US20130068433A1 - Heat exchanger - Google Patents
Heat exchanger Download PDFInfo
- Publication number
- US20130068433A1 US20130068433A1 US13/422,908 US201213422908A US2013068433A1 US 20130068433 A1 US20130068433 A1 US 20130068433A1 US 201213422908 A US201213422908 A US 201213422908A US 2013068433 A1 US2013068433 A1 US 2013068433A1
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- Prior art keywords
- heat sink
- heat
- flat tube
- heat exchanger
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
- F28D1/05366—Assemblies of conduits connected to common headers, e.g. core type radiators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention generally relates to heat exchanger tubes and more particularly to flat heat exchanger tubes produced from sheet metal strips.
- the cold plate includes channels within it for distributing the cooling liquid, and inlets and outlets for enabling the liquid to enter and exit the cold plate.
- the cold plate is then mated to the electronic circuit board.
- the electrical components on the circuit board that touch the cold plate are thereby cooled because of their close proximity to the cooling liquid, but at no time do the electrical components actually touch the cooling liquid directly.
- the fins in the conventional tube are continuous through out the length of the tube.
- the limitation of continuous fins is that the rate of heat transfer is limited due to the effect of boundary layer that initially develops and remains constant over the length of the tube.
- a heat exchanger for controlling temperature of electrical or electronic components.
- the heat exchanges comprises at least one flat tube having an inlet port and an outlet port such that a fluid coolant enters the flat tube through the inlet port and exits the flat tube through the outlet port so as to pass through multiple heat sinks located within the flat tube, a first heat sink coupled to the flat plate, the first heat sink comprising multiple fins arranged based on a first fin configuration, a second heat sink coupled to the flat plate, the second heat sink comprising multiple fins arranged based on a second fin configuration and at least one coupling device configured for receiving one or more components.
- the multiple heat sinks within the flat tube are arranged based on the position of one or more components mounted on the flat tube such that the fin densities of the heat sinks are proportional to heating characteristics of the components mounted thereon.
- a cold plate for fluid cooling one or more components comprises at least one flat tube having an inlet port and an outlet port so as to allow a coolant fluid to flow through the flat tube such that the coolant fluid passes through multiple heat sinks located within the flat tube, a first heat sink coupled to the flat plate, the first heat sink comprising multiple fins arranged based on a first fin configuration and a second heat sink coupled to the flat plate, the second heat sink comprising multiple fins arranged based on a second fin configuration. Further, the first heat sink is located at a predetermined distance from the second heat sink so as to facilitate formation of multiple boundary layers in order to increase the heat transfer coefficient.
- FIG. 1 shows a schematic diagram of a heat exchanger as described in an embodiment
- FIG. 2 shows a schematic diagram of an exemplary arrangement of heat sinks within a flat tube as described in an embodiment.
- the heat exchanger 100 includes at least one flat tube 104 formed from a circular tube to have a top surface and a bottom surface that are substantially parallel and contiguously connected by rounded corners and defining an interior space. This interior space of the flat tube 104 is used for a coolant to flow through.
- the flat tube 104 includes a plurality of heat sinks extending into the interior space. Each of the heat sinks comprise multiple fins arranged in a certain fin configuration to form a plurality of channels inside the flat tube 104 for defining a passage for the fluid coolant there through.
- three flat tubes 104 are connected between the inlet port 106 and the outlet port 108 , however the number of flat tubes 104 can vary depending on the application.
- An inlet header tube accommodates one or more inlet ports 106 through which the fluid coolant enters the multiple flat tubes 104 .
- an outlet header tube houses one or more outlet ports 108 through which the fluid coolant exits the multiple flat tubes 104 .
- Multiple parallel flat tubes 104 are coupled to the header tubes through brazed joints 110 .
- the flat tubes 104 may be made from copper, aluminum, various nickel alloys, titanium, graphite and like metals and composites.
- the coolant may be a liquid such as water or an inert gas.
- the coolant passing through the flat tubes 104 absorbs the heat from the flat tube 104 walls and in convection heat transfer mode. During the process, the coolant's temperature increases. The coolant exits the heat exchanger 100 through the outlet header tube. Thus the heat generated from the components is removed from the coolant using the heat exchanger 100 .
- a first heat sink coupled to the flat plate comprises multiple fins arranged based on a first fin configuration and a second heat sink coupled to the flat plate comprises multiple fins arranged based on a second fin configuration.
- the heat exchanger 100 further comprises a base plate 102 having at least one slot configured to support the at least one flat tube 104 .
- the base plate 102 has a roughly constant, comparatively small thickness over its entire width.
- the cross-section of the base plate 102 is designed in the manner of a rectangle, where the long sides of the rectangle lie parallel to the tube surface.
- the cooling fluid enters the base plate 102 via an inlet port 106 as indicated by arrow and exits the base plate 102 via outlet port 108 as indicated schematically by arrow.
- the heat exchanger 100 further comprises at least one coupling device configured for receiving one or more components.
- a component includes an electronic, electrical or power circuit component capable of getting heated.
- electrical/electronic components are directly attached to the top surface of the heat exchanger 100 by glue, epoxy or other known adhesives.
- screw attachments are attached to the top surface of the base plate 102 so that the electrical components can be conveniently attached and removed as necessary.
- the screw attachments may be of aluminum, copper or other like materials and compositions.
- the multiple heat sinks within the flat tube 104 are arranged based on the position of one or more components mounted on the flat tube 104 such that the fin densities of the heat sinks are proportional to heating characteristics of the components mounted thereon.
- a first circuit component that is expected to be heated to higher temperature when compared to a second circuit component positioned adjacent to the first circuit component
- a first heat sink having higher fin density is positioned below the first component
- a second heat sink having a comparatively lower fin density is positioned below the second component that is expected to be heated to a lower temperature.
- vacuum-brazing technique is utilized. Vacuum brazing allows the use of high performance fins to be placed within the liquid channel at locations where better heat transfer is desired by the surface of the base plate 102 .
- the second heat sink is located a predetermined distance from the first heat sink.
- the heat sinks are positioned such that a predetermined distance exists between two successive heat sinks inside the cold plate so as to break the boundary layers to promote the flow of the fluid coolant to be converted into turbulent flow, thereby improving heat transfer ability.
- the first fin configuration is selected from one of an extruded, bonded, elliptical and pin configuration.
- the second fin configuration is selected from one of an extruded, bonded, elliptical and pin configuration.
- two successive heat sinks may have a similar fin configuration.
- two successive heat sinks may have varied fin configurations.
- An exemplary arrangement of the heat sinks having varied fin configurations is depicted in FIG. 2 . In the example shown in FIG.
- the flat tube 200 comprises seven heat sinks wherein the first heatsink has an extruded fin configuration 202 , the second heatsink has a pin fin configuration 204 , the third heatsink has an elliptical fin configuration 206 , the fourth heatsink has a folded fin configuration 208 , the fifth heatsink has an elliptical fin configuration 210 , the sixth heatsink has a pin fin configuration 212 and the seventh heatsink has an extruded fin configuration 214 .
- the thickness and length of the fins may vary based on the desired application of the heat exchanger 100 . This arrangement of heatsinks gives rise to the flat tube 200 with increased surface area and increased turbulence.
- a flat tube 104 of this type presents advantages related to heat technology, because, for example when being operated as a cooling tube, the heat transfer characteristics for the coolant can be improved through the generation of turbulence at the intermediate portions between two successive heat sinks.
- each of the multiple heatsinks is manufactured from a material selected from the group comprising copper, aluminum, titanium, graphite and alloys thereof. Accordingly, two successive heatsinks may comprise same material. Alternatively, two successive heat sinks may be made up of different materials. In one exemplary embodiment, the first heatsink may comprise copper whereas the second heat sink may comprises aluminum or some other material other than copper.
- a method of providing internal fins to a coolant carrying tube is presented.
- a series of heatsinks with desired fin configurations are added as an insert to the interior space of the flat tube 104 .
- the heat sinks are pre-applied with a brazing alloy and are positioned inside the flat tube 104 at a desired location.
- the heatsinks along with the flat tube 104 are then placed inside a soldering oven to get the heat sinks brazed to the inside wall of the flat tube 104 .
- the surface area inside the flat tube 104 is increased which helps increase the heat transfer efficiency of the heat exchanger 100 .
- the heat exchanger 100 disclosed herein helps increase the heat transfer in the base plate 102 by increasing the surface area in the flat tube 104 and by creating turbulence in the flow at a desired area such as under a hot spot.
- a heatsink with intricate fin configuration offers resistance to the flow.
- the desired turbulence can be created.
- a combination of heatsinks with different fin configuration can be positioned inside the flat tube 104 based on the heat load pattern on the base plate 102 so as to offer more surface area for heat transfer under a hot spot.
- the heat exchanger 100 described herein employed to cool gradient coils in an magnetic resonance imaging (MRI)) system.
- MRI magnetic resonance imaging
- a gradient pulse amplifier applies current pulses to selected gradient coil assemblies to create magnetic field gradients in the three dimensions of the examination region.
- These high-powered devices generate significant thermal energy, which, if not removed, limit the device lifetime.
- a cold plate or heat exchanger 100 acts to remove heat from the gradient coil of the MRI system. The cold plate can effectively cool the gradient coil down to cryogenic temperatures.
- the heat exchanger 100 helps to maintain gradient coil temperature within a specified range regardless of the selected excitation applied, thereby enabling higher power applications for faster imaging with improved image quality and longer scan times.
- the cold plate or heat exchanger 100 acts to remove heat from a thermally conductive side of a power semiconductor device.
- the thermally conductive side of the semiconductor is maintained in firm thermal contact with the heat sink by screws or other suitable affixing mechanisms.
- Advantages of the heat exchanger 100 described herein include easy manufacturability, flexibility to select and arrange different type of heatsinks having varied fin configurations depending on the heat load pattern on the base plate 102 and ability to increase the heat transfer coefficient by maintaining distance between successive heatsinks within the flat tube 104 .
- a heat exchanger for cooling various circuit components is described.
- the embodiments are not limited and may be implemented in connection with different applications.
- the application of the invention can be extended to other areas, for example in a refrigeration apparatus, in an air conditioning system for vehicles and as a radiator for a automobiles.
- the design can be carried further and implemented in various forms and specifications.
Abstract
A heat exchanger for controlling temperature of electrical or electronic components has at least one flat tube with an inlet port and outlet port. A coolant entering through the inlet port passes through multiple heat sinks located within the flat tube before exiting through the outlet port. The heat exchanger has a first heat sink coupled to the flat plate with multiple fins arranged based on a first fin configuration, a second heat sink coupled to the flat plate with multiple fins arranged based on a second fin configuration, and at least one coupling device. The heat sinks are arranged based on a position of one or more components mounted on the flat tube such that the number of heat sink fins is proportional to heating characteristics of the components mounted on the tube.
Description
- The invention generally relates to heat exchanger tubes and more particularly to flat heat exchanger tubes produced from sheet metal strips.
- Electronic/electrical components mounted on any circuit board generate heat, which must be dissipated for their proper functioning. In low power density applications, air is typically used to cool these electronic components. The use of fans, ducting and/or heatsinks to accomplish this is well understood and widely used in industry.
- One conventional technique for cooling electronic components uses a liquid-cooled plate. The cold plate includes channels within it for distributing the cooling liquid, and inlets and outlets for enabling the liquid to enter and exit the cold plate. The cold plate is then mated to the electronic circuit board. The electrical components on the circuit board that touch the cold plate are thereby cooled because of their close proximity to the cooling liquid, but at no time do the electrical components actually touch the cooling liquid directly.
- The fins in the conventional tube are continuous through out the length of the tube. The limitation of continuous fins is that the rate of heat transfer is limited due to the effect of boundary layer that initially develops and remains constant over the length of the tube.
- Hence there exists a need for a heat exchanger tube that performs efficient heat transfer.
- The above-mentioned shortcomings, disadvantages and problems are addressed herein which will be understood by reading and understanding the following specification.
- In one embodiment a heat exchanger for controlling temperature of electrical or electronic components is provided. The heat exchanges comprises at least one flat tube having an inlet port and an outlet port such that a fluid coolant enters the flat tube through the inlet port and exits the flat tube through the outlet port so as to pass through multiple heat sinks located within the flat tube, a first heat sink coupled to the flat plate, the first heat sink comprising multiple fins arranged based on a first fin configuration, a second heat sink coupled to the flat plate, the second heat sink comprising multiple fins arranged based on a second fin configuration and at least one coupling device configured for receiving one or more components. Further, the multiple heat sinks within the flat tube are arranged based on the position of one or more components mounted on the flat tube such that the fin densities of the heat sinks are proportional to heating characteristics of the components mounted thereon.
- In another embodiment, a cold plate for fluid cooling one or more components is provided. The cold plate comprises at least one flat tube having an inlet port and an outlet port so as to allow a coolant fluid to flow through the flat tube such that the coolant fluid passes through multiple heat sinks located within the flat tube, a first heat sink coupled to the flat plate, the first heat sink comprising multiple fins arranged based on a first fin configuration and a second heat sink coupled to the flat plate, the second heat sink comprising multiple fins arranged based on a second fin configuration. Further, the first heat sink is located at a predetermined distance from the second heat sink so as to facilitate formation of multiple boundary layers in order to increase the heat transfer coefficient.
- Systems and methods of varying scope are described herein. In addition to the aspects and advantages described in this summary, further aspects and advantages will become apparent by reference to the drawings and with reference to the detailed description that follows.
-
FIG. 1 shows a schematic diagram of a heat exchanger as described in an embodiment; and -
FIG. 2 shows a schematic diagram of an exemplary arrangement of heat sinks within a flat tube as described in an embodiment. - In the following detailed description, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration specific embodiments, which may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the embodiments, and it is to be understood that other embodiments may be utilized and that logical, mechanical, electrical and other changes may be made without departing from the scope of the embodiments. The following detailed description is, therefore, not to be taken in a limiting sense.
- A
heat exchanger 100 for fluid cooling various circuit components according to an embodiment of the invention is illustrated inFIG. 1 . Theheat exchanger 100 includes at least oneflat tube 104 formed from a circular tube to have a top surface and a bottom surface that are substantially parallel and contiguously connected by rounded corners and defining an interior space. This interior space of theflat tube 104 is used for a coolant to flow through. Theflat tube 104 includes a plurality of heat sinks extending into the interior space. Each of the heat sinks comprise multiple fins arranged in a certain fin configuration to form a plurality of channels inside theflat tube 104 for defining a passage for the fluid coolant there through. - In the embodiment of
FIG. 1 , threeflat tubes 104 are connected between theinlet port 106 and theoutlet port 108, however the number offlat tubes 104 can vary depending on the application. An inlet header tube accommodates one ormore inlet ports 106 through which the fluid coolant enters the multipleflat tubes 104. Similarly, an outlet header tube houses one ormore outlet ports 108 through which the fluid coolant exits the multipleflat tubes 104. Multiple parallelflat tubes 104 are coupled to the header tubes through brazedjoints 110. Theflat tubes 104 may be made from copper, aluminum, various nickel alloys, titanium, graphite and like metals and composites. The coolant may be a liquid such as water or an inert gas. - The coolant passing through the
flat tubes 104 absorbs the heat from theflat tube 104 walls and in convection heat transfer mode. During the process, the coolant's temperature increases. The coolant exits theheat exchanger 100 through the outlet header tube. Thus the heat generated from the components is removed from the coolant using theheat exchanger 100. - Multiple heat sinks are located within each
