedly to produce an oscillatory airflow through theopenings 135, or, sequentially to direct air through theopenings 135 in thechambers heat sink 102 in a particular direction. - Embodiments of the
apparatus 100 can further include a control unit 160 (FIG. 1 ) that is configured to control the one or moreair flow devices 145 coupled to theplenum 125, actuatevalves 225 situated over the openings 135 (FIG. 2B ), or actuatevalues 240 coupled to the conduits 150 (FIG. 2D ), to deliver a desired pattern of air through theopenings 135. - In some cases, the
plenum 125 can rest directly ontops 165 of theheat exchange elements 110. In other cases, however, such as illustrated inFIG. 3A , theplenum 125 can be separated from thetops 165 of theelements 110 by agap 310. For instance, in some embodiments, thegap 310 between thehousing 130 and the tops 165 is up to about 3 mm. Minimizing thegap 310 is desirable to place theopenings 135 close to the regions of theheat sink 102 where air turbulence is desired. For instance, if theopenings 135 are located too far away from theelements 110, then the momentum of the air will be dissipated or diffused before it reaches theheat sink 102. Additionally, alarge gap 310 can undesirably increase the vertical profile of theapparatus 100. Also, too alarge gap 310 may allow air to bypass theheat exchange elements 110, thereby reducing the efficiency of heat transfer. - As further illustrated in
FIG. 3A , some embodiments of theapparatus 100 includes one or more air-flow diverters to increase air turbulence element's 110 surfaces so as to increase heat transfer. In some cases, thediverter 315 can be structures onsides 320 of one or moreheat exchange elements 110. For instance, some embodiments of thediverters 315 can include vertical slots located directly below one of theopenings 135, e.g., to provide the minimum impedance to air from theopening 135 to theelement 110 and enhance air turbulence near theside 320. In some cases, thediverter 325 can be a structure on thesurface 140 of thehousing 130 in a vicinity of one or more of theopenings 135. For instance, some embodiments ofsuch diverters 325 can include a nozzle jet structure located around theopening 135 to, e.g., direct airflow from theopening 135 to aside 320 of theelement 110 and thereby increase air mixing. In still other embodiments, thediverters sides 320 and into the center of thechannels 137 between theelements 110, e.g., to increase air mixing via longer-range thermal mixing mechanisms. The diverters could also be used to drive air laterally through theheat sink 102. Additional examples of suitable air-flow diverter designs are presented in the above-incorporated patent application Ser. No. 12/165,193. - The position and size of the
openings 135 can be cooperatively adjusted to facilitate increased air turbulence. In some embodiments, for example, the size 330 (e.g., a diameter for circular openings) of theopenings 135 can range from one-tenth of athickness 335 of theheat exchange elements 110 to one-half of awidth 340 of thechannel 137 between theelements 110. - The position of the
openings 135 relative to theelements 110 can depend on the element'sthickness 335, the opening'ssize 330 and the force of air flow through theopenings 135. - For instance, as illustrated in
FIG. 3A , whenthickness 335 of theelements 110 is relatively large compared to thesize 330openings 135, it can be advantageous for theopenings 135 to be substantially aligned with oneside 320 of one of theheat exchange elements 110. In some cases, theopenings 135 can direct air to or along thesides 320 of theheat exchange elements 110. E.g., theopenings 135 can be placed directly over oneside 320 of one of theheat exchange elements 110, or, theopening 135 can be offset from theheat exchange element 110, but have a shape that is substantially oriented, e.g., angled, so as to direct air to the side of theheat exchange elements 110. Such an alignedopening 135 can help increase the air turbulence near one of the element'ssides 320. - For instance, as illustrated in
FIG. 3B , such as when thethickness 335 of theelements 110 is relatively small compared to thesize 330opening 135, it can be advantageous for theopenings 135 to be centered directly over one of theheat exchange elements 110. Such acentered opening 135 can maximum air turbulence near both of the element'ssides 320. - For instance, as illustrated in
FIG. 3C , when there is a strong force of air-flow through theopenings 135, it can be advantageous to locate theopenings 135 substantially over the center of thechannels 137. For instance, air from theopenings 135 can spread out laterally once the air hits thesurface 120 of thebase 105, and then impinges on thesides 320 of theelements 110 thereby increasing air turbulence next to thesides 320. - For many of the example embodiments presented herein, such as in
FIGS. 1-3C , theheat exchange elements 110 are depicted as being rectangular-shaped planar fins. In some embodiments such aheat exchange elements 110 design can be desirable, e.g., because such structures can be relatively simple and inexpensive to manufacture. In other embodiment, however, it may be advantageous for theheat exchange elements 110 to have other shapes. Examples of other heat exchange element designs are presented in patent application Ser. Nos. 12/165,063; 12/165,193; and 12/165,225, all of which are incorporated by reference herein in their entirety. Non-limiting example designs include: bent or curved fins, fins that include flow diverters, monolithic structurally complex designs, or active heat sink designs. - One skilled in the art would be familiar with the appropriate sizes of the
base 105 and theelements 110 andwidth 340 of spacing between the elements 110 (FIG. 3A ), to use for particular cooling applications. Example of such sizes and spacings are presented in the above-incorporated Salamon application. - Some embodiments of the
plenum 125 include alow profile housing 130 so as not to increase the vertical profile of theapparatus 100. For instance in some embodiments thehousing 130 has aheight 350 that is less than 10 percent of aheight 355 of the heat sink 102 (FIG. 3A ). For some microelectronic applications for example, thethickness 350 is up to about 5 mm. In some embodiments, the lateral dimensions of thehousing 130 are substantially the same as the lateral dimensions as theheat sink 102. - As further illustrated in
FIG. 3A , another embodiment of the disclosure is asystem 360. Thesystem 360 comprises anapparatus 100, such as any of the embodiments of theapparatus 100 discussed in the context ofFIGS. 1-3C . For instance, theapparatus 100 comprises theheat sink 102, theplenum 120 and in some cases, the air-flow device 145 coupled to theplenum 120 so as to provide the positive air-pressure to thehousing 130. Thesystem 360 also comprises astructure 370 configured to produce heat. Theheat sink 102 of theapparatus 100 is coupled to thestructure 370. One skilled in the art would be familiar with means to couple a heat sink to a structure so as to achieve efficient heat transfer. - For instance, in some embodiments the apparatus is an electrical device, and the
heat generating structure 370 includes an integrated circuit, or, in other cases, a power supply of the electrical device. In some embodiments thesystem 360 is a heat exchanger and theheat generating structure 370 is a pipe that carries a heated fluid therein (e.g., water, air, refrigerant). For instance, a plurality ofheat sinks 102 can be thermally coupled to aheat pipe structure 370 that is configured to circulate fluid from another device that generates heat, e.g., a motor or electrical power supply (not shown). In other embodiments, however, heat pipes could be incorporated within thebase 105. Although thebase 105 andstructure 370 are depicted as having aplanar interface 375, in other cases, theinterface 375 could be non-planar (e.g., such as when thestructure 370 is the wall of a cylindrical pipe). - Another embodiment of the disclosure is a method of manufacturing an apparatus.
