US20150159970A1 - Thermal transfer catalytic heat dissipation method - Google Patents

Thermal transfer catalytic heat dissipation method Download PDF

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Publication number
US20150159970A1
US20150159970A1 US14/288,731 US201414288731A US2015159970A1 US 20150159970 A1 US20150159970 A1 US 20150159970A1 US 201414288731 A US201414288731 A US 201414288731A US 2015159970 A1 US2015159970 A1 US 2015159970A1
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United States
Prior art keywords
thermal transfer
heat dissipation
transfer interface
heat
thermal
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Abandoned
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US14/288,731
Inventor
Hung-Chih Lu
Chung-Pin Yang
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TCY-TEC Corp
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TCY-TEC Corp
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Assigned to TCY-TEC CORPORATION reassignment TCY-TEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LU, HUNG-CHIH, YANG, CHUNG-PIN
Publication of US20150159970A1 publication Critical patent/US20150159970A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives

Definitions

  • the present invention is related to a thermal transfer catalytic heat dissipation method, and particularly to a thermal transfer catalytic heat dissipation method where a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film is used dissipate a heat source when a carrier absorbs the heat source, so that the heat source is directed effectively to the ambient through the film, avoiding a thermal transfer drop with respect to the air, and achieving in that a thermal transfer effectiveness is promoted, a thermal transfer bottleneck Is effectively reduced, heat dissipation fins are saved, a heat dissipation cost is largely reduced, a volume and weight is reduced, a consumption of the raw material is reduced and a purpose of energy saving and carbon reduction is achieved.
  • a heat dissipation glue or high thermal transfer layer is disposed between a heat dissipation body and a heat source, and heat dissipation fins are further disposed on the heat dissipation body, so that the heat dissipation body is used to dissipate a heat.
  • the glue has a relatively smaller thermal transfer coefficient
  • a high heat dissipation insulating layer having a relatively larger thermal transfer coefficient, is used in replace of the glue.
  • the bottleneck and barrier of the thermal transfer does not occur on an interface between the heat source and the heat dissipation body, but on the contact between the heat dissipation body and the air.
  • the high thermal transfer layer disposed between the heat dissipation body and the air in the prior art heat dissipation mechanism is helpful for promotion of thermal transfer, it only has a limited result because the thermal transfer bottleneck and barrier are not solved. Therefore, the heat dissipation issue still has to be improved.
  • the heat dissipation fins may also increase the heat dissipation cost, increase the volume and weight of the apparatus, and waste the raw material, except for the above mentioned disadvantage.
  • the inventor of the present invention provides a thermal transfer catalytic heat dissipation method, after many efforts and researches to overcome the shortcoming encountered in the prior art.
  • It is a main object of the present invention to provide a thermal transfercatalytic heat dissipation method comprises steps of disposing a thermal transfer interface on a heat source; and disposing a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film on at least a face of the thermal transfer interface, so that the hexagonal carbon ringed nanometer heat dissipation film dissipates the heat source after the thermal transfer interface absorbs the heat source, whereby effectively guides the heat into the air, so as to avoid a thermal transfer drop with respect to the air, and achieve in that a thermal transfer effectiveness is promoted, a thermal transfer bottleneck is effectively reduced, heat dissipation fins are saved, a heat dissipation cost is largely reduced, a volume and weight is reduced, a consumption of the raw material is reduced and a purpose of energy saving and carbon reduction is achieved.
  • the thermal transfercatalytic heat dissipation method comprises disposing a thermal transfer interface on a heat source; and disposing a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film on at least a face of the thermal transfer interface, so that the hexagonal carbon ringed nanometer heat dissipation film dissipates the heat source after the thermal transfer interface absorbs the heat source.
  • the thermal transfer interface is combined with the heat source at a surface thereof, and the hexagonal carbon nanoparticles heat dissipation film is combined with the other face of the thermal transfer interface.
  • the thermal transfer interface is combined with the heat source through a glue.
  • the thermal transfer interface is combined with the heat source through a high heat dissipation insulating layer.
  • the thermal transfer interface comprises a heat dissipation assembly, a fan, and a water cooler heat dissipation element.
  • another hexagonal carbon nanoparticles heat dissipation film is further disposed between the heat source and the thermal transfer interface.
  • FIG. 1 is a cross sectional state schematic diagram of the first embodiment according to the present invention.
  • FIG. 2 is a schematic diagram of a thermal transfer state of a first embodiment according to the present invention.
  • FIG. 3 is a schematic diagram of a cross sectional state of a second embodiment according to the present invention.
  • FIG. 4 is a cross sectional state schematic diagram of a third embodiment according to the present invention.
  • FIG. 5 is a flowchart of a thermal transfercatalytic heat dissipation method according to the present invention.
  • FIG. 1 and FIG. 2 in which a schematic diagram of a cross sectional state of a first embodiment according to the present invention, and a schematic diagram of a thermal transfer state of the first embodiment according to the present invention is shown, respectively.
  • a thermal transfer interface 2 is disposed on a heat source 1 .
  • a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film 3 is disposed.
  • the hexagonal carbon nanoparticles heat dissipation film 3 is used to dissipate a heat.
  • the thermal transfer interface 2 is combined with the heat source 1 at a surface thereof.
  • the hexagonal carbon nanoparticles heat dissipation film 3 is combined on the other face of the thermal transfer interface 2 , i.e. the face of the thermal interface 2 contacting with the air.
  • the thermal transfer interface 2 may be but not limited only to a heat dissipation assembly, a fan and a water cooler heat dissipation element.
  • the thermal transfer interface 2 is combined with the heat source 1 through a glue 21 .
  • a heat is produced from the heat source 1 and transferred outwards, in which the heat source 1 may be but not only limited to a central processing unit, a graphic chip, LED chip, a solar energy chip, and an engine combust.
  • the heat from the heat source 1 is absorbed by the thermal transfer interface 2 , and dissipated by the hexagonal carbon ringed carbon heat dissipation film 3 . Since when the heat from the heat source 1 transfers outwards, an in-glue thermal transfer path 211 of the glue 21 has a relatively lower thermal transfer coefficient and thus a relatively lowered thermal transfer efficiency.
  • an in-thermal transfer path 212 of the thermal transfer interface 2 has a relatively higher thermal transfer efficiency.
  • the hexagonal carbon nanoparticles heat dissipation film 3 of the present invention may overcome effectively the bottleneck or barrier of the thermal transfer between the thermal transfer interface 2 and the air, i.e. the in-heat dissipation film 213 is effectively used to guide the thermal transfer, and the thermal transfer is guided to the air with the aid of the thermal transfer interface 2 , whereby effectively promoting the thermal transfer effect.
  • the reinforced in-air thermal transfer path 214 approaches the thermal efficiency of the thermal transfer interface 2 . Therefore, this heat dissipation policy does not require heat dissipation fins and thus the heat dissipation cost may be largely reduced. Furthermore, the volume and weight of the structure may be reduced, and a consumption of the raw material is reduced and a purpose of energy saving and carbon reduction is achieved.
  • FIG. 3 a schematic diagram of a thermal transfer state of a second embodiment according to the present invention is shown.
  • the present invention may further have the structure of the second embodiment, and the difference between the second and the first embodiments is that a high heat dissipation insulating layer 4 is combined between the thermal transfer interface 2 and the heat source 1 .
  • the heat generated from the heat source 1 is transferred to the thermal transfer interface 2 through the high heat dissipation insulating layer 4 .
  • a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film 3 is used together to dissipate the heat, whereby achieving in the efficacy of promoting the thermal transfer efficiency and effectively reducing thermal transfer bottleneck, similarly.
  • a thermal transfercatalytic heat dissipation method comprises the following steps: disposing a thermal transfer interface on a heat source ( 51 ) and disposing a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film on at least a face of the thermal transfer interface ( 52 ), so that the hexagonal carbon ringed nanometer heat dissipation film dissipates the heat source after the thermal transfer interface absorbs the heat source.
  • the heat generated from the heat source 1 is transferred to the thermal transfer interface 2 through the first hexagonal carbon nanoparticles heat dissipation film 3 a.
  • a second hexagonal carbon nanoparticles heat dissipation film 3 is used together to dissipate the heat, whereby achieving in the efficacy of promoting the thermal transfer efficiency and effectively reducing thermal transfer bottleneck, similarly.
  • the present invention may further satisfy a requirement for a real use.
  • the thermal transfer catalytic heat dissipation method is disclosed to overcome the shortcomings existing in the prior art.

Abstract

A thermal transfercatalytic heat dissipation method is disclosed, comprises steps of disposing a thermal transfer interface on a heat source; and disposing a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film on at least a face of the thermal transfer interface, so that the hexagonal carbon ringed nanometer heat dissipation film dissipates the heat source after the thermal transfer interface absorbs the heat source, so that the heat is directed effectively to the ambient through the film, avoiding a thermal transfer drop between the thermal transfer interface and the air, and achieving in that a thermal transfer effectiveness is promoted, a thermal transfer bottleneck is effectively reduced, heat dissipation fins are saved, a heat dissipation cost is largely reduced, a volume and weight is reduced, a consumption of the raw material is reduced and a purpose of energy saving and carbon reduction is achieved.

Description

    FIELD OF THE INVENTION
  • The present invention is related to a thermal transfer catalytic heat dissipation method, and particularly to a thermal transfer catalytic heat dissipation method where a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film is used dissipate a heat source when a carrier absorbs the heat source, so that the heat source is directed effectively to the ambient through the film, avoiding a thermal transfer drop with respect to the air, and achieving in that a thermal transfer effectiveness is promoted, a thermal transfer bottleneck Is effectively reduced, heat dissipation fins are saved, a heat dissipation cost is largely reduced, a volume and weight is reduced, a consumption of the raw material is reduced and a purpose of energy saving and carbon reduction is achieved.
    • DESCRIPTION OF THE RELATED ART
  • In a conventional heat dissipation mechanism, a heat dissipation glue or high thermal transfer layer is disposed between a heat dissipation body and a heat source, and heat dissipation fins are further disposed on the heat dissipation body, so that the heat dissipation body is used to dissipate a heat.
  • As far as the conventional heat dissipation mechanism is concerned, since the glue has a relatively smaller thermal transfer coefficient, a high heat dissipation insulating layer, having a relatively larger thermal transfer coefficient, is used in replace of the glue. However, the bottleneck and barrier of the thermal transfer does not occur on an interface between the heat source and the heat dissipation body, but on the contact between the heat dissipation body and the air.
  • Since there is a very huge thermal transfer drop at the interface between the heat dissipation body and the air, i.e. the heat dissipation body has a large thermal transfer while the air has a small thermal transfer, a thermal backflow is generated along a thermal transfer path in the heat dissipation fins when the heat is transferred to between the heat dissipation body and the air through the heat transfer path in the heat dissipation fins, although the prior art heat dissipation uses a high heat dissipation insulating layer having a relatively large heat transfer coefficient in replace of the glue to promote the thermal transfer efficiency. Thus, the bottleneck and barrier of thermal transfer are formed.
  • Therefore, although the high thermal transfer layer disposed between the heat dissipation body and the air in the prior art heat dissipation mechanism is helpful for promotion of thermal transfer, it only has a limited result because the thermal transfer bottleneck and barrier are not solved. Therefore, the heat dissipation issue still has to be improved. In addition, the heat dissipation fins may also increase the heat dissipation cost, increase the volume and weight of the apparatus, and waste the raw material, except for the above mentioned disadvantage.
  • In view of the drawbacks mentioned above, the inventor of the present invention provides a thermal transfer catalytic heat dissipation method, after many efforts and researches to overcome the shortcoming encountered in the prior art.
    • SUMMARY OF THE INVENTION
  • It is a main object of the present invention to provide a thermal transfercatalytic heat dissipation method comprises steps of disposing a thermal transfer interface on a heat source; and disposing a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film on at least a face of the thermal transfer interface, so that the hexagonal carbon ringed nanometer heat dissipation film dissipates the heat source after the thermal transfer interface absorbs the heat source, whereby effectively guides the heat into the air, so as to avoid a thermal transfer drop with respect to the air, and achieve in that a thermal transfer effectiveness is promoted, a thermal transfer bottleneck is effectively reduced, heat dissipation fins are saved, a heat dissipation cost is largely reduced, a volume and weight is reduced, a consumption of the raw material is reduced and a purpose of energy saving and carbon reduction is achieved.
  • To achieve the above object, the thermal transfercatalytic heat dissipation method comprises disposing a thermal transfer interface on a heat source; and disposing a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film on at least a face of the thermal transfer interface, so that the hexagonal carbon ringed nanometer heat dissipation film dissipates the heat source after the thermal transfer interface absorbs the heat source.
  • In the above embodiment, the thermal transfer interface is combined with the heat source at a surface thereof, and the hexagonal carbon nanoparticles heat dissipation film is combined with the other face of the thermal transfer interface.
  • In the above embodiment, the thermal transfer interface is combined with the heat source through a glue.
  • In the above embodiment, the thermal transfer interface is combined with the heat source through a high heat dissipation insulating layer.
  • In the above embodiment, the thermal transfer interface comprises a heat dissipation assembly, a fan, and a water cooler heat dissipation element.
  • In the above embodiment, another hexagonal carbon nanoparticles heat dissipation film is further disposed between the heat source and the thermal transfer interface.
    • BRIEF DESCRIPTIONS OF THE DRAWINGS
  • FIG. 1 is a cross sectional state schematic diagram of the first embodiment according to the present invention;
  • FIG. 2 is a schematic diagram of a thermal transfer state of a first embodiment according to the present invention;
  • FIG. 3 is a schematic diagram of a cross sectional state of a second embodiment according to the present invention; and
  • FIG. 4 is a cross sectional state schematic diagram of a third embodiment according to the present invention.
  • FIG. 5 is a flowchart of a thermal transfercatalytic heat dissipation method according to the present invention.
    •  DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Referring to FIG. 1 and FIG. 2, in which a schematic diagram of a cross sectional state of a first embodiment according to the present invention, and a schematic diagram of a thermal transfer state of the first embodiment according to the present invention is shown, respectively. As shown, in the thermal transfer catalytic heat dissipation method, on a heat source 1, a thermal transfer interface 2 is disposed. On at least a face of the thermal transfer interface 2, a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film 3 is disposed. As such, the hexagonal carbon nanoparticles heat dissipation film 3 is used to dissipate a heat. The thermal transfer interface 2 is combined with the heat source 1 at a surface thereof. The hexagonal carbon nanoparticles heat dissipation film 3 is combined on the other face of the thermal transfer interface 2, i.e. the face of the thermal interface 2 contacting with the air.
  • The thermal transfer interface 2 may be but not limited only to a heat dissipation assembly, a fan and a water cooler heat dissipation element. The thermal transfer interface 2 is combined with the heat source 1 through a glue 21.
  • When the present invention is operated, a heat is produced from the heat source 1 and transferred outwards, in which the heat source 1 may be but not only limited to a central processing unit, a graphic chip, LED chip, a solar energy chip, and an engine combust. The heat from the heat source 1 is absorbed by the thermal transfer interface 2, and dissipated by the hexagonal carbon ringed carbon heat dissipation film 3. Since when the heat from the heat source 1 transfers outwards, an in-glue thermal transfer path 211 of the glue 21 has a relatively lower thermal transfer coefficient and thus a relatively lowered thermal transfer efficiency. When the heat enters the thermal transfer interface 2, an in-thermal transfer path 212 of the thermal transfer interface 2 has a relatively higher thermal transfer efficiency.
  • Since the thermal transfer efficiency in the air is pretty low, a highest and lowest thermal transfer drop at the interface above mentioned results in a barrier for thermal transfer. The hexagonal carbon nanoparticles heat dissipation film 3 of the present invention may overcome effectively the bottleneck or barrier of the thermal transfer between the thermal transfer interface 2 and the air, i.e. the in-heat dissipation film 213 is effectively used to guide the thermal transfer, and the thermal transfer is guided to the air with the aid of the thermal transfer interface 2, whereby effectively promoting the thermal transfer effect. The reinforced in-air thermal transfer path 214 approaches the thermal efficiency of the thermal transfer interface 2. Therefore, this heat dissipation policy does not require heat dissipation fins and thus the heat dissipation cost may be largely reduced. Furthermore, the volume and weight of the structure may be reduced, and a consumption of the raw material is reduced and a purpose of energy saving and carbon reduction is achieved.
  • Referring to FIG. 3, a schematic diagram of a thermal transfer state of a second embodiment according to the present invention is shown. As shown, except for the structure mentioned in the first embodiment, the present invention may further have the structure of the second embodiment, and the difference between the second and the first embodiments is that a high heat dissipation insulating layer 4 is combined between the thermal transfer interface 2 and the heat source 1.
  • As such, the heat generated from the heat source 1 is transferred to the thermal transfer interface 2 through the high heat dissipation insulating layer 4. After the thermal transfer interface 2 absorbs the heat source, a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film 3 is used together to dissipate the heat, whereby achieving in the efficacy of promoting the thermal transfer efficiency and effectively reducing thermal transfer bottleneck, similarly.
  • Referring to FIG. 4, a schematic diagram of a thermal transfer state of a third embodiment according to the present invention is shown. As shown, except for the structure mentioned in the first and second embodiments, the present invention may further have the structure of the third embodiment, and the difference of the third and the first and first embodiments is that a high heat dissipation film 3 a is combined between the thermal transfer interface 2 and the heat source 1.
  • Therefore, a thermal transfercatalytic heat dissipation method according to the present invention, as shown in FIG. 5, comprises the following steps: disposing a thermal transfer interface on a heat source (51) and disposing a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film on at least a face of the thermal transfer interface (52), so that the hexagonal carbon ringed nanometer heat dissipation film dissipates the heat source after the thermal transfer interface absorbs the heat source.
  • As such, the heat generated from the heat source 1 is transferred to the thermal transfer interface 2 through the first hexagonal carbon nanoparticles heat dissipation film 3 a. After the thermal transfer interface 2 absorbs the heat source, a second hexagonal carbon nanoparticles heat dissipation film 3 is used together to dissipate the heat, whereby achieving in the efficacy of promoting the thermal transfer efficiency and effectively reducing thermal transfer bottleneck, similarly. As such, the present invention may further satisfy a requirement for a real use.
  • In view of the above, the thermal transfer catalytic heat dissipation method is disclosed to overcome the shortcomings existing in the prior art.
  • The hexagonal carbon nanoparticles heat dissipation film effectively guides the heat into the air, so as to avoid a thermal transfer drop with respect to the air, and achieve in that a thermal transfer effectiveness is promoted, a thermal transfer bottleneck is effectively reduced, heat dissipation fins are saved, a heat dissipation cost is largely reduced, a volume and weight is reduced, a consumption of the raw material is reduced and a purpose of energy saving and carbon reduction is achieved.
  • The above described is merely examples and preferred embodiments of the present invention, and not exemplified to intend to limit the present invention. Any modifications and changes without departing from the scope of the spirit of the present invention are deemed as within the scope of the present invention. The scope of the present invention is to be interpreted with the scope as defined in the claims.

Claims (6)

1. A thermal transfer catalytic heat dissipation method, comprises steps of:
disposing a thermal transfer interface on a heat source; and
disposing a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film on at least a face of the thermal transfer interface, so that the hexagonal carbon ringed nanometer heat dissipation film dissipates the heat source after the thermal transfer interface absorbs the heat source.
2. The thermal transfercatalytic heat dissipation method as claimed in claim 1, wherein the thermal transfer interface is combined with the heat source at a surface thereof, and the hexagonal carbon nanoparticles heat dissipation film is combined with the other face of the thermal transfer interface.
3. The thermal transfercatalytic heat dissipation method as claimed in claim 2, wherein the thermal transfer interface is combined with the heat source through a glue.
4. The thermal transfercatalytic heat dissipation method as claimed in claim 2, wherein the thermal transfer interface is combined with the heat source through a high heat dissipation insulating layer.
5. The thermal transfercatalytic heat dissipation method in claim 2, wherein the thermal transfer interface comprises a heat dissipation assembly, a fan, and a water cooler heat dissipation element.
6. The thermal transfercatalytic heat dissipation method as claimed in claim 1, wherein another hexagonal carbon nanoparticles heat dissipation film is further disposed between the heat source and the thermal transfer interface.
US14/288,731 2013-12-11 2014-05-28 Thermal transfer catalytic heat dissipation method Abandoned US20150159970A1 (en)

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CN104717876A (en) 2015-06-17
TWI542851B (en) 2016-07-21

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Owner name: TCY-TEC CORPORATION, CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LU, HUNG-CHIH;YANG, CHUNG-PIN;REEL/FRAME:032975/0163

Effective date: 20140512

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION