US2958120A - Method of flush circuit manufacture - Google Patents

Method of flush circuit manufacture Download PDF

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Publication number
US2958120A
US2958120A US582004A US58200456A US2958120A US 2958120 A US2958120 A US 2958120A US 582004 A US582004 A US 582004A US 58200456 A US58200456 A US 58200456A US 2958120 A US2958120 A US 2958120A
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United States
Prior art keywords
backing
pattern
flush
segments
insulating
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Expired - Lifetime
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US582004A
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David G Taylor
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International Business Machines Corp
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International Business Machines Corp
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Priority to US582004A priority Critical patent/US2958120A/en
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Publication of US2958120A publication Critical patent/US2958120A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0376Flush conductors, i.e. flush with the surface of the printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1089Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109Embedding of laminae within face of additional laminae
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49158Manufacturing circuit on or in base with molding of insulated base

Definitions

  • the proc esses used are variations of two basic techniques. These techniques are known as the direct and the indirect process.
  • the direct process involves the steps of providing a conductive pattern on the surface of the insulating backing and then pressing the pattern and backing into flush relationship.
  • the indirect process involves the steps of providing a conductive pattern on a temporary support, pressing an insulating backing material over the conductive pattern and removing the backing and pattern assembly from the temporary support. -As the speed of the machines in which these flush circuits are to be used has been increasing, it has become increasingly difficult to maintain an inter-conductor spatial relationship in the finished flush circuit to a desired accuracy because the conductors of the pattern tend to move laterally with relation to each other during the flushing step of the process.
  • This invention is directed to a simple technique of controlling the flow of the insulating backing to maintain inter-conductor spatial relationship of the individual parts of a conductor pattern during the flushing operation.
  • a related object is to provide a method of controlling the flow of a backing material while pressing a pattern flush with the backing so that horizontal distances between parts of the pattern are maintained.
  • Figure 1 is a cross sectional view of a quantity of back ing material showing a flow controlling negative of the desired pattern applied to the reverse side of the material
  • Figure 2 is a view as in Figure 1 after the desired pat tern has been pressed flush with the backing material.
  • the quantity of backing material 1 is provided with a desired pattern shown as segments 2 and 3 which ultimately are desired to be brought into flush relationship with the upper surface 4 of the backing.
  • horizontal dimensions such as the distance from one segment to the other or from the segments to a reference position such as the edge of the material 1 must be maintained.
  • the flow of the material 1 may carry the segments 2 and 3 out of position.
  • the flow of the material 1 can be controlled by supporting the material 1 in a configuration that is a negative of the desired pattern during the flushing operation.
  • One way in which this can be done is to provide a sheet of material having a negative configuration of the desired pattern in it. This material is shown as element 5. It being noted that vacant spaces in the material 5 coincide with the under surface 6 of the backing 1 directly beneath the segments 2 and 3 of the desired pattern to be pressed into the backing 1.
  • the finished flush pattern is shown in which the desired pattern represented by segments 2 and 3 is now accommodated into flush relationship with the surface 4 of the backing 1 and the displaced backing material resulting from the presence of these segments now occupies the open spaces in the material 5.
  • the support with the negative pattern need only have sufficient strength to support the backing material '1 during the flushing cycle, and it may be part of a supporting plate, a separate sheet of material or part of the backing material itself.
  • the insulating backing may be a sheet of phenolic resin, commonly known in the art as XXXP, used in printed wiring applications.
  • This material is generally provided with a bonded layer of copper foil on each side.
  • a positive conductor pattern such as elements 2 and 3 on the side 4 of the insulating backing 1 and a negative of the conductor pattern on the side 8 of the insulating backing 1 wherein, in this example, the copper foil on the opposite side of the insulating backing 1 serves the purpose of the material 5.
  • a negative configuration of material supporting the reverse side of a sheet of backing material into which a positive configuration of segments of a desired pattern is to be pressed flush, so that the negative configuration of material serves to control the flow of the backing material in the flushing operation thereby permitting dimensional stability to be maintained between individual segments of the pattern, as the segments travel vertically during the flushing operation.
