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Patentes

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Patente citante Fecha de presentación Fecha de emisión Cesionario original Título
US40198383 Sep 197526 Abr 1977Air pressure-actuated double-acting diaphragm pump with means to produce a selected start-up position
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US463435026 Ene 19846 Ene 1987The Coca-Cola CompanyDouble acting diaphragm pump and reversing mechanism therefor
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US50945961 Jun 199010 Mar 1992Binks Manufacturing CompanyHigh pressure piston pump for fluent materials
US55671309 Nov 199422 Oct 1996Graco Inc.Reinforced cover configuration for a diaphragm pump
US619013630 Ago 199920 Feb 2001Ingersoll-Rand CompanyDiaphragm failure sensing apparatus and diaphragm pumps incorporating same
US656177431 May 200113 May 2003Tokyo Electron LimitedDual diaphragm pump
US673614919 Dic 200218 May 2004Supercritical Systems, Inc.Method and apparatus for supercritical processing of multiple workpieces
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US687165625 Sep 200229 Mar 2005Tokyo Electron LimitedRemoval of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
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US69267986 Mar 20039 Ago 2005Tokyo Electron LimitedApparatus for supercritical processing of a workpiece
US700146827 Ene 200321 Feb 2006Tokyo Electron LimitedPressure energized pressure vessel opening and closing device and method of providing therefor
US70216356 Feb 20034 Abr 2006Tokyo Electron LimitedVacuum chuck utilizing sintered material and method of providing thereof
US706042215 Ene 200313 Jun 2006Tokyo Electron LimitedMethod of supercritical processing of a workpiece
US707791710 Feb 200318 Jul 2006Tokyo Electric LimitedHigh-pressure processing chamber for a semiconductor wafer
US714039322 Dic 200428 Nov 2006Tokyo Electron LimitedNon-contact shuttle valve for flow diversion in high pressure systems
US716338029 Jul 200316 Ene 2007Tokyo Electron LimitedControl of fluid flow in the processing of an object with a fluid
US71860935 Oct 20046 Mar 2007Tokyo Electron LimitedMethod and apparatus for cooling motor bearings of a high pressure pump
US72258206 Oct 20035 Jun 2007Tokyo Electron LimitedHigh-pressure processing chamber for a semiconductor wafer
US725037430 Jun 200431 Jul 2007Tokyo Electron LimitedSystem and method for processing a substrate using supercritical carbon dioxide processing
US725577221 Jul 200414 Ago 2007Tokyo Electron LimitedHigh pressure processing chamber for semiconductor substrate
US729156515 Feb 20056 Nov 2007Tokyo Electron LimitedMethod and system for treating a substrate with a high pressure fluid using fluorosilicic acid
US730701929 Sep 200411 Dic 2007Tokyo Electron LimitedMethod for supercritical carbon dioxide processing of fluoro-carbon films
US730701929 Sep 200411 Dic 2007Tokyo Electron LimitedMethod for supercritical carbon dioxide processing of fluoro-carbon films
US738098428 Mar 20053 Jun 2008Tokyo Electron LimitedProcess flow thermocouple
US738786828 Mar 200517 Jun 2008Tokyo Electron LimitedTreatment of a dielectric layer using supercritical CO2
US743459022 Dic 200414 Oct 2008Tokyo Electron LimitedMethod and apparatus for clamping a substrate in a high pressure processing system
US743544715 Feb 200514 Oct 2008Tokyo Electron LimitedMethod and system for determining flow conditions in a high pressure processing system
US749103612 Nov 200417 Feb 2009Tokyo Electron LimitedMethod and system for cooling a pump
US749410730 Mar 200524 Feb 2009Supercritical Systems, Inc.Gate valve for plus-atmospheric pressure semiconductor process vessels
US752438325 May 200528 Abr 2009Tokyo Electron LimitedMethod and system for passivating a processing chamber
US776714528 Mar 20053 Ago 2010Toyko Electron LimitedHigh pressure fourier transform infrared cell
US778997113 May 20057 Sep 2010Tokyo Electron LimitedTreatment of substrate using functionalizing agent in supercritical carbon dioxide