US20130243995A1 - Carrier For Manufacturing Substrate and Method Of Manufacturing Substrate Using The Same - Google Patents
Carrier For Manufacturing Substrate and Method Of Manufacturing Substrate Using The Same Download PDFInfo
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- US20130243995A1 US20130243995A1 US13/888,241 US201313888241A US2013243995A1 US 20130243995 A1 US20130243995 A1 US 20130243995A1 US 201313888241 A US201313888241 A US 201313888241A US 2013243995 A1 US2013243995 A1 US 2013243995A1
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- United States
- Prior art keywords
- adhesive layer
- layer
- metal layer
- auxiliary adhesive
- auxiliary
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1043—Subsequent to assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1142—Changing dimension during delaminating [e.g., crushing, expanding, warping, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.
Description
- This application is a divisional of U.S. patent application Ser. No. 12/787,300, filed on May 25, 2010, entitled “Carrier For Manufacturing Substrate and Method Of Manufacturing Substrate Using The Same' which claims the benefit of Korean Patent Application No. 10-2009-0133970, filed Dec. 30, 2009, entitled “A carrier member for manufacturing a substrate and a method of manufacturing a substrate using the same”, both of which are hereby incorporated by reference in their entirety into this application.
- 1. Technical Field
- The present invention relates to a carrier for manufacturing a substrate and a method of manufacturing a substrate using the same.
- 2. Description of the Related Art
- Generally, printed circuit boards (PCBs) are manufactured by patterning one or both sides of a substrate, composed of various thermosetting resins, using copper foil, and disposing and fixing ICs or electronic parts on the substrate to form an electric circuit and then coating the substrate with an insulator.
- Recently, with the advancement of the electronics industry, electronic parts are increasingly required to be highly functionalized, light, thin, short and small. Thus, printed circuit boards loaded with such electronic parts are also required to be highly densified and thin.
- In particular, in order to keep up with the thinning of printed circuit boards, a coreless substrate which can decrease thickness by removing a core and can shorten signal processing time is attracting considerable attention. However, a coreless substrate needs a carrier serving as a support during a process because it does not have a core. Hereinafter, a conventional method of manufacturing a coreless substrate will be described with reference to
FIGS. 1A to 1E . -
FIGS. 1A to 1E are sectional views sequentially showing a conventional method of manufacturing a substrate using a carrier, andFIG. 2 is an enlarged view showing an essential part of a first metal layer and a second metal layer shown inFIG. 1 . Problems of conventional technologies will be described with reference toFIGS. 1A to 1E . - First, as shown in
FIG. 1A , acarrier 10 is provided. Thecarrier 10 is fabricated by sequentially formingadhesive films 12,first metal layers 13 andsecond metal layers 14 on both sides of a copper clad laminate (CCL) 11. In this case, the carrier is heated and pressed by a press, and thus the copperclad laminate 11 and thesecond metal layer 14 attach to each other at a periphery thereof by means of theadhesive film 12. Meanwhile, in order to stably attach the copperclad laminate 11 and thesecond metal layer 14 to each other, the contact face therebetween must have a thickness of 10 mm, and thefirst metal layer 13 and thesecond metal layer 14 are vacuum-adsorbed. - Subsequently, as shown in
FIG. 1B , build uplayers 15 are formed on both sides of thecarrier 10. Here, each of the build uplayers 15 is formed in a general manner, and is additionally provided with athird metal layer 16 for preventing the warpage of the build uplayer 15 at the outermost layer thereof. - Subsequently, as shown in
FIG. 1C , the build uplayers 15 are separated from thecarrier 10. Here, the build uplayers 15 are separated from thecarrier 10 by removing the edge of the adhesive film through which the copperclad laminate 11 and thesecond metal layer 14 are attached to each other by a routing process. - Subsequently, as shown in
FIG. 1D , thesecond metal layer 14 and thethird metal layer 15 formed at the outermost layers of the build uplayer 15 are removed by etching. - Subsequently, as shown in
FIG. 1E ,openings 17 for exposingpads 19 are formed in the outermost insulation layers of the build uplayer 15, and thensolder balls 18 are formed on thepads 19. - In the above-mentioned conventional method of manufacturing a substrate, copper foil is used as the
first metal layer 13 and thesecond metal foil 14. However, the copper foil includes a matte surface (M surface) having high surface roughness and a shiny surface (S surface) having low surface roughness. Therefore, as shown inFIG. 2 , small space (S) is formed between thefirst metal layer 13 and thesecond metal layer 14 due to the matte surface (M surface), and thus it is difficult to completely maintain a vacuum. Consequently, there is a problem in that wrinkles occur when the build uplayer 15 is formed on thesecond metal layer 14. - Further, even when pin-holes are formed in the
first metal layer 13 or thesecond metal layer 14, there is a problem in that a vacuum is not maintained between thefirst metal layer 13 and thesecond metal layer 14, and thus it is difficult to continue a process. - Furthermore, when the build up
layers 15 are separated from thecarrier 10 by removing the edge of theadhesive film 12 through a routing process, the build uplayers 15 warp in an extreme manner due to the difference in material properties between thesecond metal layer 13 and the insulating material of thecarrier 10. Therefore, there are problems in that process automation cannot be realized and in that subsequent processes must be manually performed. - Accordingly, the present invention has been made to solve the above-mentioned problems, and the present invention provides a carrier for manufacturing a substrate, which can completely maintain a vacuum by attaching an auxiliary adhesive layer to a metal layer, and which can prevent the warpage of a build up layer by maintaining the adhesion between the auxiliary adhesive layer and the metal layer for a predetermined time using the adhesivity of the auxiliary adhesive layer even after a routing process, and a method of manufacturing a substrate using the same.
- An aspect of the present invention provides a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers.
- Here, the adhesive layer may be prepreg, an ajinomoto build up film (ABF) or an epoxy film.
- Further, the auxiliary adhesive layer may be a polymer film.
- Further, the auxiliary adhesive layer may have an adhesivity of 0.01˜0.2 KN/m.
- Further, the adhesivity of one side of the auxiliary adhesive layer may be lower than that of the other side of the auxiliary adhesive layer.
- Another aspect of the present invention provides a method of manufacturing a substrate using a carrier, including: forming an adhesive layer on one side or both sides of a base plate; forming an auxiliary adhesive layer on the adhesive layer, the auxiliary adhesive layer having lower adhesivity and a smaller area than the adhesive layer; applying a metal layer onto one side of the auxiliary adhesive layer and then heating and pressing the metal layer to bury the auxiliary adhesive layer in one side of the adhesive layer, and then attaching the edge of the metal layer to the adhesive layer and attaching the other portion of the metal layer, excluding the edge thereof, to the auxiliary adhesive layer to provide a carrier for manufacturing a substrate; and forming a build up layer on one side of the metal layer and then removing the edge of the metal layer attached to the adhesive layer to separate the metal layer from the auxiliary adhesive layer.
- Here, in the separating of the metal layer from the auxiliary adhesive layer, the adhesion between the metal layer and the auxiliary adhesive layer may be maintained for a predetermined time due to the adhesivity of the auxiliary adhesive layer after the edge of the metal layer has been removed.
- Further, in the separating of the metal layer from the auxiliary adhesive layer, the metal layer may be separated from the auxiliary adhesive layer by warping the metal layer after the edge of the metal layer has been removed.
- Further, in the forming of the adhesive layer, the adhesive layer may be prepreg, an ajinomoto build up film (ABF) or an epoxy film.
- Further, in the forming of the auxiliary adhesive layer, the auxiliary adhesive layer may be a polymer film.
- Further, in the forming of the auxiliary adhesive layer, the auxiliary adhesive layer may have an adhesivity of 0.01˜0.2 KN/m.
- Further, in the applying of the metal layer onto the auxiliary adhesive layer, the adhesivity of one side of the auxiliary adhesive layer may be lower than that of the other side of the auxiliary adhesive layer.
- Various objects, advantages and features of the invention will become apparent from the following description of embodiments with reference to the accompanying drawings.
- The terms and words used in the present specification and claims should not be interpreted as being limited to typical meanings or dictionary definitions, but should be interpreted as having meanings and concepts relevant to the technical scope of the present invention based on the rule according to which an inventor can appropriately define the concept of the term to describe the best method he or she knows for carrying out the invention.
- The above and other objects, features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
-
FIGS. 1A to 1E are sectional views sequentially showing a conventional method of manufacturing a substrate using a carrier; -
FIG. 2 is an enlarged view showing an essential part of a first metal layer and a second metal layer shown inFIG. 1 ; -
FIG. 3 is a sectional view showing a carrier for manufacturing a substrate according to an embodiment of the present invention; and -
FIGS. 4 to 11 are sectional views sequentially showing a method of manufacturing a substrate using the carrier according to an embodiment of the present invention. - The objects, features and advantages of the present invention will be more clearly understood from the following detailed description and preferred embodiments taken in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant descriptions thereof are omitted. Further, in the following description, the terms “one side”, “the other side” and the like are used to differentiate a certain component from other components, but the configuration of such components should not be construed to be limited by the terms. Further, in the description of the present invention, when it is determined that the detailed description of the related art would obscure the gist of the present invention, the description thereof will be omitted.
- Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.
-
FIG. 3 is a sectional view showing a carrier for manufacturing a substrate according to an embodiment of the present invention. - As shown in
FIG. 3 , thecarrier 100 for manufacturing a substrate according to this embodiment includes: abase plate 110;adhesive layers 120 formed on one side or both sides of thebase plate 110; auxiliaryadhesive layers 130, each of which is buried in one side of each of theadhesive layers 120, has a smaller area than each of theadhesive layers 120 and has lower adhesivity than each of theadhesive layers 120; andmetal layers 140, each of which is formed on one side of each of the auxiliaryadhesive layers 130, whose edges are attached to theadhesive layers 120, and whose other portions excluding the edges are attached to the auxiliary adhesive layers 130. - The
adhesive layers 120, which serve to attach and fix the metal layers 140, are formed on both sides of thebase plate 110. In the drawings, theadhesive layers 120 are formed on both sides of thebase plate 110, but the present invention is not limited thereto, and theadhesive layer 120 may be formed on one side of thebase plate 110. Further, since theadhesive layer 120 must be attached to themetal layer 140, it may be formed of prepreg, an ajinomoto build up film (ABF), an epoxy film or the like, which has at least a predetermined adhesivity. - Meanwhile, the kind of the
base plate 110 is not particularly limited. A copper clad laminate (CCL), a prepreg coated on both sides thereof with copper foil or the like may be used as thebase plate 110. - The auxiliary
adhesive layer 130, which serves to maintain the adhesion between theadhesive layer 120 and themetal layer 140 even after theadhesive layer 120 and themetal layer 140 are detached from each other by removing the edge of theadhesive layer 120, is buried in the one side of theadhesive layer 120. The auxiliaryadhesive layer 130 must not be buried in the entire region of theadhesive layer 120. The auxiliaryadhesive layer 130 must be formed such that it has a larger area than theadhesive layer 120, and must be buried in the partial region of theadhesive layer 120 such that the edge of theadhesive layer 120 is brought into contact with the edge of themetal layer 140. Since the auxiliaryadhesive layer 130 is attached to themetal layer 140 by its adhesivity, the present invention, differently from conventional technologies, does not employ vacuum adsorption. However, since themetal layer 140 must be finally detached from the auxiliaryadhesive layer 130, the auxiliaryadhesive layer 130 must have lower adhesivity than theadhesive layer 120, and themetal layer 140 must be separated from the auxiliaryadhesive layer 130 by performing an additional separation process or warping the metal layer 140 (refer toFIGS. 8 to 9 ). Therefore, the auxiliaryadhesive layer 130 may have an adhesivity of 0.01˜0.2 KN/m, but the present invention is not limited thereto. - Further, in order to finally separate the
metal layer 140 from the auxiliaryadhesive layer 130, the bonding force between the auxiliaryadhesive layer 130 and themetal layer 140 must be weaker than the bonding force between the auxiliaryadhesive layer 130 and theadhesive layer 120. Therefore, it is preferred that the adhesivity of one side of the auxiliary adhesive layer 130 (the one side thereof is brought into contact with the metal layer 140) be lower than the adhesivity of the other side of the auxiliary adhesive layer 130 (the other side thereof is brought into contact with the adhesive layer 120). - Considering the ease of the control of the bonding force and the realization of the difference in adhesivity between one side and the other side of the auxiliary
adhesive layer 130, it is preferred that a polymer film be employed as the auxiliaryadhesive layer 130. - The
metal layer 140, which serves as a release layer for separating a build uplayer 150 from theadhesive layer 120 and the auxiliaryadhesive layer 130, is formed on one side of the auxiliaryadhesive layer 130. As described above, since the auxiliaryadhesive layer 130 is formed such that it has a larger area than theadhesive layer 120, the edge of theadhesive layer 120 is exposed. Therefore, when themetal layer 140 is formed on the auxiliaryadhesive layer 130 and then heated and pressed, the edge of themetal layer 140 is attached to the edge of theadhesive layer 120, and the other portion of the metal layer, excluding the edge thereof, is attached to the auxiliaryadhesive layer 130. Meanwhile, themetal layer 140 may be made of copper (Cu), nickel (Ni) or aluminum (A), which can be easily etched, because themetal layer 140 must be separated from acarrier 100 together with a build uplayer 150 and then removed from the build up layer 150 (refer toFIG. 10 ). For example, copper foil may be used as themetal layer 140. - The
carrier 100 according to this embodiment, differently from conventional carriers, is advantageous in that themetal layer 140 and the auxiliaryadhesive layer 130 are attached to each other by the adhesivity of the auxiliaryadhesive layer 130, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be more stably performed. - Further, the
carrier 100 according to this embodiment is advantageous in that the warpage of the build uplayer 150 can be prevented by maintaining the adhesion between the auxiliaryadhesive layer 130 and themetal layer 140 using the adhesivity of the auxiliaryadhesive layer 130 even after a routing process for theadhesive layer 120, thus realizing process automation. -
FIGS. 4 to 11 are sectional views sequentially showing a method of manufacturing a substrate using the carrier according to an embodiment of the present invention. - As shown in
FIGS. 4 to 11 , the method of manufacturing a substrate using thecarrier 100 according to this embodiment includes: forming anadhesive layer 120 on one side or both sides of abase plate 110; forming an auxiliaryadhesive layer 130 on theadhesive layer 120, the auxiliaryadhesive layer 130 having lower adhesivity and a smaller area than theadhesive layer 120; applying ametal layer 140 onto one side of the auxiliaryadhesive layer 130 and then heating and pressing themetal layer 140 to bury the auxiliaryadhesive layer 130 in one side of theadhesive layer 120, and then attaching the edge of themetal layer 140 to theadhesive layer 120 and attaching the other portion of themetal layer 140, excluding the edge thereof, to the auxiliaryadhesive layer 130 to provide acarrier 100 for manufacturing a substrate; and forming a build uplayer 150 on one side of themetal layer 140 and then removing the edge of themetal layer 140 attached to theadhesive layer 120 to separate themetal layer 140 from the auxiliaryadhesive layer 130. - First, as shown in
FIG. 4 , anadhesive layer 120 is formed on abase plate 110. Here, since theadhesive layer 120 serves to attach and fix ametal layer 140 in subsequent processes, it may be formed of prepreg, an ajinomoto build up film (ABF), an epoxy film or the like, which has predetermined adhesivity or more. In the drawings, theadhesive layers 120 are formed on both sides of thebase plate 110, but the present invention is not limited thereto, and theadhesive layer 120 may be formed on one side of thebase plate 110. When theadhesive layer 120 is formed only on one side of thebase plate 110, an auxiliaryadhesive layer 130, ametal layer 140 and a build up layer are also sequentially formed only on one side of thebase plate 110. - Subsequently, as shown in
FIG. 5 , an auxiliaryadhesive layer 130 is formed on one side of theadhesive layer 120. Here, the auxiliaryadhesive layer 130 serves to maintain the adhesion between theadhesive layer 120 and themetal layer 140 even after the edge of theadhesive layer 120 has been removed in subsequent processes. Further, the auxiliaryadhesive layer 130 may have a smaller area than theadhesive layer 120 such that the edge of theadhesive layer 120 is brought into contact with the edge of themetal layer 140. Meanwhile, the auxiliaryadhesive layer 130 must have lower adhesivity than theadhesive layer 120 because it must be finally detached from themetal layer 140. Therefore, the auxiliaryadhesive layer 130 may have an adhesivity of 0.01˜0.2 KN/m, but the present invention is not limited thereto. - Further, in order to finally separate the auxiliary
adhesive layer 130 and themetal layer 140 from each other, the bonding force between the auxiliaryadhesive layer 130 and themetal layer 140 must be weaker than the bonding force between the auxiliaryadhesive layer 130 and theadhesive layer 120. Therefore, it is preferred that the adhesivity of one side of the auxiliary adhesive layer 130 (the one side thereof is brought into contact with the metal layer 140) be lower than the adhesivity of the other side of the auxiliary adhesive layer 130 (the other side thereof is brought into contact with the adhesive layer 120). - Subsequently, as shown in
FIG. 6 , ametal layer 140 is applied onto the auxiliaryadhesive layer 130 to provide acarrier 100. Concretely, themetal layer 140 is applied onto one side of the auxiliaryadhesive layer 130 and then heated and pressed to bury the auxiliaryadhesive layer 130 in one side of theadhesive layer 120, and simultaneously the edge of themetal layer 140 is attached to theadhesive layer 120, and the other portion of themetal layer 140, excluding the edge thereof, is attached to the auxiliaryadhesive layer 130. In this process, themetal layer 140 and the auxiliaryadhesive layer 130 are attached to each other not by vacuum adsorption but by the adhesivity of the auxiliaryadhesive layer 130, differently from conventional technologies. - Subsequently, as shown in
FIG. 7 , a build uplayer 150 is formed on one side of themetal layer 140. The build uplayer 150 is formed by sequentially laminating a patternedcircuit layer 153 and an insulatingmaterial 157 using plating or printing. Concretely, the build uplayer 150 can be completed by applying an insulatingmaterial 151 onto themetal layer 140, forming via holes in the insulatingmaterial 157 using a YAG or CO2 laser and then forming acircuit layer 153 includingvias 151 on the insulatingmaterial 151 through a Semi-Additive Process (SAP) or a Modified Semi-Additive Process (MSAP). Further, the build uplayer 150 may be provided with a solder resistlayer 155 at the outermost layer. Here, the solder resistlayer 155 is made of a heat-resistant coating material, and serves to protect thecircuit layer 153 such that solder is not applied on thecircuit layer 153 during soldering. - Meanwhile, in the drawings, the build up
layers 150 are formed on both sides of acarrier 100, but the build uplayer 150 may be formed only on one side of thecarrier 100 by sequentially forming theadhesive layer 120, the auxiliaryadhesive layer 130 and themetal layer 140 only on one side of thebase plate 110 in the previous process. - Subsequently, as shown in
FIGS. 8 to 9 , the edge of themetal layer 140 is removed to separate themetal layer 140 from the auxiliaryadhesive layer 130. When the edge of themetal layer 140 attached to the edge of theadhesive layer 120 is removed, the bonding force between theadhesive layer 120 and themetal layer 140 disappears. However, since the other portion of themetal layer 140, excluding the edge thereof, is attached to the auxiliaryadhesive layer 130, themetal layer 140 is not separated from the auxiliaryadhesive layer 130 the moment the edge of themetal layer 140 is removed (refer toFIG. 8A ). However, since the adhesivity of the auxiliaryadhesive layer 130 decreases with the passage of time, themetal layer 140 can be separated from the auxiliaryadhesive layer 130 after the predetermined time. In addition, themetal layer 140 may be separated from the auxiliaryadhesive layer 130 by warping the metal layer 140 (refer toFIG. 8B ) or by performing an additional separation process. In this process, since themetal layer 140 is not immediately separated from the auxiliaryadhesive layer 130 and the adhesion between themetal layer 140 and the auxiliaryadhesive layer 130 is maintained for a predetermined time due to the adhesivity of the auxiliaryadhesive layer 130, the warpage of the build uplayer 150 can be prevented, thus realizing process automation. - Subsequently, as shown in
FIGS. 10 to 11 , themetal layer 140 is removed from the build uplayer 150, and then holes 159 are formed in the solder resistlayer 155. Here, themetal layer 140 may be removed by etching, and theholes 159 are formed in the solder resistlayer 155 in order to electrically connect thecircuit layer 153 with external circuits. However, this process of forming theholes 159 in the solder resistlayer 155 is not necessarily performed by an additional process. - As described above, according to the present invention, a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.
- Further, according to the present invention, the warpage of a build up layer can be prevented by maintaining the adhesion between the auxiliary adhesive layer and the metal layer using the adhesivity of the auxiliary adhesive layer even after a routing process for the adhesive layer, thus realizing process automation.
- Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.
- Simple modifications, additions and substitutions of the present invention belong to the scope of the present invention, and the specific scope of the present invention will be clearly defined by the appended claims.
Claims (5)
1. A carrier for manufacturing a substrate, comprising:
a base plate;
adhesive layers formed on one side or both sides of the base plate;
auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and
metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers.
2. The carrier for manufacturing a substrate according to claim 1 , wherein the adhesive layer is prepreg, an ajinomoto build up film (ABF) or an epoxy film.
3. The carrier for manufacturing a substrate according to claim 1 , wherein the auxiliary adhesive layer is a polymer film.
4. The carrier for manufacturing a substrate according to claim 1 , wherein the auxiliary adhesive layer has an adhesivity of 0.01˜0.2 KN/m.
5. The carrier for manufacturing a substrate according to claim 1 , wherein the adhesivity of one side of the auxiliary adhesive layer is lower than that of the other side of the auxiliary adhesive layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/888,241 US20130243995A1 (en) | 2009-12-30 | 2013-05-06 | Carrier For Manufacturing Substrate and Method Of Manufacturing Substrate Using The Same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090133970A KR20110077403A (en) | 2009-12-30 | 2009-12-30 | A carrier member for manufacturing a substrate and a method of manufacturing a substrate using the same |
KR10-2009-0133970 | 2009-12-30 | ||
US12/787,300 US8435376B2 (en) | 2009-12-30 | 2010-05-25 | Carrier for manufacturing substrate and method of manufacturing substrate using the same |
US13/888,241 US20130243995A1 (en) | 2009-12-30 | 2013-05-06 | Carrier For Manufacturing Substrate and Method Of Manufacturing Substrate Using The Same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/787,300 Division US8435376B2 (en) | 2009-12-30 | 2010-05-25 | Carrier for manufacturing substrate and method of manufacturing substrate using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130243995A1 true US20130243995A1 (en) | 2013-09-19 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US12/787,300 Expired - Fee Related US8435376B2 (en) | 2009-12-30 | 2010-05-25 | Carrier for manufacturing substrate and method of manufacturing substrate using the same |
US13/888,241 Abandoned US20130243995A1 (en) | 2009-12-30 | 2013-05-06 | Carrier For Manufacturing Substrate and Method Of Manufacturing Substrate Using The Same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US12/787,300 Expired - Fee Related US8435376B2 (en) | 2009-12-30 | 2010-05-25 | Carrier for manufacturing substrate and method of manufacturing substrate using the same |
Country Status (4)
Country | Link |
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US (2) | US8435376B2 (en) |
JP (1) | JP4972189B2 (en) |
KR (1) | KR20110077403A (en) |
TW (1) | TW201124027A (en) |
Families Citing this family (13)
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CN102403441A (en) * | 2010-09-08 | 2012-04-04 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure |
KR101222828B1 (en) * | 2011-06-24 | 2013-01-15 | 삼성전기주식회사 | Method of manufacturing coreless substrate |
JP6091774B2 (en) * | 2012-06-12 | 2017-03-08 | 株式会社モトロニクス | Adhesive tape remover |
JP6054080B2 (en) * | 2012-07-20 | 2016-12-27 | 新光電気工業株式会社 | Support and manufacturing method thereof, wiring board manufacturing method, electronic component device manufacturing method, wiring structure |
KR101420499B1 (en) * | 2012-07-26 | 2014-07-16 | 삼성전기주식회사 | Multi-layer type coreless substrate and Method of manufacturing the same |
US20140042152A1 (en) * | 2012-08-08 | 2014-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Variable frequency microwave device and method for rectifying wafer warpage |
US9768048B2 (en) | 2013-03-15 | 2017-09-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package on-package structure |
CN104051411B (en) | 2013-03-15 | 2018-08-28 | 台湾积体电路制造股份有限公司 | Laminated packaging structure |
JP6036434B2 (en) * | 2013-03-18 | 2016-11-30 | 富士通株式会社 | Coreless wiring board manufacturing method, wiring board manufacturing carrier member and manufacturing method thereof |
KR101585554B1 (en) * | 2014-01-22 | 2016-01-14 | 앰코 테크놀로지 코리아 주식회사 | Embedded trace substrate and method manufacturing bump of the same |
TWI566652B (en) * | 2015-09-16 | 2017-01-11 | 臻鼎科技股份有限公司 | Circuit board and method for making the same field |
WO2018026004A1 (en) * | 2016-08-05 | 2018-02-08 | 三菱瓦斯化学株式会社 | Support substrate, laminate with support substrate, and method for manufacturing package substrate for mounting semiconductor element |
US11342254B2 (en) * | 2020-03-16 | 2022-05-24 | Qualcomm Incorporated | Multi-dielectric structure in two-layer embedded trace substrate |
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JP4565861B2 (en) * | 2004-02-27 | 2010-10-20 | 日本特殊陶業株式会社 | Wiring board manufacturing method |
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TW200920207A (en) | 2007-10-30 | 2009-05-01 | Asia Electronic Material Co | Protected film of printed circuit board and surface adhesive processing for using protective film of printed circuit board |
JP5195558B2 (en) * | 2009-03-19 | 2013-05-08 | 日立化成株式会社 | Manufacturing method of photoelectric composite member |
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KR101109230B1 (en) * | 2009-10-20 | 2012-01-30 | 삼성전기주식회사 | A printed circuit board and a fabricating method the same |
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2009
- 2009-12-30 KR KR1020090133970A patent/KR20110077403A/en not_active Application Discontinuation
-
2010
- 2010-05-21 JP JP2010117535A patent/JP4972189B2/en not_active Expired - Fee Related
- 2010-05-25 US US12/787,300 patent/US8435376B2/en not_active Expired - Fee Related
- 2010-05-28 TW TW099117225A patent/TW201124027A/en unknown
-
2013
- 2013-05-06 US US13/888,241 patent/US20130243995A1/en not_active Abandoned
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US4567073A (en) * | 1982-07-02 | 1986-01-28 | Minnesota Mining And Manufacturing Company | Composite low surface energy liner of perfluoropolyether |
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Also Published As
Publication number | Publication date |
---|---|
US20110159282A1 (en) | 2011-06-30 |
JP4972189B2 (en) | 2012-07-11 |
TW201124027A (en) | 2011-07-01 |
KR20110077403A (en) | 2011-07-07 |
US8435376B2 (en) | 2013-05-07 |
JP2011139013A (en) | 2011-07-14 |
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AS | Assignment |
Owner name: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA, REPUBL Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KIM, JIN HO;AHN, JIN YONG;KIM, KI HWAN;AND OTHERS;REEL/FRAME:032508/0386 Effective date: 20100426 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |