US20130319024A1 - Dual Port Heat Pipe Structure For Switchgear - Google Patents
Dual Port Heat Pipe Structure For Switchgear Download PDFInfo
- Publication number
- US20130319024A1 US20130319024A1 US13/481,977 US201213481977A US2013319024A1 US 20130319024 A1 US20130319024 A1 US 20130319024A1 US 201213481977 A US201213481977 A US 201213481977A US 2013319024 A1 US2013319024 A1 US 2013319024A1
- Authority
- US
- United States
- Prior art keywords
- evaporator
- condenser
- working fluid
- plate
- passage structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/52—Cooling of switch parts
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/52—Cooling of switch parts
- H01H2009/523—Cooling of switch parts by using heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/52—Cooling of switch parts
- H01H2009/526—Cooling of switch parts of the high voltage switches
Abstract
A cooling apparatus is provided for a switchgear. The switchgear has an enclosure having a plurality of compartments. The cooling apparatus includes at least one evaporator constructed and arranged to be mounted in one of the compartments. The evaporator includes an evaporator plate having surfaces defining passage structure therein, and a cover plate covering a portion of the evaporator plate to seal the passage structure. A condenser is located at a higher elevation than the evaporator. First and second conduits fluidly connect the evaporator plate with the condenser. A working fluid is in the passage structure so as to be heated to a vapor state at the evaporator, with the first fluid conduit transferring the vapor to the condenser and with the second fluid conduit passively returning condensed working fluid back to the passage structure of the evaporator.
Description
- The invention relates to switchgear circuit breakers and, more particularly, to a cooling apparatus for preventing temperature rise in a compartment in a switchgear.
- Switchgear configurations have current limits based on the heat rise over ambient room temperature. It is generally desired to limit the maximum temperature of the hottest spot on the switchgear main bus to 105° C. (a rise of 65° C. over an assumed ambient temperature of 40° C.), as directed by the standard IEEE 37.20.2. Typical medium and high-voltage metal-clad switchgear arrangements have maximum continuous current ratings of about 3000A, due to heat generation. It is desirable to increase this current rating. Heat produced by the electrical current in the main bus and breaker components can be cooled by the use of forced air cooling with fans mounted in every third or fourth switchgear frame. However, this solution is not practical in many cases, including in the case of arc-resistant switchgear, since the byproducts of an arc fault must be contained within the switchgear.
- Thus, there is a need to provide a more effective and low cost method of moving interior heat in a switchgear to the ambient room environment.
- An object of the invention is to fulfill the need referred to above. In accordance with the principles of the present invention, this objective is achieved by providing a cooling apparatus for a switchgear. The switchgear has an enclosure having a plurality of compartments including a circuit breaker compartment containing at least one circuit breaker, a main bus compartment housing a main bus that is connected with the circuit breaker, and a cable compartment. The cooling apparatus includes at least one evaporator constructed and arranged to be mounted in one of the compartments. The evaporator includes an evaporator plate having surfaces defining passage structure therein, and a cover plate covering a portion of the evaporator plate to seal the passage structure. A condenser is located at a higher elevation than the evaporator. A first fluid conduit fluidly connects the evaporator plate with the condenser. A second fluid conduit, separate from the first fluid conduit, fluidly connects the evaporator plate with the condenser. A working fluid is in the passage structure so as to be heated to a vapor state at the evaporator, with the first fluid conduit being constructed and arranged to transfer the vapor to the condenser and with the second fluid conduit being constructed and arranged to passively return condensed working fluid back to the passage structure of the evaporator.