  • a method of manufacturing a flush wiring pattern comprising in combination the steps of printing with an etching resistant material a positive configuration of a conductive pattern on a first side of a sheet of insulating material having metal foil covering both sides thereof, printing with an etching resistant mate-rial a negative configuration of said conductive pattern in registering alignment with said conductive pattern on the opposite side of said sheet of insulating material, etching :away said metal foil not covered by said etching resistant material forming thereby a conductive foil pattern on one side of said sheet of insulating material and a female :die of said conductive foil pattern of foil on the opposite side of said sheet of insulating material, remov ing said etching resist, placing said sheet of insulating material on a plane surface of a support with said foil female die of said conductive foil pattern in contact with said support and applying vertical pressure to said conductive foil pattern sufiicient to press said conductive foil pattern flush with the surface of said sheet of insulating material and simultaneously to press said insulating backing

Description

Nov. 1, 1960 D. G. TAYLOR METHOD OF FLUSH CIRCUIT MANUFACTURE Filed May 1, 1956 INVENTOR. DAVlD G. TAYLOR AGENT 2,958,120 Patented Nov. 1, 1960 United States Patent Oifice METHOD or FLUSH CIRCUIT MANUFACTURE David G. Taylor, Poughkeepsie, N.Y., assignor to International Business Machines Corporation, New York, N.Y., a corporation of New York Filed May 1, 1956, Ser. No. 582,004
2 Claims. (Cl. 29-1555) This application relates to the manufacture of conductive patterns on an insulating backing and, in particular to a technique of forming such patterns in flush relationship with the insulating backing.
In the manufacture of flush circuit patterns, the proc esses used are variations of two basic techniques. These techniques are known as the direct and the indirect process. The direct process involves the steps of providing a conductive pattern on the surface of the insulating backing and then pressing the pattern and backing into flush relationship. The indirect process involves the steps of providing a conductive pattern on a temporary support, pressing an insulating backing material over the conductive pattern and removing the backing and pattern assembly from the temporary support. -As the speed of the machines in which these flush circuits are to be used has been increasing, it has become increasingly difficult to maintain an inter-conductor spatial relationship in the finished flush circuit to a desired accuracy because the conductors of the pattern tend to move laterally with relation to each other during the flushing step of the process.
This invention is directed to a simple technique of controlling the flow of the insulating backing to maintain inter-conductor spatial relationship of the individual parts of a conductor pattern during the flushing operation.
Accordingly, it is a primary object of this invention to provide a method of maintaining accurate inter-con ductor spatial relationship in a flush circuit.
A related object is to provide a method of controlling the flow of a backing material while pressing a pattern flush with the backing so that horizontal distances between parts of the pattern are maintained.
Other objects of the invention will be Pointed out in the following description and claims and illustrated. in the accompanying drawings, which disclose, by way of ere ample, the principle of the invention and the best mode, which has been contemplated, of applying that principle.
In the drawings:
Figure 1 is a cross sectional view of a quantity of back ing material showing a flow controlling negative of the desired pattern applied to the reverse side of the material,
Figure 2 is a view as in Figure 1 after the desired pat tern has been pressed flush with the backing material.
Referring now to Figure 1, the quantity of backing material 1 is provided with a desired pattern shown as segments 2 and 3 which ultimately are desired to be brought into flush relationship with the upper surface 4 of the backing. During the flushing operation horizontal dimensions such as the distance from one segment to the other or from the segments to a reference position such as the edge of the material 1 must be maintained. In order to accommodate the segments 2 and 3 of the pattern, it is necessary that the backing material 1 be displaced and in such displacement, the flow of the material 1 may carry the segments 2 and 3 out of position. The flow of the material 1 can be controlled by supporting the material 1 in a configuration that is a negative of the desired pattern during the flushing operation. One way in which this can be done is to provide a sheet of material having a negative configuration of the desired pattern in it. This material is shown as element 5. It being noted that vacant spaces in the material 5 coincide with the under surface 6 of the backing 1 directly beneath the segments 2 and 3 of the desired pattern to be pressed into the backing 1.
