US20130178071A1 - Thermal oxide film formation method for silicon single crystal wafer - Google Patents

Thermal oxide film formation method for silicon single crystal wafer Download PDF

Info

Publication number
US20130178071A1
US20130178071A1 US13/824,028 US201113824028A US2013178071A1 US 20130178071 A1 US20130178071 A1 US 20130178071A1 US 201113824028 A US201113824028 A US 201113824028A US 2013178071 A1 US2013178071 A1 US 2013178071A1
Authority
US
United States
Prior art keywords
temperature
oxide film
thermal oxide
heat treatment
treatment furnace
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US13/824,028
Other versions
US9171737B2 (en
Inventor
Hiroyuki Takahashi
Kazuhiko Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Assigned to SHIN-ETSU HANDOTAI CO., LTD. reassignment SHIN-ETSU HANDOTAI CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKAHASHI, HIROYUKI, YOSHIDA, KAZUHIKO
Publication of US20130178071A1 publication Critical patent/US20130178071A1/en
Application granted granted Critical
Publication of US9171737B2 publication Critical patent/US9171737B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
    • H01L21/3165—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation
    • H01L21/31654—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself
    • H01L21/31658—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself by thermal oxidation, e.g. of SiGe
    • H01L21/31662—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself by thermal oxidation, e.g. of SiGe of silicon in uncombined form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
    • H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
    • H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/024—Group 12/16 materials
    • H01L21/02403—Oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02587—Structure
    • H01L21/0259—Microstructure
    • H01L21/02598—Microstructure monocrystalline

