US20140083669A1 - Heat sink - Google Patents

Heat sink Download PDF

Info

Publication number
US20140083669A1
US20140083669A1 US13/669,454 US201213669454A US2014083669A1 US 20140083669 A1 US20140083669 A1 US 20140083669A1 US 201213669454 A US201213669454 A US 201213669454A US 2014083669 A1 US2014083669 A1 US 2014083669A1
Authority
US
United States
Prior art keywords
fins
heat sink
fin
bottom plate
bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/669,454
Inventor
Bo Tian
Yu Han
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAN, YU, TIAN, BO
Publication of US20140083669A1 publication Critical patent/US20140083669A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to a heat sink.
  • Heat dissipation for electronic devices in a server is generally done by heat sinks. Different CPUs have different heat ratings. However, design of the heat sinks is based on the high heat ratings of the CPUs, which is inflexible.
  • FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat sink, wherein the heat sink includes a plurality of first fins and a plurality of second fins.
  • FIG. 2 is an enlarged, inverted view of one of the second fins of FIG. 1 .
  • FIG. 3 is an assembled, isometric view of FIG. 1 .
  • FIG. 4 is an enlarged view of a circled portion IV of FIG. 3 .
  • FIGS. 1 and 2 show an exemplary embodiment of a heat sink.
  • the heat sink includes a bottom plate 10 , a plurality of first fins 20 perpendicularly extending up from the bottom plate 10 , and a plurality of second fins 30 .
  • Each second fin 30 includes a main body 31 and a bar 32 connected to a bottom side of the main body 31 .
  • a hooking slot 322 is defined in a bottom of the bar 32 .
  • a plurality of pairs of resilient tabs 33 extends from a bottom of the bar 32 .
  • the resilient tabs 33 of each pair are respectively located at opposite sides of the hooking slot 322 .
  • Each resilient tab 33 is substantially C-shaped, arced toward the other resilient tab 33 of the same pair of the resilient tabs 33 .
  • FIGS. 3 and 4 show in assembly, the hooking slot 322 of each second fin 30 is aligned with the corresponding first fin 20 and is manipulated toward the first fin 30 .
  • the first fin 20 extends through the pairs of resilient tabs 33 of the second fin 30 and engages in the hooking slot 322 , to allow the resilient tabs 33 to resiliently sandwich the first fin 20 .
  • a corresponding number of second fins 30 are mounted to the first fins 20 .
  • the second fins 30 are alternately mounted to the first fins 20 , for instance, to every other one of the first fins 20 .

Abstract

A heat sink includes a bottom plate, a number of first fins extending up from the bottom plate, and a number of second fins. The second fins are detachably connected to tops of the corresponding first fins.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to a heat sink.
  • 2. Description of Related Art
  • Heat dissipation for electronic devices in a server, such as central processing units (CPUs), is generally done by heat sinks. Different CPUs have different heat ratings. However, design of the heat sinks is based on the high heat ratings of the CPUs, which is inflexible.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat sink, wherein the heat sink includes a plurality of first fins and a plurality of second fins.
  • FIG. 2 is an enlarged, inverted view of one of the second fins of FIG. 1.
  • FIG. 3 is an assembled, isometric view of FIG. 1.
  • FIG. 4 is an enlarged view of a circled portion IV of FIG. 3.
  • DETAILED DESCRIPTION
  • The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
  • FIGS. 1 and 2 show an exemplary embodiment of a heat sink. The heat sink includes a bottom plate 10, a plurality of first fins 20 perpendicularly extending up from the bottom plate 10, and a plurality of second fins 30.
  • Each second fin 30 includes a main body 31 and a bar 32 connected to a bottom side of the main body 31. A hooking slot 322 is defined in a bottom of the bar 32. A plurality of pairs of resilient tabs 33 extends from a bottom of the bar 32. The resilient tabs 33 of each pair are respectively located at opposite sides of the hooking slot 322. Each resilient tab 33 is substantially C-shaped, arced toward the other resilient tab 33 of the same pair of the resilient tabs 33.
  • FIGS. 3 and 4 show in assembly, the hooking slot 322 of each second fin 30 is aligned with the corresponding first fin 20 and is manipulated toward the first fin 30. The first fin 20 extends through the pairs of resilient tabs 33 of the second fin 30 and engages in the hooking slot 322, to allow the resilient tabs 33 to resiliently sandwich the first fin 20.
  • In use, according to the heat rating of the electronic device, a corresponding number of second fins 30 are mounted to the first fins 20. In the embodiment, the second fins 30 are alternately mounted to the first fins 20, for instance, to every other one of the first fins 20.
  • Even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and the functions of the embodiments, the disclosure is illustrative only, and changes may be made in details, especially in the matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (4)

What is claimed is:
1. A heat sink, comprising:
a bottom plate;
a plurality of first fins extending up from the bottom plate; and
a plurality of second fins detachably connected to tops of corresponding ones of the first fins opposite to the bottom plate.
2. The heat sink of claim 1, wherein a bar is formed on a bottom of each second fin, a hooking slot is defined in a bottom of the bar, the top of the corresponding first fin engages in the hooking slot, a pair of resilient tabs extends from the bottom of the bar, the resilient tabs are located at opposite sides of the hooking slot and resiliently sandwich the corresponding first fin.
3. The heat sink of claim 2, wherein each resilient tab is substantially C-shaped, arced toward the other resilient tab.
4. The heat sink of claim 1, wherein the second fins are alternately mounted to the first fins.
US13/669,454 2012-09-26 2012-11-06 Heat sink Abandoned US20140083669A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210364753.1A CN103687433A (en) 2012-09-26 2012-09-26 Radiator
CN2012103647531 2012-09-26

Publications (1)

Publication Number Publication Date
US20140083669A1 true US20140083669A1 (en) 2014-03-27

Family

ID=50323292

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/669,454 Abandoned US20140083669A1 (en) 2012-09-26 2012-11-06 Heat sink

Country Status (3)

Country Link
US (1) US20140083669A1 (en)
CN (1) CN103687433A (en)
TW (1) TW201414981A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109004811A (en) * 2018-06-22 2018-12-14 江苏英杰铝业有限公司 A kind of variable-frequency power sources aluminium sheet radiator

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105186927B (en) * 2015-10-13 2018-07-27 魏淏 A kind of gas stove wok stand using cogeneration
CN110187750A (en) * 2019-05-28 2019-08-30 浪潮商用机器有限公司 A kind of server, onboard structure and more efficiency composite layer radiators

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5437328A (en) * 1994-04-21 1995-08-01 International Business Machines Corporation Multi-stage heat sink
US6263955B1 (en) * 1996-06-27 2001-07-24 Kaveh Azar Heat sink with open region
US6639802B1 (en) * 2002-11-05 2003-10-28 Hon Hai Precision Ind. Co., Ltd. Heat sink with interlocked fins
US6672379B1 (en) * 2002-07-29 2004-01-06 Waffer Technology Corp. Positioning and buckling structure for use in a radiator
US20040080911A1 (en) * 2002-10-25 2004-04-29 Liu Heben Heat sink assembly with embedded fan
US6862183B2 (en) * 2001-10-29 2005-03-01 Intel Corporation Composite fins for heat sinks
US20060054307A1 (en) * 2004-09-15 2006-03-16 Foxconn Technology Co., Ltd. Heat sink
US20090165999A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
US20090229791A1 (en) * 2008-03-14 2009-09-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module assembly and heat sink assembly thereof
US20090236076A1 (en) * 2008-03-20 2009-09-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20100018669A1 (en) * 2008-07-28 2010-01-28 Foxconn Technology Co., Ltd. Heat dissipation device
US20100132919A1 (en) * 2008-12-03 2010-06-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
US8230903B2 (en) * 2008-04-18 2012-07-31 International Business Machines Corporation Low profile heat sink for semiconductor devices

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5437328A (en) * 1994-04-21 1995-08-01 International Business Machines Corporation Multi-stage heat sink
US6263955B1 (en) * 1996-06-27 2001-07-24 Kaveh Azar Heat sink with open region
US6862183B2 (en) * 2001-10-29 2005-03-01 Intel Corporation Composite fins for heat sinks
US6672379B1 (en) * 2002-07-29 2004-01-06 Waffer Technology Corp. Positioning and buckling structure for use in a radiator
US20040080911A1 (en) * 2002-10-25 2004-04-29 Liu Heben Heat sink assembly with embedded fan
US6639802B1 (en) * 2002-11-05 2003-10-28 Hon Hai Precision Ind. Co., Ltd. Heat sink with interlocked fins
US20060054307A1 (en) * 2004-09-15 2006-03-16 Foxconn Technology Co., Ltd. Heat sink
US20090165999A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
US20090229791A1 (en) * 2008-03-14 2009-09-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module assembly and heat sink assembly thereof
US20090236076A1 (en) * 2008-03-20 2009-09-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8230903B2 (en) * 2008-04-18 2012-07-31 International Business Machines Corporation Low profile heat sink for semiconductor devices
US20100018669A1 (en) * 2008-07-28 2010-01-28 Foxconn Technology Co., Ltd. Heat dissipation device
US20100132919A1 (en) * 2008-12-03 2010-06-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109004811A (en) * 2018-06-22 2018-12-14 江苏英杰铝业有限公司 A kind of variable-frequency power sources aluminium sheet radiator

Also Published As

Publication number Publication date
CN103687433A (en) 2014-03-26
TW201414981A (en) 2014-04-16

Similar Documents

Publication Publication Date Title
US8373989B2 (en) Fan fixing device and fan module having same
US8277178B2 (en) Fan assembly
US20130048256A1 (en) Heat dissipation device
US8807202B2 (en) Heat dissipation device
US20070279867A1 (en) Heat dissipating assembly of heat dissipating device
US8072762B2 (en) Printed circuit board assembly
US9603287B1 (en) Integrated power module
US10437299B2 (en) Heat-dissipating structure of electronic device
US20140083669A1 (en) Heat sink
US20120176747A1 (en) Heat dissipation device
US10108237B1 (en) Heat dissipating device with improved cooling performance
US9398727B2 (en) Server assembly
US20120145374A1 (en) Heat sink
US9007772B2 (en) Electronic device with heat dissipation module
US20130014920A1 (en) Heat sink assembly
US9063712B2 (en) Laptop computer cooling stand
US20100264790A1 (en) Computer enclosure
US20120020011A1 (en) Data center and server module of the same
US20160172281A1 (en) Packaging structure
US20120152509A1 (en) Heat sink
US20130233528A1 (en) Heat dissipating assembly
US20080073069A1 (en) Heat sink
US20120181000A1 (en) Heat dissipation assembly
US20120211196A1 (en) Heat dissipation assembly and latch apparatus of the same
US20120241136A1 (en) Cooling device

Legal Events

Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TIAN, BO;HAN, YU;REEL/FRAME:029243/0892

Effective date: 20121029

Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TIAN, BO;HAN, YU;REEL/FRAME:029243/0892

Effective date: 20121029

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION