US20150041359A1 - Substrate container with fluid-sealing flow passageway - Google Patents

Substrate container with fluid-sealing flow passageway Download PDF

Info

Publication number
US20150041359A1
US20150041359A1 US14/281,222 US201414281222A US2015041359A1 US 20150041359 A1 US20150041359 A1 US 20150041359A1 US 201414281222 A US201414281222 A US 201414281222A US 2015041359 A1 US2015041359 A1 US 2015041359A1
Authority
US
United States
Prior art keywords
grommet
container
nozzle
substrate container
interior
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/281,222
Inventor
Anthony Mathius Tieben
John Lystad
David L. Halbmaier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Priority to US14/281,222 priority Critical patent/US20150041359A1/en
Assigned to ENTEGRIS, INC. reassignment ENTEGRIS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HALBMAIER, DAVID L., LYSTAD, JOHN, TIEBEN, ANTHONY M.
Publication of US20150041359A1 publication Critical patent/US20150041359A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67379Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • H01L21/67393Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769Storage means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Definitions

  • the invention relates to substrate containers. More particularly, the invention relates to substrate containers that include a flow passage for a fluid.
  • carriers are utilized for transporting and/or storing batches of silicon wafers or magnetic disks before, during and after processing of the disks or wafers.
  • the wafers can be processed into integrated circuits and the disks can be processed into a magnetic storage disks for computers.
  • the terms wafer, disk, or substrate are used interchangeably herein and any of these terms can refer to semiconductor wafers, magnetic discs, flat panel substrates, and other such substrates, unless otherwise indicated.
  • wafer containers have been used to provide this necessary protection. Additionally, since the processing of disks is generally automated, it is necessary for disks to be precisely positioned relative to the processing equipment for the robotic removal and insertion of the wafers. A second purpose of a wafer container is to securely hold the wafer disks during transport.
  • wafer containers, carriers, cassettes, transport/storage bins, and the like are used interchangeably herein unless otherwise indicated.
  • Contamination is accepted as the single largest cause of yield loss in the semi-conductor industry.
  • the size of particles which can contaminate an integrated circuit has also become smaller making minimization of contaminants all the more critical.
  • Contaminants in the form of particles may be generated by abrasion such as the rubbing or scraping of the carrier with the wafers or disks, with the carrier covers or enclosures, with storage racks, with other carriers or with processing equipment.
  • particulates such as dust can be introduced into the enclosures through the openings or joints in the covers and/or enclosures.
  • a critical function of wafer carriers is to protect the wafers therein from such contaminants.
  • Containers are generally configured to axially arrange the wafers or disks in slots, and to support the wafers or disks in slots, and to support the wafers or disks by or near their peripheral edges.
  • the wafers or disks are conventionally removable from the containers in a radial direction upwardly or laterally.
  • the containers may have a shell portion with a lower opening, a door to latch into the lower opening, and a discrete carrier that rests on the door.
  • This configuration known as SMIF pods, is illustrated in U.S. Pat. Nos. 4,995,430 and 4,815,912, both owned by the owner of the instant application and both incorporated herein by reference.
  • wafer carrier assemblies can have front openings with doors that latch onto front openings, which are known as FOUPs or FOSBs, and are described in, for example, U.S. Pat. Nos. 6,354,601, 5,788,082 and 6,010,008, all of which are incorporated by reference herein.
  • the bottom covers or doors, front doors or the container portions have been provided with openings or passageways to facilitate the introduction and/or exhaustion of gases such as nitrogen or other purified gasses, into the wafer carrier assemblies to displace ambient air that might have contaminants.
  • Previous containers have employed filter plugs to reduce the amount of particular contaminants that enter the container assemblies during purging.
  • conventional attachment and sealing between the operation element, i.e. the filter, and the housing of the seal is by the way of rigid plastic housings and o-rings.
  • Wafer containers known in the art have also utilized various connection or coupling mechanisms for fluidly interfacing the flow passageways of the wafer containers to fluid supply and pressure or vacuum sources. Such attachment and sealing requires specialized components which may be of complex configuration.
  • An improved wafer container includes a an enclosure portion with an open side or bottom, a door to sealingly close the open side or open bottom and defining an enclosure or container, and a plurality of wafer support shelve contained within the container.
  • the door couples with the enclosure portion to form a continuous enclosure that isolates the wafer carrier or other substrate from the ambient atmosphere.
  • the container has at least one access structure defining a flow conduit into and out of the enclosure.
  • a sealing grommet is situated within the access structure in a fluid-tight engagement. An outer surface of the grommet establishes a generally fluid-tight seal against an inner surface of the flow conduit.
  • the grommet defines a flow passageway such as, for example, a cylindrical bore.
  • the grommet includes a contact surface that can facilitate a fluid-tight coupling between the interior volume of the wafer container and a nozzle or nipple for a fluid or vacuum source.
  • the grommet's interior sealing surface may define the flow passageway.
  • the flow passageway through the grommet includes at least one operational element substantially or totally contained therein.
  • the operational element can be any component, subassembly, or device that couples or interfaces the interior volume of the wafer container to the exterior. Examples of operational elements include valves, filters, sensors, plugs, or combinations thereof. The operational element is in fluid-tight engagement against the interior sealing surface.
  • the grommet maintains a seal against the access structure to prevent undesired chemicals or particulates from entering into the interior of the wafer container assembly.
  • any flow of fluid between the interior and exterior of the wafer container is limited to passing through the passageway defined by the grommet.
  • Types of fluid flows include the introduction of purging gases such as, for example, nitrogen into the interior of the wafer carrier assembly.
  • the fluid flow can be further limited by the operational element.
  • the operational element is a particulate filter, gas passing through the passageway must also pass through the filter.
  • the operational element is a check valve
  • the fluid flow passing through the passageway is further limited to flowing in a specific direction.
  • the flow passageway through the grommet includes a filter and a check valve. In this embodiment, both functions, filtering, and flow direction assignment, are carried out.
  • the operational element is a removable plug, in which case no fluid is permitted to flow through the passageway when the plug is inserted.
  • the operational element includes a sensor.
  • useful sensors include temperature sensors, flow rate sensors, pressure sensors, gas concentration sensors, material detectors, and proximity sensors.
  • some such as flow sensors
  • others such as pressure sensors
  • the use of uniform sizing of access structures, sealing grommets, and operational elements permits modularization.
  • the wafer container assembly housings can have a limited number of identical enclosure components with access structures positioned in a plurality of points throughout the common enclosures.
  • Each access structure can have a sealing grommet, some of which are a blanking type (without a passageway), while other access structures can have sealing grommets with various integral operational elements. Sealing grommets can be pre-assembled with various operational elements and stocked as operational cartridge subassemblies.
  • the grommet configuration provides an elastomeric element that is generally of a cylindrical configuration with a bore extending therethrough, the bore itself having a cylindrical configuration.
  • the bore being of sufficient length to contain totally or substantially the entire length of an operational component inserted therein.
  • the grommet preferably has at least one planar surface arranged to be normal to the axis of the grommet. Such surface can be utilized to effectively provide a seating surface for a nipple or nozzle as part of a purging system. Volumetrically, the grommet is preferably larger that the operational component container therein.
  • the grommet preferably has a cross sectional area taken in an axial plane whereby the cross sectional area of the grommet is greater that the cross sectional area of the opening extending axially therethrough.
  • the grommet preferably has a axial length that is greater than the diameter of the opening or bore extending axially through the grommet.
  • an o-ring generally has a circular cross section
  • the grommet herein has a non circular cross-section and cylindrical inner facing surfaces, cylindrical outer facing surfaces, and planar end surfaces.
  • FIG. 1A is an exploded perspective view of a wafer container assembly comprising a wafer carrier, a bottom cover and an enclosure portion.
  • FIG. 1B is an exploded perspective view of another embodiment of a wafer container assembly comprising a wafer carrier, side cover and an enclosure portion.
  • FIG. 2 is a bottom view of an example bottom cover showing structure located on the bottom surface of the bottom cover.
  • FIG. 3 is a diagram illustrating an example grommet and example operational element according to one embodiment of the present disclosure.
  • FIG. 4 is an exploded perspective view of an example cover or door for a wafer container assembly that includes sealing grommets and operational components.
  • FIGS. 5A-5B illustrate the construction of example operational subassemblies, each incorporating a grommet and at least one operational element.
  • FIG. 5C illustrates an example assembly of an operational subassembly into a flow conduit.
  • FIGS. 6A and 6B are cross-sectional views illustrating a gas purging arrangement according to one embodiment of the present disclosure.
  • FIG. 1A illustrates an example wafer container assembly 100 that includes wafer rack 102 , bottom section 104 and enclosure portion 106 .
  • Bottom section 104 is adapted to sealably couple with enclosure portion 106 to define an interior space which can isolate wafer carrier 102 from ambient atmosphere 108 .
  • wafer carrier 102 can comprise a plurality of elements 110 that can hold and position a plurality of silicon wafers within wafer carrier 102 .
  • elements 110 hold and position the silicon wafers such that contact between adjacent wafers is minimized, which can reduce damage to the wafers that can occur during processing and/or transportation of silicone wafers.
  • FIG. 1A illustrates an example wafer container assembly 100 that includes wafer rack 102 , bottom section 104 and enclosure portion 106 .
  • Bottom section 104 is adapted to sealably couple with enclosure portion 106 to define an interior space which can isolate wafer carrier 102 from ambient atmosphere 108 .
  • wafer carrier 102 can comprise a plurality of elements 110 that can hold and position a pluralit
  • FIG. 1B illustrates another configuration of a wafer container assembly 103 known as a FOUP or FOSB comprising an open front 104 , a front door 105 and enclosure portion 107 .
  • Wafers W are removed horizontally through the open front. Slots formed in the interior sides hold the wafer.
  • Front door 105 with seal sealingly engages with enclosure portions 107 to form an interior space that is isolated from the ambient atmosphere.
  • the structure of a wafer carrier is described in, for example, U.S. Pat. No. 6,428,729 to Bhatt et al., entitled “Composite Substrate Carrier,” which is hereby incorporated by reference herein.
  • section 120 is a side cover, bottom cover, or door of a wafer container.
  • section 120 is a non-removable, non-openable wall section.
  • Section 120 is illustrated comprising access structures in the form of openings 122 , 123 , grommets 124 , 125 situated in openings 122 , 123 and a plurality of status openings 126 .
  • the plurality of status openings 126 can be located at desired positions on cover section 120 to provide a structure for sensors, such as probes or other monitoring elements, to interface with the wafer container.
  • the interface between a sensor and a particular status opening 126 can provide information about the status of a wafer processing step or the like.
  • opening 122 facilitates fluid transfer into section 120 , which can facilitate the introduction of gases and other fluids into the interior of the wafer container.
  • opening 123 provides fluid transfer out the wafer container through section 120 such that gas or fluid located within the wafer container can be vented to the ambient atmosphere.
  • opening 122 is an inlet
  • opening 123 is an outlet.
  • FIG. 2 illustrates an embodiment where section 120 comprises two openings 122 , 123 , embodiments having four, five, six, or more access structures located in section 120 are contemplated and are within the scope of the present disclosure.
  • grommet 124 is positioned within opening 122 to seal opening 122
  • grommet 125 is positioned within opening 123 to seal opening 123
  • grommets 124 , 125 each creates a seal against the interior of their corresponding opening 122 , 123 , and provides at least one bore or passageway through the grommet.
  • the bodies of grommets 124 , 125 each have a cross-sectional shape that corresponds with the interior features of openings 122 , 123 , and is sized to seal and substantially occlude its corresponding opening 152 , 153 .
  • grommet 124 includes two distinct passageways.
  • FIG. 3 illustrates one example embodiment of grommet 124 , 125 .
  • Grommet 124 , 125 according to this embodiment has a generally cylindrical body 128 .
  • body 128 is formed from rubber, silicone, or other elastomer or polymer having desired sealing characteristics.
  • body 128 includes sealing features 130 in the form of ring-shaped protrusions circumferentially situated along the exterior of the cylindrical wall.
  • Grommet 124 , 125 also includes bore 132 passing through the center of body 128 .
  • the interior surface of body 128 that defines bore 132 optionally includes sealing features (not shown) for sealing against operational element 134 situated at least partially within bore 132 .
  • operational element 132 is a valve such as a check valve. In another example embodiment, operational element 132 is a fluid filter. In another embodiment, operational element 132 is a sensor, such as a temperature sensor, flow rate sensor, pressure sensor, gas concentration sensor, material detector, or proximity sensor. In another embodiment, operational element 132 is simply a plug to prevent fluid travel through flow passageway 204 .
  • FIG. 4 illustrates an example cover section 150 .
  • Cover section 150 includes cover enclosure 170 , latch elements 172 , 174 , cam 176 and outer cover section 178 .
  • Cam 176 is connected to latch elements 172 , 174 such that rotation of cam 176 actuates latches 172 , 174 , which causes protrusions 180 to extend through openings 182 located in housing 170 and lock housing 170 to another enclosure section (not shown).
  • Outer cover 178 is assembled over latch elements 172 , 174 and cam 176 .
  • Cover section 150 also includes access structures 160 , 161 .
  • Access structure 160 includes inlet opening 152 and flow conduit 157 .
  • Access structure 161 includes outlet opening 153 and flow conduit 158 .
  • Flow conduits 157 and 158 each have a generally cylindrical wall having a height that extends through the thickness of cover section 150 from the exterior of the wafer container to the interior.
  • FIGS. 5A and 5B illustrate operational subassemblies 162 and 163 in greater detail.
  • Operational subassembly 162 is an inlet subassembly and includes grommet 154 having body 202 and bore 205 .
  • Operational subassembly 162 further includes check valve 211 installable into bore 204 , and filter 210 .
  • Embodiments of filter 210 include particle filters of suitable technology, such as HEPA filtration, or the like.
  • Operational subassembly 163 is an outlet subassembly that includes grommet 155 having body 203 and bore 205 .
  • operational subassemblies 162 , 163 are each pre-assembled with their respective constituent components as operational cartridges.
  • FIG. 5C illustrates the assembly of operational subassembly 162 into flow conduit 157 .
  • Filter 210 is retained in place between the bottom of grommet 154 and retaining surface 164 of flow conduit 157 .
  • Grommet 154 fits within flow channel 157 and forms a seal with the interior wall of flow channel 157 .
  • Check valve 211 fits sealably within flow passageway 204 through grommet 154 , and is aligned so that flow is permitted in the downward direction as indicated in FIG. 5C .
  • the grommets include a body having a bore located within the housing, the bore extending along the major axis of the housing.
  • the embodiments of grommets of the present disclosure can comprise an operation element located with the bore.
  • the operation element can comprise a check valve that can regulate the flow of gas or other fluids through the bore, a filter, a sensor or combinations thereof.
  • the check valves employed in the present disclosure can be oriented within the bore such that the grommets can be used to seal both inlet and outlet openings on wafer carrier doors and/or enclosures.
  • the design of the grommet body can facilitate sealing of the opening without the need for a additional O-rings attached to the grommet.
  • embodiments of grommets of the present disclosure can combine a grommet body, check value and/or filter into an integral cartridge, which can improve the overall sealing ability of the grommets and can facilitate easier construction of wafer carrier assemblies.
  • the grommets have an axial height from about 1 ⁇ 8 inch to about 1 inch, while in other embodiments the grommets can have an axial height from about 3 ⁇ 8 inch to about 3 ⁇ 4 inch.
  • embodiments of grommets of the present disclosure can have a diameter from about 1 ⁇ 4 inch to about 1.5 inches, while in other embodiments the grommets can have a diameter from about 12 inch to about 3 ⁇ 4 inch.
  • One of ordinary skill in the art will recognize that additional ranges of axial height and diameter of the grommets are contemplated and are within the scope of the present disclosure.
  • the grommets can be distinguished from O-rings known in the art in a number of ways.
  • the grommet configuration provides an elastomeric element that is generally of a cylindrical configuration with a bore extending therethrough, the bore itself having a cylindrical configuration.
  • the bore being of sufficient length to contain totally or substantially the entire length of an operational component inserted therein.
  • the grommet preferably has at least one planar surface arranged to be normal to the axis of the grommet. Such surface can be utilized to effectively provide a seating surface for a nipple or nozzle as part of a purging system. Volumetrically, the grommet is preferably larger that the operational component container therein.
  • the grommet preferably has a cross sectional area taken in an axial plane whereby the cross sectional area of the grommet is greater that the cross sectional area of the opening extending axially therethrough.
  • the grommet preferably has a axial length that is greater than the diameter of the opening or bore extending axially through the grommet.
  • an o-ring generally has a circular cross section
  • the grommet herein has a non circular cross-section and cylindrical inner facing surfaces, cylindrical outer facing surfaces, and planar end surfaces.
  • FIGS. 6A and 6B are cross-sectional views illustrating a gas purging arrangement according to one embodiment of the present disclosure.
  • Example grommets 300 and 302 are situated in respective access structures 304 and 306 of an example wafer container having an interior 308 and exterior 310 .
  • Access structures 304 , 306 are formed within a wall or door 312 of the wafer container, and each functions as a purging port.
  • Access structure 304 includes a retaining structure 314 that has a geometry specially adapted to sealably engage grommet 300 .
  • access structure 306 includes a retaining structure 316 that has a geometry adapted to engage with grommet 302 .
  • Grommets 300 and 302 each have various sealing features 318 , 320 for creating fluid-tight contact with certain interior surfaces of retaining structures 314 and 316 , respectively, as indicated.
  • FIG. 6A illustrates an inlet arrangement; whereas FIG. 6B illustrates an outlet arrangement. For each arrangement, the direction of the flow is indicated.
  • the inlet arrangement of FIG. 6A also includes filter 322 situated and fluidly sealed between the contacting surfaces of grommet 300 and retaining structure 314 .
  • the inlet arrangement of FIG. 6A also includes a one-way valve assembly 324 positioned to permit fluid travel only in the indicated flow direction.
  • the outlet arrangement of FIG. 6B includes a one-way valve assembly 326 positioned to permit fluid travel only in the flow direction indicated.
  • Valve assemblies 324 , 326 are fluidly sealed within respective flow passageways 328 , 330 defined by the bores of grommets 300 , 302 .
  • Grommets 300 , 302 have retaining features 332 , 334 for securely holding valve assemblies 324 , 326 in place within respective flow passageways 328 , 330 .
  • one-way valves 324 , 326 comprise valve bodies 336 and 338 , outer seal rings 340 and 342 , inner seal rings 344 and 346 , moveable pistons 348 and 350 , and biasing springs 352 and 354 .
  • the inlet and outlet arrangements can function in concert during a purging activity in which existing air or gas within the interior 308 of the wafer container is displaced by newly introduced air, gas, or other fluid.
  • a vacuum source 360 is coupled to the interior volume 308 by a outlet nozzle 362 .
  • Outlet nozzle is adapted to interface with a contact surface 364 of grommet 302 .
  • grommet 302 compresses, but maintains its seal against the sealing inner surfaces of retaining structure 316 and against the outer surface of valve assembly 326 .
  • the seals between grommet 302 and retaining structure 316 and valve assembly 326 are actually improved or made more effective by the downward force applied onto grommet 302 by outlet nozzle 362 .
  • a replacement fluid source (not shown) is coupled with interior volume 308 via an inlet nozzle having similar geometry with outlet nozzle 362 and coupled with inlet grommet 300 in the same manner in which outlet nozzle 362 is coupled with outlet grommet 302 .
  • no outlet nozzle is coupled with grommet 302 , and the inlet nozzle carries pressurized replacement fluid into the interior volume 308 .
  • the displaced fluid simply exists through the outlet arrangement of FIG.
  • grommets 300 , 302 can have the same cross-section shape as the opening in which the grommet is designed to seal.
  • grommets 300 , 302 have a generally cylindrical shape with a generally circular cross-section.
  • one of ordinary skill in the art will recognize a variety of grommet body geometries are within the spirit of the present disclosure.
  • grommets 300 and 302 are identical parts.
  • valve assemblies 324 and 326 are identical parts.
  • the components of the present disclosure can be used to seal both inlet and outlet openings using the same component elements.
  • grommets of the present disclosure can further include additional retaining features (not shown) for securely holding a filter such as filter 322 in the same or similar manner in which retaining features 332 , 334 retain valve assemblies 324 , 326 .
  • a pre-assembled operational subassembly can incorporate a grommet, a valve and a filter into a integral subassembly.
  • the grommet body, flanges and other components of the grommets of the present disclosure can be composed of any material suitable for use in semi-conductor processing applications including polymers and elasotmers.
  • the grommet body and flanges can be composed of a fluoroelastomer. Examples of fluoroelastomers are sold under the trade name Viton® by Dupont Dow Elastomers.
  • the elastomeric grommet body or grommet can have a fluoropolymer, or other inert polymer, coated onto to the surface of the grommet to isolate the elatomeric substance from the interior of the substrate container.
  • the polymer or fluoropolymer coating should have some flexibility such that the sealing characteristics of the elastomeric grommet body are maintained.

Abstract

A substrate container includes an enclosure and an access structure formed in the enclosure and providing fluid access through the enclosure to an interior of the substrate container. The access structure includes an opening and an inner surface. A grommet is situated against the inner surface of the access structure.

Description

    RELATED APPLICATIONS
  • This application is a continuation of application Ser. No. 12/026,336 filed Feb. 5, 2008, issuing May 20, 2014, as U.S. Pat. No. 8,727,125, which is a divisional of application Ser. No. 11/108,619 filed Apr. 17, 2005 which issued as U.S. Pat. No. 7,328,727 on Feb. 12, 2008, which claims the benefit of U.S. Provisional Application No. 60/563,528 filed Apr. 18, 2004, each of which is hereby fully incorporated herein by reference.
  • FIELD OF THE INVENTION
  • The invention relates to substrate containers. More particularly, the invention relates to substrate containers that include a flow passage for a fluid.
  • BACKGROUND OF THE INVENTION
  • In general, carriers are utilized for transporting and/or storing batches of silicon wafers or magnetic disks before, during and after processing of the disks or wafers. The wafers can be processed into integrated circuits and the disks can be processed into a magnetic storage disks for computers. The terms wafer, disk, or substrate are used interchangeably herein and any of these terms can refer to semiconductor wafers, magnetic discs, flat panel substrates, and other such substrates, unless otherwise indicated.
  • The processing of wafer disks into integrated circuit chips often involves multiple steps where the disks are processed at various processing stations, and stored and transported between processing steps. Due to the delicate nature of the disks and their susceptibility to contamination by particles or chemicals, it is vital that they are properly protected throughout this procedure. Wafer containers have been used to provide this necessary protection. Additionally, since the processing of disks is generally automated, it is necessary for disks to be precisely positioned relative to the processing equipment for the robotic removal and insertion of the wafers. A second purpose of a wafer container is to securely hold the wafer disks during transport. The terms wafer containers, carriers, cassettes, transport/storage bins, and the like, are used interchangeably herein unless otherwise indicated.
  • During processing of semiconductor wafers or magnetic disks, the presence of or generation of particulates presents very significant contamination problems. Contamination is accepted as the single largest cause of yield loss in the semi-conductor industry. As the size of integrated circuitry has continued to be reduced, the size of particles which can contaminate an integrated circuit has also become smaller making minimization of contaminants all the more critical. Contaminants in the form of particles may be generated by abrasion such as the rubbing or scraping of the carrier with the wafers or disks, with the carrier covers or enclosures, with storage racks, with other carriers or with processing equipment. Additionally, particulates such as dust can be introduced into the enclosures through the openings or joints in the covers and/or enclosures. Thus, a critical function of wafer carriers is to protect the wafers therein from such contaminants.
  • Containers are generally configured to axially arrange the wafers or disks in slots, and to support the wafers or disks in slots, and to support the wafers or disks by or near their peripheral edges. The wafers or disks are conventionally removable from the containers in a radial direction upwardly or laterally. The containers may have a shell portion with a lower opening, a door to latch into the lower opening, and a discrete carrier that rests on the door. This configuration, known as SMIF pods, is illustrated in U.S. Pat. Nos. 4,995,430 and 4,815,912, both owned by the owner of the instant application and both incorporated herein by reference. Additionally, wafer carrier assemblies can have front openings with doors that latch onto front openings, which are known as FOUPs or FOSBs, and are described in, for example, U.S. Pat. Nos. 6,354,601, 5,788,082 and 6,010,008, all of which are incorporated by reference herein. In certain configurations, the bottom covers or doors, front doors or the container portions have been provided with openings or passageways to facilitate the introduction and/or exhaustion of gases such as nitrogen or other purified gasses, into the wafer carrier assemblies to displace ambient air that might have contaminants.
  • Previous containers have employed filter plugs to reduce the amount of particular contaminants that enter the container assemblies during purging. However, conventional attachment and sealing between the operation element, i.e. the filter, and the housing of the seal is by the way of rigid plastic housings and o-rings. Wafer containers known in the art have also utilized various connection or coupling mechanisms for fluidly interfacing the flow passageways of the wafer containers to fluid supply and pressure or vacuum sources. Such attachment and sealing requires specialized components which may be of complex configuration.
  • SUMMARY OF THE INVENTION
  • An improved wafer container according to one aspect of the invention includes a an enclosure portion with an open side or bottom, a door to sealingly close the open side or open bottom and defining an enclosure or container, and a plurality of wafer support shelve contained within the container. The door couples with the enclosure portion to form a continuous enclosure that isolates the wafer carrier or other substrate from the ambient atmosphere. The container has at least one access structure defining a flow conduit into and out of the enclosure. A sealing grommet is situated within the access structure in a fluid-tight engagement. An outer surface of the grommet establishes a generally fluid-tight seal against an inner surface of the flow conduit. In one embodiment, the grommet defines a flow passageway such as, for example, a cylindrical bore. In a related embodiment, the grommet includes a contact surface that can facilitate a fluid-tight coupling between the interior volume of the wafer container and a nozzle or nipple for a fluid or vacuum source. The grommet's interior sealing surface may define the flow passageway.
  • Optionally, the flow passageway through the grommet includes at least one operational element substantially or totally contained therein. The operational element can be any component, subassembly, or device that couples or interfaces the interior volume of the wafer container to the exterior. Examples of operational elements include valves, filters, sensors, plugs, or combinations thereof. The operational element is in fluid-tight engagement against the interior sealing surface.
  • In operation, according to one embodiment, the grommet maintains a seal against the access structure to prevent undesired chemicals or particulates from entering into the interior of the wafer container assembly. Thus, any flow of fluid between the interior and exterior of the wafer container is limited to passing through the passageway defined by the grommet. Types of fluid flows include the introduction of purging gases such as, for example, nitrogen into the interior of the wafer carrier assembly.
  • The fluid flow can be further limited by the operational element. For example, where the operational element is a particulate filter, gas passing through the passageway must also pass through the filter. In another example case where the operational element is a check valve, the fluid flow passing through the passageway is further limited to flowing in a specific direction. In one embodiment, the flow passageway through the grommet includes a filter and a check valve. In this embodiment, both functions, filtering, and flow direction assignment, are carried out. In the another example embodiment, the operational element is a removable plug, in which case no fluid is permitted to flow through the passageway when the plug is inserted.
  • In another example embodiment, the operational element includes a sensor. Types of useful sensors include temperature sensors, flow rate sensors, pressure sensors, gas concentration sensors, material detectors, and proximity sensors. Among these, and other sensors used as operational elements, some (such as flow sensors) may permit flow-through, while others (such as pressure sensors) function also as plugs.
  • In manufacturing, the use of uniform sizing of access structures, sealing grommets, and operational elements, permits modularization. Thus, for a product line of various wafer containers, each having specialized operational elements, the wafer container assembly housings can have a limited number of identical enclosure components with access structures positioned in a plurality of points throughout the common enclosures. Each access structure can have a sealing grommet, some of which are a blanking type (without a passageway), while other access structures can have sealing grommets with various integral operational elements. Sealing grommets can be pre-assembled with various operational elements and stocked as operational cartridge subassemblies.
  • An advantage and feature of preferred embodiments of the invention is that the grommet configuration provides an elastomeric element that is generally of a cylindrical configuration with a bore extending therethrough, the bore itself having a cylindrical configuration. The bore being of sufficient length to contain totally or substantially the entire length of an operational component inserted therein. The grommet preferably has at least one planar surface arranged to be normal to the axis of the grommet. Such surface can be utilized to effectively provide a seating surface for a nipple or nozzle as part of a purging system. Volumetrically, the grommet is preferably larger that the operational component container therein. The grommet preferably has a cross sectional area taken in an axial plane whereby the cross sectional area of the grommet is greater that the cross sectional area of the opening extending axially therethrough. The grommet preferably has a axial length that is greater than the diameter of the opening or bore extending axially through the grommet. Whereas an o-ring generally has a circular cross section, the grommet herein has a non circular cross-section and cylindrical inner facing surfaces, cylindrical outer facing surfaces, and planar end surfaces.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1A is an exploded perspective view of a wafer container assembly comprising a wafer carrier, a bottom cover and an enclosure portion.
  • FIG. 1B is an exploded perspective view of another embodiment of a wafer container assembly comprising a wafer carrier, side cover and an enclosure portion.
  • FIG. 2 is a bottom view of an example bottom cover showing structure located on the bottom surface of the bottom cover.
  • FIG. 3 is a diagram illustrating an example grommet and example operational element according to one embodiment of the present disclosure.
  • FIG. 4 is an exploded perspective view of an example cover or door for a wafer container assembly that includes sealing grommets and operational components.
  • FIGS. 5A-5B illustrate the construction of example operational subassemblies, each incorporating a grommet and at least one operational element.
  • FIG. 5C illustrates an example assembly of an operational subassembly into a flow conduit.
  • FIGS. 6A and 6B are cross-sectional views illustrating a gas purging arrangement according to one embodiment of the present disclosure.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • FIG. 1A illustrates an example wafer container assembly 100 that includes wafer rack 102, bottom section 104 and enclosure portion 106. Bottom section 104 is adapted to sealably couple with enclosure portion 106 to define an interior space which can isolate wafer carrier 102 from ambient atmosphere 108. As shown in FIG. 1, wafer carrier 102 can comprise a plurality of elements 110 that can hold and position a plurality of silicon wafers within wafer carrier 102. Generally, elements 110 hold and position the silicon wafers such that contact between adjacent wafers is minimized, which can reduce damage to the wafers that can occur during processing and/or transportation of silicone wafers. FIG. 1B illustrates another configuration of a wafer container assembly 103 known as a FOUP or FOSB comprising an open front 104, a front door 105 and enclosure portion 107. Wafers W are removed horizontally through the open front. Slots formed in the interior sides hold the wafer. Front door 105 with seal sealingly engages with enclosure portions 107 to form an interior space that is isolated from the ambient atmosphere. The structure of a wafer carrier is described in, for example, U.S. Pat. No. 6,428,729 to Bhatt et al., entitled “Composite Substrate Carrier,” which is hereby incorporated by reference herein. Additionally, wafer carrier assemblies having front openings with doors that latch onto front openings, known as FOUPs or FOSBs, are described in U.S. Pat. Nos. 6,354,601, 5,788,082, 6,010,008, all owned by the owner of the instant application and all hereby incorporated by reference herein. Receiving structure 109 for the grommets 124, 125 may be in the bottom wall of the enclosure portion.
  • Referring to FIG. 2, an example wafer container section 120. In one type of embodiment, section 120 is a side cover, bottom cover, or door of a wafer container. In other type of embodiment, section 120 is a non-removable, non-openable wall section. Section 120 is illustrated comprising access structures in the form of openings 122, 123, grommets 124, 125 situated in openings 122, 123 and a plurality of status openings 126. Generally, the plurality of status openings 126 can be located at desired positions on cover section 120 to provide a structure for sensors, such as probes or other monitoring elements, to interface with the wafer container. For example, the interface between a sensor and a particular status opening 126 can provide information about the status of a wafer processing step or the like.
  • In one example embodiment, opening 122 facilitates fluid transfer into section 120, which can facilitate the introduction of gases and other fluids into the interior of the wafer container. Similarly, opening 123 provides fluid transfer out the wafer container through section 120 such that gas or fluid located within the wafer container can be vented to the ambient atmosphere. Thus, in this embodiment, opening 122 is an inlet, while opening 123 is an outlet. Although FIG. 2 illustrates an embodiment where section 120 comprises two openings 122, 123, embodiments having four, five, six, or more access structures located in section 120 are contemplated and are within the scope of the present disclosure.
  • As illustrated in FIG. 2, grommet 124 is positioned within opening 122 to seal opening 122, and grommet 125 is positioned within opening 123 to seal opening 123. As described below, grommets 124, 125 each creates a seal against the interior of their corresponding opening 122, 123, and provides at least one bore or passageway through the grommet. In one embodiment, the bodies of grommets 124, 125 each have a cross-sectional shape that corresponds with the interior features of openings 122, 123, and is sized to seal and substantially occlude its corresponding opening 152, 153. One of ordinary skill in the art will recognize that the cross-sectional shape and size of openings 122, 123 can be guided by size gas flow requirements, and operating pressures of a particular wafer container assembly. In a related embodiment (not shown), grommet 124 includes two distinct passageways.
  • FIG. 3 illustrates one example embodiment of grommet 124, 125. Grommet 124, 125 according to this embodiment has a generally cylindrical body 128. In one type of embodiment, body 128 is formed from rubber, silicone, or other elastomer or polymer having desired sealing characteristics. Optionally, body 128 includes sealing features 130 in the form of ring-shaped protrusions circumferentially situated along the exterior of the cylindrical wall. Grommet 124, 125 also includes bore 132 passing through the center of body 128. The interior surface of body 128 that defines bore 132 optionally includes sealing features (not shown) for sealing against operational element 134 situated at least partially within bore 132.
  • In one example embodiment, operational element 132 is a valve such as a check valve. In another example embodiment, operational element 132 is a fluid filter. In another embodiment, operational element 132 is a sensor, such as a temperature sensor, flow rate sensor, pressure sensor, gas concentration sensor, material detector, or proximity sensor. In another embodiment, operational element 132 is simply a plug to prevent fluid travel through flow passageway 204.
  • FIG. 4 illustrates an example cover section 150. Cover section 150 includes cover enclosure 170, latch elements 172, 174, cam 176 and outer cover section 178. Cam 176 is connected to latch elements 172, 174 such that rotation of cam 176 actuates latches 172, 174, which causes protrusions 180 to extend through openings 182 located in housing 170 and lock housing 170 to another enclosure section (not shown). Outer cover 178 is assembled over latch elements 172, 174 and cam 176. Cover section 150 also includes access structures 160, 161. Access structure 160 includes inlet opening 152 and flow conduit 157. Access structure 161 includes outlet opening 153 and flow conduit 158. Flow conduits 157 and 158 each have a generally cylindrical wall having a height that extends through the thickness of cover section 150 from the exterior of the wafer container to the interior.
  • Flow conduits 157 and 158 retain operational subassemblies 162 and 163, respectively. FIGS. 5A and 5B illustrate operational subassemblies 162 and 163 in greater detail. Operational subassembly 162 is an inlet subassembly and includes grommet 154 having body 202 and bore 205. Operational subassembly 162 further includes check valve 211 installable into bore 204, and filter 210. Embodiments of filter 210 include particle filters of suitable technology, such as HEPA filtration, or the like. Operational subassembly 163 is an outlet subassembly that includes grommet 155 having body 203 and bore 205. Optionally, operational subassemblies 162, 163 are each pre-assembled with their respective constituent components as operational cartridges.
  • FIG. 5C illustrates the assembly of operational subassembly 162 into flow conduit 157. Filter 210 is retained in place between the bottom of grommet 154 and retaining surface 164 of flow conduit 157. Grommet 154 fits within flow channel 157 and forms a seal with the interior wall of flow channel 157. Check valve 211 fits sealably within flow passageway 204 through grommet 154, and is aligned so that flow is permitted in the downward direction as indicated in FIG. 5C.
  • As described above, openings 152, 153 in cover section 150, or in any other enclosure portion, such as section 120 of a wafer container assembly, can be sealed by the grommets of the present disclosure. In one embodiment, the grommets include a body having a bore located within the housing, the bore extending along the major axis of the housing. Additionally, the embodiments of grommets of the present disclosure can comprise an operation element located with the bore. The operation element can comprise a check valve that can regulate the flow of gas or other fluids through the bore, a filter, a sensor or combinations thereof. The check valves employed in the present disclosure can be oriented within the bore such that the grommets can be used to seal both inlet and outlet openings on wafer carrier doors and/or enclosures. Additionally, as described below, the design of the grommet body can facilitate sealing of the opening without the need for a additional O-rings attached to the grommet. Furthermore, embodiments of grommets of the present disclosure can combine a grommet body, check value and/or filter into an integral cartridge, which can improve the overall sealing ability of the grommets and can facilitate easier construction of wafer carrier assemblies. In some embodiments, the grommets have an axial height from about ⅛ inch to about 1 inch, while in other embodiments the grommets can have an axial height from about ⅜ inch to about ¾ inch. Additionally, embodiments of grommets of the present disclosure can have a diameter from about ¼ inch to about 1.5 inches, while in other embodiments the grommets can have a diameter from about 12 inch to about ¾ inch. One of ordinary skill in the art will recognize that additional ranges of axial height and diameter of the grommets are contemplated and are within the scope of the present disclosure.
  • The grommets can be distinguished from O-rings known in the art in a number of ways. For example the grommet configuration provides an elastomeric element that is generally of a cylindrical configuration with a bore extending therethrough, the bore itself having a cylindrical configuration. The bore being of sufficient length to contain totally or substantially the entire length of an operational component inserted therein. The grommet preferably has at least one planar surface arranged to be normal to the axis of the grommet. Such surface can be utilized to effectively provide a seating surface for a nipple or nozzle as part of a purging system. Volumetrically, the grommet is preferably larger that the operational component container therein. The grommet preferably has a cross sectional area taken in an axial plane whereby the cross sectional area of the grommet is greater that the cross sectional area of the opening extending axially therethrough. The grommet preferably has a axial length that is greater than the diameter of the opening or bore extending axially through the grommet. Whereas an o-ring generally has a circular cross section, the grommet herein has a non circular cross-section and cylindrical inner facing surfaces, cylindrical outer facing surfaces, and planar end surfaces.
  • FIGS. 6A and 6B are cross-sectional views illustrating a gas purging arrangement according to one embodiment of the present disclosure. Example grommets 300 and 302 are situated in respective access structures 304 and 306 of an example wafer container having an interior 308 and exterior 310. Access structures 304, 306 are formed within a wall or door 312 of the wafer container, and each functions as a purging port. Access structure 304 includes a retaining structure 314 that has a geometry specially adapted to sealably engage grommet 300. Likewise, access structure 306 includes a retaining structure 316 that has a geometry adapted to engage with grommet 302. Grommets 300 and 302 each have various sealing features 318, 320 for creating fluid-tight contact with certain interior surfaces of retaining structures 314 and 316, respectively, as indicated.
  • FIG. 6A illustrates an inlet arrangement; whereas FIG. 6B illustrates an outlet arrangement. For each arrangement, the direction of the flow is indicated. The inlet arrangement of FIG. 6A also includes filter 322 situated and fluidly sealed between the contacting surfaces of grommet 300 and retaining structure 314. The inlet arrangement of FIG. 6A also includes a one-way valve assembly 324 positioned to permit fluid travel only in the indicated flow direction. Analogously, the outlet arrangement of FIG. 6B includes a one-way valve assembly 326 positioned to permit fluid travel only in the flow direction indicated. Valve assemblies 324, 326 are fluidly sealed within respective flow passageways 328, 330 defined by the bores of grommets 300, 302. Grommets 300, 302 have retaining features 332, 334 for securely holding valve assemblies 324, 326 in place within respective flow passageways 328, 330. In one type of embodiment, one- way valves 324, 326 comprise valve bodies 336 and 338, outer seal rings 340 and 342, inner seal rings 344 and 346, moveable pistons 348 and 350, and biasing springs 352 and 354.
  • In operation, the inlet and outlet arrangements can function in concert during a purging activity in which existing air or gas within the interior 308 of the wafer container is displaced by newly introduced air, gas, or other fluid. In one embodiment, as illustrated in FIG. 6B a vacuum source 360 is coupled to the interior volume 308 by a outlet nozzle 362. Outlet nozzle is adapted to interface with a contact surface 364 of grommet 302. When downward force is exerted by the outlet nozzle into grommet 302, grommet 302 compresses, but maintains its seal against the sealing inner surfaces of retaining structure 316 and against the outer surface of valve assembly 326. In one embodiment, the seals between grommet 302 and retaining structure 316 and valve assembly 326 are actually improved or made more effective by the downward force applied onto grommet 302 by outlet nozzle 362.
  • As the vacuum 360 is coupled with the interior volume 308, existing fluid in volume 308 is drawn out of the wafer container through the outlet of FIG. 6B, while replacement fluid is drawn in through the inlet of FIG. 6A, including through filter 322. In a related embodiment (not shown), a replacement fluid source (not shown) is coupled with interior volume 308 via an inlet nozzle having similar geometry with outlet nozzle 362 and coupled with inlet grommet 300 in the same manner in which outlet nozzle 362 is coupled with outlet grommet 302. In another embodiment (not shown), no outlet nozzle is coupled with grommet 302, and the inlet nozzle carries pressurized replacement fluid into the interior volume 308. In this embodiment, the displaced fluid simply exists through the outlet arrangement of FIG. 6B Generally, grommets 300, 302 can have the same cross-section shape as the opening in which the grommet is designed to seal. For example, in one embodiment, grommets 300, 302 have a generally cylindrical shape with a generally circular cross-section. However, one of ordinary skill in the art will recognize a variety of grommet body geometries are within the spirit of the present disclosure.
  • In one embodiment, grommets 300 and 302 are identical parts. In a related embodiment, valve assemblies 324 and 326 are identical parts. Thus, in one type of embodiment, the components of the present disclosure can be used to seal both inlet and outlet openings using the same component elements.
  • In another embodiment, grommets of the present disclosure can further include additional retaining features (not shown) for securely holding a filter such as filter 322 in the same or similar manner in which retaining features 332, 334 retain valve assemblies 324, 326. Thus, a pre-assembled operational subassembly can incorporate a grommet, a valve and a filter into a integral subassembly.
  • The grommet body, flanges and other components of the grommets of the present disclosure can be composed of any material suitable for use in semi-conductor processing applications including polymers and elasotmers. In some embodiments, the grommet body and flanges can be composed of a fluoroelastomer. Examples of fluoroelastomers are sold under the trade name Viton® by Dupont Dow Elastomers. Additionally, in some embodiments, the elastomeric grommet body or grommet can have a fluoropolymer, or other inert polymer, coated onto to the surface of the grommet to isolate the elatomeric substance from the interior of the substrate container. Generally, the polymer or fluoropolymer coating should have some flexibility such that the sealing characteristics of the elastomeric grommet body are maintained.
  • The embodiments above are intended to be illustrative and not limiting. Additional embodiments are within the claims. Although the present invention has been described with reference to particular embodiments, workers skilled in the art will recognize that changes may be made in form and substance without departing from the spirit and scope of the invention.

Claims (9)

1. A substrate container, comprising an enclosure portion with an open side or bottom, a door to sealing close the open side or bottom; one of the door and the container portion having a purging port comprising a first access structure formed in the enclosure and providing fluid access through the enclosure to an interior of the substrate container, wherein the access structure includes an opening passing from interior the container to exterior the container, and wherein the access structure has a cylindrical inwardly facing surface; and a first elastomeric grommet having a generally cylindrical body, an inner facing cylindrical surface, and an outer facing cylindrical surface, the body sealingly engaged with the cylindrical inwardly facing surface of the access structure.
2. A method of purging a substrate container comprising the steps of:
selecting a substrate container comprising:
a grommet having a bore with an interior surface, the grommet being formed of an elastomeric material, the bore defining a fluid flow passage,
an operational element situated at least partially within the bore and in sealing engagement with the elastomeric material on the interior surface of the bore,
the grommet having an elastomeric material exteriorly exposed with respect to the substrate container, the elastomeric material providing a seating surface,
contacting the seating surface of the elastomeric material with a purging nozzle,
compressing the elastomeric material with force from the nozzle thereby sealingly interfacing the grommet with a purging source, and
injecting a purging gas into the substrate container.
3. The method of claim 2 wherein the substrate container has a door and grommet positioned with its face oriented downwardly, and further comprising the step of engaging the grommet from below the substrate container with the nozzle.
4. The method of claim 2 further comprising the step of engaging the nozzle with a planar surface of the grommet that is normal to an axis of the grommet.
5. The method of claim 2 wherein the contact of the nozzle is positioned around and radially spaced from the bore of the grommet.
6. A method of purging a substrate container comprising the steps of:
selecting a substrate container comprising an openable container having a door, a grommet formed of an elastomeric material having, an axis, a face and an opening extending therethrough, the grommet providing a flow passageway from exterior the container to interior the container, with
the face of the grommet having a planar surface substantially normal to the axis and surrounding a flow passageway,
coupling the face of the grommet to a purging gas source;
axially compressing the elastomeric material of the grommet with a force from the nozzle on the planar surface of the grommet thereby effecting a seal between the grommet and the nozzle radially outside of the flow passageway, and
displacing at least a portion of the interior gas with a gas from the purging gas source.
7. The method of claim 6 wherein the displacing of the interior gas is accomplished by drawing the interior gas out of the substrate container with a vacuum.
8. The method of claim 6 wherein the contact of the nozzle is positioned around and radially spaced from the bore of the grommet.
9. The method of claim 6 further comprising the step of engaging the nozzle with a planar surface of the grommet that is normal to an axis of the grommet.
US14/281,222 2004-04-18 2014-05-19 Substrate container with fluid-sealing flow passageway Abandoned US20150041359A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/281,222 US20150041359A1 (en) 2004-04-18 2014-05-19 Substrate container with fluid-sealing flow passageway

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US56352804P 2004-04-18 2004-04-18
US11/108,619 US7328727B2 (en) 2004-04-18 2005-04-17 Substrate container with fluid-sealing flow passageway
US12/026,336 US8727125B2 (en) 2004-04-18 2008-02-05 Substrate container with fluid-sealing flow passageway
US14/281,222 US20150041359A1 (en) 2004-04-18 2014-05-19 Substrate container with fluid-sealing flow passageway

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US12/026,336 Continuation US8727125B2 (en) 2004-04-18 2008-02-05 Substrate container with fluid-sealing flow passageway

Publications (1)

Publication Number Publication Date
US20150041359A1 true US20150041359A1 (en) 2015-02-12

Family

ID=35197529

Family Applications (3)

Application Number Title Priority Date Filing Date
US11/108,619 Active US7328727B2 (en) 2004-04-18 2005-04-17 Substrate container with fluid-sealing flow passageway
US12/026,336 Active 2026-03-08 US8727125B2 (en) 2004-04-18 2008-02-05 Substrate container with fluid-sealing flow passageway
US14/281,222 Abandoned US20150041359A1 (en) 2004-04-18 2014-05-19 Substrate container with fluid-sealing flow passageway

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US11/108,619 Active US7328727B2 (en) 2004-04-18 2005-04-17 Substrate container with fluid-sealing flow passageway
US12/026,336 Active 2026-03-08 US8727125B2 (en) 2004-04-18 2008-02-05 Substrate container with fluid-sealing flow passageway

Country Status (6)

Country Link
US (3) US7328727B2 (en)
EP (1) EP1737763A2 (en)
JP (2) JP5213440B2 (en)
KR (1) KR101213311B1 (en)
CN (1) CN101683650B (en)
WO (1) WO2005102872A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016160636A1 (en) * 2015-03-27 2016-10-06 Entegris, Inc. Bottom opening pod with magnetically coupled cassettes
WO2016190982A1 (en) * 2015-05-22 2016-12-01 Applied Materials, Inc Substrate carrier door assemblies, substrate carriers, and methods including magnetic door seal

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080260498A1 (en) * 2004-04-07 2008-10-23 Tatsuhiko Nagata Atmosphere Purge-Port Connecting Device for Wafer Storage Container
US7328727B2 (en) * 2004-04-18 2008-02-12 Entegris, Inc. Substrate container with fluid-sealing flow passageway
US20060065571A1 (en) * 2004-09-27 2006-03-30 Tim Hsiao Wafer shipping box and wafer transportation method
JP4597708B2 (en) * 2005-02-25 2010-12-15 平田機工株式会社 FOUP opener
JP4827500B2 (en) * 2005-11-16 2011-11-30 信越ポリマー株式会社 Package
TWI298185B (en) * 2006-01-25 2008-06-21 Promos Technologies Inc Wafer-transferring pod capable of monitoring process environment
CN101506087B (en) * 2006-06-19 2011-09-21 诚实公司 System for purging reticle storage
CN101663423B (en) 2007-02-28 2012-03-28 恩特格里公司 Purge system for a substrate container
US20080283538A1 (en) * 2007-05-14 2008-11-20 Rowen Christopher G Insulated retainer having thermometer for beverage container
TWM331514U (en) * 2007-11-15 2008-05-01 Gudeng Prec Industral Co Ltd Storage apparatus for storing semiconductor element or reticle
EP2272088B1 (en) 2008-03-13 2016-12-07 Entegris, Inc. Wafer container with tubular environmental control components
US20100051501A1 (en) * 2008-08-29 2010-03-04 International Business Machines Corporation Ic waper carrier sealed from ambient atmosphere during transportation from one process to the next
US8235218B2 (en) 2008-10-01 2012-08-07 Gudeng Precision Industrial Co., Ltd. Sealing apparatus with interlocking air inflation device for wafer carrier
US20100078894A1 (en) * 2008-10-01 2010-04-01 Gudeng Precision Industrial Co., Ltd. Sealing apparatus of wafer carrier and sealing method thereof
US8899443B2 (en) * 2008-12-15 2014-12-02 Wki Holding Company, Inc. Container assembly with flexible seal
TWI346638B (en) * 2008-12-26 2011-08-11 Gudeng Prec Industral Co Ltd A purging valve and a wafer container having the purging valve
TWI386575B (en) * 2009-01-20 2013-02-21 Gudeng Prec Industral Co Ltd A purging valve and a wafer container having the purging valve
TWI363030B (en) * 2009-07-10 2012-05-01 Gudeng Prec Industral Co Ltd Wafer container with top flange structure
JP2011187539A (en) * 2010-03-05 2011-09-22 Sinfonia Technology Co Ltd Gas charging apparatus, gas discharging apparatus, gas charging method, and gas discharging method
EP2705528A4 (en) 2011-05-03 2014-11-26 Entegris Inc Wafer container with particle shield
EP2742526A4 (en) 2011-08-12 2015-01-14 Entegris Inc Wafer carrier
US20140041755A1 (en) * 2012-08-09 2014-02-13 Santa Phoenix Technology Inc. Wafer pod gas charging apparatus
US9412632B2 (en) * 2012-10-25 2016-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. Reticle pod
KR102166754B1 (en) * 2012-11-20 2020-10-16 엔테그리스, 아이엔씨. Substrate container with purge ports
CN102974581A (en) * 2012-12-12 2013-03-20 天津中环领先材料技术有限公司 Process for cleaning wafer box holding monocrystalline silicon polishing wafer
JP5960078B2 (en) * 2013-02-20 2016-08-02 信越ポリマー株式会社 Substrate storage container
EP2966678B1 (en) * 2013-03-05 2017-08-16 Murata Machinery, Ltd. Measurement unit and purge gas flow rate measuring method
US9117863B1 (en) * 2013-05-16 2015-08-25 Seagate Technology Llc Cassette configurations to support platters having different diameters
JP6106271B2 (en) * 2013-06-03 2017-03-29 ミライアル株式会社 Substrate storage container
JP5888288B2 (en) * 2013-06-26 2016-03-16 株式会社ダイフク Inspection equipment for goods storage facilities
US10566226B2 (en) * 2014-11-11 2020-02-18 Applied Materials, Inc. Multi-cassette carrying case
JP6450156B2 (en) * 2014-11-12 2019-01-09 ミライアル株式会社 Gas purge filter
WO2016089912A1 (en) * 2014-12-01 2016-06-09 Entegris, Inc. Substrate container valve assemblies
JP6455261B2 (en) * 2015-03-20 2019-01-23 シンフォニアテクノロジー株式会社 Nozzle tip structure, purge device and load port
US20180174874A1 (en) * 2015-06-15 2018-06-21 Entegris, Inc. Wafer carrier having a door with a unitary body
JP2018526824A (en) * 2015-08-25 2018-09-13 インテグリス・インコーポレーテッド Modular board support pillar interlock
JP6561700B2 (en) * 2015-09-04 2019-08-21 シンフォニアテクノロジー株式会社 Gas injection equipment
JP6590728B2 (en) * 2016-02-18 2019-10-16 信越ポリマー株式会社 Substrate storage container valve
US10388554B2 (en) * 2016-04-06 2019-08-20 Entegris, Inc. Wafer shipper with purge capability
JP2017188609A (en) * 2016-04-08 2017-10-12 インテグリス・インコーポレーテッド Wafer shipper microenvironment including purge performance
KR200492425Y1 (en) * 2016-04-08 2020-10-13 엔테그리스, 아이엔씨. Wafer shipper microenvironment with purge capability
JP6855774B2 (en) * 2016-12-13 2021-04-07 Tdk株式会社 Wafer transfer container atmosphere measuring device, wafer transfer container, wafer transfer container internal cleaning device, and wafer transfer container internal cleaning method
US11646214B2 (en) * 2017-03-27 2023-05-09 Shin-Etsu Polymer Co., Ltd. Substrate storage container
JP7132488B2 (en) * 2017-04-28 2022-09-07 シンフォニアテクノロジー株式会社 Gas supply device, gas supply device control method, load port, and semiconductor manufacturing equipment
US11139188B2 (en) * 2017-04-28 2021-10-05 Sinfonia Technology Co., Ltd. Gas supply device, method for controlling gas supply device, load port, and semiconductor manufacturing apparatus
SG11201913051UA (en) * 2017-07-14 2020-01-30 Shin Etsu Polymer Co Ltd Substrate storage container
TWI763002B (en) * 2018-01-11 2022-05-01 家登精密工業股份有限公司 Quick release valve, substrate container using the same and method for loading/unloading the same
JP7147116B2 (en) * 2018-03-28 2022-10-05 信越ポリマー株式会社 Substrate storage container
JP7110663B2 (en) * 2018-03-28 2022-08-02 Tdk株式会社 WAFER CONTAINER AND WAFER CONTAINER CLEANING METHOD
WO2019226143A1 (en) * 2018-05-21 2019-11-28 Hewlett-Packard Development Company, L.P. Print substance donor containers
JP7234527B2 (en) * 2018-07-30 2023-03-08 Tdk株式会社 Filter structure with built-in sensor and wafer storage container
SG11202100743XA (en) 2018-08-28 2021-02-25 Entegris Inc Membrane diffuser for a substrate container
WO2020065968A1 (en) 2018-09-28 2020-04-02 ミライアル株式会社 Substrate accommodation container
KR102150670B1 (en) * 2018-11-01 2020-09-01 세메스 주식회사 Stocker
JP7247440B2 (en) * 2018-11-29 2023-03-29 信越ポリマー株式会社 Substrate storage container
KR102012389B1 (en) * 2019-04-03 2019-08-20 (주)에이이 Purge nozzle module for load port
KR20210147093A (en) 2019-04-26 2021-12-06 엔테그리스, 아이엔씨. Purge connections and modules for substrate containers
US11104496B2 (en) * 2019-08-16 2021-08-31 Gudeng Precision Industrial Co., Ltd. Non-sealed reticle storage device
US11656130B2 (en) * 2019-12-09 2023-05-23 Kidde Technologies, Inc. Wire mesh grommet for fire and overheat detection system
KR102242026B1 (en) * 2020-06-29 2021-04-19 피엠씨글로벌 주식회사 Photomask case in which nitrogen gas is injected into the interior space

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5628121A (en) * 1995-12-01 1997-05-13 Convey, Inc. Method and apparatus for maintaining sensitive articles in a contaminant-free environment
US5988233A (en) * 1998-03-27 1999-11-23 Asyst Technologies, Inc. Evacuation-driven SMIF pod purge system
US6042651A (en) * 1996-09-13 2000-03-28 Semifab Incorporated Molecular contamination control system
US20040237244A1 (en) * 2003-05-26 2004-12-02 Tdk Corporation Purge system for product container and interface seal used in the system
US6880598B2 (en) * 2002-09-06 2005-04-19 Eaton Corporation Check valve for tire inflation system
US20050247594A1 (en) * 2002-09-11 2005-11-10 Shin-Etsu Polymer Co., Ltd. Substrate-storing container
US20050252827A1 (en) * 2004-04-18 2005-11-17 Tieben Anthony M Substrate container with fluid-sealing flow passageway
US20060266011A1 (en) * 2005-04-04 2006-11-30 Halbmaier David L Environmental control in a reticle SMIF pod
US20080204680A1 (en) * 2007-02-28 2008-08-28 Entegris, Inc. Purge system for a substrate container
US7455180B2 (en) * 2002-10-25 2008-11-25 Shin-Etsu Polymer Co., Ltd. Substrate storage container
US20110114129A1 (en) * 2007-12-18 2011-05-19 Entegris, Inc. Methods and apparatuses for controlling contamination of substrates
US20110114534A1 (en) * 2008-03-13 2011-05-19 Entegris, Inc. Wafer container with tubular environmental control components
US7950524B2 (en) * 2008-12-26 2011-05-31 Gudeng Precision Industrial Co., Ltd Wafer container having the purging valve
US20120297981A1 (en) * 2009-12-10 2012-11-29 Entegris, Inc. Porous barrier for evenly distributed purge gas in a microenvironment
US20120309286A1 (en) * 2011-05-31 2012-12-06 Sinfonia Technology Co., Ltd. Purge apparatus and load port
US8596312B2 (en) * 2010-03-05 2013-12-03 Sinfonia Technology Co., Ltd. Gas charging apparatus, gas discharging apparatus, gas charging method, and gas discharging method
US20130326841A1 (en) * 2012-06-11 2013-12-12 Sinfonia Technology Co., Ltd. Purge nozzle unit, purge apparatus and load port
US20150000789A1 (en) * 2013-06-26 2015-01-01 Daifuku Co., Ltd. Processing Facility
US20150294889A1 (en) * 2012-11-20 2015-10-15 Entegris, Inc. Substrate container with purge ports

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668484A (en) * 1984-02-13 1987-05-26 Elliott David J Transport containers for semiconductor wafers
US4815912A (en) * 1984-12-24 1989-03-28 Asyst Technologies, Inc. Box door actuated retainer
US4666479A (en) * 1985-07-18 1987-05-19 Tensho Electric Industrial Co., Ltd. Semiconductor wafer container
US4724874A (en) * 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
DE3789058T2 (en) 1987-10-28 1994-07-07 Asyst Technologies Sealable portable container with a system for filtering particles.
US4995430A (en) * 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
US5217053A (en) * 1990-02-05 1993-06-08 Texas Instruments Incorporated Vented vacuum semiconductor wafer cassette
US5137063A (en) * 1990-02-05 1992-08-11 Texas Instruments Incorporated Vented vacuum semiconductor wafer cassette
US5303482A (en) * 1991-01-29 1994-04-19 Shinko Electric Co., Ltd. Wafer airtight keeping unit and keeping facility thereof
US5255783A (en) * 1991-12-20 1993-10-26 Fluoroware, Inc. Evacuated wafer container
US5346518A (en) 1993-03-23 1994-09-13 International Business Machines Corporation Vapor drain system
US5346519A (en) * 1993-04-27 1994-09-13 Pneumafil Corporation Filter media construction
US5363276A (en) * 1993-09-01 1994-11-08 Ncr Corporation Apparatus for containing and supporting electronic components
US5482161A (en) * 1994-05-24 1996-01-09 Fluoroware, Inc. Mechanical interface wafer container
US5518115A (en) * 1994-09-22 1996-05-21 Poly Vac Incorporated Sterilization and storage container tray including grommets
US5873468A (en) * 1995-11-16 1999-02-23 Sumitomo Sitix Corporation Thin-plate supporting container with filter means
US6003674A (en) * 1996-05-13 1999-12-21 Brooks; Ray Gene Method and apparatus for packing contaminant-sensitive articles and resulting package
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
US6010008A (en) * 1997-07-11 2000-01-04 Fluoroware, Inc. Transport module
JP3167970B2 (en) * 1997-10-13 2001-05-21 ティーディーケイ株式会社 Clean box, clean transfer method and device
US6164664A (en) * 1998-03-27 2000-12-26 Asyst Technologies, Inc. Kinematic coupling compatible passive interface seal
US6428729B1 (en) * 1998-05-28 2002-08-06 Entegris, Inc. Composite substrate carrier
US6187182B1 (en) * 1998-07-31 2001-02-13 Semifab Incorporated Filter cartridge assembly for a gas purging system
US6056026A (en) * 1998-12-01 2000-05-02 Asyst Technologies, Inc. Passively activated valve for carrier purging
US6354601B1 (en) * 1999-01-06 2002-03-12 Fluoroware, Inc. Seal for wafer containers
US6997664B1 (en) * 2000-07-19 2006-02-14 Industrial Technology Research Institute Apparatus for loading/unloading wafers to and from semiconductor fabrication equipment
TW511650U (en) * 2001-09-12 2002-11-21 Ind Tech Res Inst Ventilator device for cleaning container

Patent Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5628121A (en) * 1995-12-01 1997-05-13 Convey, Inc. Method and apparatus for maintaining sensitive articles in a contaminant-free environment
US6042651A (en) * 1996-09-13 2000-03-28 Semifab Incorporated Molecular contamination control system
US5988233A (en) * 1998-03-27 1999-11-23 Asyst Technologies, Inc. Evacuation-driven SMIF pod purge system
US6880598B2 (en) * 2002-09-06 2005-04-19 Eaton Corporation Check valve for tire inflation system
US20050247594A1 (en) * 2002-09-11 2005-11-10 Shin-Etsu Polymer Co., Ltd. Substrate-storing container
US7455180B2 (en) * 2002-10-25 2008-11-25 Shin-Etsu Polymer Co., Ltd. Substrate storage container
US20040237244A1 (en) * 2003-05-26 2004-12-02 Tdk Corporation Purge system for product container and interface seal used in the system
US20050252827A1 (en) * 2004-04-18 2005-11-17 Tieben Anthony M Substrate container with fluid-sealing flow passageway
US7328727B2 (en) * 2004-04-18 2008-02-12 Entegris, Inc. Substrate container with fluid-sealing flow passageway
US20080121560A1 (en) * 2004-04-18 2008-05-29 Entegris, Inc. Substrate container with fluid-sealing flow passageway
US8727125B2 (en) * 2004-04-18 2014-05-20 Entegris, Inc. Substrate container with fluid-sealing flow passageway
US20060266011A1 (en) * 2005-04-04 2006-11-30 Halbmaier David L Environmental control in a reticle SMIF pod
US7400383B2 (en) * 2005-04-04 2008-07-15 Entegris, Inc. Environmental control in a reticle SMIF pod
US8146623B2 (en) * 2007-02-28 2012-04-03 Entegris, Inc. Purge system for a substrate container
US20080204680A1 (en) * 2007-02-28 2008-08-28 Entegris, Inc. Purge system for a substrate container
US20110114129A1 (en) * 2007-12-18 2011-05-19 Entegris, Inc. Methods and apparatuses for controlling contamination of substrates
US20150041360A1 (en) * 2008-03-13 2015-02-12 Entegris, Inc. Wafer container with tubular environmental control components
US8783463B2 (en) * 2008-03-13 2014-07-22 Entegris, Inc. Wafer container with tubular environmental control components
US20110114534A1 (en) * 2008-03-13 2011-05-19 Entegris, Inc. Wafer container with tubular environmental control components
US7950524B2 (en) * 2008-12-26 2011-05-31 Gudeng Precision Industrial Co., Ltd Wafer container having the purging valve
US20120297981A1 (en) * 2009-12-10 2012-11-29 Entegris, Inc. Porous barrier for evenly distributed purge gas in a microenvironment
US9054144B2 (en) * 2009-12-10 2015-06-09 Entegris, Inc. Porous barrier for evenly distributed purge gas in a microenvironment
US20150348810A1 (en) * 2009-12-10 2015-12-03 Entegris, Inc. Porous barrier for evenly distributed purge gas in a microenvironment
US8596312B2 (en) * 2010-03-05 2013-12-03 Sinfonia Technology Co., Ltd. Gas charging apparatus, gas discharging apparatus, gas charging method, and gas discharging method
US20120309286A1 (en) * 2011-05-31 2012-12-06 Sinfonia Technology Co., Ltd. Purge apparatus and load port
US20130326841A1 (en) * 2012-06-11 2013-12-12 Sinfonia Technology Co., Ltd. Purge nozzle unit, purge apparatus and load port
US9174253B2 (en) * 2012-06-11 2015-11-03 Sinfonia Technology Co., Ltd. Purge nozzle unit, purge apparatus and load port
US20150294889A1 (en) * 2012-11-20 2015-10-15 Entegris, Inc. Substrate container with purge ports
US20150000789A1 (en) * 2013-06-26 2015-01-01 Daifuku Co., Ltd. Processing Facility

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016160636A1 (en) * 2015-03-27 2016-10-06 Entegris, Inc. Bottom opening pod with magnetically coupled cassettes
US10850279B2 (en) 2015-03-27 2020-12-01 Entegris, Inc. Bottom opening pod with magnetically coupled casssettes
WO2016190982A1 (en) * 2015-05-22 2016-12-01 Applied Materials, Inc Substrate carrier door assemblies, substrate carriers, and methods including magnetic door seal
US10196845B2 (en) 2015-05-22 2019-02-05 Applied Materials, Inc. Substrate carrier door assemblies, substrate carriers, and methods including magnetic door seal

Also Published As

Publication number Publication date
KR101213311B1 (en) 2012-12-17
CN101683650A (en) 2010-03-31
EP1737763A2 (en) 2007-01-03
US20080121560A1 (en) 2008-05-29
JP5213440B2 (en) 2013-06-19
CN101683650B (en) 2011-12-21
US7328727B2 (en) 2008-02-12
JP2007533166A (en) 2007-11-15
WO2005102872A2 (en) 2005-11-03
WO2005102872A3 (en) 2006-12-21
KR20070007936A (en) 2007-01-16
US20050252827A1 (en) 2005-11-17
US8727125B2 (en) 2014-05-20
JP5301589B2 (en) 2013-09-25
JP2011181930A (en) 2011-09-15

Similar Documents

Publication Publication Date Title
US7328727B2 (en) Substrate container with fluid-sealing flow passageway
US11869787B2 (en) Substrate container valve assemblies
US10388554B2 (en) Wafer shipper with purge capability
US6187182B1 (en) Filter cartridge assembly for a gas purging system
US5611452A (en) Sealable transportable container having improved liner
EP1555689B1 (en) Substrate storage container
USRE39241E1 (en) Modular SMIF pod breather, adsorbent, and purge cartridges
JP4201583B2 (en) Substrate storage container
TWI423451B (en) Substrate container with fluid-sealing flow passageway
TWM532450U (en) Wafer shipper
JP2017188609A (en) Wafer shipper microenvironment including purge performance
KR200492425Y1 (en) Wafer shipper microenvironment with purge capability

Legal Events

Date Code Title Description
AS Assignment

Owner name: ENTEGRIS, INC., MASSACHUSETTS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TIEBEN, ANTHONY M.;LYSTAD, JOHN;HALBMAIER, DAVID L.;SIGNING DATES FROM 20050715 TO 20050718;REEL/FRAME:033207/0203

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO PAY ISSUE FEE