- In accordance with another aspect of the invention, a method of cooling a switchgear is provided. The switchgear has an enclosure having a plurality of compartments including a circuit breaker compartment containing at least one circuit breaker, a main bus compartment housing a main bus that is connected with the circuit breaker, and a cable compartment. The method provides at least one evaporator including an evaporator plate having surfaces defining passage structure therein, and a cover plate covering a portion of the evaporator plate to seal the passage structure. The evaporator is mounted in one of the compartments. A condenser is provided at a higher elevation than the evaporator, with first and second fluid conduits fluidly connecting the evaporator with the condenser. A working fluid is in the evaporator. Heat is transferred from the evaporator to the working fluid to cause the working fluid to evaporate with the evaporated vapor being delivered to the condenser via the first fluid conduit. The working fluid that condenses in the condenser is returned passively to the evaporator via the second fluid conduit.
- Other objects, features and characteristics of the present invention, as well as the methods of operation and the functions of the related elements of the structure, the combination of parts and economics of manufacture will become more apparent upon consideration of the following detailed description and appended claims with reference to the accompanying drawings, all of which form a part of this specification.
- The invention will be better understood from the following detailed description of the preferred embodiments thereof, taken in conjunction with the accompanying drawings wherein like numbers indicate like parts, in which:
-
FIG. 1 is a view of a cooling apparatus in the form of a heat pipe structure in accordance with an embodiment, shown mounted in a switchgear. -
FIG. 2 is an enlarged view of the evaporator and fluid conduits of the heat pipe structure ofFIG. 1 , with the evaporator shown with a transparent cover plate for clarity of illustrating the internal passage structure thereof. - With reference to
FIG. 1 , a cooling apparatus in the form of a heat pipe structure is shown, generally indicated at 10, mounted in aswitchgear 12, generally indicated at 12. In the embodiment, theswitchgear 12 is preferably an indoor, medium or high voltage metal-clad switchgear having a maximum continuous current ratings of about 4000 Amp. As used herein, the terms “medium voltage switchgear” and “high voltage switchgear” are used interchangeably, and refer to switchgear rated for operation at or exceeding 1 kV. In general,switchgear 12 comprises an enclosure, such as metal-clad enclosure 14, for housing the switchgear components.Enclosure 14 may contain one or more separate compartments, such ascircuit breaker compartment 16, containing one ormore circuit breakers 18, amain bus compartment 20 housing amain bus 22, andcable compartment 24. In the embodiment shown,circuit breaker 18 is a three-pole drawout type circuit breaker.Circuit breaker 18 is connected toprimary contacts 27 that are supported byprimary bushing plates bus bars 28 of themain bus 22. - As noted above, the
main bus 22 of theswitchgear 12 has temperature rise restrictions that are measured relative to the ambient temperature. In accordance with the embodiment, theheat pipe structure 10 applies an evaporative recycling cooling arrangement with anevaporator 30 located at convenient and critical points associated with themain bus 22,bus bars 23, risers, cable connections, and/orprimary contacts 27, preferably where the conventional copper space plate is currently employed. - The
heat pipe structure 10 operates to cool a first location by transporting heat from the first location to a second location via the use of a working fluid. Referring toFIGS. 1 and 2 , theheat pipe structure 10 includes a plurality ofevaporators 30. Eachevaporator 30 of theheat pipe structure 10 is placed in thermal contact with a first location to be cooled (e.g., near the heat generating components associated with themain bus 22 such as coupled with thebus bars 23 in themain bus compartment 20, or in the cable compartment 24). Afirst fluid conduit 32 connects eachevaporator 30 to a condenser 34 (FIG. 1 ). Workingfluid 36 resides in theevaporator 30 and settles near a bottom portion 38 thereof. Heat from the first location causes the liquid workingfluid 36 to evaporate, primarily atevaporator 30. Thereafter, the working fluid 36 (in a gaseous or vapor state) travels upstream through thefirst fluid conduit 32 to thecondenser 34, where the heat is released as a substantial portion of the evaporated working fluid condenses back to a liquid state (although some condensation and evaporation may also occur in the first fluid conduit 32). The condensed (e.g., liquid) workingfluid 36 then travels downstream through asecond fluid conduit 40, separate from thefirst fluid conduit 32, back to theevaporator 30 to complete a cooling cycle. Thecondenser 34 is preferably mounted to theenclosure 14 and can be located on the exterior, interior or partially on both the interior and exterior of theenclosure 14 so that thecondenser 34 can exchange heat with abundant ambient airflow. - The
heat pipe structure 10 is advantageously in the form of a thermosiphon—a term connoting that condensed working fluid is transported from thecondenser 34 to eachevaporator 30 primarily by operation of gravity. As such, in a thermosiphon generally, thecondenser 34 is arranged at a higher elevation (in the gravitational field) than eachevaporator 30, and a vertical drop should be present between thecondenser 34 and theevaporator 30. - With reference to
FIG. 2 , in the embodiment, eachevaporator 30 is approximately 4″×4″×0.75″ and comprises two copper plates. A first orevaporator plate 42 is generally rectangular and has sufficient thickness to allow for passage structure 44 in which the workingfluid 36 will evaporate, and to allow connection of the first andsecond fluid conduits surfaces 45 to define a continuous, generally serpentine passage extending from thebottom portion 46 to thetop portion 48 of theevaporator plate 42 so that the workingfluid 36 changes direction multiple times in the passage structure 44 prior to reaching thefirst conduit 32. Thus, the serpentine passage structure 44 increases the surface area in contact with the workingfluid 36 to heat the working fluid to the vapor state. A second or cover plate 50 (shown transparent inFIG. 2 so that the passage structure 44 can be seen) covers a portion of theevaporator plate 42 to seal the passage structure 44 while providing addition heat transfer surface area. A gasket or seal (not shown can be provided about the periphery of thecover plate 50 and sandwiched between thecover plate 50 and theevaporator plate 42 when thecover plate 50 is coupled to theevaporator plate 42.Mounting holes 51 can be provided for receiving fasteners to secure thecover plate 50 to theevaporator plate 42. Alternatively, the periphery of thecover plate 50 can be welded or adhered to theevaporator plate 42, without a gasket. - The
copper evaporator plate 42 andcopper cover plate 50 can include additional gating to provide more effective heat transfer to the workingfluid 36. Aninlet 52 of thesecond fluid conduit 40 that returns the workingfluid 36 to theevaporator 30 is preferably located at thebottom portion 46 of theevaporator plate 42. Anoutlet 54 of thefirst fluid conduit 32 that delivers vapor to thecondenser 34 is preferably located at thetop portion 48 of theevaporator plate 42. However, it can be appreciated that the connection of the first and secondfluid conduits evaporator plate 42 can be located to optimize and control working fluid flow and levels within theevaporator 30. The use of separatefluid conduits - If the
heat pipe structure 10 cooling system is intended to form an electrical isolation gap, the workingfluid 36 needs to be electrically insulating. Examples of suitable workingfluids 36 are refrigerants such as hydrofluorocarbons (e.g. R134a, R245fa), fluorketones (e.g., NOVEC-649™, commercially available from 3M), and hydrofluoroethers (e.g., HFE-7100™, commercially available from 3M). In addition, portions of thefluid conduits - The foregoing preferred embodiments have been shown and described for the purposes of illustrating the structural and functional principles of the present invention, as well as illustrating the methods of employing the preferred embodiments and are subject to change without departing from such principles. Therefore, this invention includes all modifications encompassed within the spirit of the following claims.
Claims (19)
1. A cooling apparatus for a switchgear, the switchgear having an enclosure having a plurality of compartments including a circuit breaker compartment containing at least one circuit breaker, a main bus compartment housing a main bus that is connected with the circuit breaker, and a cable compartment, the cooling apparatus comprising:
at least one evaporator constructed and arranged to be mounted in one of the compartments, the at least one evaporator comprising:
an evaporator plate having surfaces defining passage structure therein, and
a cover plate covering a portion of the evaporator plate to seal the passage structure,
a condenser located at a higher elevation than the evaporator,
a first fluid conduit fluidly connecting the evaporator plate with the condenser,
a second fluid conduit, separate from the first fluid conduit, fluidly connecting the evaporator plate with the condenser, and
a working fluid in the passage structure so as to be heated to a vapor state at the evaporator, with the first fluid conduit being constructed and arranged to transfer the vapor to the condenser and with the second fluid conduit being constructed and arranged to passively return condensed working fluid back to the passage structure of the evaporator.
2. The cooling apparatus of claim 1 , wherein the evaporator plate has a top portion and a bottom portion, the first fluid conduit being coupled to the top portion and the second fluid conduit being coupled to the bottom portion.
3. The cooling apparatus of claim 2 , wherein the passage structure extends from the bottom portion to the top portion of the evaporator plate.
4. The cooling apparatus of claim 3 , wherein the passage structure is defined by surfaces so as to form a continuous, serpentine passage between the bottom portion and the top portion of the evaporator plate so that the working fluid must change direction multiple times in the passage prior to reaching the first conduit.
5. The cooling apparatus of claim 1 , wherein the evaporator plate and the cover plate are each composed of copper.
6. The cooling apparatus of claim 1 , wherein the working fluid is selected from the group consisting of hydrofluorocarbon, fluoroketone, and hydrofluoroether refrigerants, and any mixtures thereof.
7. The cooling apparatus of claim 1 , in combination with the switchgear, wherein the at least one evaporator is mounted in the main bus compartment.
8. The cooling apparatus of claim 7 , where a plurality of evaporators are connected with the condenser, each evaporator being adjacent to an associated bus bar of the main bus.
9. The combination of claim 7 , wherein the condenser is mounted to the enclosure.
10. The cooling apparatus of claim 1 , wherein the condenser is constructed and arranged to exchange heat with ambient air to cause the vapor to condense to liquid working fluid.
11. A method of cooling a switchgear having an enclosure having a plurality of compartments including a circuit breaker compartment containing at least one circuit breaker, a main bus compartment housing a main bus that is connected with the circuit breaker, and a cable compartment, the method comprising the steps of:
providing at least one evaporator comprising an evaporator plate having surfaces defining passage structure therein, and a cover plate covering a portion of the evaporator plate to seal the passage structure,
mounting the evaporator in one of the compartments,
providing a condenser at a higher elevation than the evaporator, with a first and second fluid conduits fluidly connecting the evaporator with the condenser, and with a working fluid in the evaporator,
permitting heat transfer from the evaporator to the working fluid to cause the working fluid to convert form a liquid to a vapor state, with the vapor being delivered to the condenser via the first fluid conduit, and
passively returning the working fluid that condenses in the condenser to the evaporator via the second fluid conduit.
12. The method of claim 11 , wherein the step of providing the evaporator includes providing the evaporator plate to have a top portion and a bottom portion, the first fluid conduit being coupled to the top portion and the second fluid conduit being coupled to the bottom portion.
13. The method of claim 12 , wherein the passage structure extends from the bottom portion to the top portion of the evaporator plate.
14. The method of claim 13 , wherein the passage structure is defined by surfaces so as to form a continuous, serpentine passage between the bottom portion and the top portion of the evaporator plate so that the working fluid must change direction multiple times in the passage prior to reaching the first conduit.
15. The method of claim 11 , wherein the evaporator plate and the cover plate are provided from copper.
16. The method of claim 11 , wherein the working fluid is selected from the group consisting of hydrofluorocarbon, fluoroketone, and hydrofluoroether refrigerants, and any mixtures thereof.
17. The method of claim 11 , wherein the evaporator is mounted in the main bus compartment.
18. The method of claim 17 , wherein a plurality of evaporators is provided and each evaporator is mounted adjacent to an associated bus bar of the main bus.
19. The method of claim 1 , wherein the condenser is mounted on the enclosure.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/481,977 US20130319024A1 (en) | 2012-05-29 | 2012-05-29 | Dual Port Heat Pipe Structure For Switchgear |
EP13728277.8A EP2856482A1 (en) | 2012-05-29 | 2013-05-22 | Dual port heat pipe structure for switchgear |
PCT/US2013/042126 WO2013181027A1 (en) | 2012-05-29 | 2013-05-22 | Dual port heat pipe structure for switchgear |
CN201380027614.2A CN104335310A (en) | 2012-05-29 | 2013-05-22 | Dual port heat pipe structure for switchgear |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/481,977 US20130319024A1 (en) | 2012-05-29 | 2012-05-29 | Dual Port Heat Pipe Structure For Switchgear |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130319024A1 true US20130319024A1 (en) | 2013-12-05 |
Family
ID=48607358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/481,977 Abandoned US20130319024A1 (en) | 2012-05-29 | 2012-05-29 | Dual Port Heat Pipe Structure For Switchgear |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130319024A1 (en) |
EP (1) | EP2856482A1 (en) |
CN (1) | CN104335310A (en) |
WO (1) | WO2013181027A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150124381A1 (en) * | 2013-11-05 | 2015-05-07 | Chia Hsing Electrical Co., Ltd. | Switchboard copper busbar heat dissipating device |
CN104701778A (en) * | 2014-12-10 | 2015-06-10 | 西安泰劳森电气科技有限公司 | Self cooling type high voltage alternating current metal closing switchgear |
EP3159908A1 (en) * | 2015-10-21 | 2017-04-26 | Anord Control Systems Limited | Improvement of heat dissipation from acb toes |
EP3267447A1 (en) * | 2016-07-05 | 2018-01-10 | TE Connectivity Germany GmbH | Contact device for high-current transfer |
CN109841435A (en) * | 2019-03-25 | 2019-06-04 | 上海电气集团股份有限公司 | A kind of radiator for frame circuit breaker |
US10453624B2 (en) | 2015-07-29 | 2019-10-22 | Abb Schweiz Ag | Electrical connector device including heat transfer device and method of manufacturing same |
US10755872B2 (en) * | 2016-05-02 | 2020-08-25 | Abb Power Grids Switzerland Ag | Generator switch with a cooling device |
US20220238285A1 (en) * | 2021-01-27 | 2022-07-28 | Abb Schweiz Ag | Electric Pole Part Apparatus |
TWI784962B (en) * | 2016-07-26 | 2022-12-01 | 美商脫其泰有限責任公司 | Thermosiphons for use with temperature-regulated storage devices |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3742461B1 (en) * | 2019-05-20 | 2022-02-23 | ABB Schweiz AG | Cooling apparatus for a medium voltage or high voltage switchgear |
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US5203399A (en) * | 1990-05-16 | 1993-04-20 | Kabushiki Kaisha Toshiba | Heat transfer apparatus |
US6971442B2 (en) * | 2001-06-29 | 2005-12-06 | Intel Corporation | Method and apparatus for dissipating heat from an electronic device |
US7228690B2 (en) * | 2002-02-09 | 2007-06-12 | Thermetica Limited | Thermal storage apparatus |
US20080216493A1 (en) * | 2007-03-08 | 2008-09-11 | Liebert Corporation | Microchannel cooling condenser for precision cooling applications |
US7719823B2 (en) * | 2004-12-08 | 2010-05-18 | Siemens Industry, Inc. | Modular insulation system |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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DE2051150A1 (en) * | 1970-10-19 | 1972-04-20 | Voigt & Haeffner Gmbh | Cooling device for electrical switches |
DE202006013674U1 (en) * | 2006-09-06 | 2006-11-02 | Abb Patent Gmbh | Switch cabinet, has flexible pipe of isolating material provided between condenser and evaporator areas to transport evaporated fluid from evaporator section to condenser section and vice versa |
DE202009019071U1 (en) * | 2009-02-17 | 2016-03-17 | Gudrun Stemke | Evaporator and cooler using such evaporator |
DE102009010897A1 (en) * | 2009-02-27 | 2010-09-02 | Siemens Aktiengesellschaft | Heat dissipation of device bays and control cabinets with heatpipes working according to the capillary principle |
PL2280460T3 (en) * | 2009-07-27 | 2012-02-29 | Abb Research Ltd | Power switchgear |
-
2012
- 2012-05-29 US US13/481,977 patent/US20130319024A1/en not_active Abandoned
-
2013
- 2013-05-22 WO PCT/US2013/042126 patent/WO2013181027A1/en active Application Filing
- 2013-05-22 CN CN201380027614.2A patent/CN104335310A/en active Pending
- 2013-05-22 EP EP13728277.8A patent/EP2856482A1/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5203399A (en) * | 1990-05-16 | 1993-04-20 | Kabushiki Kaisha Toshiba | Heat transfer apparatus |
US6971442B2 (en) * | 2001-06-29 | 2005-12-06 | Intel Corporation | Method and apparatus for dissipating heat from an electronic device |
US7228690B2 (en) * | 2002-02-09 | 2007-06-12 | Thermetica Limited | Thermal storage apparatus |
US7719823B2 (en) * | 2004-12-08 | 2010-05-18 | Siemens Industry, Inc. | Modular insulation system |
US20080216493A1 (en) * | 2007-03-08 | 2008-09-11 | Liebert Corporation | Microchannel cooling condenser for precision cooling applications |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150124381A1 (en) * | 2013-11-05 | 2015-05-07 | Chia Hsing Electrical Co., Ltd. | Switchboard copper busbar heat dissipating device |
CN104701778A (en) * | 2014-12-10 | 2015-06-10 | 西安泰劳森电气科技有限公司 | Self cooling type high voltage alternating current metal closing switchgear |
US10453624B2 (en) | 2015-07-29 | 2019-10-22 | Abb Schweiz Ag | Electrical connector device including heat transfer device and method of manufacturing same |
EP3159908A1 (en) * | 2015-10-21 | 2017-04-26 | Anord Control Systems Limited | Improvement of heat dissipation from acb toes |
US9953771B2 (en) | 2015-10-21 | 2018-04-24 | Anord Control Systems Limited | Heat dissipation from ACB toes |
US10755872B2 (en) * | 2016-05-02 | 2020-08-25 | Abb Power Grids Switzerland Ag | Generator switch with a cooling device |
JP7042042B2 (en) | 2016-07-05 | 2022-03-25 | ティーイー コネクティビティ ジャーマニー ゲゼルシャフト ミット ベシュレンクテル ハフツンク | Contact device for high current transmission |
JP2018006750A (en) * | 2016-07-05 | 2018-01-11 | ティーイー コネクティビティ ジャーマニー ゲゼルシャフト ミット ベシュレンクテル ハフツンクTE Connectivity Germany GmbH | Contact device for transmitting high current |
EP3267447A1 (en) * | 2016-07-05 | 2018-01-10 | TE Connectivity Germany GmbH | Contact device for high-current transfer |
TWI784962B (en) * | 2016-07-26 | 2022-12-01 | 美商脫其泰有限責任公司 | Thermosiphons for use with temperature-regulated storage devices |
CN109841435A (en) * | 2019-03-25 | 2019-06-04 | 上海电气集团股份有限公司 | A kind of radiator for frame circuit breaker |
US20220238285A1 (en) * | 2021-01-27 | 2022-07-28 | Abb Schweiz Ag | Electric Pole Part Apparatus |
US11842877B2 (en) * | 2021-01-27 | 2023-12-12 | Abb Schweiz Ag | Electric pole part apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP2856482A1 (en) | 2015-04-08 |
CN104335310A (en) | 2015-02-04 |
WO2013181027A1 (en) | 2013-12-05 |
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Legal Events
Date | Code | Title | Description |
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AS | Assignment |
Owner name: ABB TECHNOLOGY AG, SWITZERLAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FISCHER-CARNE, PATRICK R.;REEL/FRAME:028277/0622 Effective date: 20120525 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |