US20120138281A1 - Heat Exchanger for Electronic Assemblies - Google Patents

Heat Exchanger for Electronic Assemblies Download PDF

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Publication number
US20120138281A1
US20120138281A1 US13/240,504 US201113240504A US2012138281A1 US 20120138281 A1 US20120138281 A1 US 20120138281A1 US 201113240504 A US201113240504 A US 201113240504A US 2012138281 A1 US2012138281 A1 US 2012138281A1
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United States
Prior art keywords
passages
longitudinal
transverse
passage
heat exchanger
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Abandoned
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US13/240,504
Inventor
John Santini
Ronald Tallman
Gary Mulcahy
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Transistor Devices Inc
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Transistor Devices Inc
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Publication date
Application filed by Transistor Devices Inc filed Critical Transistor Devices Inc
Priority to US13/240,504 priority Critical patent/US20120138281A1/en
Assigned to TRANSISTOR DEVICES, INC. D/B/A TDI POWER reassignment TRANSISTOR DEVICES, INC. D/B/A TDI POWER ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MULCAHY, GARY, SANTINI, JOHN, TALLMAN, RONALD
Publication of US20120138281A1 publication Critical patent/US20120138281A1/en
Priority to US14/329,068 priority patent/US20140352149A1/en
Assigned to MADISON CAPITAL FUNDING LLC, AS AGENT reassignment MADISON CAPITAL FUNDING LLC, AS AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TRANSISTOR DEVICES INC.
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00Making other particular articles
    • B21D53/02Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02Header boxes; End plates
    • F28F9/0246Arrangements for connecting header boxes with flow lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254Cold plates transferring heat from heat source to coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927Liquid coolant without phase change
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making

