US20140183568A1 - Led package with flexible polyimide circuit and method of manufacturing led package - Google Patents
Led package with flexible polyimide circuit and method of manufacturing led package Download PDFInfo
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- US20140183568A1 US20140183568A1 US14/107,887 US201314107887A US2014183568A1 US 20140183568 A1 US20140183568 A1 US 20140183568A1 US 201314107887 A US201314107887 A US 201314107887A US 2014183568 A1 US2014183568 A1 US 2014183568A1
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- light emitting
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- flextape
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- emitting die
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
A light emitting diode (LED) package may include a base, at least one light emitting die on the base, and a flextape on the base. The flextape includes at least one metal trace connected to the light emitting die. In a method of manufacturing the LED package, the base may be formed so as to include a basin and at least one light emitting die may be placed within the basin. The flextape may be provided to include at least one metal trace that is electrically connected to the light emitting die.
Description
- 1. Field of the Invention
- Example embodiments of the present invention, in general, relate to a light emitting diode (LED) package with a flexible polyimide circuit, and to a method of manufacturing an LED package.
- 2. Description of the Related Art
- Light emitting diodes (LEDs) are widely used in consumer applications. In consumer applications, one or more LED dies (or chips) are mounted within a LED package. The package includes a packaging material with metal leads (to the LED dies from outside circuits), a protective housing for the LED dies, a heat sink, or a combination of leads, housing and heat sink. Various implementations of the LED packages are available in the marketplace to fill a wide range of applications.
- For example, there is an expanding demand in the marketplace for the use of high-intensity LEDs in various applications. High intensity LEDs generate more light by operating at higher electrical power. However, high intensity LEDs generate more heat that needs to be dissipated. In addition, there exists a continuing demand in the marketplace to reduce the cost of producing these high intensity LEDs.
- An example embodiment of the present invention is directed to a light emitting diode (LED) package. The package includes a base, at least one light emitting die on the base, and a flextape on the base. The flextape includes at least one metal trace connected to the light emitting die.
- Another example embodiment of the present invention is directed to a method of manufacturing an LED package. In the method, a base may be formed so as to include a basin and at least one light emitting die may be placed within the basin. A flextape may be provided to include at least one metal trace that is electrically connected to the light emitting die.
- Exemplary embodiments of the present invention will become more fully understood from the detailed description given herein below and the accompanying drawings, wherein like elements are represented by like reference numerals, which are given by way of illustration only and thus are not limitative of the exemplary embodiments of the present invention.
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FIG. 1A illustrates a perspective view of a LED package in accordance with an exemplary embodiment of the present invention. -
FIG. 1B illustrates a top view ofFIG. 1A . -
FIG. 1C illustrates a cutaway side view ofFIG. 1A . -
FIG. 2A illustrates a perspective view of a portion of the LED package ofFIG. 1A . -
FIG. 2B illustrates a top view of the portion illustrated inFIG. 2A . -
FIG. 2C illustrates a cutaway side view of the portion illustrated inFIG. 2A cut alongline 2C-2C ofFIG. 2B . -
FIG. 3A illustrates a top view of another portion of the LED package ofFIG. 1A . -
FIG. 3B illustrates a cutaway side view of the portion illustrated inFIG. 3A cut alongline 3B-3B. -
FIG. 3C illustrates a more detailed view of the portion shown inFIG. 3B . -
FIG. 4 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. -
FIG. 5 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. -
FIG. 6 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. -
FIG. 7 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. -
FIG. 8 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. -
FIG. 9 illustrates a side view of an LED package according to another exemplary embodiment of the present invention. -
FIG. 10 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. -
FIG. 11 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. -
FIGS. 12A and 12B are flowcharts illustrating a method of manufacturing a LED package according to an exemplary embodiment of the present invention. -
FIGS. 13A and 13B illustrate die cross-sections to illustrate example orientations of electrodes on the light-emitting die according to an exemplary embodiment of the present invention. -
FIGS. 14A and 14B illustrate a side view of a LED package to illustrate a lens variation applicable toFIGS. 8 and 10 , according to another exemplary embodiment of the present invention. - As used herein, the term “lens” may be understood as a device for either concentrating or diverging light, typically formed from a piece of shaped glass, polymer or plastic. For example, a lens as described herein may be embodied as a generally semi-spherical piece of shaped glass, polymer or plastic for concentrating or diverging light emitted from a light emitting die or LED assembly. A “flextape” as used herein may be understood as a polymer like film which in one high temperature example may be composed of a polyimide, i.e., a flexible polyimide circuit having at least one polyimide layer and at least one conductive layer within a flexible plastic resin. The conductive layer forms a metal trace connected to a light emitting die or LED assembly.
- Example embodiments illustrating various aspects of the present invention will now be described with reference to the figures. As illustrated in the figures, sizes of structures and/or portions of structures may be exaggerated relative to other structures or portions for illustrative purposes only and thus are provided merely to illustrate general structures in accordance with the example embodiments of the present invention.
- Furthermore, various aspects of the example embodiments may be described with reference to a structure or a portion being formed on other structures, portions, or both. For example, a reference to a structure being formed “on” or “above” another structure or portion contemplates that additional structures, portions or both may intervene there between. References to a structure or a portion being formed “on” another structure or portion without an intervening structure or portion may be described herein as being formed “directly on” the structure or portion.
- Additionally, relative terms such as “on” or “above” are used to describe one structure's or portion's relationship to another structure or portion as illustrated in the figures. Further, relative terms such as “on” or “above” are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if a device or assembly in the figures is turned over, a structure or portion described as “above” other structures or portions would be oriented “below” the other structures or portions. Likewise, if a device or assembly in the figures is rotated along an axis, a structure or portion described as “above” other structures or portions would be oriented “next to”, “left of” or “right of” the other structures or portions.
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FIG. 1A illustrates a perspective view of an LED package in accordance with an exemplary embodiment of the present invention,FIG. 1B illustrates a top view ofFIG. 1A andFIG. 1C illustrates a cutaway side view ofFIG. 1A taken alongline 1C-1C ofFIG. 1B . Referring toFIGS. 1A through 1C , a light emitting diode (LED)package 100 includes a base 110 defining abasin 112. At least one light emitting die 104 is placed within thebasin 112. Aflextape 120 including at least one metal trace is provided on thebase 110 and electrically connected to alight emitting die 104. Although shown generally inFIGS. 1A-1C as one circuit (for convenience of explanation),flextape 120 may be composed of a number of complex integrated circuits and leads/metal traces on top ofbase 110. - The
package 100 is a discrete unit which can be fabricated in a continuous or batch process. Electrical and thermal properties are contained within thepackage 100. In other words,package 100 provides both an electrical isolation and a thermal conduction function for the LED chip or die 104 therein. In an example, thepackage 100 may be referred to as a surface mount type (SMT) device. -
FIGS. 13A and 13B illustrate die cross-sections to illustrate example orientations of electrodes on the light-emitting die according to an exemplary embodiment of the present invention. The light-emittingdie 104 may be oriented in a planar configuration with “same-side-electronics”, in which the electrodes are provided on the same side of thedie 104, or in a vertical orientation in which there are “vertical structure” electrodes.FIGS. 13A and 13B illustrate these two orientations. -
FIG. 13A shows an LED chip or die 104 with ananode 1305 andcathode 1310 on the same side of theLED chip 104.FIG. 13A thus illustrates one example chip orientation, shown as a surface-emitting AlGaInP multiquantum-well (MOW) and double heterostructure (DH)layer structure 1315 that is bonded with ametal reflector 1320 on asubstrate 1330.FIG. 13B show theanode 1305 andcathode 1310 on opposite sides of thesubstrate 1330 with ametal reflector 1320 and an exampleInGaN chip layer 1315. - The orientations shown in
FIGS. 13A and 13B for light-emitting die (LED chip) 104 therefore illustrate industry standard parts that highlight the concept of “same-side” electrodes and “vertical-structure” electrodes. Either die 104 arrangement can be flipped for connection changes. - A retaining
ring 130 is arranged to be adhered to or fastened to theflextape 120 and/orbase 110. As example fastening means, retainingring 130 may be glued via an epoxy, potted, bonded with a plastic and/or formed as a plastic or ceramic mold tobase 110. In one example, the retainingring 130 may be adhered to the base 110 with an adhesive. - The retaining
ring 130 may serve several functions, including but not limited to mechanical protection for the light-emittingdie 104 andwirebond 129, a shape for encapsulant as a container, alens 140 retention mechanism, as thering 130 provides a side load on thelens 140, and alens 140 positioning function. In the latter function, thering 130 enables thelens 140 to float so as to accommodate expansion or shrinkage of thelens 140 for varying temperatures. This function is described in more detail in co-pending and commonly-assigned U.S. patent application Ser. No. 11/044,126, filed Jan. 27, 2005 to Peter Andrews et al. and entitled “Methods for Packaging a Light Emitting Device and Packaged Light Emitting Devices”, the relevant portions describing the floating aspect of the retaining ring incorporated by reference herein. - The retaining
ring 130 is arranged above thebasin 112 so as to substantially encircle thebasin 112. In one example, alens 140 is placed on the retainingring 130. In the figures, thelens 140 is shown as having a generally semispherical upper configuration which tapers into a generally planar, horizontal bottom surface that rests on a ledge of retainingring 130, as shown in the side view ofFIG. 1C for example. However, it is evident to one skilled in the art thatlens 140 could have another shape for either concentrating or diverging light. For example, thelens 140 could be arranged so as to extend below light emitting die 104 so as to center the emitting part ofdie 104 in the center of ahemispherical lens 140 shape (i.e., the chip ofdie 104 sits up in thelens 140, with a portion oflens 140 extending below the chip surface). Thebase 110, retainingring 130 andlens 140 may collectively define anenclosed cavity 102 which encompassesbasin 112 and the space within thebasin 112. -
FIG. 2A illustrates a perspective view of a portion of theLED package 100 ofFIG. 1A ,FIG. 2B illustrates a top view of the portion illustrated inFIG. 2A andFIG. 2C illustrates a cutaway side view of the portion illustrated inFIG. 2A , as cut alongline 2C-2C ofFIG. 2B . Referring toFIGS. 1A through 2C , the base 110 can be composed of a metal or other thermally conductive material (for example, any metal or metal alloy, or non-metal conductors such as AlN, Al20 s) for removing or “sinking” heat from thelight emitting die 104. For this reason, thebase 110 may also be referred to as a heat sink. - The base 110 can be formed to various sizes depending on the desired application for the
LED package 100. For the illustrated example embodiment only, thebase 110 may have a width dimension of 4.5 mm, alength dimension 113 of 5 mm, and aheight dimension 115 of 1.05 mm, it being understood that these dimensions may be smaller or larger for a given application. Thedie 104 is encompassed within thebasin 112. Thebasin 112 has basin surfaces 114, which inFIG. 2C are shown as inclined, angled surfaces 114. The basin surfaces 114 may include an optical finish to reflect light from thelight emitting die 104. Dimensions of thebasin 112 may vary depending in a number of factors including, for example, the dimensions of thebase 110, size of thedie 104, etc. As shown best inFIG. 2B , in one example thebasin 112 may have anouter radius 121 of approximately 1.0 mm. - The base 110 may include
chamfers 116 proximal to its edges. Thechamfers 116 may be formed to any desired width to accommodate theflextape 120 With thechamfers 116, as theflextape 120 is placed on thebase 110, anangle 118 at which the flextape is bent is less than ninety degrees. This angle may be set to a desired inclination (based on a given application) so as to reduce mechanical stresses on theflextape 120, which may thus increase the reliability of theflextape 120. In one example, theangle 118 may be 52.5 degrees. Eachchamfer 116 may have awidth 117 that is less than thelength 113 of the base 110 such as, for example, 4.25 mm. Accordingly, theflextape 120 may be attached to thepackage 100 viachamfers 116 or slits formed inbase 110. Thiswidth 117 may be varied so as to accommodate a givenflextape 120. - The base 110 can be processed and treated using a number of techniques such as an electrolytic plating process, for example. The base 110 can be processed as an under layer or a pure Nickel layer by using a sulfate Nickel solution, so as to achieve a plate thickness of the base 110 in a range of about 100 to 200 pin. Then, a finish layer of pure silver can be formed using a silver cyanide solution that is free of an organic or inorganic brightener such as Antimony, so that the resultant plate thickness of
base 110 is between about 100-200 pin. -
FIG. 3A illustrates a top view of anotherportion 122 of the LED package ofFIG. 1A , illustrating flextape 120 ofFIG. 1A in more detail.FIG. 3B illustrates a cutaway side view of theflextape 120 inFIG. 3A cut alongline 3B-3B, andFIG. 3C illustrates a more detailed view of theportion 122 of theflextape 120 and a portion of bond wire 129 (see alsoFIG. 1C ) electrically connecting theflextape 120 to thelight emitting die 104. - Referring to
FIGS. 1A through 3C , theflextape 120 may include multiple layers. The layers may include apolyimide layer 124 of flexible plastic resin. Polyimide material is a synthetic polymeric resin of a class that is resistant to high temperatures, wear and corrosion. Polyimide materials have been used primarily as a coating or film on a substrate substance and are electrically insulating materials. - The
