US2958120A - Method of flush circuit manufacture - Google Patents
Method of flush circuit manufacture Download PDFInfo
- Publication number
- US2958120A US2958120A US582004A US58200456A US2958120A US 2958120 A US2958120 A US 2958120A US 582004 A US582004 A US 582004A US 58200456 A US58200456 A US 58200456A US 2958120 A US2958120 A US 2958120A
- Authority
- US
- United States
- Prior art keywords
- backing
- pattern
- flush
- segments
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/109—Embedding of laminae within face of additional laminae
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
Definitions
- the proc esses used are variations of two basic techniques. These techniques are known as the direct and the indirect process.
- the direct process involves the steps of providing a conductive pattern on the surface of the insulating backing and then pressing the pattern and backing into flush relationship.
- the indirect process involves the steps of providing a conductive pattern on a temporary support, pressing an insulating backing material over the conductive pattern and removing the backing and pattern assembly from the temporary support. -As the speed of the machines in which these flush circuits are to be used has been increasing, it has become increasingly difficult to maintain an inter-conductor spatial relationship in the finished flush circuit to a desired accuracy because the conductors of the pattern tend to move laterally with relation to each other during the flushing step of the process.
- This invention is directed to a simple technique of controlling the flow of the insulating backing to maintain inter-conductor spatial relationship of the individual parts of a conductor pattern during the flushing operation.
- a related object is to provide a method of controlling the flow of a backing material while pressing a pattern flush with the backing so that horizontal distances between parts of the pattern are maintained.
- Figure 1 is a cross sectional view of a quantity of back ing material showing a flow controlling negative of the desired pattern applied to the reverse side of the material
- Figure 2 is a view as in Figure 1 after the desired pat tern has been pressed flush with the backing material.
- the quantity of backing material 1 is provided with a desired pattern shown as segments 2 and 3 which ultimately are desired to be brought into flush relationship with the upper surface 4 of the backing.
- horizontal dimensions such as the distance from one segment to the other or from the segments to a reference position such as the edge of the material 1 must be maintained.
- the flow of the material 1 may carry the segments 2 and 3 out of position.
- the flow of the material 1 can be controlled by supporting the material 1 in a configuration that is a negative of the desired pattern during the flushing operation.
- One way in which this can be done is to provide a sheet of material having a negative configuration of the desired pattern in it. This material is shown as element 5. It being noted that vacant spaces in the material 5 coincide with the under surface 6 of the backing 1 directly beneath the segments 2 and 3 of the desired pattern to be pressed into the backing 1.
- the finished flush pattern is shown in which the desired pattern represented by segments 2 and 3 is now accommodated into flush relationship with the surface 4 of the backing 1 and the displaced backing material resulting from the presence of these segments now occupies the open spaces in the material 5.
- the support with the negative pattern need only have sufficient strength to support the backing material '1 during the flushing cycle, and it may be part of a supporting plate, a separate sheet of material or part of the backing material itself.
- the insulating backing may be a sheet of phenolic resin, commonly known in the art as XXXP, used in printed wiring applications.
- This material is generally provided with a bonded layer of copper foil on each side.
- a positive conductor pattern such as elements 2 and 3 on the side 4 of the insulating backing 1 and a negative of the conductor pattern on the side 8 of the insulating backing 1 wherein, in this example, the copper foil on the opposite side of the insulating backing 1 serves the purpose of the material 5.
- a negative configuration of material supporting the reverse side of a sheet of backing material into which a positive configuration of segments of a desired pattern is to be pressed flush, so that the negative configuration of material serves to control the flow of the backing material in the flushing operation thereby permitting dimensional stability to be maintained between individual segments of the pattern, as the segments travel vertically during the flushing operation.