Definitions

  • the invention pertains to the field of heat exchangers. More particularly, the invention pertains to liquid-cooled heat exchangers and methods of manufacture thereof.
  • Modern electronic equipment is often designed for mounting in racks or cabinets with only a small clearance between modules. This does not leave much room for large heat sinks or piping which might extend outward from the modules.
  • Heat exchangers for such modular assemblies are often in the form of flat plates which form one or more sides of the module case, to which circuit boards or heat-generating components may be mounted. If the heat exchangers are liquid cooled, the cooling liquid passes through pipes or tubes soldered or otherwise bonded to a surface of the plates or inset into a surface of the plate, with the fluid being supplied and exhausted from the exchangers through connections on an end of the plate.
  • U.S. Pat. No. 5,829,516 or 6,333,849 show such an arrangement of tubes mounted to or inset into flat plates.
  • Liquid cooled heat exchanger plates have also been provided with internal cooling chambers through which liquid is circulated.
  • U.S. Pat. No. 5,159,529 is an example of such an exchanger, in which essentially the entire interior of the plate forms a fluid chamber.
  • FIGS. 3-5 shows a heat exchange plate in which four parallel holes are drilled from one end through most of the length of a solid plate.
  • Two cross-holes are drilled at least part-way through from the sides near the opposite end to cross-connect the two outer pairs of longitudinal holes.
  • the ends of the cross-holes are plugged, and an external pipe is provided to interconnect the drilled end of the two inner holes, to provide a single serpentine path for the fluid.
  • White Paper TW0055 “Next Generation Military Vehicle Power Conversion Modules”, published in March 2008 by TDI Power (Transistor Devices, Inc.), shows, in FIGS. 9 and 10 , a U-shaped water-cooled heat exchanger housing a power converter. Holes are drilled the length of the three sides of the “U” for coolant circulation, similar to the arrangement in the 5,829,516 patent discussed above. While this arrangement has advantages in providing liquid cooling, drilling these long holes for coolant has proven problematic in manufacture.
  • U.S. Pat. No. 7,624,791 shows, in FIGS. 2A and 2B , a tubular cooling body having a central passageway, formed by using a hollow, drawn or extruded raw material. The body is then bent into a U-shaped configuration.
  • the invention presents a liquid-cooled heat exchanger for electronic assemblies and a method of making the heat exchanger.
  • the exchanger has a solid metal body in the form of an elongated flat plate to which an electronic assembly can be mounted, or a number of such plates formed in an L- or U-shaped configuration to enclose two or more sides of the assembly.
  • the elongated body is formed by extrusion, with parallel enclosed longitudinal passages formed along a length of the body during the extrusion process. Transverse passages are drilled to intersect the extruded longitudinal passages.
  • the longitudinal passages and transverse passages are plugged on at least one of their outside ends, and optionally at points along their lengths, to create desired patterns of liquid flow through the heat exchanger.
  • FIG. 1 shows a perspective view of an electronic assembly mounted within a U-shaped heat exchanger.
  • FIG. 2 shows a top view of a plate-type heat exchanger.
  • FIG. 3 shows a cut-through view of the heat exchanger of FIG. 2 , along the lines 3 - 3 .
  • FIG. 4 shows a perspective view of an L-shaped heat exchanger.
  • FIG. 5 shows a cut-through view of the heat exchanger of FIG. 4 , along the lines 5 - 5 .
  • FIG. 6 shows a perspective view of a U-shaped heat exchanger.
  • FIG. 7 shows a cut-through view of the heat exchanger of FIG. 6 , along the lines 7 - 7 .
  • FIGS. 8 a - 8 c show sectional views of a plate-type heat exchanger, showing differing patterns of liquid flow.
  • FIG. 9 is a flowchart of a method of making a heat exchanger.
  • FIG. 10 shows examples of plugs for use with the heat exchanger.
  • the invention presents a liquid-cooled heat exchanger for electronic assemblies and a method of making the heat exchanger.
  • the exchanger has a solid metal body in the form of an elongated flat plate to which the electronic assembly can be mounted, or a number of such plates formed in an L- or U-shaped configuration to enclose two or more sides of the assembly.
  • the elongated body is formed by extrusion, with parallel enclosed longitudinal passages formed along a length of the body during the extrusion process. Cross-passages are drilled to intersect the extruded longitudinal passages.
  • the longitudinal passages and cross-passages are plugged on at least one of their outside ends, and optionally at points along their lengths, to create desired patterns of liquid flow through the heat exchanger.
  • FIG. 1 shows a perspective view of an electronic assembly 8 .
  • the electrical components of the assembly in this case a power supply, are conventionally mounted on a printed circuit board 6 which has a connector 7 allowing the assembly to connect to wiring or a bus in a rack or other mounting arrangement (not shown).
  • the assembly 8 is mounted within a U-shaped heat exchanger formed of a base plate 1 and sides 2 and 3 , which closely surround the components and to which the circuit board 6 is mounted. Heat generated by the components is removed by liquid circulating in passages through the plate 1 and the sides 2 and 3 , as will be described in greater detail below. Appropriate pipes or connectors 4 and 5 are provided to connect to a circulating supply of cooling liquid and to carry away heated liquid, as is conventional in a liquid-cooled apparatus.
  • FIG. 2 shows a top view of an embodiment of the invention in the form of a flat plate-type heat exchanger
  • FIG. 3 shows a cut-through view of the heat exchanger of FIG. 2 , along the lines 3 - 3 .
  • the heat exchanger in this embodiment is a flat plate 10 made of a heat-conductive material such as aluminum or other metal, having a thickness, width and length.
  • the dimensions of the plate 10 would be determined in a manner known to the art, so as to fit the electronic assembly which it is intended to cool and to fit in whatever mounting arrangement might be required.
  • the plate 10 is formed by extrusion, and in the process of extrusion a number of parallel passages are formed running longitudinally through the plate.
  • a number of parallel passages are formed running longitudinally through the plate.
  • four such passages are shown— 11 a , 11 b , 11 c and 11 d —but it will be understood that any number of passages could be included within the teachings of the invention.
  • FIG. 2 shows a simple arrangement of evenly spaced longitudinal passages 11 a - d , but it will be understood that the passages could be arranged to have more liquid coolant through parts of the plate where more heat load is expected, or, conversely, to avoid areas where holes might need to be drilled to mount larger components.
  • Liquid inlet 16 and outlet 17 connectors provide connections to the circulating cooling liquid system (not shown).
  • Transverse passages are drilled across the width of the plate 10 , intersecting some or all of the longitudinal passages 11 a - d .
  • parallel transverse passages 13 and 15 are drilled completely across the width of the plate 10 , on the end of the plate 10 having connectors 16 and 17 , intersecting all four longitudinal passages 11 a - 11 d .
  • transverse passages 12 a and 12 b on the opposite end of the plate 10 , are only drilled part-way across the width of the plate, so that transverse passage 12 a only intersects longitudinal passages 11 a and 11 b , while transverse passage 12 b intersects longitudinal passages 11 c and 11 d .
  • transverse passages As with the longitudinal passages, it will be understood that the particular arrangement of transverse passages shown in the figure are for example only. More or fewer transverse passages could be drilled, in different locations and arrangements, within the teachings of the invention. Transverse passages can be drilled to provide additional passages in areas needing additional cooling, or to avoid areas where mounting holes are needed.
  • FIGS. 8 a - 8 c discussed below, show a plate with four longitudinal passages and seven transverse passages, for example.
  • the outside ends of the transverse and longitudinal passages will need to be plugged to prevent the cooling liquid from the fluid input 16 from simply flowing out of the ends of the passages. This can be done by welding or brazing, or by inserting plugs 14 into the outer ends of the passages as shown in the figure.
  • FIG. 10 shows several examples of plugs as might be used within the teachings of the invention.
  • Plugs 100 and 110 could be made of resilient material and compressed into the passages, or the plugs 14 could be made of rigid material and press-fit into the passages and secured by a sealant or adhesive.
  • the passages may be threaded along at least the outermost portion of their lengths, to facilitate screwing plug 120 into the plate.
  • Plugs can be relatively short and pushed into the transverse or longitudinal passages until they lodge between passages, thus blocking flow from one passage to another parallel to it. In the example of FIG. 2 , this has been done in transverse passage 13 , where plugs 20 block liquid flow through transverse passage 13 from longitudinal passage 11 a to longitudinal passage 11 b , or from 11 c to 11 d . Because there is no plug between longitudinal passages 11 b and 11 c , liquid can flow from one passage to the other through transverse passage 13 .
  • Longer plugs can be used to block two or more longitudinal and transverse passages simultaneously, such as plug 18 , shown pushed into transverse passage 15 across longitudinal passages 11 b and 11 c . This not only blocks flow along transverse passage 15 , but also prevents flow between the intersecting longitudinal passages 11 b and 11 c.
  • Dash-dot line 19 shows the flow of fluid through the heat exchanger shown in FIG. 2 .
  • Fluid flows in connector 16 , then along longitudinal passage 11 a and through transverse passage 12 a to longitudinal passage 11 b .
  • Plug 18 blocks passage 11 b , so the fluid flows across transverse passage 13 to longitudinal passage 11 c , then to transverse passage 12 b , and back on longitudinal passage 11 d to exit at connector 17 .
  • FIG. 4 shows a perspective view of an L-shaped heat exchanger
  • FIG. 5 shows a cut-through view of the heat exchanger of FIG. 4 , along the lines 5 - 5 .
  • An L-shaped heat exchanger would have a base plate 45 and side plate 46 , preferably formed as a single unit by extrusion.
  • Parallel longitudinal passages 40 and 47 are formed during the extrusion process along the length of the base plate 45 , and a number of parallel transverse passages 43 are drilled across the plate to intersect the longitudinal passages 40 .
  • parallel longitudinal passages 41 are formed in side plate 46
  • transverse passages 42 are drilled to intersect the longitudinal passages 41 and also longitudinal passage 47 in the base plate 45 .
  • FIG. 6 shows a perspective view of a U-shaped heat exchanger
  • FIG. 7 shows a cut-through view of the heat exchanger of FIG. 6 , along the lines 7 - 7 .
  • An electronic assembly can be mounted to the U-shaped heat exchanger, as shown in FIG. 1 , forming a modular liquid cooled electronic component.
  • the U-shaped heat exchanger would have a base plate 45 and side plate 46 , and would also have a second side plate 66 .
  • all three plates 45 , 46 and 67 are formed as a single unit by extrusion.
  • Parallel longitudinal passages 40 , 47 and 62 are formed during the extrusion process along the length of the base plate 45 , and a number of parallel transverse passages 43 are drilled across the plate to intersect the longitudinal passages 40 .
  • parallel longitudinal passages 41 are formed in side plate 46
  • transverse passages 42 are drilled to intersect the longitudinal passages 41 and also longitudinal passage 47 in the base plate 45 .
  • transverse passages 61 are formed in side plate 66
  • transverse passages 62 are drilled to intersect the longitudinal passages 61 and also longitudinal passage 67 in the base plate 45 .
  • heat exchangers are possible within the teachings of the invention, in addition to the plate, L- and U-shaped exchangers described in detail above.
  • a Z-shaped heat exchanger could be produced.
  • a full tube heat exchanger could be made by adding another plate parallel to plate 45 , closing off the open side of the “U”. More or fewer passages could be provided than is shown in the examples, and either longitudinal or transverse passages could be omitted entirely on one side wall 46 or 66 as might be required for a particular application.
  • FIGS. 8 a - 8 c show sectional views of a plate-type heat exchanger similar to that of FIG. 2 , showing differing patterns of liquid flow created by different arrangements of plugs.
  • the heat exchanger of FIGS. 8 a - 8 c has four longitudinal passages 11 a - 11 d , formed as part of the extrusion process of making the plate 10 .
  • Seven transverse passages 80 a - 80 g are drilled to intersect the longitudinal passages 11 a - 11 d . It will be understood that the specific number and location of these passages are shown for explanatory purposes only, and the number and location of longitudinal and transverse passages can be varied within the teachings of the invention.
  • FIG. 8 a shows a heat exchanger configured for a relatively simple fluid flow, similar to that of FIG. 2 .
  • plugs 14 are placed at the ends of longitudinal passages 11 a - 11 d opposite the end with connectors 16 and 17 .
  • Plugs 14 are also placed to block the ends of all of the transverse passages 80 a - 80 g .
  • Plugs 14 are also placed in transverse passage 80 a between longitudinal passages 11 b and 11 c , and in transverse passages 80 b - 80 f between longitudinal passages 11 a and 11 b , between longitudinal passages 11 b and 11 c , and between longitudinal passages 11 c and 11 d .
  • a long plug 88 is placed in transverse passage 80 g , blocking longitudinal passages 11 b and 11 c.
  • FIG. 8 b shows a heat exchanger configured for a more circuitous flow, shown by dot-dashed line 89 b .
  • a U-shaped external fluid connector 81 is used at the end of the plate 10 which has connectors 16 and 17 , to route fluid between longitudinal passages 11 b and 11 c . It will be understood that such external connectors could be used within the teachings of the invention to route fluid flow between other passages, as might be required for a particular flow pattern.
  • plugs 14 are placed at the ends of longitudinal passages 11 a - 11 d opposite the end with connectors 16 and 17 .
  • Plugs are placed in the transverse passages 80 a - 80 g as follows:
  • This arrangement of plugs 14 and long plugs 88 results in a flow 89 b from inlet connector 16 down the length of longitudinal passage 11 a , through transverse passage 80 a to longitudinal passage 11 b , across transverse passage 80 b to longitudinal passage 11 c , across transverse passage 80 a to longitudinal passage 11 d .
  • Fluid passes along 11 d to transverse passage 80 d , crosses over along 80 d to longitudinal passage 11 b .
  • the fluid then exits the plate 10 through connector 81 , and back into the plate 10 through longitudinal passage 11 c , across transverse passage 80 f to longitudinal passage 11 d , then out through outlet connector 17 .
  • FIG. 8 c illustrates still another example of fluid flow 89 c from connector 16 to connector 17 , the flow being more complex than in FIG. 8 a or 8 b , as might be required by a particular electronic assembly.
  • plugs are placed in the transverse passages 80 a - 80 g as follows:
  • Plugs 14 are placed in longitudinal passages 11 a - 11 d as follows:
  • This arrangement of plugs 14 and long plugs 88 results in a flow 89 c from inlet connector 16 into longitudinal passage 11 a , through transverse passage 80 g to longitudinal passage 11 b , across transverse passage 80 f to longitudinal passage 11 a , across transverse passage 80 e to longitudinal passage 11 b .
  • Fluid passes along 11 b to transverse passage 80 d , crosses over along transverse passage 80 d to longitudinal passage 11 a , back to longitudinal passage 11 b through transverse passage 80 c , then back to longitudinal passage 11 a through transverse passage 80 b .
  • transverse passage 80 a From longitudinal passage 11 a , the flow crosses transverse passage 80 a to longitudinal passage 11 c , then up 11 c to transverse passage 80 b , across 80 b to longitudinal passage 11 d . From longitudinal passage 11 d , flow crosses transverse passage 80 c to longitudinal passage 11 c , then back to longitudinal passage 11 d on transverse passage 80 d , back to longitudinal passage 11 c on transverse passage 80 e . The flow continues on longitudinal passage 11 c to transverse passage 80 g , where it crosses to longitudinal passage 11 d , then out through outlet connector 17 .
  • FIG. 9 is a flowchart of a method of making a heat exchanger of the kind described above. It will be understood that the method is applicable to the plate, L- and U-shaped exchangers.

Abstract

A liquid-cooled heat exchanger for electronic assemblies and a method of making the heat exchanger. The exchanger has a solid metal body in the form of an elongated flat plate to which the electronic assembly can be mounted, or a number of such plates formed in an L- or U-shaped configuration to enclose two or more sides of the assembly. The elongated body is formed by extrusion, with parallel enclosed longitudinal passages formed along a length of the body during the extrusion process. Transverse passages are drilled to intersect the extruded longitudinal passages. The longitudinal passages and transverse passages are plugged on at least one of their outside ends, and optionally at points along their lengths, to create desired patterns of liquid flow through the heat exchanger.

Description

    REFERENCE TO RELATED APPLICATIONS
  • This application claims one or more inventions which were disclosed in Provisional Application No. 61/419,930, filed Dec. 6, 2010. The benefit under 35 USC §119(e) of the United States provisional application is hereby claimed, and the aforementioned application is hereby incorporated herein by reference.
  • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The invention pertains to the field of heat exchangers. More particularly, the invention pertains to liquid-cooled heat exchangers and methods of manufacture thereof.
  • 2. Description of Related Art
  • Electronic circuits must frequently operate in demanding physical environments in which liquid cooling is a preferred method for managing the heat associated with power losses. Conventional heat exchange systems use a monolithic air-to-liquid or surface-to-liquid heat exchangers to accomplish the cooling tasks. These conventional heat exchange systems have proven to be less than optimal when considering the aspects of cost and thermal management.
  • In many instances, it has become impossible to effectively couple all of the heat being generated in the system to the liquid cooling utilized to provide heat exchange, which results in excessive temperatures within the liquid-cooled structures. In addition, it is generally difficult to scale a particular solution either up or down in power, thereby requiring a ground up effort to support different power requirements.
  • Modern electronic equipment is often designed for mounting in racks or cabinets with only a small clearance between modules. This does not leave much room for large heat sinks or piping which might extend outward from the modules.
  • Heat exchangers for such modular assemblies are often in the form of flat plates which form one or more sides of the module case, to which circuit boards or heat-generating components may be mounted. If the heat exchangers are liquid cooled, the cooling liquid passes through pipes or tubes soldered or otherwise bonded to a surface of the plates or inset into a surface of the plate, with the fluid being supplied and exhausted from the exchangers through connections on an end of the plate. U.S. Pat. No. 5,829,516 or 6,333,849 show such an arrangement of tubes mounted to or inset into flat plates.
  • Liquid cooled heat exchanger plates have also been provided with internal cooling chambers through which liquid is circulated. U.S. Pat. No. 5,159,529 is an example of such an exchanger, in which essentially the entire interior of the plate forms a fluid chamber.
  • It is known to provide drilled holes through solid plates for cooling. U.S. Pat. No. 5,829,516, noted above, also, in prior art FIGS. 3-5, shows a heat exchange plate in which four parallel holes are drilled from one end through most of the length of a solid plate. Two cross-holes are drilled at least part-way through from the sides near the opposite end to cross-connect the two outer pairs of longitudinal holes. The ends of the cross-holes are plugged, and an external pipe is provided to interconnect the drilled end of the two inner holes, to provide a single serpentine path for the fluid.
  • White Paper TW0055, “Next Generation Military Vehicle Power Conversion Modules”, published in March 2008 by TDI Power (Transistor Devices, Inc.), shows, in FIGS. 9 and 10, a U-shaped water-cooled heat exchanger housing a power converter. Holes are drilled the length of the three sides of the “U” for coolant circulation, similar to the arrangement in the 5,829,516 patent discussed above. While this arrangement has advantages in providing liquid cooling, drilling these long holes for coolant has proven problematic in manufacture.
  • U.S. Pat. No. 7,624,791 shows, in FIGS. 2A and 2B, a tubular cooling body having a central passageway, formed by using a hollow, drawn or extruded raw material. The body is then bent into a U-shaped configuration.
  • SUMMARY OF THE INVENTION
  • The invention presents a liquid-cooled heat exchanger for electronic assemblies and a method of making the heat exchanger. The exchanger has a solid metal body in the form of an elongated flat plate to which an electronic assembly can be mounted, or a number of such plates formed in an L- or U-shaped configuration to enclose two or more sides of the assembly. The elongated body is formed by extrusion, with parallel enclosed longitudinal passages formed along a length of the body during the extrusion process. Transverse passages are drilled to intersect the extruded longitudinal passages. The longitudinal passages and transverse passages are plugged on at least one of their outside ends, and optionally at points along their lengths, to create desired patterns of liquid flow through the heat exchanger.
  • BRIEF DESCRIPTION OF THE DRAWING
  • FIG. 1 shows a perspective view of an electronic assembly mounted within a U-shaped heat exchanger.
  • FIG. 2 shows a top view of a plate-type heat exchanger.
  • FIG. 3 shows a cut-through view of the heat exchanger of FIG. 2, along the lines 3-3.
  • FIG. 4 shows a perspective view of an L-shaped heat exchanger.
  • FIG. 5 shows a cut-through view of the heat exchanger of FIG. 4, along the lines 5-5.
  • FIG. 6 shows a perspective view of a U-shaped heat exchanger.
  • FIG. 7 shows a cut-through view of the heat exchanger of FIG. 6, along the lines 7-7.
  • FIGS. 8 a-8 c show sectional views of a plate-type heat exchanger, showing differing patterns of liquid flow.
  • FIG. 9 is a flowchart of a method of making a heat exchanger.
  • FIG. 10 shows examples of plugs for use with the heat exchanger.
  • DETAILED DESCRIPTION OF THE INVENTION
  • The invention presents a liquid-cooled heat exchanger for electronic assemblies and a method of making the heat exchanger. The exchanger has a solid metal body in the form of an elongated flat plate to which the electronic assembly can be mounted, or a number of such plates formed in an L- or U-shaped configuration to enclose two or more sides of the assembly. The elongated body is formed by extrusion, with parallel enclosed longitudinal passages formed along a length of the body during the extrusion process. Cross-passages are drilled to intersect the extruded longitudinal passages. The longitudinal passages and cross-passages are plugged on at least one of their outside ends, and optionally at points along their lengths, to create desired patterns of liquid flow through the heat exchanger.
  • FIG. 1 shows a perspective view of an electronic assembly 8. The electrical components of the assembly, in this case a power supply, are conventionally mounted on a printed circuit board 6 which has a connector 7 allowing the assembly to connect to wiring or a bus in a rack or other mounting arrangement (not shown).
  • The assembly 8 is mounted within a U-shaped heat exchanger formed of a base plate 1 and sides 2 and 3, which closely surround the components and to which the circuit board 6 is mounted. Heat generated by the components is removed by liquid circulating in passages through the plate 1 and the sides 2 and 3, as will be described in greater detail below. Appropriate pipes or connectors 4 and 5 are provided to connect to a circulating supply of cooling liquid and to carry away heated liquid, as is conventional in a liquid-cooled apparatus.
  • Looking at the heat exchanger in greater detail, FIG. 2 shows a top view of an embodiment of the invention in the form of a flat plate-type heat exchanger, and FIG. 3 shows a cut-through view of the heat exchanger of FIG. 2, along the lines 3-3.