FIG. 4 presents a flow diagram of selected steps in anexample method 400 of manufacturing anapparatus 100 of the disclosure, such as any of the embodiments discussed in the context ofFIGS. 1-3C . - With continuing reference to
FIGS. 1-3C throughout, themethod 400 comprises astep 410 of providing aheat sink 102. The heat sink includes abase 105 and a plurality ofheat exchange elements 110, connected to and raised above, asurface 120 ofbase 105. The heat sink could be a commercially available sink or any of the heat sink designs disclosed in any of above-incorporated patent applications. - The
method 400 also comprises astep 420 of providing aplenum 125, theplenum 125 including ahousing 130 configured to hold a positive air-pressure therein and,openings 135 in asurface 140 of thehousing 130. Providing theplenum 125 instep 420, in some cases, can include a step 430 of forming theopenings 135 in a first metal sheet (e.g., via stamping or drilling) and astep 435 of forming thehousing 130 by coupling walls to the sheet and then coupling a second sheet to the walls to form an enclosed cavity in thehousing 130. - The method also comprises a
step 440 of positioning theplenum 125 above theheat exchange elements 110, such that air exiting theplenum 125 through theopenings 110 is directed to theheat sink 102. - Some embodiments of the method further include a
step 450 of coupling an air-flow device 145 to theplenum 125 so as to provide the positive air-pressure to thehousing 130. Forinstance conduits 150 can be attached from the output of the air-flow device 145 to thehousing 130. - Although the embodiments have been described in detail, those of ordinary skill in the art should understand that they could make various changes, substitutions and alterations herein without departing from the scope of the disclosure.
Claims (20)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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US12/835,375 US20120012286A1 (en) | 2010-07-13 | 2010-07-13 | Air jet active heat sink apparatus |
PCT/US2011/042915 WO2012009174A2 (en) | 2010-07-13 | 2011-07-05 | Air jet active heat sink apparatus |
TW100123944A TW201212807A (en) | 2010-07-13 | 2011-07-06 | Air jet active heat sink apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US12/835,375 US20120012286A1 (en) | 2010-07-13 | 2010-07-13 | Air jet active heat sink apparatus |
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US20120012286A1 true US20120012286A1 (en) | 2012-01-19 |
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Family Applications (1)
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US12/835,375 Abandoned US20120012286A1 (en) | 2010-07-13 | 2010-07-13 | Air jet active heat sink apparatus |
Country Status (3)
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US (1) | US20120012286A1 (en) |
TW (1) | TW201212807A (en) |
WO (1) | WO2012009174A2 (en) |
Cited By (4)
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US20150308103A1 (en) * | 2012-11-30 | 2015-10-29 | Rensselaer Polytechnic Institute | Methods and systems of modifying air flow at building structures |
US20150342088A1 (en) * | 2014-05-22 | 2015-11-26 | General Electric Company | Integrated compact impingement on extended heat surface |
DE102016210198A1 (en) * | 2016-06-09 | 2017-12-14 | Zf Friedrichshafen Ag | Cooling of components with a pressure surge generator to form a turbulent coolant flow |
CN109862761A (en) * | 2019-03-28 | 2019-06-07 | 西门子(上海)电气传动设备有限公司 | Radiator and high-voltage frequency converter |
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- 2011-07-06 TW TW100123944A patent/TW201212807A/en unknown
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US10988923B2 (en) * | 2012-11-30 | 2021-04-27 | Rensselaer Polytechnic Institute | Methods and systems of modifying air flow at building structures |
US20150342088A1 (en) * | 2014-05-22 | 2015-11-26 | General Electric Company | Integrated compact impingement on extended heat surface |
US10085363B2 (en) * | 2014-05-22 | 2018-09-25 | General Electric Company | Integrated compact impingement on extended heat surface |
DE102016210198A1 (en) * | 2016-06-09 | 2017-12-14 | Zf Friedrichshafen Ag | Cooling of components with a pressure surge generator to form a turbulent coolant flow |
CN109862761A (en) * | 2019-03-28 | 2019-06-07 | 西门子(上海)电气传动设备有限公司 | Radiator and high-voltage frequency converter |
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WO2012009174A3 (en) | 2012-03-29 |
WO2012009174A2 (en) | 2012-01-19 |
TW201212807A (en) | 2012-03-16 |
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