- a method of manufacturing a flush wiring pattern comprising in combination the steps of printing with an etching resistant material a positive configuration of a conductive pattern on a first side of a sheet of insulating material having metal foil covering both sides thereof, printing with an etching resistant mate-rial a negative configuration of said conductive pattern in registering alignment with said conductive pattern on the opposite side of said sheet of insulating material, etching :away said metal foil not covered by said etching resistant material forming thereby a conductive foil pattern on one side of said sheet of insulating material and a female :die of said conductive foil pattern of foil on the opposite side of said sheet of insulating material, remov ing said etching resist, placing said sheet of insulating material on a plane surface of a support with said foil female die of said conductive foil pattern in contact with said support and applying vertical pressure to said conductive foil pattern sufiicient to press said conductive foil pattern flush with the surface of said sheet of insulating material and simultaneously to press said insulating backing
Description
Nov. 1, 1960 D. G. TAYLOR METHOD OF FLUSH CIRCUIT MANUFACTURE Filed May 1, 1956 INVENTOR. DAVlD G. TAYLOR AGENT 2,958,120 Patented Nov. 1, 1960 United States Patent Oifice METHOD or FLUSH CIRCUIT MANUFACTURE David G. Taylor, Poughkeepsie, N.Y., assignor to International Business Machines Corporation, New York, N.Y., a corporation of New York Filed May 1, 1956, Ser. No. 582,004
2 Claims. (Cl. 29-1555) This application relates to the manufacture of conductive patterns on an insulating backing and, in particular to a technique of forming such patterns in flush relationship with the insulating backing.
In the manufacture of flush circuit patterns, the proc esses used are variations of two basic techniques. These techniques are known as the direct and the indirect process. The direct process involves the steps of providing a conductive pattern on the surface of the insulating backing and then pressing the pattern and backing into flush relationship. The indirect process involves the steps of providing a conductive pattern on a temporary support, pressing an insulating backing material over the conductive pattern and removing the backing and pattern assembly from the temporary support. -As the speed of the machines in which these flush circuits are to be used has been increasing, it has become increasingly difficult to maintain an inter-conductor spatial relationship in the finished flush circuit to a desired accuracy because the conductors of the pattern tend to move laterally with relation to each other during the flushing step of the process.
This invention is directed to a simple technique of controlling the flow of the insulating backing to maintain inter-conductor spatial relationship of the individual parts of a conductor pattern during the flushing operation.
Accordingly, it is a primary object of this invention to provide a method of maintaining accurate inter-con ductor spatial relationship in a flush circuit.
A related object is to provide a method of controlling the flow of a backing material while pressing a pattern flush with the backing so that horizontal distances between parts of the pattern are maintained.
Other objects of the invention will be Pointed out in the following description and claims and illustrated. in the accompanying drawings, which disclose, by way of ere ample, the principle of the invention and the best mode, which has been contemplated, of applying that principle.
In the drawings:
Figure 1 is a cross sectional view of a quantity of back ing material showing a flow controlling negative of the desired pattern applied to the reverse side of the material,
Figure 2 is a view as in Figure 1 after the desired pat tern has been pressed flush with the backing material.
Referring now to Figure 1, the quantity of backing material 1 is provided with a desired pattern shown as segments 2 and 3 which ultimately are desired to be brought into flush relationship with the upper surface 4 of the backing. During the flushing operation horizontal dimensions such as the distance from one segment to the other or from the segments to a reference position such as the edge of the material 1 must be maintained. In order to accommodate the segments 2 and 3 of the pattern, it is necessary that the backing material 1 be displaced and in such displacement, the flow of the material 1 may carry the segments 2 and 3 out of position. The flow of the material 1 can be controlled by supporting the material 1 in a configuration that is a negative of the desired pattern during the flushing operation. One way in which this can be done is to provide a sheet of material having a negative configuration of the desired pattern in it. This material is shown as element 5. It being noted that vacant spaces in the material 5 coincide with the under surface 6 of the backing 1 directly beneath the segments 2 and 3 of the desired pattern to be pressed into the backing 1.
In the flushing operation, pressure or a combination of heat and pressure, is applied to the segments 2 and 3 in the direction of the arrows 7. The flushing operation results in the segments 2 and 3 being forced into flush relationship with the upper surface 4 of the backing and as a result of the openings in the material 5, the direction of flow of the backing, as it is deformed, to accommodate the segments 2 and 3 is shown by the arrows 8 drawn in the material 1. This flow confines movement of the segments 2 and 3 to a vertical path. There is no tendency toward horizontal movement because all horizontal forces applied to the segments of the desired pattern are opposed by equal and opposite horizontal forces as a result of the direction of flow of the backing material 1.
Referring now to Figure 2, the finished flush pattern is shown in which the desired pattern represented by segments 2 and 3 is now accommodated into flush relationship with the surface 4 of the backing 1 and the displaced backing material resulting from the presence of these segments now occupies the open spaces in the material 5. The support with the negative pattern need only have sufficient strength to support the backing material '1 during the flushing cycle, and it may be part of a supporting plate, a separate sheet of material or part of the backing material itself.
Taking for a specific example a flush circuit, the insulating backing may be a sheet of phenolic resin, commonly known in the art as XXXP, used in printed wiring applications. This material is generally provided with a bonded layer of copper foil on each side. Using the photo-etch process also well known in the art, it is possible, referring to Figure 1 to provide a positive conductor pattern such as elements 2 and 3 on the side 4 of the insulating backing 1 and a negative of the conductor pattern on the side 8 of the insulating backing 1 wherein, in this example, the copper foil on the opposite side of the insulating backing 1 serves the purpose of the material 5. Once the flushing cycle has taken place and the conductive segments 2 and 3 have been accommodated into flush relationship with the surface 4 of the insulating backing 1 and portions of the insulating backing 1 have filled the openings in the material 5 on the opposite of the sheet of the insulating backing 1, these portions and the foil 5 may now be removed by, for example, such operations as abrading. In many applications employing fiush circuits the material 5 does not interfere with the circuit operation and may be left on.
As may be seen from the above description what has been provided is a negative configuration of material supporting the reverse side of a sheet of backing material into which a positive configuration of segments of a desired pattern is to be pressed flush, so that the negative configuration of material serves to control the flow of the backing material in the flushing operation thereby permitting dimensional stability to be maintained between individual segments of the pattern, as the segments travel vertically during the flushing operation.
Thus, while the technique of this invention has been described in detail with respect to the manufacturing of flush wiring patterns, it will be obvious to one skilled in the art that the basic principle of this invention, namely, supporting the material in a configuration that is the negative of the desired pattern on the opposite side of a sheet of backing material in order to control the flow of the backing material during the vertical flushing operation may readily be applied in any situation wherein a design of a material is brought into flush relationship with a backing material. 6
While there have been shown and described and pointed out the fundamental novel features of the invention as applied to a preferred embodiment, it will be understood that various omissions and substitutions and changes in the form and details of the device illustrated and in its operation may be made by those skilled in the art without departing from the spirit of the invention. 'It is the intention therefore, to-be limited only as indicated by the following claims.
: What is claimed is:
l. A method of manufacturing a flush wiring pattern comprising in combination the steps of printing with an etching resistant material a positive configuration of a conductive pattern on a first side of a sheet of insulating material having metal foil covering both sides thereof, printing with an etching resistant mate-rial a negative configuration of said conductive pattern in registering alignment with said conductive pattern on the opposite side of said sheet of insulating material, etching :away said metal foil not covered by said etching resistant material forming thereby a conductive foil pattern on one side of said sheet of insulating material and a female :die of said conductive foil pattern of foil on the opposite side of said sheet of insulating material, remov ing said etching resist, placing said sheet of insulating material on a plane surface of a support with said foil female die of said conductive foil pattern in contact with said support and applying vertical pressure to said conductive foil pattern sufiicient to press said conductive foil pattern flush with the surface of said sheet of insulating material and simultaneously to press said insulating backing into the space defined by said foil female die and the plane surface of said support and into contact with the plane surface of said support.
2. The method of claim 1 including the step of removing said foil female die and the displaced insulating material therein from the opposite side of said sheet of insulating material.