  • The heat exchanger in this embodiment is a flat plate 10 made of a heat-conductive material such as aluminum or other metal, having a thickness, width and length. The dimensions of the plate 10 would be determined in a manner known to the art, so as to fit the electronic assembly which it is intended to cool and to fit in whatever mounting arrangement might be required.
  • The plate 10 is formed by extrusion, and in the process of extrusion a number of parallel passages are formed running longitudinally through the plate. In the example shown in FIG. 2, four such passages are shown—11 a, 11 b, 11 c and 11 d—but it will be understood that any number of passages could be included within the teachings of the invention. FIG. 2 shows a simple arrangement of evenly spaced longitudinal passages 11 a-d, but it will be understood that the passages could be arranged to have more liquid coolant through parts of the plate where more heat load is expected, or, conversely, to avoid areas where holes might need to be drilled to mount larger components. Liquid inlet 16 and outlet 17 connectors provide connections to the circulating cooling liquid system (not shown).
  • Transverse passages are drilled across the width of the plate 10, intersecting some or all of the longitudinal passages 11 a-d. In the example of FIG. 2, parallel transverse passages 13 and 15 are drilled completely across the width of the plate 10, on the end of the plate 10 having connectors 16 and 17, intersecting all four longitudinal passages 11 a-11 d. On the other hand, transverse passages 12 a and 12 b, on the opposite end of the plate 10, are only drilled part-way across the width of the plate, so that transverse passage 12 a only intersects longitudinal passages 11 a and 11 b, while transverse passage 12 b intersects longitudinal passages 11 c and 11 d. As with the longitudinal passages, it will be understood that the particular arrangement of transverse passages shown in the figure are for example only. More or fewer transverse passages could be drilled, in different locations and arrangements, within the teachings of the invention. Transverse passages can be drilled to provide additional passages in areas needing additional cooling, or to avoid areas where mounting holes are needed. FIGS. 8 a-8 c, discussed below, show a plate with four longitudinal passages and seven transverse passages, for example.
  • It will be appreciated that, at the least, the outside ends of the transverse and longitudinal passages will need to be plugged to prevent the cooling liquid from the fluid input 16 from simply flowing out of the ends of the passages. This can be done by welding or brazing, or by inserting plugs 14 into the outer ends of the passages as shown in the figure.
  • FIG. 10 shows several examples of plugs as might be used within the teachings of the invention. Plugs 100 and 110, of differing lengths as will be discussed in greater detail below, could be made of resilient material and compressed into the passages, or the plugs 14 could be made of rigid material and press-fit into the passages and secured by a sealant or adhesive. Alternatively, the passages may be threaded along at least the outermost portion of their lengths, to facilitate screwing plug 120 into the plate.
  • The arrangement of intersecting longitudinal and transverse passages makes it possible to use additional plugs to create a desired internal liquid flow. Plugs can be relatively short and pushed into the transverse or longitudinal passages until they lodge between passages, thus blocking flow from one passage to another parallel to it. In the example of FIG. 2, this has been done in transverse passage 13, where plugs 20 block liquid flow through transverse passage 13 from longitudinal passage 11 a to longitudinal passage 11 b, or from 11 c to 11 d. Because there is no plug between longitudinal passages 11 b and 11 c, liquid can flow from one passage to the other through transverse passage 13.
  • Longer plugs can be used to block two or more longitudinal and transverse passages simultaneously, such as plug 18, shown pushed into transverse passage 15 across longitudinal passages 11 b and 11 c. This not only blocks flow along transverse passage 15, but also prevents flow between the intersecting longitudinal passages 11 b and 11 c.
  • Dash-dot line 19 shows the flow of fluid through the heat exchanger shown in FIG. 2. Fluid flows in connector 16, then along longitudinal passage 11 a and through transverse passage 12 a to longitudinal passage 11 b. Plug 18 blocks passage 11 b, so the fluid flows across transverse passage 13 to longitudinal passage 11 c, then to transverse passage 12 b, and back on longitudinal passage 11 d to exit at connector 17.
  • FIG. 4 shows a perspective view of an L-shaped heat exchanger, and FIG. 5 shows a cut-through view of the heat exchanger of FIG. 4, along the lines 5-5.
  • An L-shaped heat exchanger would have a base plate 45 and side plate 46, preferably formed as a single unit by extrusion. Parallel longitudinal passages 40 and 47 are formed during the extrusion process along the length of the base plate 45, and a number of parallel transverse passages 43 are drilled across the plate to intersect the longitudinal passages 40. Similarly, parallel longitudinal passages 41 are formed in side plate 46, and transverse passages 42 are drilled to intersect the longitudinal passages 41 and also longitudinal passage 47 in the base plate 45. By having longitudinal passage 47 intersected by both sets of transverse passages 42 and 43, it is possible by appropriate insertion of plugs to direct fluid flow between connectors 16 and 17 through both base plate 45 and side plate 46.
  • FIG. 6 shows a perspective view of a U-shaped heat exchanger, and FIG. 7 shows a cut-through view of the heat exchanger of FIG. 6, along the lines 7-7. An electronic assembly can be mounted to the U-shaped heat exchanger, as shown in FIG. 1, forming a modular liquid cooled electronic component.
  • As with the L-shaped heat exchanger described above, the U-shaped heat exchanger would have a base plate 45 and side plate 46, and would also have a second side plate 66. Preferably, all three plates 45, 46 and 67 are formed as a single unit by extrusion. Parallel longitudinal passages 40, 47 and 62 are formed during the extrusion process along the length of the base plate 45, and a number of parallel transverse passages 43 are drilled across the plate to intersect the longitudinal passages 40. Similarly, parallel longitudinal passages 41 are formed in side plate 46, and transverse passages 42 are drilled to intersect the longitudinal passages 41 and also longitudinal passage 47 in the base plate 45. Also, parallel longitudinal passages 61 are formed in side plate 66, and transverse passages 62 are drilled to intersect the longitudinal passages 61 and also longitudinal passage 67 in the base plate 45. By having longitudinal passages 47 and 67 intersected by all of the of transverse passages 42, 62 and 43, it is possible by appropriate insertion of plugs to direct fluid flow between connectors 16 and 17 through base plate 45 and both side plates 46 and 66.
  • Other designs of heat exchangers are possible within the teachings of the invention, in addition to the plate, L- and U-shaped exchangers described in detail above. For example, if the side walls 46 and 66 from the U-shaped exchanger were put on opposite surfaces of the plate 45, a Z-shaped heat exchanger could be produced. Alternatively, a full tube heat exchanger could be made by adding another plate parallel to plate 45, closing off the open side of the “U”. More or fewer passages could be provided than is shown in the examples, and either longitudinal or transverse passages could be omitted entirely on one side wall 46 or 66 as might be required for a particular application.
  • The use of the intersecting transverse and longitudinal passages and long and short plugs allows for flexibility and efficiency, by allowing a designer to use a standardized heat exchanger and then customize the fluid flow as required by the electronic components to be cooled. To illustrate this process, FIGS. 8 a-8 c show sectional views of a plate-type heat exchanger similar to that of FIG. 2, showing differing patterns of liquid flow created by different arrangements of plugs.
  • The heat exchanger of FIGS. 8 a-8 c has four longitudinal passages 11 a-11 d, formed as part of the extrusion process of making the plate 10. Seven transverse passages 80 a-80 g are drilled to intersect the longitudinal passages 11 a-11 d. It will be understood that the specific number and location of these passages are shown for explanatory purposes only, and the number and location of longitudinal and transverse passages can be varied within the teachings of the invention.
  • FIG. 8 a shows a heat exchanger configured for a relatively simple fluid flow, similar to that of FIG. 2. As in FIG. 2, plugs 14 are placed at the ends of longitudinal passages 11 a-11 d opposite the end with connectors 16 and 17. Plugs 14 are also placed to block the ends of all of the transverse passages 80 a-80 g. Plugs 14 are also placed in transverse passage 80 a between longitudinal passages 11 b and 11 c, and in transverse passages 80 b-80 f between longitudinal passages 11 a and 11 b, between longitudinal passages 11 b and 11 c, and between longitudinal passages 11 c and 11 d. A long plug 88 is placed in transverse passage 80 g, blocking longitudinal passages 11 b and 11 c.
  • This results in a simple back-and-forth fluid flow shown by dot-dashed line 89 a. Fluid flows in connector 16, then along longitudinal passage 11 a and through transverse passage 80 a to longitudinal passage 11 b. Plug 88 blocks passage 11 b, so the fluid flows across transverse passage 80 f to longitudinal passage 11 c, then to transverse passage 80 a, and back on longitudinal passage 11 d to exit at connector 17.
  • FIG. 8 b shows a heat exchanger configured for a more circuitous flow, shown by dot-dashed line 89 b. In this example, a U-shaped external fluid connector 81 is used at the end of the plate 10 which has connectors 16 and 17, to route fluid between longitudinal passages 11 b and 11 c. It will be understood that such external connectors could be used within the teachings of the invention to route fluid flow between other passages, as might be required for a particular flow pattern.
  • In the example of FIG. 8 b, plugs 14 are placed at the ends of longitudinal passages 11 a-11 d opposite the end with connectors 16 and 17. Plugs are placed in the transverse passages 80 a-80 g as follows:
      • in transverse passage 80 a, a plug 14 at each end and between longitudinal passages 11 b and 11 c.
      • in transverse passage 80 b, a plug 14 at each end, between longitudinal passages 11 a and 11 b and between longitudinal passages 11 c and 11 d.
      • in transverse passage 80 c, a plug 14 at each end, and a long plug 88 is placed across longitudinal passages 11 c and 11 d.
      • in transverse passage 80 d, a plug 14 is placed at each end and between longitudinal passages 11 a and 1lb.
      • in transverse passage 80 e, plugs 14 are placed at the end of the passage adjacent longitudinal passage 11 a, and between longitudinal passages 11 a and 11 b, and a long plug 88 is placed across longitudinal passages 11 c and 11 d.
      • in transverse passage 80 f, plugs 14 are placed at each end, between longitudinal passages 11 a and 11 b and between longitudinal passages 11 b and 11 c.
      • in transverse passage 80 g, a plug 14 at each end, between longitudinal passages 11 a and 11 b and between longitudinal passages 11 c and 11 d.
  • This arrangement of plugs 14 and long plugs 88 results in a flow 89 b from inlet connector 16 down the length of longitudinal passage 11 a, through transverse passage 80 a to longitudinal passage 11 b, across transverse passage 80 b to longitudinal passage 11 c, across transverse passage 80 a to longitudinal passage 11 d. Fluid passes along 11 d to transverse passage 80 d, crosses over along 80 d to longitudinal passage 11 b. The fluid then exits the plate 10 through connector 81, and back into the plate 10 through longitudinal passage 11 c, across transverse passage 80 f to longitudinal passage 11 d, then out through outlet connector 17.
  • FIG. 8 c illustrates still another example of fluid flow 89 c from connector 16 to connector 17, the flow being more complex than in FIG. 8 a or 8 b, as might be required by a particular electronic assembly.
  • In the example of FIG. 8 c, plugs are placed in the transverse passages 80 a-80 g as follows:
      • in transverse passage 80 a, a plug 14 at the end of the passage adjacent longitudinal passage 11 a, and a long plug 88 is inserted from the opposite end, blocking longitudinal passage 11 d.
      • in transverse passages 80 b, 80 c, 80 d and 80 e, a plug 14 at each end and between longitudinal passages 11 b and 11 c.
      • in transverse passage 80 f, a plug 14 at each end and between longitudinal passages 11 b and 11 c and between longitudinal passages 11 c and 11 d.
      • in transverse passage 80 g, a plug 14 at each end and between longitudinal passages 11 b and 11 c.
  • Plugs 14 are placed in longitudinal passages 11 a-11 d as follows:
      • in longitudinal passage 11 a, at the end opposite connector 16, between transverse passages 80 b and 80 c, between transverse passages 80 d and 80 e, and between transverse passages 80 f and 80 g.
      • in longitudinal passage 11 b, at both ends, between transverse passages 80 a and 80 b, between transverse passages 80 c and 80 d, and between transverse passages 80 e and 80 f.
      • in longitudinal passage 11 c, at both ends, between transverse passages 80 b and 80 c, and between transverse passages 80 d and 80 e.
      • in longitudinal passage 11 d, between transverse passages 80 c and 80 d, and between transverse passages 80 e and 80 f.
  • This arrangement of plugs 14 and long plugs 88 results in a flow 89 c from inlet connector 16 into longitudinal passage 11 a, through transverse passage 80 g to longitudinal passage 11 b, across transverse passage 80 f to longitudinal passage 11 a, across transverse passage 80 e to longitudinal passage 11 b. Fluid passes along 11 b to transverse passage 80 d, crosses over along transverse passage 80 d to longitudinal passage 11 a, back to longitudinal passage 11 b through transverse passage 80 c, then back to longitudinal passage 11 a through transverse passage 80 b. From longitudinal passage 11 a, the flow crosses transverse passage 80 a to longitudinal passage 11 c, then up 11 c to transverse passage 80 b, across 80 b to longitudinal passage 11 d. From longitudinal passage 11 d, flow crosses transverse passage 80 c to longitudinal passage 11 c, then back to longitudinal passage 11 d on transverse passage 80 d, back to longitudinal passage 11 c on transverse passage 80 e. The flow continues on longitudinal passage 11 c to transverse passage 80 g, where it crosses to longitudinal passage 11 d, then out through outlet connector 17.
  • FIG. 9 is a flowchart of a method of making a heat exchanger of the kind described above. It will be understood that the method is applicable to the plate, L- and U-shaped exchangers.
    • 90. First, the body of the heat exchanger is produced by extrusion. By methods known to the art, the body shape and dimensions can be determined as required. The longitudinal passages are formed as part of the extrusion process.
    • 91. Optionally, the extrusion can be made much longer than the actual device, in which case the extrusion will be cut to length. Alternatively, the extrusion can be made to the desired length, and a cutting step will not be necessary.
    • 92. The transverse passages are drilled.
    • 93. If desired, all or some of the lengths of the longitudinal passages and transverse passages are threaded to accept plugs or connectors.
    • 94. Internal plugs are inserted into the transverse passages and/or longitudinal passages, and located as needed to produce the desired flow patterns.
    • 95. The ends of the transverse passage and longitudinal passages are sealed with plugs, as needed.
    • 96. Connectors are installed on the ends of one or more passages as desired.
    • 97. An electronic assembly is mounted to the heat exchanger.
  • Accordingly, it is to be understood that the embodiments of the invention herein described are merely illustrative of the application of the principles of the invention. Reference herein to details of the illustrated embodiments is not intended to limit the scope of the claims, which themselves recite those features regarded as essential to the invention.

Claims (18)

1. A heat exchanger for electronic assemblies, comprising:
a) a solid heat-conductive base plate having a length, a width and a thickness, the plate being formed by extrusion with a plurality of parallel longitudinal passages enclosed in the thickness along the length of the base plate; the base plate also having a plurality of parallel transverse passages drilled across at least part of the width, perpendicular to the plurality of longitudinal passages, such that each transverse passage intersects at least two longitudinal passages;
b) a fluid inlet at an end of a longitudinal passage or a transverse passage;
c) a fluid outlet at an end of a longitudinal passage or a transverse passage; and
d) a plurality of plugs for blocking fluid flow, inserted into the plurality of longitudinal passages and the plurality of transverse passages,
the plugs being located such that fluid is constrained to flow from the fluid inlet through the plurality of longitudinal passages and the plurality of transverse passages to the fluid outlet.
2. The heat exchanger of claim 1, in which the exchanger further comprises a solid heat-conductive side wall having a length, a height and a thickness, formed by extrusion with the base plate to form an L-shaped unit, the side wall having a plurality of parallel longitudinal passages enclosed in the thickness along the length of the side wall; the side wall also having a plurality of parallel transverse passages drilled across at least part of the height, perpendicular to the plurality of longitudinal passages, such that each transverse passage intersects at least two longitudinal passages.
3. The heat exchanger of claim 2, in which at least one of the transverse passages is drilled to intersect at least one longitudinal passage on the base plate and at least one longitudinal passage on the side wall.
4. The heat exchanger of claim 1, in which the exchanger further comprises two solid heat-conductive side walls having a length, a height and a thickness, formed by extrusion with the base plate to form a U-shaped unit, at least one of the side walls having a plurality of parallel longitudinal passages enclosed in the thickness along the length of the side walls; and at least one of the side walls also having a plurality of parallel transverse passages drilled across at least part of the height, perpendicular to the plurality of longitudinal passages, such that each transverse passage intersects at least two longitudinal passages.
5. The heat exchanger of claim 4, in which at least one of the transverse passages in a side wall is drilled to intersect at least one longitudinal passage on the base plate and at least one longitudinal passage on the side wall.
6. The heat exchanger of claim 4, in which both side walls are extruded with longitudinal passages and drilled with transverse passages.
7. The heat exchanger of claim 1, in which the plugs are made of resilient material.
8. The heat exchanger of claim 1, in which at least an end portion of the transverse passages and the longitudinal passages is threaded.
9. The heat exchanger of claim 8, in which at least some of the plugs are threaded to mate with a threaded end portion of the longitudinal passages and the transverse passages.
10. The heat exchanger of claim 1, in which at least one plug has a length sufficient to block more than one passage when the plug is inserted into an intersecting passage.
11. The heat exchanger of claim 1, further comprising a U-shaped connector for insertion into an end of two parallel longitudinal passages or two transverse passages, for fluid flow therebetween.
12. A method of making a heat exchanger for electronic assemblies, comprising:
a) extruding a solid heat-conductive plate having a length, a width and a thickness, with a plurality of parallel longitudinal passages enclosed in the thickness along the length of the plate;
b) drilling a plurality of parallel transverse passages drilled across at least part of the width, perpendicular to the plurality of longitudinal passages, such that each transverse passage intersects at least two longitudinal passages;
c) inserting a plurality of plugs for blocking fluid flow into the plurality of longitudinal passages and the plurality of transverse passages, the plugs being located such that fluid is constrained to flow from a fluid inlet at an end of a longitudinal passage or a transverse passage through the plurality of longitudinal passages and the plurality of transverse passages to a fluid outlet at an end of a longitudinal passage or a transverse passage.
13. The method of claim 12, further comprising sealing an open end of at least one longitudinal passage or transverse passage.
14. The method of claim 12, further comprising installing a connector at the fluid input and at the fluid output.
15. The method of claim 12, further comprising mounting an electronic assembly to the base plate.
16. The method of claim 12, further comprising cutting the base plate to a determined length.
17. The method of claim 12, in which the plate is formed with a base plate and a side wall forming an L-shaped heat exchanger.
18. The method of claim 12, in which the plate is formed with a base plate and two side walls forming a U-shaped heat exchanger.
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITPI20130063A1 (en) * 2013-07-04 2015-01-05 Cosmec Italia S R L THERMAL EXCHANGE BODY AND EQUIPMENT FOR THE PRODUCTION OF ICE, IN PARTICULAR, FOR USE WITH HIGH PRESSURE REFRIGERANT FLUIDS, AND METHOD FOR THE MANUFACTURE OF THESE HEAT EXCHANGES
CN105108335A (en) * 2014-04-14 2015-12-02 黑拉许克联合股份有限公司 Device for cooling power electronics by means of a cooling medium and method for producing the device
US20160151941A1 (en) * 2013-07-18 2016-06-02 Brückner Maschinenbau Gmbh& Co.Kg Lateral guide rail for a transport system, in particular a stretching unit
US9445526B2 (en) 2014-12-22 2016-09-13 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
US20170229378A1 (en) * 2013-03-15 2017-08-10 Atieva, Inc. Inverter power module packaging with cold plate
US9980415B2 (en) 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling
EP3415856A1 (en) * 2017-06-13 2018-12-19 Nokia Solutions and Networks Oy Modular heat exchanger and method for making the same
EP3490355A1 (en) * 2017-11-28 2019-05-29 Siemens Aktiengesellschaft Modular converter
US11126165B2 (en) * 2020-02-11 2021-09-21 Uatc, Llc Vehicle computing system cooling systems
EP4017235A1 (en) * 2020-12-18 2022-06-22 Valeo Siemens eAutomotive France SAS Cooling module for an electrical assembly
CN114667035A (en) * 2022-03-02 2022-06-24 中国电子科技集团公司第二十九研究所 Flow resistance adjustable simulation leads to fluid device
EP3962257A4 (en) * 2020-05-28 2022-07-13 Hangzhou Dareruohan Technology Co., Ltd. Heat dissipation device, and heat dissipation and heating system
US11699634B2 (en) * 2019-05-03 2023-07-11 Applied Materials, Inc. Water cooled plate for heat management in power amplifiers

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3084810B1 (en) * 2018-07-31 2022-01-14 Valeo Systemes Thermiques THERMAL REGULATION ELEMENT OF AN ELECTRICAL COMPONENT, OF A MOTOR VEHICLE, LIKELY TO GENERATE HEAT DURING ITS OPERATION
CN113811150A (en) * 2021-08-12 2021-12-17 珠海英搏尔电气股份有限公司 Heat dissipation bridge, motor controller, power assembly and vehicle

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1621742A (en) * 1925-08-20 1927-03-22 Farrel Foundry And Machine Co Fluid-circulating plate
US1818387A (en) * 1928-07-23 1931-08-11 Southwark Foundry & Machine Co Steam platen
US1929824A (en) * 1931-05-12 1933-10-10 French Oil Mill Machinery Press plate or the like and method of making the same
US2743347A (en) * 1954-04-06 1956-04-24 Dubl Dee Engineering Corp Heat transfer unit
US3904933A (en) * 1974-10-23 1975-09-09 Control Data Corp Cooling apparatus for electronic modules
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US6031751A (en) * 1998-01-20 2000-02-29 Reliance Electric Industrial Company Small volume heat sink/electronic assembly
US6213195B1 (en) * 1998-12-23 2001-04-10 Hamilton Sundstrand Corporation Modular coolant manifold for use with power electronics devices having integrated coolers
WO2002035898A1 (en) * 2000-10-24 2002-05-02 Siemens Aktiengesellschaft Liquid-cooled housing
US20030106681A1 (en) * 2001-12-07 2003-06-12 Roland Hauri Chill tube for the continuous casting of metals
US20050241806A1 (en) * 2004-04-30 2005-11-03 I-Ming Liu Radiator plate rapid cooling apparatus
US7320359B2 (en) * 2003-06-04 2008-01-22 Vacon Oyj Liquid cooling element and connection arrangement of liquid cooling element
US20100044023A1 (en) * 2008-08-21 2010-02-25 Andres Alberto Canales Heat exchanger systems & fabrication methods

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6354002B1 (en) * 1997-06-30 2002-03-12 Solid State Cooling Systems Method of making a thick, low cost liquid heat transfer plate with vertically aligned fluid channels
FI117590B (en) * 2004-06-11 2006-11-30 Abb Oy Heat Sink
US20080104840A1 (en) * 2006-11-03 2008-05-08 Qnx Cooling Systems Inc. Heat transfer unit extrusion process

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1621742A (en) * 1925-08-20 1927-03-22 Farrel Foundry And Machine Co Fluid-circulating plate
US1818387A (en) * 1928-07-23 1931-08-11 Southwark Foundry & Machine Co Steam platen
US1929824A (en) * 1931-05-12 1933-10-10 French Oil Mill Machinery Press plate or the like and method of making the same
US2743347A (en) * 1954-04-06 1956-04-24 Dubl Dee Engineering Corp Heat transfer unit
US3904933A (en) * 1974-10-23 1975-09-09 Control Data Corp Cooling apparatus for electronic modules
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US6031751A (en) * 1998-01-20 2000-02-29 Reliance Electric Industrial Company Small volume heat sink/electronic assembly
US6213195B1 (en) * 1998-12-23 2001-04-10 Hamilton Sundstrand Corporation Modular coolant manifold for use with power electronics devices having integrated coolers
WO2002035898A1 (en) * 2000-10-24 2002-05-02 Siemens Aktiengesellschaft Liquid-cooled housing
US20030106681A1 (en) * 2001-12-07 2003-06-12 Roland Hauri Chill tube for the continuous casting of metals
US7320359B2 (en) * 2003-06-04 2008-01-22 Vacon Oyj Liquid cooling element and connection arrangement of liquid cooling element
US20050241806A1 (en) * 2004-04-30 2005-11-03 I-Ming Liu Radiator plate rapid cooling apparatus
US20100044023A1 (en) * 2008-08-21 2010-02-25 Andres Alberto Canales Heat exchanger systems & fabrication methods

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Translation of document WO 0235898 A1 named TRANS-WO 0235898 A1 *

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10321613B2 (en) * 2013-03-15 2019-06-11 Atieva, Inc. Inverter power module packaging with cold plate
US20170229378A1 (en) * 2013-03-15 2017-08-10 Atieva, Inc. Inverter power module packaging with cold plate
ITPI20130063A1 (en) * 2013-07-04 2015-01-05 Cosmec Italia S R L THERMAL EXCHANGE BODY AND EQUIPMENT FOR THE PRODUCTION OF ICE, IN PARTICULAR, FOR USE WITH HIGH PRESSURE REFRIGERANT FLUIDS, AND METHOD FOR THE MANUFACTURE OF THESE HEAT EXCHANGES
US20160151941A1 (en) * 2013-07-18 2016-06-02 Brückner Maschinenbau Gmbh& Co.Kg Lateral guide rail for a transport system, in particular a stretching unit
US10525616B2 (en) * 2013-07-18 2020-01-07 Brückner Maschinenbau GmbH & Co. KG Lateral guide rail for a transport system, in particular a stretching unit
CN105108335A (en) * 2014-04-14 2015-12-02 黑拉许克联合股份有限公司 Device for cooling power electronics by means of a cooling medium and method for producing the device
US9445526B2 (en) 2014-12-22 2016-09-13 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
US9980415B2 (en) 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling
WO2018228766A1 (en) * 2017-06-13 2018-12-20 Nokia Solutions And Networks Oy Modular heat exchanger and method for making the same
EP3415856A1 (en) * 2017-06-13 2018-12-19 Nokia Solutions and Networks Oy Modular heat exchanger and method for making the same
EP3490355A1 (en) * 2017-11-28 2019-05-29 Siemens Aktiengesellschaft Modular converter
US11699634B2 (en) * 2019-05-03 2023-07-11 Applied Materials, Inc. Water cooled plate for heat management in power amplifiers
US11126165B2 (en) * 2020-02-11 2021-09-21 Uatc, Llc Vehicle computing system cooling systems
US20220019194A1 (en) * 2020-02-11 2022-01-20 Uatc, Llc Vehicle Computing System Cooling Systems
US11287806B2 (en) 2020-02-11 2022-03-29 Uatc, Llc Vehicle computing system cooling systems
US11537106B2 (en) * 2020-02-11 2022-12-27 Uatc, Llc Vehicle computing system cooling systems
EP3962257A4 (en) * 2020-05-28 2022-07-13 Hangzhou Dareruohan Technology Co., Ltd. Heat dissipation device, and heat dissipation and heating system
EP4017235A1 (en) * 2020-12-18 2022-06-22 Valeo Siemens eAutomotive France SAS Cooling module for an electrical assembly
FR3118393A1 (en) * 2020-12-18 2022-06-24 Valeo Siemens Eautomotive France Sas Cooling module for an electrical assembly
CN114667035A (en) * 2022-03-02 2022-06-24 中国电子科技集团公司第二十九研究所 Flow resistance adjustable simulation leads to fluid device

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