flextape 120 also includes a metalconductive layer metal trace second polyimide layer 128 is shown, so as to sandwichconductive layer polyimide layers FIG. 3A , theconductive layer metal trace polarity mark 119. Themetal trace FIG. 3C , an exposedportion 125 of theflextape 120 may be coated with SnPb or Pb to facilitate soldering of thebond wire 129 to theflextape 120. A high temperature solder such as Sn, AgSn, AuSn, etc. may be used as the soldering agent, for example. Another way to connect theflextape 120 may be by wirebonding. - The
LED package 100 includes the retainingring 130 placed on theflextape 120 and positioned above thebasin 112 so as to encircle thebasin 112. The retainingring 130 may be composed of a thermally conductive material such as metal, ceramic or plastic. In one example, the retainingring 130 may have a generally cylindrical shape with an inner flange or ledge to accommodate the placement of thelens 140 thereon. Dimensions of the retainingring 130 may vary widely depending on the desired application. In one example, the retainingring 130 may have anouter diameter radius 131 of about 3.1 mm. - The
lens 140 may be composed of a clear polymer, plastic or glass suitable to conduct and direct light from thelight emitting die 104. As shown,lens 140 has a generally semi-spherical shape, but the shape may be different for different applications. - The
cavity 102 is a space enclosed by thebase 110, retainingring 130 andlens 140. Thecavity 102 encompasses the space within thebasin 112. In one example, thecavity 102 may be filled with an encapsulant material such as clear epoxy, silicon, or a combination of epoxy and silicon, for example. In an example, the encapsulant may have an optical index that matches the optical index of thelens 140. Depending on the desired implementation, as thelens 140 is placed on the retainingring 130, thelens 140 may be in contact with the retainingring 130, or thelens 140 may be floating on the encapsulant and not in contact with the retainingring 130. -
FIG. 4 illustrates a side view of aLED package 210 according to another exemplary embodiment of the present invention. Portions of theLED package 210 are similar to corresponding portions of theLED package 100 inFIGS. 1A-3C , and thus are assigned the same reference numerals. A detailed explanation of common components are omitted for purposes of brevity; only those features differing from that previously explained are described in detail inFIG. 4 . - Referring to
FIG. 4 , thebasin 112 ofbase 110 is filled with anindex matching encapsulant 212 encapsulating thelight emitting die 104. InFIG. 4 , theencapsulant 212 is illustrated using a transparent hatched area. This is for clarity of the illustration only. Theindex matching encapsulant 212 can be formed having a curved topouter surface 213, for example. Theencapsulant 212 can be formulated to different degrees of hardness by performing multiple curing processes. In an example, theencapsulant 212 can be formulating through several curing processes to form a hard outer surface (top outer surface 213) while the remainder of theencapsulant 212 within, e.g., the core, remains softer. In this example, one material formulation may be used for theouter surface 213, while another, different material formulation may be used for the softer encapsulant in the core. -
FIG. 5 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. Portions of theLED package 220 are similar to corresponding portions of theLED package 100 inFIGS. 1A-3C orLED package 210 inFIG. 4 , and thus are assigned the same reference numerals. A detailed explanation of common components are omitted for purposes of brevity; only those features differing from that previously explained are described in detail inFIG. 5 . - Referring to
FIG. 5 , thebase 110 ofLED package 220 defines thebasin 112 which is filled with an index matching encapsulant 212 (shown by hatching) encapsulating thelight emitting die 104. InFIG. 5 , alens 140 may be placed on thebase 110 and directly on theencapsulant 212 which fills thebasin 112. The lens can be any shape as needed for optics, however semi-hemispherical is common. Accordingly, no retainingring 130 is employed in this example; thelens 140 may be built onto and fixedly attached tobase 110 vialens material 212. In one example, the lens may be formed by an encapsulating material. - If the lens is dispensed, then an encapsulating material is used and the lens shape is formed by retarding the spread of the encapsulant and controlling the volume to form a dome and then curing the encapsulant. This shape control is may use the meniscus forming properties of the encapsulating material by designing meniscus holding features or altering surface energies to enhance the surface tension characteristics. If the lens is molded, in one example the part is transferred into a mold and the lens material injected into a cavity, or the mold can be brought to the part and material injected. Molding is a common method of shaping plastic, silicones, glass, etc.
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FIG. 6 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. Portions of theLED package 230 are similar to corresponding portions of theLED package 100 inFIGS. 1A-3C orLED package 210 inFIG. 4 , and thus are assigned the same reference numerals. A detailed explanation of common components are omitted for purposes of brevity; only those features differing from that previously explained are described in detail inFIG. 6 . - Referring to
FIG. 6 , theLED package 230 includes the retainingring 130, which is placed on theflextape 120 and encircles space orcavity 102 above thelight emitting die 104. Thecavity 102 is the space enclosed by thebase 110, retainingring 130 andlens 140, as previously described, and which encompasses the space within thebasin 112. - An
encapsulant 232 encapsulates the light emitting die 104 and at least partially fills the space encircled by the retainingring 130. - In one example, the
encapsulant 232 completely fills thecavity 102 encircled by the retainingring 130, as well as thebasin 112 and interior space withinlens 140. Theencapsulant 232 includes a generally semi-spherical outertop surface 233, and illustrated by a mostly transparent hatched area. This is for clarity of the illustration only. Similar to theencapsulant 212 ofFIG. 4 theencapsulant 232 can be formulated to different degrees of hardness via several curing processes of different material formulations. -
FIG. 7 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. Portions of theLED package 310 are similar to corresponding portions of theLED package 100 inFIGS. 1A-3C orLED package 210 inFIG. 4 , and thus are assigned the same reference numerals. A detailed explanation of common components are omitted for purposes of brevity; only those features differing from that previously explained are described in detail inFIG. 7 . - Referring to
FIG. 7 , thebase 110 ofLED package 220 defines the surface on which is placedlight emitting die 104. Unlike the previous figures, nobasin 112 is formed inbase 110. Instead, an index matching encapsulant 212 (shown by hashing) is formed directly overbase 110, die 104 andflextape 120 so as to encapsulant thelight emitting die 104. InFIG. 7 , the encapsulant itself represents the lens. Accordingly, no retainingring 130 orlens 140 is employed in this example. Further, twobonding wires 129 may be used, each connected to a separate positive ornegative trace flextape 120. - As in
FIG. 4 , theindex matching encapsulant 212 can be formed having a curved topouter surface 213, and can be formulated to different degrees of hardness, i.e., using different material formulations. In an example, theencapsulant 212 can be cured in one material formulation to form a hard outer surface (top outer surface 213) while the remainder of theencapsulant 212 within, e.g., the core, may be formed and then cured using another material to remain softer. -
FIG. 8 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. Portions of theLED package 320 are similar to corresponding portions of theLED package 100 inFIGS. 1A-3C orLED package 310 inFIG. 7 , and thus are assigned the same reference numerals. A detailed explanation of common components are omitted for purposes of brevity; only those features differing from that previously explained are described in detail inFIG. 8 . - Referring to
FIG. 8 , thebase 110 ofLED package 320 defines the surface on which is placedlight emitting die 104. Unlike the previous figures, nobasin 112 is formed inbase 110. Instead, and as described inFIG. 5 , anindex matching encapsulant 212 may be formed directly overbase 110, die 104 andflextape 120 so as to encapsulant thelight emitting die 104. InFIG. 8 , alens 140 may be placed on thebase 110 and directly on theencapsulant 212 which encapsulated die 104. This lens may be designed such that a hollow exists in the lens to allow for the features of the die and wirebonds. Accordingly, no retainingring 130 is employed in this example; thelens 140 may be fixedly attached tobase 110 viaencapsulant 212 in one example, or formed by the encapsulanting material by potting or molding.FIG. 9 illustrates a side view of an LED package according to another exemplary embodiment of the present invention. Portions of theLED package 330 are similar to corresponding portions of theLED package 100 inFIGS. 1A-3C ,LED package 210 inFIG. 4 orLED package 230 ofFIG. 6 , and thus are assigned the same reference numerals. A detailed explanation of common components are omitted for purposes of brevity; only those features differing from that previously explained are described in detail inFIG. 9 . - Referring to
FIG. 9 , theLED package 330 includes the retainingring 130, which is placed on theflextape 120 and encircles space orcavity 102 above thelight emitting die 104. Thecavity 102 is the space enclosed by thebase 110, retainingring 130 andlens 140, as previously described. However, nobasin 112 is formed inbase 110. Further, twobonding wires 129 may be used, each connected to a separate positive ornegative trace flextape 120. -
FIG. 9 is this similar toFIG. 1C , but uses twobonding wires 129 and nobasin 112. Further, anencapsulant 232 as described inFIG. 6 may be used to encapsulate the light emitting die 104 and partially fill the space encircled by the retainingring 130. In one example, theencapsulant 232 completely fills thecavity 102 encircled by the retainingring 130 and interior space withinlens 140. Theencapsulant 232 could include a generally semi-spherical outertop surface 233, as shown inFIG. 6 . In this variant, and as initially described inFIG. 4 ,encapsulant 232 can be formulated to cure at different degrees of hardness. -
FIG. 10 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. Referring toFIG. 10 , theLED package 340 includes the retainingring 130, which is placed on theflextape 120 and encircles space orcavity 102 above thelight emitting die 104. Nobasin 112 is formed inbase 110, and twobonding wires 129 may be used, each connected to a separate positive ornegative trace flextape 120.FIG. 10 thus illustrates an embodiment somewhat similar toFIG. 1C in which an encapsulant may not be used, but differs fromFIG. 1C in that twobonding wires 129 are used and nobasin 112 is formed inbase 110. -
FIG. 11 illustrates a side view of a LED package according to another exemplary embodiment of the present invention. Referring to FIG.lithe LED package 400 includes nobasin 112 and includes a single bonding wire 129 (cathode or anode). InFIG. 11 , the polyimide layers 124 and 128 and intervening metalconductive layer flex tape 120 are shown in more detail. Part ofpolyimide layer 128 has been removed so to expose metal traces 126 a and 126 b. InFIG. 11 , the light emitting die 104 resides on an elevated surface offlex tape 120. For example,metal trace 126 a may be fabricated so as to be thicker thanmetal trace 126 b, as shown by distances d1 and d2 from the surface of ametal base 110′. Alternatively, thedie 104 could be placed on thelower trace 126 b, withbonding wire 129 electrically connected to trace 126 a. In another example,base 110 could be grooved or recessed so that theflextape 120 sits flush with the top surface ofbase 110. - In
FIG. 11 ,metal base 110′ is not necessary part ofLED package 400. This allows a low-cost-light-weight light emitting component to be placed directly on a Printed Circuit Board or Metal-Core-PCB. Also because the configuration ofFIG. 11 enables the ability to mass produce a number of dies 104 on a continuous stretch offlex tape 120, for application to any desired metal structure which may act as the anode, cathode or neutral wire for electrical conduction and as a heat sink (neutral) to remove heat fromdie 104. Thus,package 400 could be used in a lighting application where it is desired to wrap a continuous reel of flex tape with a plurality of dies 104 along a bridge span, on a vertical metal pole, etc., so as to provide lighting for a given application. -
FIGS. 12A and 12B are flowcharts illustrating a method of manufacturing a LED package according to an exemplary embodiment of the present invention. Referring toFIG. 12A , in a givenmethod 160, in this example for fabricating a portion of an LED package or LED subassembly for anLED package 100 as shown inFIGS. 1A-3C , for example, abase 110 may be formed (162) using a thermally conductive material so as to define abasin 112. One or more light emitting die's 104 may be placed (164) within thebasin 112. Aflextape 120 is placed (166) on thebase 110. Theflextape 120 can include one or more metal traces 126 a, 126 b, depending on the application. The metal trace(s) 126 a, 126 b, may be electrically connected (168) to the die 104 by abond wire 129, for example. - Referring to
sub-process 170 inFIG. 12B , to manufacture acomplete LED package ring 130 may be placed (172) on theflextape 120 so that it is arranged above. thebasin 112 and encircles thebasin 112. Thecavity 102 may be filled (174) with an encapsulant (212/232, etc.) using a suitable encapsulation process (174). In an example, this may entail multiple filling and curing processes. Thelens 140 is then placed (176) on the retainingring 130.Step 176. Following thelens 140 attachment, further curing may be necessary for theencapsulant 212/232. Each of the process functions 172 through 176 can be practiced individually or in a given combination or given order to manufacture a givenLED package FIGS. 7 , 8 and 11. - Therefore, in one example embodiment as shown by
FIGS. 1A-1C , anLED package 100 includes abase 110, at least one light emitting die 104, aflextape 120, a retainingring 130 and alens 140. In this example, thebase 110 includes abasin 112 encompassing thedie 104. Theflextape 120 includes at least one metal trace connected to thelight emitting die 104. The retainingring 130 is on the flextape and positioned above so as to substantially encircle thebasin 112. Thelens 140 is positioned on the retainingring 130. Accordingly, thebase 110, retainingring 130 andlens 140 may collectively define acavity 102 which encompasses thebasin 112. - The use of flextape may facilitate the manufacturing process as compared to conventional manufacturing techniques. The flextape do to its constituent component construction can withstand relatively high temperatures (Le., 300° C.) without damage. Accordingly, during the manufacturing process, a high temperature solder (such as Sn, AgSn, AuSn, etc.) can be applied to the
base 110,flextape 120, light emitting die 104, or to any combination of these components. Additionally, a metal base having markedly better heat transfer properties is used in lie of the conventional ceramic or plastic base. - Accordingly, in one example, the light emitting die 104 may be directly placed into the
basin 112 of themetal base 110, or placed directly on abase 110 construction having nobasin 112 formed therein. By forming ametal base 110 with a reflector-shapedbasin 112 for a desired heat conduction and/or optical arrangement, desired thermal management characteristics and optical output reflection characteristics may be achievable. These designs may thus improve heat dissipation characteristics of a formed LED package. Moreover, the process for attaching constituent components of the package during manufacture may be relatively simple and quick and thus potentially less costly as compared to attachment techniques of prior art LED package designs. - As described with reference to
FIG. 11 , for example, the flextape may include multiple, intricate circuitry and metal trace patterns for applications where it may be desirable to use multiple light emitting dies (e.g., multiple colors such as Red, Green, and Blue). Furthermore, these complex patterns may be relatively easy and cost effective to implement using existing flextape techniques. A flextape having complex patterns may enable the manufacture of LED packages having sophisticated functions at a minimal increase in cost. This may be due in part to the fact that flextape may be manufactured in mass using a reel-to-reel production technique, for example. - As discussed above, the design of package 100 (which is an SMT device) permits both electrical and thermal properties to be contained within the
package 100. In other words, thepackage 100 provides both an electrical isolation and a thermal conduction function for the LED chip or die 104 therein. - The example embodiments of the present invention being thus described, it will be obvious that the same may be varied in many ways. For example,
lens 140 may be differently configured than as illustrated inFIGS. 8 and 10 .FIGS. 14A and 14B illustrate a side view of a LED package to illustrate a lens variation applicable toFIGS. 8 and 10 , according to another exemplary embodiment of the present invention. As shown in FIGS. 14A and 14B, there is shown apre-molded lens 140 that is placed over the LED die 104, withencapsulant 212/232 used betweenlens 140 and die 104. - In another example, the
flextape 120 may be embodied other than as a polyimide polymer film. In one example, the application of a polyimide such as PYROLUX® by Dupont may be sprayed on a metal substrate of a suitable thickness, (such as 2 um thick). A leadframe such as copper (Cu) may be used for the metal traces and die attach platform. The top of the flextape could be insulated or not depending on needs/desires of the application or LED. Additionally, the polyimide could be etched as desired into a “flex-print” type lead configuration and applied to a heat sink. - Such variations are not to be regarded as departure from the spirit and scope of the exemplary embodiments of the present invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.
Claims (15)
1. A light emitting diode (LED) package, comprising:
a base;
at least one light emitting die on a portion of the base;
a flextape including at least one metal trace connected to the at least one light emitting die;
a retaining ring on the flextape and encircling space above the portion of the base on which the at least one light emitting die resides, the flextape configured to extend between the base and the retaining ring; and
a lens on the retaining ring, the package adapted to provide a thermal conduction and electrical isolation function for the light emitting die therein.
2. The package of claim 1 , wherein the base defines a basin therein with the at least one light emitting die residing within the basin, and wherein the base, retaining ring and lens define a cavity encompassing the basin.
3. The package of claim 2 , wherein the cavity is filled with index matching encapsulant.
4. The package of claim 2 , wherein the encapsulant has a harder, outer surface and a softer core.
5. The package of claim 2 , wherein the basin includes surfaces having an optical finish.
6. The package of claim 1 , wherein the base includes a first chamfer and a second chamfer.
7. The package of claim 1 , wherein the flextape includes a polyimide layer, and a conductive layer forming at least one metal trace.
8. The package of claim 1 , wherein the flextape includes two polyimide layers sandwiching a conductive layer, the conductive layer forming at least one metal trace.
9. A method of manufacturing an LED package, comprising:
forming a base which includes a basin;
placing at least one light emitting die within the basin;
providing a flextape including at least one metal trace on the base; and
electrically connecting the light emitting die with the at least one metal trace, the formed package adapted to provide a thermal conduction and electrical isolation function for the light emitting die therein.
10. The method of claim 9 , further comprising:
placing a retaining ring on the flextape, and
placing a lens on the retaining ring.
11. A method of manufacturing an LED package, comprising:
providing a flexible polyimid tape,
placing a plurality of light emitting dies on the tape, and
encapsulating each of the dies with an encapsulant that serves as a lens for each die, a manufactured package adapted to provide a thermal conduction and electrical isolation function for a given light emitting die therein.
12. An LED package formed by the method of claim 11 , the package configured for attachment via the flextape to a given metal structure which serves as a base of the package.
13. The package of claim 12 , wherein index matching encapsulant encapsulates each light emitting die.
14. A light emitting diode (LED) package, comprising:
a rigid base having a first planar surface extending along a single plane;
at least one light emitting die disposed on a first portion of the first planar surface of the rigid base; and
a flextape at least partially disposed on a second portion the first planar surface of the rigid base, the flextape comprising at least one metal trace disposed within a flexible plastic resin such that the flextape comprises at least a first layer of the flexible plastic resin with the metal trace positioned on the first layer, and a second layer of the flexible plastic resin positioned on the at least one metal trace, the at least one metal trace being connected to the light emitting die, and the package being adapted to provide a thermal conduction and electrical isolation function for the light emitting die therein.
15. The package of claim 14 , wherein the at least one light emitting die and at least a portion of the flextape are coplanar.
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US14/107,887 US20140183568A1 (en) | 2006-06-29 | 2013-12-16 | Led package with flexible polyimide circuit and method of manufacturing led package |
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US11/476,836 US8610134B2 (en) | 2006-06-29 | 2006-06-29 | LED package with flexible polyimide circuit and method of manufacturing LED package |
US14/107,887 US20140183568A1 (en) | 2006-06-29 | 2013-12-16 | Led package with flexible polyimide circuit and method of manufacturing led package |
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US11/476,836 Continuation US8610134B2 (en) | 2006-06-29 | 2006-06-29 | LED package with flexible polyimide circuit and method of manufacturing LED package |
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US14/107,887 Abandoned US20140183568A1 (en) | 2006-06-29 | 2013-12-16 | Led package with flexible polyimide circuit and method of manufacturing led package |
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US20080001160A1 (en) | 2008-01-03 |
US8610134B2 (en) | 2013-12-17 |
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