References Cited in the file of this patent UNITED STATES PATENTS 2,587,439 2,734,150 Beck Feb. 7, 1956 FOREIGN PATENTS 646,3'14 Great Britain Nov. 22, 1950 Bungay Feb. 26, 1952 ulane-.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US582004A US2958120A (en) | 1956-05-01 | 1956-05-01 | Method of flush circuit manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US582004A US2958120A (en) | 1956-05-01 | 1956-05-01 | Method of flush circuit manufacture |
Publications (1)
Publication Number | Publication Date |
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US2958120A true US2958120A (en) | 1960-11-01 |
Family
ID=24327455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US582004A Expired - Lifetime US2958120A (en) | 1956-05-01 | 1956-05-01 | Method of flush circuit manufacture |
Country Status (1)
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US (1) | US2958120A (en) |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3201851A (en) * | 1960-10-05 | 1965-08-24 | Sanders Associates Inc | Method of making interconnecting multilayer circuits |
DE1206503B (en) * | 1963-01-08 | 1965-12-09 | Huels Chemische Werke Ag | Process for making a printed circuit board |
US3222756A (en) * | 1961-08-23 | 1965-12-14 | Melvin M Kanfman | Techniques associated with inductive sensing of tunnel diode memory cells |
US3235942A (en) * | 1959-12-02 | 1966-02-22 | Burroughs Corp | Electrode assemblies and methods of making same |
US3268644A (en) * | 1961-07-20 | 1966-08-23 | Nuclear Materials & Equipment | Method of making a specimen assembly |
US3290753A (en) * | 1963-08-19 | 1966-12-13 | Bell Telephone Labor Inc | Method of making semiconductor integrated circuit elements |
US3293399A (en) * | 1963-12-14 | 1966-12-20 | Balco Filtertechnik G M B H | Printed circuit contact arrangement |
US3296099A (en) * | 1966-05-16 | 1967-01-03 | Western Electric Co | Method of making printed circuits |
US3300832A (en) * | 1963-06-28 | 1967-01-31 | Rca Corp | Method of making composite insulatorsemiconductor wafer |
US3335048A (en) * | 1963-02-19 | 1967-08-08 | Lieges Des Hamendas Et De La P | Mosaic tile assembly |
US3391023A (en) * | 1965-03-29 | 1968-07-02 | Fairchild Camera Instr Co | Dielecteric isolation process |
DE1273649B (en) * | 1961-10-14 | 1968-07-25 | Wilhelm Ruppert Jun | Process for the production of a printed circuit with the help of ribbon conductors |
US3755027A (en) * | 1970-11-19 | 1973-08-28 | Philips Corp | Method of manufacturing a gas discharge panel and panel manufactured by said method |
US3873429A (en) * | 1973-07-09 | 1975-03-25 | Rockwell International Corp | Flush printed circuit apparatus |
US3913224A (en) * | 1972-09-27 | 1975-10-21 | Siemens Ag | Production of electrical components, particularly RC networks |
US4017968A (en) * | 1975-09-18 | 1977-04-19 | Jerobee Industries, Inc. | Method of making plated through hole printed circuit board |
US4023997A (en) * | 1967-10-09 | 1977-05-17 | Western Electric Company, Inc. | Method of placing an oriented array of devices on a releasable mounting |
US4606787A (en) * | 1982-03-04 | 1986-08-19 | Etd Technology, Inc. | Method and apparatus for manufacturing multi layer printed circuit boards |
US4651417A (en) * | 1984-10-23 | 1987-03-24 | New West Technology Corporation | Method for forming printed circuit board |
US4680557A (en) * | 1985-04-22 | 1987-07-14 | Tektronix, Inc. | Staggered ground-plane microstrip transmission line |
US4751126A (en) * | 1983-12-19 | 1988-06-14 | Kabushiki Kaisha Toshiba | A method of making a circuit board and a circuit board produced thereby |
US5496435A (en) * | 1992-06-02 | 1996-03-05 | Texas Instruments Incorporated | Semiconductor lead frame lead stabilization |
US5525181A (en) * | 1991-10-31 | 1996-06-11 | U.S. Philips Corporation | Method of manufacturing a multilayer printed circuit board having first and second conducting patterns connected through an adhesive layer and laminate for the manufacture of such a printed circuit board |
US6083837A (en) * | 1996-12-13 | 2000-07-04 | Tessera, Inc. | Fabrication of components by coining |
US6651324B1 (en) * | 2000-11-06 | 2003-11-25 | Viasystems Group, Inc. | Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer |
US20080296055A1 (en) * | 2007-05-29 | 2008-12-04 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of fabricating the same |
US20120222299A1 (en) * | 2009-01-09 | 2012-09-06 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing a printed circuit board |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB646314A (en) * | 1948-06-22 | 1950-11-22 | James White Dalgleish | Improvements in electric wiring and coil forming |
US2587439A (en) * | 1950-01-05 | 1952-02-26 | Electrographic Corp | Making ready cylindrical printing plate |
US2734150A (en) * | 1956-02-07 | Circuit component and method of making same |
-
1956
- 1956-05-01 US US582004A patent/US2958120A/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2734150A (en) * | 1956-02-07 | Circuit component and method of making same | ||
GB646314A (en) * | 1948-06-22 | 1950-11-22 | James White Dalgleish | Improvements in electric wiring and coil forming |
US2587439A (en) * | 1950-01-05 | 1952-02-26 | Electrographic Corp | Making ready cylindrical printing plate |
Cited By (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3235942A (en) * | 1959-12-02 | 1966-02-22 | Burroughs Corp | Electrode assemblies and methods of making same |
US3201851A (en) * | 1960-10-05 | 1965-08-24 | Sanders Associates Inc | Method of making interconnecting multilayer circuits |
US3268644A (en) * | 1961-07-20 | 1966-08-23 | Nuclear Materials & Equipment | Method of making a specimen assembly |
US3222756A (en) * | 1961-08-23 | 1965-12-14 | Melvin M Kanfman | Techniques associated with inductive sensing of tunnel diode memory cells |
DE1273649B (en) * | 1961-10-14 | 1968-07-25 | Wilhelm Ruppert Jun | Process for the production of a printed circuit with the help of ribbon conductors |
DE1206503B (en) * | 1963-01-08 | 1965-12-09 | Huels Chemische Werke Ag | Process for making a printed circuit board |
US3335048A (en) * | 1963-02-19 | 1967-08-08 | Lieges Des Hamendas Et De La P | Mosaic tile assembly |
US3300832A (en) * | 1963-06-28 | 1967-01-31 | Rca Corp | Method of making composite insulatorsemiconductor wafer |
US3290753A (en) * | 1963-08-19 | 1966-12-13 | Bell Telephone Labor Inc | Method of making semiconductor integrated circuit elements |
US3293399A (en) * | 1963-12-14 | 1966-12-20 | Balco Filtertechnik G M B H | Printed circuit contact arrangement |
US3391023A (en) * | 1965-03-29 | 1968-07-02 | Fairchild Camera Instr Co | Dielecteric isolation process |
US3296099A (en) * | 1966-05-16 | 1967-01-03 | Western Electric Co | Method of making printed circuits |
US4023997A (en) * | 1967-10-09 | 1977-05-17 | Western Electric Company, Inc. | Method of placing an oriented array of devices on a releasable mounting |
US3755027A (en) * | 1970-11-19 | 1973-08-28 | Philips Corp | Method of manufacturing a gas discharge panel and panel manufactured by said method |
US3913224A (en) * | 1972-09-27 | 1975-10-21 | Siemens Ag | Production of electrical components, particularly RC networks |
US3873429A (en) * | 1973-07-09 | 1975-03-25 | Rockwell International Corp | Flush printed circuit apparatus |
US4017968A (en) * | 1975-09-18 | 1977-04-19 | Jerobee Industries, Inc. | Method of making plated through hole printed circuit board |
US4606787A (en) * | 1982-03-04 | 1986-08-19 | Etd Technology, Inc. | Method and apparatus for manufacturing multi layer printed circuit boards |
US4751126A (en) * | 1983-12-19 | 1988-06-14 | Kabushiki Kaisha Toshiba | A method of making a circuit board and a circuit board produced thereby |
US4651417A (en) * | 1984-10-23 | 1987-03-24 | New West Technology Corporation | Method for forming printed circuit board |
US4680557A (en) * | 1985-04-22 | 1987-07-14 | Tektronix, Inc. | Staggered ground-plane microstrip transmission line |
US5525181A (en) * | 1991-10-31 | 1996-06-11 | U.S. Philips Corporation | Method of manufacturing a multilayer printed circuit board having first and second conducting patterns connected through an adhesive layer and laminate for the manufacture of such a printed circuit board |
US5496435A (en) * | 1992-06-02 | 1996-03-05 | Texas Instruments Incorporated | Semiconductor lead frame lead stabilization |
US6083837A (en) * | 1996-12-13 | 2000-07-04 | Tessera, Inc. | Fabrication of components by coining |
US6184140B1 (en) | 1996-12-13 | 2001-02-06 | Tessera, Inc. | Methods of making microelectronic packages utilizing coining |
US6651324B1 (en) * | 2000-11-06 | 2003-11-25 | Viasystems Group, Inc. | Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer |
US20040168314A1 (en) * | 2000-11-06 | 2004-09-02 | Giuseppe Pedretti | Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer |
US20080296055A1 (en) * | 2007-05-29 | 2008-12-04 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of fabricating the same |
US8161634B2 (en) * | 2007-05-29 | 2012-04-24 | Samsung Electro-Mechanics Co., Ltd. | Method of fabricating a printed circuit board |
US20120222299A1 (en) * | 2009-01-09 | 2012-09-06 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing a printed circuit board |
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