US20130273819A1 - Wafer transfer device for chemical mechanical polishing apparatus - Google Patents
Wafer transfer device for chemical mechanical polishing apparatus Download PDFInfo
- Publication number
- US20130273819A1 US20130273819A1 US13/384,617 US201113384617A US2013273819A1 US 20130273819 A1 US20130273819 A1 US 20130273819A1 US 201113384617 A US201113384617 A US 201113384617A US 2013273819 A1 US2013273819 A1 US 2013273819A1
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- US
- United States
- Prior art keywords
- lifting frame
- wafer
- transfer device
- contraposition ring
- lower portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
A wafer-transfer device for a chemical-mechanical polishing apparatus includes a base and lifting frame. A first cylinder is connected to a lower portion of the lifting frame to lift it and includes a piston rod passing through the lower portion of the lifting frame and fixed to the base. A basin-shaped contraposition ring is mounted onto an upper portion of the lifting frame via a spring. An inner edge of a top of the contraposition ring defines a curved surface adapted to a contour of a polishing head of the chemical-mechanical polishing apparatus. A wafer support is disposed above the contraposition ring. A second cylinder is mounted onto the contraposition ring and includes a piston rod passing through the contraposition ring and connected to a bottom of the wafer support to lift it. Respective axes of the wafer support, second cylinder, and contraposition ring coincide with one another.
Description
- This application is a “national phase” application of Patent Cooperation Treaty Application PCT/CN2011/076831 filed on Jul. 4, 2011, which, in turn, claims priority to and benefit of the filing date of Chinese Patent Application 201010623316.8 filed on Dec. 29, 2010 and entitled “Wafer Transfer Device for Chemical Mechanical Polishing Apparatus.”
- 1. Field of Invention
- The invention relates, generally, to a wafer-transfer device and, more specifically, to such a device for a chemical-mechanical polishing apparatus.
- 2. Description of Related Art
- A wafer-transfer device needs to be used for transferring and positioning a wafer during a chemical-mechanical polishing process. Accurate docking between a conventional wafer-transfer device and polishing head is difficult to realize because of mechanical errors, which may cause failures of wafer transfer (particularly when the wafer is loaded by the polishing head) or even result in wafer breakage, thus seriously affecting the subsequent operation.
- Thus, there is a need in the related art for a wafer-transfer device for transferring and positioning a wafer during a chemical-mechanical polishing process that may be accurately docked with a polishing head. More specifically, there is a need in the related art for such a device accurate docking between it and a polishing head is not difficult to realize because of mechanical error. There is a need in the related art for such a device that also does not cause failures of wafer transfer, particularly when the wafer is loaded by the polishing head. There is a need in the related art for such a device that also does not even result in wafer breakage, thus seriously affecting the subsequent operation.
- The invention overcomes the disadvantages in the related art in a wafer-transfer device for a chemical-mechanical polishing apparatus. The device includes a base and lifting frame. A first cylinder is connected to a lower portion of the lifting frame to lift the lifting frame and has a piston rod passing through the lower portion of the lifting frame and fixed to the base. A basin-shaped contraposition ring is mounted onto an upper portion of the lifting frame via a spring. An inner edge of a top of the contraposition ring has a curved surface adapted to a contour of a polishing head of the chemical-mechanical polishing apparatus. A wafer support is disposed above the contraposition ring. A second cylinder is mounted onto the contraposition ring and has a piston rod passing through the contraposition ring and connected to a bottom of the wafer support to lift the wafer support. An axis of the wafer support, an axis of the second cylinder, and an axis of the contraposition ring coincide with one another.
- An advantage of the wafer-transfer device of the invention is that it transfers and positions a wafer during a chemical-mechanical polishing process and may be accurately docked with a polishing head.
- Another advantage of the wafer-transfer device of the invention is that accurate docking between it and a polishing head is not difficult to realize because of mechanical error.
- Another advantage of the wafer-transfer device of the invention is that it does not cause failures of wafer transfer, particularly when the wafer is loaded by the polishing head.
- Another advantage of the wafer-transfer device of the invention is that it does not even result in wafer breakage, thus seriously affecting the subsequent operation.
- Other objects, features, and advantages of the invention are readily appreciated as the same becomes better understood while the subsequent detailed description of embodiments of the invention is read taken in conjunction with the accompanying drawing thereof.
-
FIG. 1 is a sectional view of an embodiment of a wafer-transfer device for a chemical-mechanical polishing apparatus according to the invention; -
FIG. 2 is a sectional view showing the embodiment of the wafer-transfer device for a chemical-mechanical polishing apparatus according to the invention shown inFIG. 1 docked with a polishing head; and -
FIG. 3 is a sectional view showing a wafer ejected from the embodiment of the wafer-transfer device for a chemical-mechanical polishing apparatus according to the invention shown inFIG. 1 . - Referring now to the figures, where like numerals are used to represent like structure, an embodiment of a wafer-transfer device for a chemical-mechanical polishing apparatus according to the invention is generally indicated at 10. The wafer-
transfer device 10 includes generally abase 100, alifting frame 200, afirst cylinder 300, a basin-shaped contraposition ring 400, awafer support 500, and asecond cylinder 600. - The
first cylinder 300 is connected to alower portion 240 of thelifting frame 200 to lift thelifting frame 200. Apiston rod 310 of thefirst cylinder 300 passes through thelower portion 240 of thelifting frame 200 and is fixed to thebase 100. Thecontraposition ring 400 is mounted onto anupper portion 230 of thelifting frame 200 via aspring 410, and an inner edge of a top of thecontraposition ring 400 has a curved surface adapted to a contour of apolishing head 30 of the chemical-mechanical polishing apparatus. Thewafer support 500 is disposed above thecontraposition ring 400. Thesecond cylinder 600 is mounted onto thecontraposition ring 400. Apiston rod 610 of thesecond cylinder 600 passes through thecontraposition ring 400 and is connected to a bottom of thewafer support 500 to lift thewafer support 500. An axis of the wafer support 500, an axis of thesecond cylinder 600, and an axis of thecontraposition ring 400 are coincided with one another. - With the wafer-
transfer device 10, because the inner edge of the top of thecontraposition ring 400 has the curved surface adapted to the contour of thepolishing head 30 of the chemical-mechanical polishing apparatus, when thepolishing head 30 carrying awafer 20 is docked with the wafer-transfer device 10, the curved surface of the curved surface of the top of thecontraposition ring 400 may be coincided with the contour of thepolishing head 30 so that thecontraposition ring 400 may be accurately docked with thepolishing head 30 under an action of geometrical factors. Therefore, the wafer-transfer device 10 may significantly increase the success rate of the wafer transfer so that the efficiency of the chemical-mechanical polishing is improved greatly and the cost of the chemical-mechanical polishing is remarkably lowered. - Referring to
FIGS. 1 through 3 , in an embodiment, theupper portion 230 of thelifting frame 200 may be formed with aside wall 210 surrounding thecontraposition ring 400 and being perpendicular to thelifting frame 200. Thecontraposition ring 400 may be surrounded inside theside wall 210, thus protecting thecontraposition ring 400. Specifically, theside wall 210 may be integrally formed with thelifting frame 200. - In an embodiment, the wafer-
transfer device 10 may include further a guidingshaft 700 and linear bearing 800. A first end of the guidingshaft 700 may be fixed to thebase 100, and a second end of the guidingshaft 700 may pass through thelower portion 240 of thelifting frame 200. The linear bearing 800 may be fitted over the guidingshaft 700 and fixed to thelower portion 240 of thelifting frame 200. An axis of the linear bearing 800 is parallel to the axis of thewafer support 500. By providing the guidingshaft 700 and linear bearing 800, thelifting frame 200 may be driven by thefirst cylinder 300 to lift along the axis of the guidingshaft 700. That is, thelifting frame 200 may be driven by thefirst cylinder 300 to lift along the axis of thewafer support 500 so that thewafer support 500 is always maintained in a “horizontal” state. - Specifically, a plurality of
first cylinders 300 are arranged on thelower portion 240 of thelifting frame 200 along a circumferential direction of thelifting frame 200 at equal intervals. That is, the plurality offirst cylinders 300 may be located on one circumference. By arranging a plurality offirst cylinders 300 on thelower portion 240 of thelifting frame 200 along the circumferential direction of thelifting frame 200 at equal intervals, when thelifting frame 200 is driven by thefirst cylinders 300 to lift, a driving force of thefirst cylinders 300 may be balanced and uniformly applied to thelifting frame 200 to avoid unbalanced loading. Alternatively, a plurality oflinear bearings 800 are arranged on thelower portion 240 of thelifting frame 200 along the circumferential direction of thelifting frame 200 at equal intervals. That is, the plurality oflinear bearings 800 may be located on one circumference. A plurality of guidingshafts 700 may be arranged on thelower portion 240 of thelifting frame 200 along the circumferential direction of thelifting frame 200 at equal intervals. That is, the plurality of guidingshafts 700 may be located on one circumference. By arranging the plurality of guidingshafts 700 and plurality oflinear bearings 800 on thelower portion 240 of thelifting frame 200 along the circumferential direction of thelifting frame 200 at equal intervals, thelifting frame 200 may be driven by thefirst cylinders 300 to accurately lift along the axis of thewafer support 500 so that thewafer support 500 is always maintained in a “horizontal” state. - In an embodiment, the wafer-
transfer device 10 may include further ascrew 420, which may pass through a through-hole 430 formed in thecontraposition ring 400 andspring 410 and be screwed into a screw-hole formed in theupper portion 230 of thelifting frame 200. In other words, thescrew 420 passes through the through-hole 430,spring 410, and screw-hole 420 in sequence from top to bottom. Thecontraposition ring 400 may be firmly mounted onto theupper portion 230 of thelifting frame 200 by thescrew 420. - In an embodiment, the through-
hole 430 may include alarge aperture portion 431 andsmall aperture portion 432 located below and communicated with thelarge aperture portion 431. Thescrew 420 may include ascrew cap 421 and screw stem 422 connected with each other. Thescrew cap 421 may be received inside thelarge aperture portion 431 and cover a top of thesmall aperture portion 432. The screw stem 422 may pass through thesmall aperture portion 432,spring 410, and screw-hole in sequence from top to bottom. By receiving thescrew cap 421 inside thelarge aperture portion 431 of the through-hole 430, thescrew 420 may be protected, and the structure of the wafer-transfer device 10 may be simplified. Specifically, a diameter of the screw stem 422 of thescrew 420 may be smaller than that of thesmall aperture portion 432 of the through-hole 430 by 1-3 mm, which may allow thecontraposition ring 400 to move horizontally in a predetermined range when an outside force is applied to thecontraposition ring 400. - In an embodiment, the wafer-
transfer device 10 may include further acover plate 440 for covering a top of the through-hole 430 in thecontraposition ring 400. In other words, thecover plate 440 may cover a top of thelarge aperture portion 431 of the through-hole 430 in thecontraposition ring 400. Thecover plate 440 may prevent foreign matter from entering into the through-hole 430. Specifically, thecover plate 440 may be disposed in a step-slot formed in the top of the through-hole 430 (i.e., the top of the large aperture portion 431). - In an embodiment, a plurality of
screws 420, plurality ofcover plates 440, and plurality ofsprings 410 are arranged on theupper portion 230 of thelifting frame 200 along a circumferential direction of thelifting frame 200 at equal intervals, respectively. When the amounts of compression of the plurality ofsprings 410 are different, thecontraposition ring 400 may deflect in a small range. Specifically, the plurality ofscrews 420, plurality ofcover plates 440, and plurality ofsprings 410 may be arranged on one circumference. - In an embodiment, the wafer-
transfer device 10 may include further ahydraulic buffer 900 mounted onto thelower portion 240 of thelifting frame 200 and located below thebase 100. During an ascending process of thelifting frame 200, when thelifting frame 200 nearly approaches an end of the ascending travel (for instance, when a distance from thelifting frame 200 to the end of the ascending travel is 3-5 mm), thehydraulic buffer 900 may be contacted with the base 100 so that a reacting force may be applied to thelifting frame 200 by the base 100 to reduce the ascending speed of thelifting frame 200. Therefore, thecontraposition ring 400 may be prevented from crashing into the polishinghead 30 to ensure a successful docking of thecontraposition ring 400 with the polishinghead 30. Specifically, an external screw thread is formed on thehydraulic buffer 900, and an internal screw thread is formed on thelower portion 240 of thelifting frame 200 so that thehydraulic buffer 900 may be threadedly fitted in thelower portion 240 of thelifting frame 200 or locked in thelower portion 240 of thelifting frame 200 via a screw nut. - In an embodiment, a plurality of
hydraulic buffers 900 are arranged on thelower portion 240 of thelifting frame 200 along a circumferential direction of thelifting frame 200 at equal intervals (that is, the plurality ofhydraulic buffers 900 are located on one circumference) so that the reacting force applied to thelifting frame 200 by thebase 100 is uniformly distributed onto thelifting frame 200. - In an embodiment, a
chamber 220 may be defined in thelifting frame 200, and a portion of thesecond cylinder 600 is located in thechamber 220 so that the space occupied by the wafer-transfer device 10 is greatly saved and the structure of the wafer-transfer device 10 is compact. Specifically, thelifting frame 200 may be hollow and I-shaped. That is, both of theupper portion 230 andlower portion 240 of thelifting frame 200 may be rounded while amiddle portion 250 of thelifting frame 200 may be hollow and have a cylindrical cross-section. Themiddle portion 250 of thelifting frame 200 may be connected with theupper portion 230 andlower portion 240 of thelifting frame 200, respectively. - A wafer-transfer process of the wafer-
transfer device 10 will now be described.FIG. 1 shows an “initial” state of the wafer-transfer device 10, wherein each part of the wafer-transfer device 10 is at a “low” position. When the polishinghead 30 is moved above the wafer-transfer device 10, thefirst cylinder 300 is actuated (that is, thepiston rod 310 of thefirst cylinder 300 is retracted into a chamber of the first cylinder 300) to drive the liftingframe 200 to move upward and then to drive thecontraposition ring 400 andwafer support 500 to move upward until thecontraposition ring 400 is docked with the polishing head 30 (as shown inFIG. 2 ). Then, thewafer 20 is released by the polishinghead 30 and drops onto thewafer support 500 under the action of its gravity. Then, the polishinghead 30 leaves. Subsequently, thefirst cylinder 300 is actuated (that is, thepiston rod 310 of thefirst cylinder 300 is extended out of the chamber of the first cylinder 300) to drive the liftingframe 200 to move downward and then to drive thecontraposition ring 400 andwafer support 500 to move downward until each of thelifting frame 200,contraposition ring 400, andwafer support 500 goes back to an “initial” position (the “low” position). Thus, an unloading of thewafer 20 is completed. Subsequently, thesecond cylinder 600 is actuated (that is, thepiston rod 610 of thesecond cylinder 600 is extended out of a chamber of the second cylinder 600) to drive thewafer support 500 andwafer 20 on thewafer support 500 to move upward (as shown inFIG. 3 ) so that thewafer 20 on thewafer support 500 may be taken away by a robot. Finally, thesecond cylinder 600 is actuated (that is, thepiston rod 610 of thesecond cylinder 600 is retracted into the chamber of the second cylinder 600) to drive thewafer support 500 to move downward until thewafer support 500 goes back to an “initial” position (the “low” position). - A process of transferring the
wafer 20 to the wafer-transfer device 10 by the robot and then loading thewafer 20 onto the polishinghead 30 is contrary to the foregoing process so that the detailed description thereof is omitted here. With the wafer-transfer device 10, thecontraposition ring 400 may be accurately docked with the polishinghead 30. - The wafer-
transfer device 10 transfers and positions a wafer during a chemical-mechanical polishing process and may be accurately docked with a polishing head. Also, accurate docking between the wafer-transfer device 10 and a polishing head is not difficult to realize because of mechanical error. Furthermore, the wafer-transfer device 10 does not cause failures of wafer transfer, particularly when the wafer is loaded by the polishing head. In addition, the wafer-transfer device 10 does not even result in wafer breakage, thus seriously affecting the subsequent operation. - The invention has been described above in an illustrative manner. It is to be understood that the terminology that has been used above is intended to be in the nature of words of description rather than of limitation. Many modifications and variations of the invention are possible in light of the above teachings. Therefore, within the scope of the appended claims, the invention may be practiced other than as specifically described above.
Claims (10)
1. A wafer-transfer device for a chemical-mechanical polishing apparatus, said device comprising:
a base;
a lifting frame;
at least one first cylinder connected to a lower portion of said lifting frame to lift said lifting frame and including a piston rod passing through said lower portion of said lifting frame and fixed to said base;
a basin-shaped contraposition ring mounted onto an upper portion of said lifting frame via at least one spring, an inner edge of a top of said contraposition ring defining a curved surface adapted to a contour of a polishing head of the chemical-mechanical polishing apparatus;
a wafer support disposed above said contraposition ring; and
a second cylinder mounted onto said contraposition ring and including a piston rod passing through said contraposition ring and connected to a bottom of said wafer support to lift said wafer support, wherein an axis of said wafer support, an axis of said second cylinder, and an axis of said contraposition ring coincide with one another.
2. A wafer-transfer device as set forth in claim 1 , wherein said upper portion of said lifting frame is formed with a side wall surrounding said contraposition ring and being substantially perpendicular to said upper portion of said lifting frame.
3. A wafer-transfer device as set forth in claim 1 , wherein said device comprises further at least one guiding shaft including a first end fixed to said base and a second end passing through said lower portion of said lifting frame and at least one linear bearing fitted over said guiding shaft, fixed to said lower portion of said lifting frame, and defining an axis of said linear bearing that is substantially parallel to said axis of said wafer support.
4. A wafer-transfer device as set forth in claim 1 , wherein said device comprises further at least one screw that passes through a corresponding through-hole formed in said contraposition ring and spring and is screwed into a corresponding screw-hole formed in said upper portion of said lifting frame.
5. A wafer-transfer device as set forth in claim 4 , wherein said device comprises further at least one cover plate for covering a top of corresponding said through-hole in said contraposition ring.
6. A wafer-transfer device as set forth in claim 5 , wherein a plurality of screws, cover plates, and springs are arranged on said upper portion of said lifting frame along a circumferential direction of said lifting frame at substantially equal respective intervals.
7. A wafer-transfer device as set forth in claim 1 , wherein said device comprises further a plurality of hydraulic buffers mounted onto said lower portion of said lifting frame, arranged on said lower portion of said lifting frame along a circumferential direction of said lifting frame at substantially equal intervals, and located below said base.
8. A wafer-transfer device as set forth in claim 1 , wherein a chamber is defined in said lifting frame and a portion of said second cylinder is located in said chamber.
9. A wafer-transfer device as set forth in claim 3 , wherein a plurality of first cylinders are arranged on said lower portion of said lifting frame along a circumferential direction of said lifting frame at substantially equal intervals and a plurality of linear bearings and guiding shafts are arranged on said lower portion of said lifting frame along said circumferential direction at substantially equal respective intervals.
10. A wafer-transfer device as set forth in claim 1 , wherein said lifting frame is substantially hollow and I-shaped.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010623316.8 | 2010-12-29 | ||
CN2010106233168A CN102049730B (en) | 2010-12-29 | 2010-12-29 | Wafer replacing device used in chemical mechanical polishing equipment |
PCT/CN2011/076831 WO2012088868A1 (en) | 2010-12-29 | 2011-07-04 | Wafer exchanging device for chemical mechanical polishing apparatus |
Publications (1)
Publication Number | Publication Date |
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US20130273819A1 true US20130273819A1 (en) | 2013-10-17 |
Family
ID=43954701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/384,617 Abandoned US20130273819A1 (en) | 2010-12-29 | 2011-07-04 | Wafer transfer device for chemical mechanical polishing apparatus |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130273819A1 (en) |
CN (1) | CN102049730B (en) |
TW (1) | TWI447795B (en) |
WO (1) | WO2012088868A1 (en) |
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Also Published As
Publication number | Publication date |
---|---|
WO2012088868A1 (en) | 2012-07-05 |
CN102049730A (en) | 2011-05-11 |
TWI447795B (en) | 2014-08-01 |
TW201227819A (en) | 2012-07-01 |
CN102049730B (en) | 2012-02-15 |
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