In the flushing operation, pressure or a combination of heat and pressure, is applied to the segments 2 and 3 in the direction of the arrows 7. The flushing operation results in the segments 2 and 3 being forced into flush relationship with the upper surface 4 of the backing and as a result of the openings in the material 5, the direction of flow of the backing, as it is deformed, to accommodate the segments 2 and 3 is shown by the arrows 8 drawn in the material 1. This flow confines movement of the segments 2 and 3 to a vertical path. There is no tendency toward horizontal movement because all horizontal forces applied to the segments of the desired pattern are opposed by equal and opposite horizontal forces as a result of the direction of flow of the backing material 1.
Referring now to Figure 2, the finished flush pattern is shown in which the desired pattern represented by segments 2 and 3 is now accommodated into flush relationship with the surface 4 of the backing 1 and the displaced backing material resulting from the presence of these segments now occupies the open spaces in the material 5. The support with the negative pattern need only have sufficient strength to support the backing material '1 during the flushing cycle, and it may be part of a supporting plate, a separate sheet of material or part of the backing material itself.
Taking for a specific example a flush circuit, the insulating backing may be a sheet of phenolic resin, commonly known in the art as XXXP, used in printed wiring applications. This material is generally provided with a bonded layer of copper foil on each side. Using the photo-etch process also well known in the art, it is possible, referring to Figure 1 to provide a positive conductor pattern such as elements 2 and 3 on the side 4 of the insulating backing 1 and a negative of the conductor pattern on the side 8 of the insulating backing 1 wherein, in this example, the copper foil on the opposite side of the insulating backing 1 serves the purpose of the material 5. Once the flushing cycle has taken place and the conductive segments 2 and 3 have been accommodated into flush relationship with the surface 4 of the insulating backing 1 and portions of the insulating backing 1 have filled the openings in the material 5 on the opposite of the sheet of the insulating backing 1, these portions and the foil 5 may now be removed by, for example, such operations as abrading. In many applications employing fiush circuits the material 5 does not interfere with the circuit operation and may be left on.
As may be seen from the above description what has been provided is a negative configuration of material supporting the reverse side of a sheet of backing material into which a positive configuration of segments of a desired pattern is to be pressed flush, so that the negative configuration of material serves to control the flow of the backing material in the flushing operation thereby permitting dimensional stability to be maintained between individual segments of the pattern, as the segments travel vertically during the flushing operation.
Thus, while the technique of this invention has been described in detail with respect to the manufacturing of flush wiring patterns, it will be obvious to one skilled in the art that the basic principle of this invention, namely, supporting the material in a configuration that is the negative of the desired pattern on the opposite side of a sheet of backing material in order to control the flow of the backing material during the vertical flushing operation may readily be applied in any situation wherein a design of a material is brought into flush relationship with a backing material. 6
While there have been shown and described and pointed out the fundamental novel features of the invention as applied to a preferred embodiment, it will be understood that various omissions and substitutions and changes in the form and details of the device illustrated and in its operation may be made by those skilled in the art without departing from the spirit of the invention. 'It is the intention therefore, to-be limited only as indicated by the following claims.
: What is claimed is:
l. A method of manufacturing a flush wiring pattern comprising in combination the steps of printing with an etching resistant material a positive configuration of a conductive pattern on a first side of a sheet of insulating material having metal foil covering both sides thereof, printing with an etching resistant mate-rial a negative configuration of said conductive pattern in registering alignment with said conductive pattern on the opposite side of said sheet of insulating material, etching :away said metal foil not covered by said etching resistant material forming thereby a conductive foil pattern on one side of said sheet of insulating material and a female :die of said conductive foil pattern of foil on the opposite side of said sheet of insulating material, remov ing said etching resist, placing said sheet of insulating material on a plane surface of a support with said foil female die of said conductive foil pattern in contact with said support and applying vertical pressure to said conductive foil pattern sufiicient to press said conductive foil pattern flush with the surface of said sheet of insulating material and simultaneously to press said insulating backing into the space defined by said foil female die and the plane surface of said support and into contact with the plane surface of said support.
2. The method of claim 1 including the step of removing said foil female die and the displaced insulating material therein from the opposite side of said sheet of insulating material.
References Cited in the file of this patent UNITED STATES PATENTS 2,587,439 2,734,150 Beck Feb. 7, 1956 FOREIGN PATENTS 646,3'14 Great Britain Nov. 22, 1950 Bungay Feb. 26, 1952 ulane-.
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Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3201851A (en) * 1960-10-05 1965-08-24 Sanders Associates Inc Method of making interconnecting multilayer circuits
DE1206503B (en) * 1963-01-08 1965-12-09 Huels Chemische Werke Ag Process for making a printed circuit board
US3222756A (en) * 1961-08-23 1965-12-14 Melvin M Kanfman Techniques associated with inductive sensing of tunnel diode memory cells
US3235942A (en) * 1959-12-02 1966-02-22 Burroughs Corp Electrode assemblies and methods of making same
US3268644A (en) * 1961-07-20 1966-08-23 Nuclear Materials & Equipment Method of making a specimen assembly
US3290753A (en) * 1963-08-19 1966-12-13 Bell Telephone Labor Inc Method of making semiconductor integrated circuit elements
US3293399A (en) * 1963-12-14 1966-12-20 Balco Filtertechnik G M B H Printed circuit contact arrangement
US3296099A (en) * 1966-05-16 1967-01-03 Western Electric Co Method of making printed circuits
US3300832A (en) * 1963-06-28 1967-01-31 Rca Corp Method of making composite insulatorsemiconductor wafer
US3335048A (en) * 1963-02-19 1967-08-08 Lieges Des Hamendas Et De La P Mosaic tile assembly
US3391023A (en) * 1965-03-29 1968-07-02 Fairchild Camera Instr Co Dielecteric isolation process
DE1273649B (en) * 1961-10-14 1968-07-25 Wilhelm Ruppert Jun Process for the production of a printed circuit with the help of ribbon conductors
US3755027A (en) * 1970-11-19 1973-08-28 Philips Corp Method of manufacturing a gas discharge panel and panel manufactured by said method
US3873429A (en) * 1973-07-09 1975-03-25 Rockwell International Corp Flush printed circuit apparatus
US3913224A (en) * 1972-09-27 1975-10-21 Siemens Ag Production of electrical components, particularly RC networks
US4017968A (en) * 1975-09-18 1977-04-19 Jerobee Industries, Inc. Method of making plated through hole printed circuit board
US4023997A (en) * 1967-10-09 1977-05-17 Western Electric Company, Inc. Method of placing an oriented array of devices on a releasable mounting
US4606787A (en) * 1982-03-04 1986-08-19 Etd Technology, Inc. Method and apparatus for manufacturing multi layer printed circuit boards
US4651417A (en) * 1984-10-23 1987-03-24 New West Technology Corporation Method for forming printed circuit board
US4680557A (en) * 1985-04-22 1987-07-14 Tektronix, Inc. Staggered ground-plane microstrip transmission line
US4751126A (en) * 1983-12-19 1988-06-14 Kabushiki Kaisha Toshiba A method of making a circuit board and a circuit board produced thereby
US5496435A (en) * 1992-06-02 1996-03-05 Texas Instruments Incorporated Semiconductor lead frame lead stabilization
US5525181A (en) * 1991-10-31 1996-06-11 U.S. Philips Corporation Method of manufacturing a multilayer printed circuit board having first and second conducting patterns connected through an adhesive layer and laminate for the manufacture of such a printed circuit board
US6083837A (en) * 1996-12-13 2000-07-04 Tessera, Inc. Fabrication of components by coining
US6651324B1 (en) * 2000-11-06 2003-11-25 Viasystems Group, Inc. Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer
US20080296055A1 (en) * 2007-05-29 2008-12-04 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of fabricating the same
US20120222299A1 (en) * 2009-01-09 2012-09-06 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing a printed circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB646314A (en) * 1948-06-22 1950-11-22 James White Dalgleish Improvements in electric wiring and coil forming
US2587439A (en) * 1950-01-05 1952-02-26 Electrographic Corp Making ready cylindrical printing plate
US2734150A (en) * 1956-02-07 Circuit component and method of making same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2734150A (en) * 1956-02-07 Circuit component and method of making same
GB646314A (en) * 1948-06-22 1950-11-22 James White Dalgleish Improvements in electric wiring and coil forming
US2587439A (en) * 1950-01-05 1952-02-26 Electrographic Corp Making ready cylindrical printing plate

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3235942A (en) * 1959-12-02 1966-02-22 Burroughs Corp Electrode assemblies and methods of making same
US3201851A (en) * 1960-10-05 1965-08-24 Sanders Associates Inc Method of making interconnecting multilayer circuits
US3268644A (en) * 1961-07-20 1966-08-23 Nuclear Materials & Equipment Method of making a specimen assembly
US3222756A (en) * 1961-08-23 1965-12-14 Melvin M Kanfman Techniques associated with inductive sensing of tunnel diode memory cells
DE1273649B (en) * 1961-10-14 1968-07-25 Wilhelm Ruppert Jun Process for the production of a printed circuit with the help of ribbon conductors
DE1206503B (en) * 1963-01-08 1965-12-09 Huels Chemische Werke Ag Process for making a printed circuit board
US3335048A (en) * 1963-02-19 1967-08-08 Lieges Des Hamendas Et De La P Mosaic tile assembly
US3300832A (en) * 1963-06-28 1967-01-31 Rca Corp Method of making composite insulatorsemiconductor wafer
US3290753A (en) * 1963-08-19 1966-12-13 Bell Telephone Labor Inc Method of making semiconductor integrated circuit elements
US3293399A (en) * 1963-12-14 1966-12-20 Balco Filtertechnik G M B H Printed circuit contact arrangement
US3391023A (en) * 1965-03-29 1968-07-02 Fairchild Camera Instr Co Dielecteric isolation process
US3296099A (en) * 1966-05-16 1967-01-03 Western Electric Co Method of making printed circuits
US4023997A (en) * 1967-10-09 1977-05-17 Western Electric Company, Inc. Method of placing an oriented array of devices on a releasable mounting
US3755027A (en) * 1970-11-19 1973-08-28 Philips Corp Method of manufacturing a gas discharge panel and panel manufactured by said method
US3913224A (en) * 1972-09-27 1975-10-21 Siemens Ag Production of electrical components, particularly RC networks
US3873429A (en) * 1973-07-09 1975-03-25 Rockwell International Corp Flush printed circuit apparatus
US4017968A (en) * 1975-09-18 1977-04-19 Jerobee Industries, Inc. Method of making plated through hole printed circuit board
US4606787A (en) * 1982-03-04 1986-08-19 Etd Technology, Inc. Method and apparatus for manufacturing multi layer printed circuit boards
US4751126A (en) * 1983-12-19 1988-06-14 Kabushiki Kaisha Toshiba A method of making a circuit board and a circuit board produced thereby
US4651417A (en) * 1984-10-23 1987-03-24 New West Technology Corporation Method for forming printed circuit board
US4680557A (en) * 1985-04-22 1987-07-14 Tektronix, Inc. Staggered ground-plane microstrip transmission line
US5525181A (en) * 1991-10-31 1996-06-11 U.S. Philips Corporation Method of manufacturing a multilayer printed circuit board having first and second conducting patterns connected through an adhesive layer and laminate for the manufacture of such a printed circuit board
US5496435A (en) * 1992-06-02 1996-03-05 Texas Instruments Incorporated Semiconductor lead frame lead stabilization
US6083837A (en) * 1996-12-13 2000-07-04 Tessera, Inc. Fabrication of components by coining
US6184140B1 (en) 1996-12-13 2001-02-06 Tessera, Inc. Methods of making microelectronic packages utilizing coining
US6651324B1 (en) * 2000-11-06 2003-11-25 Viasystems Group, Inc. Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer
US20040168314A1 (en) * 2000-11-06 2004-09-02 Giuseppe Pedretti Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer
US20080296055A1 (en) * 2007-05-29 2008-12-04 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of fabricating the same
US8161634B2 (en) * 2007-05-29 2012-04-24 Samsung Electro-Mechanics Co., Ltd. Method of fabricating a printed circuit board
US20120222299A1 (en) * 2009-01-09 2012-09-06 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing a printed circuit board

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