Definitions

  • the present invention relates to a thermal oxide film formation method for suppressing slip dislocation, etc. taking place when thermal oxide film is formed on a silicon single crystal wafer.
  • a thermal oxide film on the surface of a silicon single crystal wafer e.g., silicon single crystal wafer is mounted on a heat treatment jig (frequently referred to as wafer boat) made of heat resistant material (e.g., quartz or SiC) to set such a jig within a tube for heat treatment furnace to perform heat treatment under oxidizing atmosphere.
  • a heat treatment jig (frequently referred to as wafer boat) made of heat resistant material (e.g., quartz or SiC) to set such a jig within a tube for heat treatment furnace to perform heat treatment under oxidizing atmosphere.
  • Control of film thickness of the thermal oxide film formed in this way is performed after subjected to calculation by the kind of the heat treatment atmosphere, the heat treatment temperature and/or heat treatment time.
  • thermal oxide film to be formed on the surface of the silicon single crystal wafer although depending upon the purpose, in the case of fabricating a bonded SOI wafer including a thick buried oxide film layer (BOX layer) as described in the Patent Literature 1, a thick thermal oxide film is formed on at least one of two silicon single crystal wafers to be bonded and a bonding process is performed.
  • BOX layer buried oxide film layer
  • high temperature/long time heat treatment is performed under the atmosphere including water vapor such as wet O 2 oxidation or pyrogenic oxidation, etc. as the heat treatment atmosphere where oxidation rate is high.
  • the present invention has been made in view of the above-described problems, and aims at providing a method of forming a thermal oxide film of preventing sticking onto a wafer boat taking place particularly in forming s thick oxide film to have ability to suppress occurrence of slip dislocation and/or crack of a silicon single crystal wafer during formation of the thermal oxide film.
  • the present invention provides a method of forming a thermal oxide film on a silicon single crystal wafer, at least comprising: throwing the silicon single crystal wafer into a heat treatment furnace; elevating temperature of the heat treatment furnace up to a temperature T1 where a thermal oxide film is formed to form a thermal oxide film having a thickness d1; subsequently lowering the temperature of the heat treatment furnace down to a temperature lower than the temperature T1; and thereafter elevating the temperature of the heat treatment furnace up to a temperature T2 higher than the temperature T1 to additionally form a thermal oxide film having a thickness d2 thicker than the thickness d1.
  • the thermal oxide film formed in this way warp phenomenon of wafer takes place resulting from a temperature difference between a wafer outer peripheral part and a central part occurring at the time of lowering temperature, and therefore a position in contact with a wafer boat for holding the wafer changes. For this reason, it is possible to prevent that the wafer is stuck onto the wafer boat by the thermal oxide film.
  • the thermal oxide film formed during oxidation at the temperature T1 of the preceding stage has the effect of the protective film in high temperature oxidation performed at the temperature T2 of the succeeding stage.
  • a thick oxide film is additionally formed by high temperature oxidation of the succeeding stage, while suppressing occurrence of the slip dislocation and/or crack in the state where the contact position is changed and the thermal oxide film as the protective film is formed at the preceding stage. Therefore, it is possible to efficiently form satisfactory thick thermal oxide film.
  • the temperature of the heat treatment furnace is elevated up to the temperature T2 higher than the temperature T1 without taking out the silicon single crystal wafer from the heat treatment furnace to additionally form a thermal oxide film having the thickness d2 thicker than the thickness d1 after the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1.
  • the thermal oxide film is additionally formed as described above, thereby making it possible to additionally form the thermal oxide film continuously within the heat treatment furnace. Such a process is efficient.
  • the temperature T1 is set to a temperature lower than 1200° C.
  • the temperature T2 is set to a temperature of 1200° C. or more.
  • the temperature T1 is set to a temperature lower than 1200° C., thereby making it possible to form a thermal oxide film while effectively preventing occurrence of slip dislocation by the low temperature oxidation of the preceding stage.
  • the temperature T2 is set to a temperature of 1200° C. or more, thereby making it possible to efficiently form thick thermal oxide film by the high temperature oxidation of the succeeding stage at a sufficient oxidation rate.
  • the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1
  • the temperature of the heat treatment furnace is lowered down to a temperature lower than the temperature T1 by 200° C. or more.
  • the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1 by 200° C. or more, thereby making it possible to allow warp phenomenon of the wafer at time of lowering temperature to sufficiently take place to change the position in contact with the wafer boat thus to effectively prevent sticking.
  • the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1
  • the temperature of the heat treatment furnace is lowered down to a temperature equal to or less than a throw-in temperature when the silicon single crystal wafer is thrown into the heat treatment furnace.
  • the temperature of the heat treatment furnace is lowered down to a temperature equal to or less than a throw-in temperature when the silicon single crystal wafer is thrown into the heat treatment furnace, thereby making it possible to allow warp phenomenon of the wafer at the time of lowering temperature to sufficiently take place to change the position in contact with the wafer boat to securely prevent sticking.
  • a film thickness obtained by totalizing the thickness d1 and the thickness d2 may be 2500 nm or more.
  • the thickness d1 is 500 nm or more.
  • the thickness d1 is 500 nm or more so that the thermal oxide film thus formed functions as a satisfactory protective film in high temperature oxidation of the succeeding stage to securely prevent occurrence of the slip dislocation.
  • thermal oxide film having the thickness d2 is additionally formed, further additional formation of a thermal oxide film by lowering the temperature of the heat treatment furnace down to a temperature lower than the temperature T1 and thereafter elevating the temperature of the heat treatment furnace up to a temperature higher than the temperature T1 is repeated one or more times.
  • the thermal oxide film is additionally formed as described above, thereby making it possible to securely prevent sticking onto the wafer boat particularly in forming a thick thermal oxide film.
  • FIG. 1 is a view showing temperature and atmospheric gas within a heat treatment furnace in an example
  • FIG. 2 is view showing temperature and atmospheric gas within a heat treatment furnace in comparative examples 1, 2, and
  • FIG. 3 is a view showing temperature and atmospheric gas within a heat treatment furnace in a comparative example 3.
  • a silicon single crystal wafer is first thrown into, e.g., a longitudinal heat treatment furnace.
  • wafers are filled into a wafer boat having supporting parts for mounting a plurality of wafers thereon to perform loading the wafer boat into a tube of the heat treatment furnace to thereby throw them thereinto.
  • a heater is set so that there is provided, e.g., temperature of about 500° C.
  • the temperature of the heat treatment furnace is elevated up to the temperature T1 where a thermal oxide film is formed to hold such temperature to thereby form a thermal oxide film having thickness d1.
  • the temperature T1 where the thermal oxide film is formed is not particularly limited.
  • the temperature of the heat treatment furnace is a temperature higher than 600° C.
  • a thermal oxide film having a certain thickness is formed, but it is preferable that, e.g., the temperature T1 is a temperature lower than 1200° C.
  • the temperature of the heat treatment furnace is a temperature lower than 1200° C.
  • the thickness d1 of the thermal oxide film to be formed at this time is not particularly limited, but e.g., a thickness of 500 nm or more is preferable.
  • the thermal oxide film having such a thickness is formed, whereby the thermal oxide film has a thickness to a degree such that the thermal oxide film sufficiently functions as a protective film in high temperature oxidation of the succeeding stage, thus making it possible to sufficiently suppress occurrence of the slip dislocation.
  • the temperature of the heat treatment furnace is lowered down to a temperature lower than the temperature T1.
  • the temperature of the heat treatment furnace is lowered so that a temperature difference takes place between the outer peripheral part of the wafer and the central part thereof.
  • warp phenomenon takes place at the wafer resulting from the temperature difference.
  • the position in contact with the wafer boat changes. For this reason, it can be prevented that the wafer may be stuck onto the wafer boat by the thermal oxide film formed.
  • the temperature of the heat treatment is lowered down to a temperature lower than the temperature T1 by 200° C. or more.
  • the temperature of the heat treatment furnace is lowered down to a temperature equal to or less than a throw-in temperature when the silicon single crystal wafer is thrown into the heat treatment furnace.
  • the temperature of the heat treatment furnace is elevated up to a temperature T2 higher than the temperature T1 to additionally form a thermal oxide film having thickness d2 thicker than the thickness d1.
  • this thermal oxide film functions as a protective film so that slip dislocation is difficult to occur even at a high temperature.
  • a thermal oxide film having thickness d2 thicker than that of the low temperature oxidation of the preceding stage in high temperature oxidation since the oxidation rate is high due to high temperature, it is possible to efficiently and additionally form thick thermal oxide film.
  • the temperature T2 at this time may be a temperature higher than the temperature T1, but is not particularly limited. In this case, for example, it is preferable that the temperature T2 is 1200° C. or more.
  • the temperature T2 is 1200° C. or more, since the oxidation rate is sufficiently high, such a process is efficient. Moreover, even when the temperature T2 is such a high temperature, since the thermal oxide film is formed by the low temperature oxidation of the preceding stage in the present invention, such thermal oxide film functions as a protective film so that slip dislocation is difficult to take place.
  • the temperature of the heat treatment furnace is elevated up to the temperature T2 without taking out the wafer toward the outside of the heat treatment furnace to continuously perform formation of the oxide film after the temperature of the heat treatment furnace is lowered.
  • Such temperature elevation, temperature lowering and temperature holding within the heat treatment furnace may be performed by controlling heater output.
  • temperature-elevating rate and temperature-lowering rate are not particularly limited.
  • the atmosphere in formation of a thermal oxide film is oxidizing atmosphere where the oxide film is formed
  • the atmosphere is not also particularly limited, and e.g., wet O 2 oxidation and/or pyrogenic oxidation, etc. may be performed under the atmosphere including vapor water.
  • thermal oxide film formation method of the present invention as described above, occurrence of slip dislocation and/or crack is prevented also in forming a thick thermal oxide film having thickness of 2500 nm or more, otherwise 5000 nm or more where slip dislocation, etc. is apt to particularly take place, and thus a satisfactory thermal oxide film can be formed.
  • the thermal oxide film having the thickness d2 is additionally formed in a manner as described above, further additional formation of a thermal oxide film by lowering the temperature of the heat treatment furnace down to a temperature lower than the temperature T1 and thereafter elevating the temperature of the heat treatment furnace up to a temperature higher than the temperature T1 is repeated one or more times.
  • temperature lowering and temperature elevation of the present invention may be repeated further one or more times in this way to thereby prevent sticking onto the wafer boat, thus making it possible securely prevent slip dislocation and/or crack.
  • the oxide film formation method according to the present invention may be also applied to a bonded SOI wafer made by bonding two ordinary silicon single crystal wafers through the oxide film, and to a SOI wafer fabricated through high temperature heat treatment after oxygen ions are implanted into an ordinary silicon single crystal wafer, in addition to ordinary silicon single crystal wafer comprised of only silicon single crystal.
  • “silicon single crystal wafer” in the present invention may include these SOI wafers.
  • a mirror polished silicon single crystal wafer having a diameter of 200 mm and crystal orientation ⁇ 100> was thrown into a longitudinal heat treatment furnace to form a thermal oxide film having a thickness of 6000 nm by the heat treatment profile of FIG. 1 .
  • Table 1 there are shown throw-in temperature Tin(° C.), low temperature oxidation temperature T1(° C.), lowered temperature T(° C.), high temperature oxidation temperature T2(° C.) and taking-out temperature Tout(° C.) in this instance.
  • the oxidation is performed by the pyrogenic oxidation.
  • oxidation 1 oxidation time was adjusted so that a thermal oxidation film having a thickness of 1000 nm is formed.
  • oxidation 2 oxidation time was adjusted so that a thermal oxidation film having a thickness of 5000 nm is additionally formed.
  • the temperature-elevating rate from Tin(° C.) to T1(° C.) was set to 5(° C./min), and the temperature-lowering rate from Tin(° C.) to T(° C.) was set to 2.5(° C./min).
  • the temperature-elevating rate from T(° C.) to T2(° C.) was set to 2(° C./min) until 900° C., was set to 1(° C./min) between 900° C. and 1200(° C.), and was set to 0.5(° C./min) between 1200 and 1250(° C.).
  • the temperature-lowering rate from T2(° C.) to Tout(° C.) was set to 0.5(° C./min) until 1200° C., was set to 1(° C./min) between 1200 and 1100(° C.), and was set to 2(° C./min) between 1100 and Tout(° C.).
  • the thermal oxide film having a thickness of 6000 nm was formed thereafter to observe the slip dislocation by the X-ray topography method. As a result, at the position in contact with the wafer boat, contact trace was observed, but linear slip dislocation was not observed.
  • a mirror polished silicon single crystal wafer having a diameter of 200 mm and crystal orientation ⁇ 100> was thrown into a longitudinal heat treatment furnace to form a thermal oxide film having a thickness of 5500 nm by the heat treatment profile of FIG. 1 .
  • Table 1 there are shown throw-in temperature Tin(° C.), low temperature oxidation temperature T1(° C.), lowered temperature T(° C.), high temperature oxidation temperature T2(° C.) and taking-out temperature Tout(° C.) in this instance.
  • the oxidation was performed by the pyrogenic oxidation.
  • oxidation 1 oxidation time was adjusted so that a thermal oxide film having a thickness of 500 nm is formed.
  • oxidation 2 oxidation time was adjusted so that a thermal oxidation film having a thickness of 5000 nm is additionally formed.
  • the temperature-elevating rate from Tin(° C.) to T1(° C.) was set to 5(° C./min), and the temperature-lowering rate from T1(° C.) to T(° C.) was set to 2.5(° C./min).
  • the temperature-elevating rate from T(° C.) to T2(° C.) was set to 2(° C./min) until 900° C., was set to 1(° C./min) between 900° C. and 1200(° C.), and was set to 0.5(° C./min) between 1200 and 1250(° C.).
  • the temperature-lowering rate from T2(° C.) to Tout(° C.) was set to 0.5(° C./min) until 1200° C., was set to 1(° C./min) between 1200 and 1100(° C.), and was set to 2(° C./min) between 1100 and Tout(° C.).
  • the thermal oxide film having a thickness of 5500 nm was formed thereafter to observe the slip dislocation by the X-ray topography method. As a result, at the position in contact with the wafer boat, contact trace was observed, but linear slip dislocation was not observed.
  • a mirror polished silicon single crystal wafer having a diameter of 200 mm and crystal orientation ⁇ 100> was thrown into a longitudinal heat treatment furnace to form an oxide film having a thickness of 2500 nm by the heat treatment profile of FIG. 1 .
  • the table 1 there are shown throw-in temperature Tin(° C.), low temperature oxidation temperature T1(° C.), lowered temperature T(° C.), high temperature oxidation temperature T2(° C.) and taking-out temperature Tout(° C.) in this instance.
  • the oxidation is performed by the pyrogenic oxidation.
  • oxidation 1 oxidation time was adjusted so that a thermal oxidation film having a thickness of 500 nm is formed.
  • oxidation 2 oxidation time was adjusted so that a thermal oxidation film having a thickness of 2000 nm is additionally formed.
  • the temperature-elevating rate from Tin(° C.) to T1(° C.) was set to 5(° C./min), and the temperature-lowering rate from T1(° C.) to T(° C.) was set to 2.5(° C./min).
  • the temperature-elevating rate from T(° C.) to T2(° C.) was set to 2(° C./min) until 900° C., and was set to 1 (° C./min) between 900° C. and 1200(° C.).
  • the temperature-lowering rate from T2(° C.) to Tout(° C.) was set to 1(° C./min) until 1100° C., and was set to 2(° C./min) between 1100 and Tout(° C.).
  • the thermal oxide film having a thickness of 2500 nm was formed thereafter to observe the slip dislocation by the X-ray topography method. As a result, at the position in contact with the wafer boat, contact trace was observed, but linear slip dislocation was not observed.
  • thermal oxide film thicknesses in Examples 1-3 are shown in Table 2.
  • a thermal oxide film having a thickness of 6000 nm was formed under the same condition as that of the example 1 except for the fact that the wafer is once taken out toward the outside of the heat treatment furnace after temperature lowering down to T(° C.).
  • the thermal oxide film having a thickness of 6000 nm was formed thereafter to observe the slip dislocation by the X-ray topography method. As a result, at the position in contact with the wafer boat, contact trace was observed, but linear slip dislocation was not observed.
  • a mirror polished silicon single crystal wafer having a diameter of 200 mm and crystal orientation ⁇ 100> was thrown into a longitudinal heat treatment furnace to form an oxide film having a thickness of 6000 nm by the heat treatment profile of FIG. 2 .
  • the table 3 there are shown throw-in temperature Tin(° C.), oxidation temperature T11(° C.), and taking out temperature Tout(° C.) in this instance.
  • Example 1 In addition, the temperature-elevating rate and the temperature-lowering rate were set to the same condition as those at the time of the high temperature oxidation of Example 1.
  • the thermal oxide film having a thickness of 6000 nm was formed thereafter to observe the slip dislocation by the X-ray topography method. As a result, a strong linear slip dislocation having, as base point, contact trace with respect to the wafer boat was observed as crossing mark.
  • a mirror polished silicon single crystal wafer having a diameter of 200 mm and crystal orientation ⁇ 100> was thrown into a longitudinal heat treatment furnace to form an oxide film having a thickness of 2500 nm by the heat treatment profile of FIG. 2 .
  • Table 3 there are shown throw-in temperature Tin(° C.), oxidation temperature T11(° C.) and taking-out temperature Tout(° C.) in this instance.
  • Example 3 In addition, the temperature-elevating rate and temperature-lowering rate were set to the same condition as those at the time of the high temperature oxidation of Example 3.
  • the thermal oxide film having a thickness of 2500 nm was formed thereafter to observe a slip dislocation by the X-ray topography.
  • a linear slip dislocation having, as base point, contact trace with respect to wafer boat was observed as crossing mark.
  • a mirror polished silicon single crystal wafer having a diameter of 200 mm and crystal orientation ⁇ 100> was thrown into a longitudinal heat treatment furnace to form a thermal oxide film having a thickness of 6000 nm by the heat treatment profile, as described in FIG. 3 , having double-stage heat treatment in which temperature elevating is performed without temperature lowering between heat treatments of the preceding stage and the succeeding stage.
  • Table 5 there are shown throw-in temperature Tin(° C.), oxidation temperatures T11, T12 (° C.) and taking-out temperature Tout(° C.).
  • the oxidation was performed by the pyrogenic oxidation.
  • oxidation 1 oxidation time was adjusted so that a thermal oxide film having a thickness 1000 nm is formed.
  • oxidation 2 oxidation time was adjusted so that a thermal oxide film having a thickness 5000 nm is additionally formed.
  • a thermal oxide film having a thickness of 6000 nm was formed thereafter to observe slip dislocation by the X-ray topography method.
  • a strong linear slip dislocation (weak (short) as compared to Comparative Example 1) having, as base point, contact trace with respect to wafer boat was observed as crossing mark.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

Disclosed is a method of forming a thermal oxide film on a silicon single crystal wafer, which includes throwing the silicon single wafer into a heat treatment furnace; elevating temperature of the heat treatment furnace up to a temperature T1 where a thermal oxide film is formed to form a thermal oxide film having a thickness d1; subsequently lowering the temperature of the heat treatment furnace down to a temperature lower than the temperature T1; and thereafter elevating the temperature of the heat treatment furnace up to a temperature T2 higher than the temperature T1 to additionally form a thermal oxide film having a thickness d2 thicker than the thickness d1. Thus, there is provided a thermal oxide film formation method to suppress occurrence of slip dislocation and/or crack of the silicon single wafer during formation of the thermal oxide film.

Description

    TECHNICAL FIELD
  • The present invention relates to a thermal oxide film formation method for suppressing slip dislocation, etc. taking place when thermal oxide film is formed on a silicon single crystal wafer.
    • BACKGROUND TECHNOLOGY
  • Hitherto, in order to form a thermal oxide film on the surface of a silicon single crystal wafer, e.g., silicon single crystal wafer is mounted on a heat treatment jig (frequently referred to as wafer boat) made of heat resistant material (e.g., quartz or SiC) to set such a jig within a tube for heat treatment furnace to perform heat treatment under oxidizing atmosphere.
  • Control of film thickness of the thermal oxide film formed in this way is performed after subjected to calculation by the kind of the heat treatment atmosphere, the heat treatment temperature and/or heat treatment time.
  • In regard to film thickness of thermal oxide film to be formed on the surface of the silicon single crystal wafer, although depending upon the purpose, in the case of fabricating a bonded SOI wafer including a thick buried oxide film layer (BOX layer) as described in the Patent Literature 1, a thick thermal oxide film is formed on at least one of two silicon single crystal wafers to be bonded and a bonding process is performed.
  • For the purpose of forming such a thick oxide film, high temperature/long time heat treatment is performed under the atmosphere including water vapor such as wet O2 oxidation or pyrogenic oxidation, etc. as the heat treatment atmosphere where oxidation rate is high.
    • CITATION LIST Patent Literature
    • Patent Literature 1: Japanese Unexamined Patent Publication (Kokai) No. 2008-277702
    SUMMARY OF THE INVENTION Problems to be Solved by the Invention
  • Particularly, in forming a thick thermal oxide film, when high temperature/long time heat treatment is performed under the atmosphere including water vapor, the thermal oxide film formed on the surface of the silicon single crystal wafer is stuck onto a wafer boat. For this reason, there was the problem that slip dislocation and/or crack may take place at the part thereof.
  • The present invention has been made in view of the above-described problems, and aims at providing a method of forming a thermal oxide film of preventing sticking onto a wafer boat taking place particularly in forming s thick oxide film to have ability to suppress occurrence of slip dislocation and/or crack of a silicon single crystal wafer during formation of the thermal oxide film.
    • Means for Solving the Problems
  • To attain the above-mentioned problems, the present invention provides a method of forming a thermal oxide film on a silicon single crystal wafer, at least comprising: throwing the silicon single crystal wafer into a heat treatment furnace; elevating temperature of the heat treatment furnace up to a temperature T1 where a thermal oxide film is formed to form a thermal oxide film having a thickness d1; subsequently lowering the temperature of the heat treatment furnace down to a temperature lower than the temperature T1; and thereafter elevating the temperature of the heat treatment furnace up to a temperature T2 higher than the temperature T1 to additionally form a thermal oxide film having a thickness d2 thicker than the thickness d1.
  • By forming the thermal oxide film in this way, warp phenomenon of wafer takes place resulting from a temperature difference between a wafer outer peripheral part and a central part occurring at the time of lowering temperature, and therefore a position in contact with a wafer boat for holding the wafer changes. For this reason, it is possible to prevent that the wafer is stuck onto the wafer boat by the thermal oxide film. Moreover, the thermal oxide film formed during oxidation at the temperature T1 of the preceding stage has the effect of the protective film in high temperature oxidation performed at the temperature T2 of the succeeding stage. Further, a thick oxide film is additionally formed by high temperature oxidation of the succeeding stage, while suppressing occurrence of the slip dislocation and/or crack in the state where the contact position is changed and the thermal oxide film as the protective film is formed at the preceding stage. Therefore, it is possible to efficiently form satisfactory thick thermal oxide film.
  • At this time, it is preferable that the temperature of the heat treatment furnace is elevated up to the temperature T2 higher than the temperature T1 without taking out the silicon single crystal wafer from the heat treatment furnace to additionally form a thermal oxide film having the thickness d2 thicker than the thickness d1 after the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1.
  • The thermal oxide film is additionally formed as described above, thereby making it possible to additionally form the thermal oxide film continuously within the heat treatment furnace. Such a process is efficient.
  • At this time, it is preferable that the temperature T1 is set to a temperature lower than 1200° C., and the temperature T2 is set to a temperature of 1200° C. or more.
  • As described above, the temperature T1 is set to a temperature lower than 1200° C., thereby making it possible to form a thermal oxide film while effectively preventing occurrence of slip dislocation by the low temperature oxidation of the preceding stage. Moreover, the temperature T2 is set to a temperature of 1200° C. or more, thereby making it possible to efficiently form thick thermal oxide film by the high temperature oxidation of the succeeding stage at a sufficient oxidation rate.
  • At this time, it is preferable that when the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1, the temperature of the heat treatment furnace is lowered down to a temperature lower than the temperature T1 by 200° C. or more.
  • As described above, the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1 by 200° C. or more, thereby making it possible to allow warp phenomenon of the wafer at time of lowering temperature to sufficiently take place to change the position in contact with the wafer boat thus to effectively prevent sticking.
  • At this time, it is preferable that when the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1, the temperature of the heat treatment furnace is lowered down to a temperature equal to or less than a throw-in temperature when the silicon single crystal wafer is thrown into the heat treatment furnace.
  • As described above, the temperature of the heat treatment furnace is lowered down to a temperature equal to or less than a throw-in temperature when the silicon single crystal wafer is thrown into the heat treatment furnace, thereby making it possible to allow warp phenomenon of the wafer at the time of lowering temperature to sufficiently take place to change the position in contact with the wafer boat to securely prevent sticking.
  • At this time, a film thickness obtained by totalizing the thickness d1 and the thickness d2 may be 2500 nm or more.
  • Also in forming such a thick thermal oxide film, in accordance with the method according to the present invention, it is possible to prevent occurrence of slip dislocation thus to perform satisfactory formation of the thermal oxide film.
  • At this time, it is preferable that the thickness d1 is 500 nm or more.
  • As described above, the thickness d1 is 500 nm or more so that the thermal oxide film thus formed functions as a satisfactory protective film in high temperature oxidation of the succeeding stage to securely prevent occurrence of the slip dislocation.
  • At this time, it is preferable that after the thermal oxide film having the thickness d2 is additionally formed, further additional formation of a thermal oxide film by lowering the temperature of the heat treatment furnace down to a temperature lower than the temperature T1 and thereafter elevating the temperature of the heat treatment furnace up to a temperature higher than the temperature T1 is repeated one or more times.
  • The thermal oxide film is additionally formed as described above, thereby making it possible to securely prevent sticking onto the wafer boat particularly in forming a thick thermal oxide film.
    • Advantageous Effects of the Invention
  • As described above, in accordance with the present invention, it is possible to efficiently perform thermal oxide film formation while suppressing occurrence of slip dislocation and/or crack particularly also in forming a thick thermal oxide film.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a view showing temperature and atmospheric gas within a heat treatment furnace in an example,
  • FIG. 2 is view showing temperature and atmospheric gas within a heat treatment furnace in comparative examples 1, 2, and
  • FIG. 3 is a view showing temperature and atmospheric gas within a heat treatment furnace in a comparative example 3.
    •  BEST MODE FOR CARRYING OUT THE INVENTION
  • While the present invention will now be described in detail with reference to the drawings as an example of preferred embodiments, the present invention is not limited to such an implementation.
  • In the present invention, a silicon single crystal wafer is first thrown into, e.g., a longitudinal heat treatment furnace.
  • In this instance, wafers are filled into a wafer boat having supporting parts for mounting a plurality of wafers thereon to perform loading the wafer boat into a tube of the heat treatment furnace to thereby throw them thereinto. As temperature (throw-in temperature) within the heat treatment furnace at this time, a heater is set so that there is provided, e.g., temperature of about 500° C.
  • Next, the temperature of the heat treatment furnace is elevated up to the temperature T1 where a thermal oxide film is formed to hold such temperature to thereby form a thermal oxide film having thickness d1.
  • At this time, as long as the temperature of the heat treatment furnace is a temperature such that thermal oxide film can be formed on a silicon single crystal wafer, the temperature T1 where the thermal oxide film is formed is not particularly limited. In this case, when the temperature of the heat treatment furnace is a temperature higher than 600° C., a thermal oxide film having a certain thickness is formed, but it is preferable that, e.g., the temperature T1 is a temperature lower than 1200° C. When the temperature of the heat treatment furnace is a temperature lower than 1200° C., it is possible to sufficiently suppress occurrence of the slip dislocation during formation of the thermal oxide film.
  • The thickness d1 of the thermal oxide film to be formed at this time is not particularly limited, but e.g., a thickness of 500 nm or more is preferable.
  • The thermal oxide film having such a thickness is formed, whereby the thermal oxide film has a thickness to a degree such that the thermal oxide film sufficiently functions as a protective film in high temperature oxidation of the succeeding stage, thus making it possible to sufficiently suppress occurrence of the slip dislocation.
  • Next, the temperature of the heat treatment furnace is lowered down to a temperature lower than the temperature T1.
  • In this way, the temperature of the heat treatment furnace is lowered so that a temperature difference takes place between the outer peripheral part of the wafer and the central part thereof. As a result, warp phenomenon takes place at the wafer resulting from the temperature difference. Thus, the position in contact with the wafer boat changes. For this reason, it can be prevented that the wafer may be stuck onto the wafer boat by the thermal oxide film formed.
  • In this instance, it is preferable that the temperature of the heat treatment is lowered down to a temperature lower than the temperature T1 by 200° C. or more. Moreover, it is more preferable that the temperature of the heat treatment furnace is lowered down to a temperature equal to or less than a throw-in temperature when the silicon single crystal wafer is thrown into the heat treatment furnace.
  • When the temperature of the heat treatment furnace is lowered down to such a temperature, warp phenomenon of the wafer is caused to sufficiently take place, thereby making it possible to securely attain sticking prevention based on change of the position in contact with the wafer boat.
  • Next, the temperature of the heat treatment furnace is elevated up to a temperature T2 higher than the temperature T1 to additionally form a thermal oxide film having thickness d2 thicker than the thickness d1.
  • In this way, in the high temperature oxidation process of the succeeding stage, because the thermal oxide film is already formed at the low temperature oxidation process of the preceding stage, this thermal oxide film functions as a protective film so that slip dislocation is difficult to occur even at a high temperature. Moreover, when a thermal oxide film having thickness d2 thicker than that of the low temperature oxidation of the preceding stage in high temperature oxidation, since the oxidation rate is high due to high temperature, it is possible to efficiently and additionally form thick thermal oxide film.
  • The temperature T2 at this time may be a temperature higher than the temperature T1, but is not particularly limited. In this case, for example, it is preferable that the temperature T2 is 1200° C. or more.
  • When the temperature T2 is 1200° C. or more, since the oxidation rate is sufficiently high, such a process is efficient. Moreover, even when the temperature T2 is such a high temperature, since the thermal oxide film is formed by the low temperature oxidation of the preceding stage in the present invention, such thermal oxide film functions as a protective film so that slip dislocation is difficult to take place.
  • Moreover, while a wafer can be taken out toward the outside of the heat treatment furnace before the temperature of the heat treatment furnace is elevated up to the temperature T2 after the temperature of the heat treatment furnace is lowered, it is preferable that if the throughput of the oxidation process is taken into account, the temperature of the heat treatment furnace is elevated up to the temperature T2 without taking out the wafer toward the outside of the heat treatment furnace to continuously perform formation of the oxide film after the temperature of the heat treatment furnace is lowered.
  • Such temperature elevation, temperature lowering and temperature holding within the heat treatment furnace may be performed by controlling heater output. Moreover, temperature-elevating rate and temperature-lowering rate are not particularly limited.
  • Further, as long as the atmosphere in formation of a thermal oxide film is oxidizing atmosphere where the oxide film is formed, the atmosphere is not also particularly limited, and e.g., wet O2 oxidation and/or pyrogenic oxidation, etc. may be performed under the atmosphere including vapor water.
  • According to the thermal oxide film formation method of the present invention as described above, occurrence of slip dislocation and/or crack is prevented also in forming a thick thermal oxide film having thickness of 2500 nm or more, otherwise 5000 nm or more where slip dislocation, etc. is apt to particularly take place, and thus a satisfactory thermal oxide film can be formed.
  • Moreover, the thermal oxide film having the thickness d2 is additionally formed in a manner as described above, further additional formation of a thermal oxide film by lowering the temperature of the heat treatment furnace down to a temperature lower than the temperature T1 and thereafter elevating the temperature of the heat treatment furnace up to a temperature higher than the temperature T1 is repeated one or more times.
  • Particularly in the case of forming a thick thermal oxide film, etc., temperature lowering and temperature elevation of the present invention may be repeated further one or more times in this way to thereby prevent sticking onto the wafer boat, thus making it possible securely prevent slip dislocation and/or crack.
  • It is to be noted that the oxide film formation method according to the present invention may be also applied to a bonded SOI wafer made by bonding two ordinary silicon single crystal wafers through the oxide film, and to a SOI wafer fabricated through high temperature heat treatment after oxygen ions are implanted into an ordinary silicon single crystal wafer, in addition to ordinary silicon single crystal wafer comprised of only silicon single crystal. Accordingly, “silicon single crystal wafer” in the present invention may include these SOI wafers.
    • EXAMPLES
  • While the present invention will be described in more concrete manner by making reference to the examples and the comparative examples, the present invention is not limited to these examples.
    • Example 1
  • A mirror polished silicon single crystal wafer having a diameter of 200 mm and crystal orientation <100> was thrown into a longitudinal heat treatment furnace to form a thermal oxide film having a thickness of 6000 nm by the heat treatment profile of FIG. 1. In the Table 1, there are shown throw-in temperature Tin(° C.), low temperature oxidation temperature T1(° C.), lowered temperature T(° C.), high temperature oxidation temperature T2(° C.) and taking-out temperature Tout(° C.) in this instance.
  • The oxidation is performed by the pyrogenic oxidation. In the case of the low temperature oxidation (oxidation 1), oxidation time was adjusted so that a thermal oxidation film having a thickness of 1000 nm is formed. In the case of the high temperature oxidation (oxidation 2), oxidation time was adjusted so that a thermal oxidation film having a thickness of 5000 nm is additionally formed.
  • The temperature-elevating rate from Tin(° C.) to T1(° C.) was set to 5(° C./min), and the temperature-lowering rate from Tin(° C.) to T(° C.) was set to 2.5(° C./min).
  • Moreover, the temperature-elevating rate from T(° C.) to T2(° C.) was set to 2(° C./min) until 900° C., was set to 1(° C./min) between 900° C. and 1200(° C.), and was set to 0.5(° C./min) between 1200 and 1250(° C.). The temperature-lowering rate from T2(° C.) to Tout(° C.) was set to 0.5(° C./min) until 1200° C., was set to 1(° C./min) between 1200 and 1100(° C.), and was set to 2(° C./min) between 1100 and Tout(° C.).
  • The thermal oxide film having a thickness of 6000 nm was formed thereafter to observe the slip dislocation by the X-ray topography method. As a result, at the position in contact with the wafer boat, contact trace was observed, but linear slip dislocation was not observed.
    • Example 2
  • A mirror polished silicon single crystal wafer having a diameter of 200 mm and crystal orientation <100> was thrown into a longitudinal heat treatment furnace to form a thermal oxide film having a thickness of 5500 nm by the heat treatment profile of FIG. 1. In the Table 1, there are shown throw-in temperature Tin(° C.), low temperature oxidation temperature T1(° C.), lowered temperature T(° C.), high temperature oxidation temperature T2(° C.) and taking-out temperature Tout(° C.) in this instance.
  • The oxidation was performed by the pyrogenic oxidation. In the case of the low temperature oxidation (oxidation 1), oxidation time was adjusted so that a thermal oxide film having a thickness of 500 nm is formed. In the case of the high temperature oxidation (oxidation 2), oxidation time was adjusted so that a thermal oxidation film having a thickness of 5000 nm is additionally formed.
  • The temperature-elevating rate from Tin(° C.) to T1(° C.) was set to 5(° C./min), and the temperature-lowering rate from T1(° C.) to T(° C.) was set to 2.5(° C./min).
  • Moreover, the temperature-elevating rate from T(° C.) to T2(° C.) was set to 2(° C./min) until 900° C., was set to 1(° C./min) between 900° C. and 1200(° C.), and was set to 0.5(° C./min) between 1200 and 1250(° C.). The temperature-lowering rate from T2(° C.) to Tout(° C.) was set to 0.5(° C./min) until 1200° C., was set to 1(° C./min) between 1200 and 1100(° C.), and was set to 2(° C./min) between 1100 and Tout(° C.).
  • The thermal oxide film having a thickness of 5500 nm was formed thereafter to observe the slip dislocation by the X-ray topography method. As a result, at the position in contact with the wafer boat, contact trace was observed, but linear slip dislocation was not observed.
    • Example 3
  • A mirror polished silicon single crystal wafer having a diameter of 200 mm and crystal orientation <100> was thrown into a longitudinal heat treatment furnace to form an oxide film having a thickness of 2500 nm by the heat treatment profile of FIG. 1. In the table 1, there are shown throw-in temperature Tin(° C.), low temperature oxidation temperature T1(° C.), lowered temperature T(° C.), high temperature oxidation temperature T2(° C.) and taking-out temperature Tout(° C.) in this instance.
  • The oxidation is performed by the pyrogenic oxidation. In the case of the low temperature oxidation (oxidation 1), oxidation time was adjusted so that a thermal oxidation film having a thickness of 500 nm is formed. In the case of the high temperature oxidation (oxidation 2), oxidation time was adjusted so that a thermal oxidation film having a thickness of 2000 nm is additionally formed.
  • The temperature-elevating rate from Tin(° C.) to T1(° C.) was set to 5(° C./min), and the temperature-lowering rate from T1(° C.) to T(° C.) was set to 2.5(° C./min).
  • Moreover, the temperature-elevating rate from T(° C.) to T2(° C.) was set to 2(° C./min) until 900° C., and was set to 1 (° C./min) between 900° C. and 1200(° C.). The temperature-lowering rate from T2(° C.) to Tout(° C.) was set to 1(° C./min) until 1100° C., and was set to 2(° C./min) between 1100 and Tout(° C.).
  • The thermal oxide film having a thickness of 2500 nm was formed thereafter to observe the slip dislocation by the X-ray topography method. As a result, at the position in contact with the wafer boat, contact trace was observed, but linear slip dislocation was not observed.
  • The temperatures at the time of forming thermal oxide film in Examples 1-3 are shown in Table 1, and the thermal oxide film thicknesses in Examples 1-3 are shown in Table 2.
    • [Table 1]
  • TABLE 1
    Tin (° C.) T1 (° C.) T (° C.) T2 (° C.) Tout (° C.)
    Example 1 500 1050 500 1250 500
    Example 2 600 1000 800 1250 600
    Example 3 500 1000 500 1200 500
  • TABLE 2
    Total oxide
    Oxidation (1) Oxidation (2) film
    d1 (nm) d2 (nm) thickness
    Example 1 1000 5000 6000 nm
    Example 2 500 5000 5500 nm
    Example 3 500 2000 2500 nm
    • Example 4
  • A thermal oxide film having a thickness of 6000 nm was formed under the same condition as that of the example 1 except for the fact that the wafer is once taken out toward the outside of the heat treatment furnace after temperature lowering down to T(° C.).
  • The thermal oxide film having a thickness of 6000 nm was formed thereafter to observe the slip dislocation by the X-ray topography method. As a result, at the position in contact with the wafer boat, contact trace was observed, but linear slip dislocation was not observed.
    • Comparative Example 1
  • A mirror polished silicon single crystal wafer having a diameter of 200 mm and crystal orientation <100> was thrown into a longitudinal heat treatment furnace to form an oxide film having a thickness of 6000 nm by the heat treatment profile of FIG. 2. In the table 3, there are shown throw-in temperature Tin(° C.), oxidation temperature T11(° C.), and taking out temperature Tout(° C.) in this instance.
  • In addition, the temperature-elevating rate and the temperature-lowering rate were set to the same condition as those at the time of the high temperature oxidation of Example 1.
  • The thermal oxide film having a thickness of 6000 nm was formed thereafter to observe the slip dislocation by the X-ray topography method. As a result, a strong linear slip dislocation having, as base point, contact trace with respect to the wafer boat was observed as crossing mark.
    • Comparative Example 2
  • A mirror polished silicon single crystal wafer having a diameter of 200 mm and crystal orientation <100> was thrown into a longitudinal heat treatment furnace to form an oxide film having a thickness of 2500 nm by the heat treatment profile of FIG. 2. In Table 3, there are shown throw-in temperature Tin(° C.), oxidation temperature T11(° C.) and taking-out temperature Tout(° C.) in this instance.
  • In addition, the temperature-elevating rate and temperature-lowering rate were set to the same condition as those at the time of the high temperature oxidation of Example 3.
  • The thermal oxide film having a thickness of 2500 nm was formed thereafter to observe a slip dislocation by the X-ray topography. As a result, a linear slip dislocation having, as base point, contact trace with respect to wafer boat was observed as crossing mark.
  • The temperatures at the time of forming thermal oxide films in Comparative Examples 1, 2 are shown in the Table 3, and the thermal oxide film thicknesses in Comparative Examples 1, 2 are shown in Table 4.
  • TABLE 3
    Tin (° C.) T11 (° C.) Tout (° C.)
    Comparative 500 1250 500
    Example 1
    Comparative 500 1200 500
    Example 2
  • TABLE 4
    Oxidation
    d11 (nm)
    Comparative Example 1 6000
    Comparative Example 2 2500
    • Comparative Example 3
  • A mirror polished silicon single crystal wafer having a diameter of 200 mm and crystal orientation <100> was thrown into a longitudinal heat treatment furnace to form a thermal oxide film having a thickness of 6000 nm by the heat treatment profile, as described in FIG. 3, having double-stage heat treatment in which temperature elevating is performed without temperature lowering between heat treatments of the preceding stage and the succeeding stage. In Table 5, there are shown throw-in temperature Tin(° C.), oxidation temperatures T11, T12 (° C.) and taking-out temperature Tout(° C.). The oxidation was performed by the pyrogenic oxidation. In the case of low temperature oxidation (oxidation 1), oxidation time was adjusted so that a thermal oxide film having a thickness 1000 nm is formed. In the case of the high temperature oxidation (oxidation 2), oxidation time was adjusted so that a thermal oxide film having a thickness 5000 nm is additionally formed.
  • In addition, the temperature-elevating rate and the temperature-lowering rate were set to the same conditions as those of Example 1.
  • A thermal oxide film having a thickness of 6000 nm was formed thereafter to observe slip dislocation by the X-ray topography method. As a result, a strong linear slip dislocation (weak (short) as compared to Comparative Example 1) having, as base point, contact trace with respect to wafer boat was observed as crossing mark.
  • The temperatures at the time of forming thermal oxide film in Comparative Example 3 are shown in Table 5, and the thermal oxide film thicknesses in Comparative Example 3 are illustrated in Table 6.
  • TABLE 5
    Tin (° C.) T11 (° C.) T12 (° C.) Tout (° C.)
    Comparative 500 1050 1250 500
    Example 3
  • TABLE 6
    Total oxide
    Oxidation (1) Oxidation (2) film
    d11 (nm) d12 (nm) thickness
    Comparative 1000 5000 6000 nm
    Example 3
  • It is to be noted that the present invention is not restricted to the foregoing embodiment. The foregoing embodiment is just an exemplification, and any examples that have substantially the same configuration and demonstrate the same functions and effects as the technical concept described in claims of the present invention are included in the technical scope of the present invention.

Claims (17)

1-8. (canceled)
9. A method of forming a thermal oxide film on a silicon single crystal wafer, at least comprising:
throwing the silicon single crystal wafer into a heat treatment furnace;
elevating temperature of the heat treatment furnace up to a temperature T1 where a thermal oxide film is formed to form a thermal oxide film having a thickness d1;
subsequently lowering the temperature of the heat treatment furnace down to a temperature lower than the temperature T1; and thereafter
elevating the temperature of the heat treatment furnace up to a temperature T2 higher than the temperature T1 to additionally form a thermal oxide film having a thickness d2 thicker than the thickness d1.
10. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 9, wherein
the temperature of the heat treatment furnace is elevated up to the temperature T2 higher than the temperature T1 without taking out the silicon single crystal wafer from the heat treatment furnace to additionally form a thermal oxide film having the thickness d2 thicker than the thickness d1 after the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1.
11. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 9,
wherein the temperature T1 is set to a temperature lower than 1200° C., and the temperature T2 is set to a temperature of 1200° C. or more.
12. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 10,
wherein the temperature T1 is set to a temperature lower than 1200° C., and the temperature T2 is set to a temperature of 1200° C. or more.
13. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 9,
wherein when the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1, the temperature of the heat treatment furnace is lowered down to a temperature lower than the temperature T1 by 200° C. or more.
14. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 10,
wherein when the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1, the temperature of the heat treatment furnace is lowered down to a temperature lower than the temperature T1 by 200° C. or more.
15. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 11,
wherein when the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1, the temperature of the heat treatment furnace is lowered down to a temperature lower than the temperature T1 by 200° C. or more.
16. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 12,
wherein when the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1, the temperature of the heat treatment furnace is lowered down to a temperature lower than the temperature T1 by 200° C. or more.
17. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 9,
wherein when the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1, the temperature of the heat treatment furnace is lowered down to a temperature equal to or less than a throw-in temperature when the silicon single crystal wafer is thrown into the heat treatment furnace.
18. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 16,
wherein when the temperature of the heat treatment furnace is lowered down to the temperature lower than the temperature T1, the temperature of the heat treatment furnace is lowered down to a temperature equal to or less than a throw-in temperature when the silicon single crystal wafer is thrown into the heat treatment furnace.
19. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 9,
wherein a film thickness obtained by totalizing the thickness d1 and the thickness d2 is 2500 nm or more.
20. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 18,
wherein a film thickness obtained by totalizing the thickness d1 and the thickness d2 is 2500 nm or more.
21. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 9,
wherein the thickness d1 is 500 nm or more.
22. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 20,
wherein the thickness d1 is 500 nm or more.
23. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 9,
wherein after the thermal oxide film having the thickness d2 is additionally formed, further additional formation of a thermal oxide film by lowering the temperature of the heat treatment furnace down to a temperature lower than the temperature T1 and thereafter elevating the temperature of the heat treatment furnace up to a temperature higher than the temperature T1 is repeated one or more times.
24. The method of forming a thermal oxide film on a silicon single crystal wafer according to claim 22,
wherein after the thermal oxide film having the thickness d2 is additionally formed, further additional formation of a thermal oxide film by lowering the temperature of the heat treatment furnace down to a temperature lower than the temperature T1 and thereafter elevating the temperature of the heat treatment furnace up to a temperature higher than the temperature T1 is repeated one or more times.
US13/824,028 2010-11-10 2011-10-06 Thermal oxide film formation method for silicon single crystal wafer Active 2032-01-16 US9171737B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010251775A JP5479304B2 (en) 2010-11-10 2010-11-10 Method for forming thermal oxide film on silicon single crystal wafer
JP2010-251775 2010-11-10
PCT/JP2011/005626 WO2012063402A1 (en) 2010-11-10 2011-10-06 Method for forming thermal oxide film of monocrystalline silicon wafer

Publications (2)

Publication Number Publication Date
US20130178071A1 true US20130178071A1 (en) 2013-07-11
US9171737B2 US9171737B2 (en) 2015-10-27

Family

ID=46050574

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/824,028 Active 2032-01-16 US9171737B2 (en) 2010-11-10 2011-10-06 Thermal oxide film formation method for silicon single crystal wafer

Country Status (6)

Country Link
US (1) US9171737B2 (en)
EP (1) EP2639819B1 (en)
JP (1) JP5479304B2 (en)
KR (1) KR101725777B1 (en)
CN (1) CN103262222B (en)
WO (1) WO2012063402A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5780234B2 (en) * 2012-12-14 2015-09-16 信越半導体株式会社 Manufacturing method of SOI wafer
CN105355551B (en) * 2015-11-12 2018-05-15 扬州杰利半导体有限公司 A kind of wafer passivation technique
CN117096012B (en) * 2023-08-22 2024-03-26 中环领先半导体科技股份有限公司 Oxide film, silicon wafer and preparation method thereof

Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4494303A (en) * 1983-03-31 1985-01-22 At&T Bell Laboratories Method of making dielectrically isolated silicon devices
US5009926A (en) * 1989-05-18 1991-04-23 Oki Electric Industry Co., Ltd. Method of forming an insulating film
US5648282A (en) * 1992-06-26 1997-07-15 Matsushita Electronics Corporation Autodoping prevention and oxide layer formation apparatus
US5650353A (en) * 1992-09-29 1997-07-22 Shin-Etsu Handotai Co., Ltd. Method for production of SOI substrate
US5738909A (en) * 1996-01-10 1998-04-14 Micron Technology, Inc. Method of forming high-integrity ultrathin oxides
US5786277A (en) * 1995-09-29 1998-07-28 Nec Corporation Method of manufacturing a semiconductor device having an oxide film of a high quality on a semiconductor substrate
US5851892A (en) * 1997-05-07 1998-12-22 Cypress Semiconductor Corp. Fabrication sequence employing an oxide formed with minimized inducted charge and/or maximized breakdown voltage
US5926741A (en) * 1996-07-12 1999-07-20 Sharp Kabushiki Kaisha Method of forming gate dielectric films for MOSFETs without generation of natural oxide films
US5962854A (en) * 1996-06-12 1999-10-05 Ishizuka Electronics Corporation Infrared sensor and infrared detector
US6281141B1 (en) * 1999-02-08 2001-08-28 Steag Rtp Systems, Inc. Process for forming thin dielectric layers in semiconductor devices
US20010017294A1 (en) * 1997-11-14 2001-08-30 Nobutoshi Aoki Method and equipment for manufacturing semiconductor device
US20010050052A1 (en) * 1998-04-03 2001-12-13 Tsuyoshi Moriyama Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
US20010052621A1 (en) * 2000-06-05 2001-12-20 Beaman Kevin L. PD-SOI substrate with suppressed floating body effect and method for its fabrication
US6455382B1 (en) * 2001-05-03 2002-09-24 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-step method for forming sacrificial silicon oxide layer
US20030054596A1 (en) * 2001-09-17 2003-03-20 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming a uniform ultra-thin gate oxide layer
US6537926B1 (en) * 1999-09-14 2003-03-25 Infineon Technologies, Ag Process for improving the thickness uniformity of a thin oxide layer in semiconductor wafer fabrication
JP2004064037A (en) * 2002-06-03 2004-02-26 Sanyo Electric Co Ltd Method of manufacturing semiconductor device
US20040185676A1 (en) * 2003-01-31 2004-09-23 Nec Electronics Corporation Semiconductor device and method of manufacturing semiconductor device
US6797323B1 (en) * 1996-11-29 2004-09-28 Sony Corporation Method of forming silicon oxide layer
US20040224531A1 (en) * 2003-05-09 2004-11-11 Samsung Electronics Co., Ltd. Method of forming an oxide layer and method of forming an oxinitride layer
US20040235295A1 (en) * 2003-05-20 2004-11-25 Zhong Dong Methods for improving quality of high temperature oxide (HTO) formed from halogen-containing precursor and products thereof and apparatus thereof
USRE38674E1 (en) * 1991-12-17 2004-12-21 Intel Corporation Process for forming a thin oxide layer
US7332448B2 (en) * 2004-09-10 2008-02-19 Seiko Epson Corporation Manufacturing method of semiconductor device and semiconductor manufacturing device
US20100032710A1 (en) * 2005-10-25 2010-02-11 Peter Steven Bui Deep Diffused Thin Photodiodes
US20100144161A1 (en) * 2008-12-09 2010-06-10 Hitachi-Kokusai Electric Inc. Semiconductor device manufacturing method and substrate processing apparatus
US20100184267A1 (en) * 2009-01-21 2010-07-22 Tokyo Electron Limited Method of forming silicon oxide film and method of production of semiconductor memory device using this method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186255A (en) * 1996-11-29 1999-07-09 Sony Corp Method of forming silicon oxide film
US6541394B1 (en) * 1999-01-12 2003-04-01 Agere Systems Guardian Corp. Method of making a graded grown, high quality oxide layer for a semiconductor device
JP2000232222A (en) * 1999-02-10 2000-08-22 Nec Corp Manufacture of semiconductor device
JP4914536B2 (en) * 2001-02-28 2012-04-11 東京エレクトロン株式会社 Oxide film formation method
US6890831B2 (en) 2002-06-03 2005-05-10 Sanyo Electric Co., Ltd. Method of fabricating semiconductor device
JP4427489B2 (en) 2005-06-13 2010-03-10 株式会社東芝 Manufacturing method of semiconductor device
JP2007053227A (en) 2005-08-18 2007-03-01 Matsushita Electric Ind Co Ltd Semiconductor device and its manufacturing method
JP5280015B2 (en) * 2007-05-07 2013-09-04 信越半導体株式会社 Manufacturing method of SOI substrate

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4494303A (en) * 1983-03-31 1985-01-22 At&T Bell Laboratories Method of making dielectrically isolated silicon devices
US5009926A (en) * 1989-05-18 1991-04-23 Oki Electric Industry Co., Ltd. Method of forming an insulating film
USRE38674E1 (en) * 1991-12-17 2004-12-21 Intel Corporation Process for forming a thin oxide layer
US5648282A (en) * 1992-06-26 1997-07-15 Matsushita Electronics Corporation Autodoping prevention and oxide layer formation apparatus
US5650353A (en) * 1992-09-29 1997-07-22 Shin-Etsu Handotai Co., Ltd. Method for production of SOI substrate
US5786277A (en) * 1995-09-29 1998-07-28 Nec Corporation Method of manufacturing a semiconductor device having an oxide film of a high quality on a semiconductor substrate
US5738909A (en) * 1996-01-10 1998-04-14 Micron Technology, Inc. Method of forming high-integrity ultrathin oxides
US5962854A (en) * 1996-06-12 1999-10-05 Ishizuka Electronics Corporation Infrared sensor and infrared detector
US5926741A (en) * 1996-07-12 1999-07-20 Sharp Kabushiki Kaisha Method of forming gate dielectric films for MOSFETs without generation of natural oxide films
US6797323B1 (en) * 1996-11-29 2004-09-28 Sony Corporation Method of forming silicon oxide layer
US5851892A (en) * 1997-05-07 1998-12-22 Cypress Semiconductor Corp. Fabrication sequence employing an oxide formed with minimized inducted charge and/or maximized breakdown voltage
US20010017294A1 (en) * 1997-11-14 2001-08-30 Nobutoshi Aoki Method and equipment for manufacturing semiconductor device
US20010050052A1 (en) * 1998-04-03 2001-12-13 Tsuyoshi Moriyama Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
US6281141B1 (en) * 1999-02-08 2001-08-28 Steag Rtp Systems, Inc. Process for forming thin dielectric layers in semiconductor devices
US6537926B1 (en) * 1999-09-14 2003-03-25 Infineon Technologies, Ag Process for improving the thickness uniformity of a thin oxide layer in semiconductor wafer fabrication
US20010052621A1 (en) * 2000-06-05 2001-12-20 Beaman Kevin L. PD-SOI substrate with suppressed floating body effect and method for its fabrication
US6455382B1 (en) * 2001-05-03 2002-09-24 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-step method for forming sacrificial silicon oxide layer
US20030054596A1 (en) * 2001-09-17 2003-03-20 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming a uniform ultra-thin gate oxide layer
JP2004064037A (en) * 2002-06-03 2004-02-26 Sanyo Electric Co Ltd Method of manufacturing semiconductor device
US20040185676A1 (en) * 2003-01-31 2004-09-23 Nec Electronics Corporation Semiconductor device and method of manufacturing semiconductor device
US20040224531A1 (en) * 2003-05-09 2004-11-11 Samsung Electronics Co., Ltd. Method of forming an oxide layer and method of forming an oxinitride layer
US20040235295A1 (en) * 2003-05-20 2004-11-25 Zhong Dong Methods for improving quality of high temperature oxide (HTO) formed from halogen-containing precursor and products thereof and apparatus thereof
US7332448B2 (en) * 2004-09-10 2008-02-19 Seiko Epson Corporation Manufacturing method of semiconductor device and semiconductor manufacturing device
US20100032710A1 (en) * 2005-10-25 2010-02-11 Peter Steven Bui Deep Diffused Thin Photodiodes
US20100144161A1 (en) * 2008-12-09 2010-06-10 Hitachi-Kokusai Electric Inc. Semiconductor device manufacturing method and substrate processing apparatus
US20100184267A1 (en) * 2009-01-21 2010-07-22 Tokyo Electron Limited Method of forming silicon oxide film and method of production of semiconductor memory device using this method

Also Published As

Publication number Publication date
EP2639819A1 (en) 2013-09-18
WO2012063402A1 (en) 2012-05-18
KR20140015263A (en) 2014-02-06
US9171737B2 (en) 2015-10-27
CN103262222B (en) 2016-03-30
CN103262222A (en) 2013-08-21
EP2639819B1 (en) 2017-01-04
JP5479304B2 (en) 2014-04-23
EP2639819A4 (en) 2014-04-02
JP2012104651A (en) 2012-05-31
KR101725777B1 (en) 2017-04-11

Similar Documents

Publication Publication Date Title
JP6070954B2 (en) Semiconductor substrate on glass having stiffening layer and manufacturing process thereof
JP6425835B2 (en) Method of manufacturing a diamond-semiconductor composite substrate
TWI474397B (en) Method for forming silicon oxide film of SOI wafer
JP5487565B2 (en) Epitaxial wafer and method for manufacturing the same
WO2019128524A1 (en) Method for eliminating wafer warpage and composite substrate
US9171737B2 (en) Thermal oxide film formation method for silicon single crystal wafer
KR101313462B1 (en) Method for heat treating silicon wafer
JP6288323B2 (en) Method for producing thermally oxidized heterogeneous composite substrate
JP5273150B2 (en) Manufacturing method of silicon epitaxial wafer
US8853054B2 (en) Method of manufacturing silicon-on-insulator wafers
EP2924736A1 (en) Method for manufacturing soi wafer
US20080268621A1 (en) Method for manufacturing compound material wafer and corresponding compound material wafer
US8324078B2 (en) Method and installation for fracturing a composite substrate along an embrittlement plane
US11393772B2 (en) Bonding method for semiconductor substrate, and bonded semiconductor substrate
JP6822375B2 (en) Manufacturing method of silicon epitaxial wafer
JP2010153488A (en) Manufacturing method of soi wafer, and soi wafer
JP2007019303A (en) Semiconductor substrate and manufacturing method thereof
US20230230875A1 (en) Support substrate for bonded wafer
KR100857386B1 (en) Method for thermal process of SOI wafer
JP2006080294A (en) Method of manufacturing substrate
EP1605504A1 (en) Method for manufacturing a SOI wafer

Legal Events

Date Code Title Description
AS Assignment

Owner name: SHIN-ETSU HANDOTAI CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TAKAHASHI, HIROYUKI;YOSHIDA, KAZUHIKO;REEL/FRAME:030046/0749

Effective date: 20130226

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8