flat tube 104. In an exemplary embodiment, a first heat sink coupled to the flat plate comprises multiple fins arranged based on a first fin configuration and a second heat sink coupled to the flat plate comprises multiple fins arranged based on a second fin configuration. - The
heat exchanger 100 further comprises abase plate 102 having at least one slot configured to support the at least oneflat tube 104. Thebase plate 102 has a roughly constant, comparatively small thickness over its entire width. The cross-section of thebase plate 102 is designed in the manner of a rectangle, where the long sides of the rectangle lie parallel to the tube surface. The cooling fluid enters thebase plate 102 via aninlet port 106 as indicated by arrow and exits thebase plate 102 viaoutlet port 108 as indicated schematically by arrow. - The
heat exchanger 100 further comprises at least one coupling device configured for receiving one or more components. A component includes an electronic, electrical or power circuit component capable of getting heated. In one embodiment, electrical/electronic components are directly attached to the top surface of theheat exchanger 100 by glue, epoxy or other known adhesives. In another embodiment of the invention, screw attachments are attached to the top surface of thebase plate 102 so that the electrical components can be conveniently attached and removed as necessary. The screw attachments may be of aluminum, copper or other like materials and compositions. - In one embodiment, the multiple heat sinks within the
flat tube 104 are arranged based on the position of one or more components mounted on theflat tube 104 such that the fin densities of the heat sinks are proportional to heating characteristics of the components mounted thereon. - For example, a first circuit component that is expected to be heated to higher temperature when compared to a second circuit component positioned adjacent to the first circuit component, a first heat sink having higher fin density is positioned below the first component and a second heat sink having a comparatively lower fin density is positioned below the second component that is expected to be heated to a lower temperature. For this purpose vacuum-brazing technique is utilized. Vacuum brazing allows the use of high performance fins to be placed within the liquid channel at locations where better heat transfer is desired by the surface of the
base plate 102. - In one embodiment, the second heat sink is located a predetermined distance from the first heat sink. The heat sinks are positioned such that a predetermined distance exists between two successive heat sinks inside the cold plate so as to break the boundary layers to promote the flow of the fluid coolant to be converted into turbulent flow, thereby improving heat transfer ability.
- In one embodiment, the first fin configuration is selected from one of an extruded, bonded, elliptical and pin configuration. Likewise, the second fin configuration is selected from one of an extruded, bonded, elliptical and pin configuration. Accordingly, two successive heat sinks may have a similar fin configuration. Alternatively, two successive heat sinks may have varied fin configurations. An exemplary arrangement of the heat sinks having varied fin configurations is depicted in
FIG. 2 . In the example shown inFIG. 2 , theflat tube 200 comprises seven heat sinks wherein the first heatsink has an extrudedfin configuration 202, the second heatsink has apin fin configuration 204, the third heatsink has anelliptical fin configuration 206, the fourth heatsink has a foldedfin configuration 208, the fifth heatsink has anelliptical fin configuration 210, the sixth heatsink has apin fin configuration 212 and the seventh heatsink has an extrudedfin configuration 214. However, the thickness and length of the fins may vary based on the desired application of theheat exchanger 100. This arrangement of heatsinks gives rise to theflat tube 200 with increased surface area and increased turbulence. - Although, compared to a
flat tube 104 having heat sink with a similar fin configuration, aflat tube 104 of this type presents advantages related to heat technology, because, for example when being operated as a cooling tube, the heat transfer characteristics for the coolant can be improved through the generation of turbulence at the intermediate portions between two successive heat sinks. - Further, each of the multiple heatsinks is manufactured from a material selected from the group comprising copper, aluminum, titanium, graphite and alloys thereof. Accordingly, two successive heatsinks may comprise same material. Alternatively, two successive heat sinks may be made up of different materials. In one exemplary embodiment, the first heatsink may comprise copper whereas the second heat sink may comprises aluminum or some other material other than copper.
- In another embodiment, a method of providing internal fins to a coolant carrying tube is presented. In this method, a series of heatsinks with desired fin configurations are added as an insert to the interior space of the
flat tube 104. The heat sinks are pre-applied with a brazing alloy and are positioned inside theflat tube 104 at a desired location. The heatsinks along with theflat tube 104 are then placed inside a soldering oven to get the heat sinks brazed to the inside wall of theflat tube 104. This forms aflat tube 104 with internal fins. Thus the surface area inside theflat tube 104 is increased which helps increase the heat transfer efficiency of theheat exchanger 100. - The
heat exchanger 100 disclosed herein helps increase the heat transfer in thebase plate 102 by increasing the surface area in theflat tube 104 and by creating turbulence in the flow at a desired area such as under a hot spot. As coolant flows from one end and leaves from other end, a heatsink with intricate fin configuration offers resistance to the flow. By optimizing the fin geometry, the desired turbulence can be created. A combination of heatsinks with different fin configuration can be positioned inside theflat tube 104 based on the heat load pattern on thebase plate 102 so as to offer more surface area for heat transfer under a hot spot. - In one embodiment, the
heat exchanger 100 described herein employed to cool gradient coils in an magnetic resonance imaging (MRI)) system. In the MRI system a gradient pulse amplifier applies current pulses to selected gradient coil assemblies to create magnetic field gradients in the three dimensions of the examination region. These high-powered devices generate significant thermal energy, which, if not removed, limit the device lifetime. A cold plate orheat exchanger 100 acts to remove heat from the gradient coil of the MRI system. The cold plate can effectively cool the gradient coil down to cryogenic temperatures. Thus theheat exchanger 100 helps to maintain gradient coil temperature within a specified range regardless of the selected excitation applied, thereby enabling higher power applications for faster imaging with improved image quality and longer scan times. - In one embodiment, the cold plate or
heat exchanger 100 acts to remove heat from a thermally conductive side of a power semiconductor device. The thermally conductive side of the semiconductor is maintained in firm thermal contact with the heat sink by screws or other suitable affixing mechanisms. - Advantages of the
heat exchanger 100 described herein include easy manufacturability, flexibility to select and arrange different type of heatsinks having varied fin configurations depending on the heat load pattern on thebase plate 102 and ability to increase the heat transfer coefficient by maintaining distance between successive heatsinks within theflat tube 104. - Further, use of standard heatsinks results in decreased cost of the flat tube assembly and heatsink. As the heatsinks are readily and widely available, it is easy to source any heatsink and assemble it in the
flat tube 104. - In various embodiments of the invention, a heat exchanger for cooling various circuit components is described. However, the embodiments are not limited and may be implemented in connection with different applications. The application of the invention can be extended to other areas, for example in a refrigeration apparatus, in an air conditioning system for vehicles and as a radiator for a automobiles. The design can be carried further and implemented in various forms and specifications.
- This written description uses examples to describe the subject matter herein, including the best mode, and also to enable any person skilled in the art to make and use the subject matter. The patentable scope of the subject matter is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.
Claims (10)
1. A heat exchanger comprising:
at least one flat tube having an inlet port and an outlet port such that a fluid coolant enters the flat tube through the inlet port and exits the flat tube through the outlet port so as to pass through multiple heat sinks located within the flat tube;
a first heat sink coupled to the flat plate, the first heat sink comprising multiple fins arranged based on a first fin configuration;
a second heat sink coupled to the flat plate, the second heat sink comprising multiple fins arranged based on a second fin configuration; and
at least one coupling device configured for receiving one or more components;
wherein the multiple heat sinks within the flat tube are arranged based on the position of one or more components mounted on the flat tube such that the fin densities of the heat sinks are proportional to heating characteristics of the components mounted thereon.
2. The heat exchanger of claim 1 , further comprising a base plate having at least one slot configured to support the at least one flat tube.
3. The heat exchanger of claim 1 , wherein the second heat sink is located a predetermined distance from the first heat sink.
4. The heat exchanger of claim 1 , wherein the first and second fin configuration is selected from one of an extruded, bonded, elliptical and pin configuration.
5. The heat exchanger of claim 1 , wherein each of the multiple heat sinks is manufactured from a material selected from the group comprising copper, aluminum, titanium, graphite and alloys thereof.
6. The heat exchanger of claim 5 , wherein the material of first heat sink is different from the material of the second heat sink.
7. A cold plate for fluid cooling one or more components, the cold plate comprising:
at least one flat tube having an inlet port and an outlet port so as to allow a coolant fluid to flow through the flat tube such that the coolant fluid passes through multiple heat sinks located within the flat tube;
a first heat sink coupled to the flat plate, the first heat sink comprising multiple fins arranged based on a first fin configuration; and
a second heat sink coupled to the flat plate, the second heat sink comprising multiple fins arranged based on a second fin configuration;
wherein the first heat sink is located at a predetermined distance from the second heat sink so as to facilitate formation of multiple boundary layers in order to increase the heat transfer coefficient.
8. The cold plate of claim 7 , wherein the first fin configuration is different from the second fin configuration.
9. The cold plate of claim 7 , wherein the first and second fin configuration is selected from one of an extruded, bonded, elliptical and pin configuration.
10. The cold plate of claim 7 , wherein each of the multiple heat sinks is manufactured from a material selected from the group comprising copper, aluminum, titanium, graphite and alloys thereof.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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IN841CH2011 | 2011-03-17 | ||
IN841/CHE/2011 | 2011-03-17 |
Publications (1)
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US20130068433A1 true US20130068433A1 (en) | 2013-03-21 |
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US13/422,908 Abandoned US20130068433A1 (en) | 2011-03-17 | 2012-03-16 | Heat exchanger |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US20130340978A1 (en) * | 2012-06-20 | 2013-12-26 | Abb Technology Ag | Two-phase cooling system for electronic components |
US20140338643A1 (en) * | 2013-05-15 | 2014-11-20 | Caterpillar Inc. | System and method for cooling of an exhaust gas recirculation unit |
US20170099725A1 (en) * | 2015-10-02 | 2017-04-06 | Analogic Corporation | Cooling assembly for electronics assembly of imaging system |
CN108980970A (en) * | 2018-07-30 | 2018-12-11 | 珠海格力电器股份有限公司 | A kind of heater |
CN112222789A (en) * | 2020-08-23 | 2021-01-15 | 蚌埠市神舟机械有限公司 | Manufacturing process of marine radiator |
WO2021112524A1 (en) * | 2019-12-04 | 2021-06-10 | Hanon Systems | Heat exchanger with integrated drier and plate for a plate heat exchanger |
WO2021178197A1 (en) * | 2020-03-04 | 2021-09-10 | Cisco Technology, Inc. | Thermal management of high capacity optics in dense arrangements |
US11647607B2 (en) | 2021-01-22 | 2023-05-09 | Cisco Technology, Inc. | Localized immersion cooling enclosure with thermal efficiency features |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20130340978A1 (en) * | 2012-06-20 | 2013-12-26 | Abb Technology Ag | Two-phase cooling system for electronic components |
US20140338643A1 (en) * | 2013-05-15 | 2014-11-20 | Caterpillar Inc. | System and method for cooling of an exhaust gas recirculation unit |
US20170099725A1 (en) * | 2015-10-02 | 2017-04-06 | Analogic Corporation | Cooling assembly for electronics assembly of imaging system |
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WO2021112524A1 (en) * | 2019-12-04 | 2021-06-10 | Hanon Systems | Heat exchanger with integrated drier and plate for a plate heat exchanger |
WO2021178197A1 (en) * | 2020-03-04 | 2021-09-10 | Cisco Technology, Inc. | Thermal management of high capacity optics in dense arrangements |
US11523541B2 (en) * | 2020-03-04 | 2022-12-06 | Cisco Technology, Inc. | Thermal management of high capacity optics in dense arrangements |
CN112222789A (en) * | 2020-08-23 | 2021-01-15 | 蚌埠市神舟机械有限公司 | Manufacturing process of marine radiator |
US11647607B2 (en) | 2021-01-22 | 2023-05-09 | Cisco Technology, Inc. | Localized immersion cooling enclosure with thermal efficiency features |
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Legal Events
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AS | Assignment |
Owner name: GENERAL ELECTRIC COMPANY, NEW YORK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MUTHIGI, SHREEKANTH MURTHY;POOVANKAVIL, NISHAD;REEL/FRAME:027895/0026 Effective date: 20120315 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |