US2962161A - Semi-conductor package - Google Patents

Description

Nov. 29, 1960 J. w. LACY 2,962,161

SEMI-CONDUCTOR PACKAGE Filed July '7, 1958 INVENTOR James Flay BY www ATTORNEYS United States Patent 2,962,161 SEMI-CONDUCTOR PACKAGE James W. Lacy, Dallas, Tex.,

ments Incorporated, Dallas, Delaware asn'gnor to Texas Instru- Tex., a corporation of The present invention relates to a novel package, and more particularly to a unique arrangement for individually packaging semi-conductor devices, such as diodes and transistors.

In merchandizing semi-conductor devices, care must be taken in the handling and shipping of the devices. It is known that shocks and vibration, as well as other forces, can exert harmful effects upon the devices. One way to protect the devices from such harmful effects is by suitable packaging.

Accordingly, it is an object of the present invention to provide novel individual packages for semi-conductor devices which are simple in construction and yet provide a high degree of protection against shock and vibration.

It is another object of the present invention to provide a package for semi-conductor devices which may be fabricated as one of a plurality of attached but readily separable such packages.

It is another object of the present invention to provide a bookmatch-like package for semi-conductor devices which may be rapidly and economically fabricated and which provides a high degree of insulation of the semiconductor device against vibration and shock.

It is a further object of the present invention to pro- 'vide a package which may be easily loaded with products of a wide variety of configurations.

In accordance with the present invention, a large paper board blank is divided into a plurality of narrow strips by a series of parallel tear lines. The packages are formed all at once by folding and stapling the paper board blank as a unit. Individual packages may thereafter be removed. Alternatively, a single strip may be removed from the blank and assembled as an individual package. Each narrow strip is divided into four main panels of substantially equal length and additional small panels subsisting between predetermined ones of the large panels. One of the large panels is provided with a series of intersecting cut lines which define a small aperture in the upper portion of the panel. The blank is folded and stapled such that the panel with the aperture lies between a front panel and two rear panels. The leads of the semi-conductor device are inserted through the aperture in the aforesaid apertured panel and into the region between this panel and one of the rear panels disposed behind it. The leads cause these two panels to stand off from one another and this in turn provides a cushion effect between the main body of the semi-conductor device, which is partially received in the aforesaid aper- (me, and the rear panels. The front panel constitutes the front flap of the package and is adapted to have its lower portion inserted behind a small front flap formed by one of the aforesaid small panels being stapled to the panel with the aperture. The front panel can be inserted into the region between the apertured panel and the front flap only a predetermined distance as determined by the position of the staple and in consequence, is forced to bow outwardly away from the body of the semi-conducpanel13 which -2,962,16l Patented Nov. 29, 1960 2 tor device, thereby to shield the device from direct blows. It is therefore another object of the present invention to provide a package for semi-conductor devices wherein the leads of the device when located in the package are arranged to produce a cushioning effect for the semi-conductor unit.

It is yet another object of the present invention to provide a package for semi-conductor devices in which a front flap may be readily folded out of the way to enable easy access to the device. The front flap, when in a position to cover the device, stands otf therefrom to provide cushioning therefor.

It is yet a further object of the present invention to provide a package convenient for the group-lot handling, storage and sale of small products while at the same time providing convenient from the group-lot for individual unit handling and sale.

The above and still further objects, features and advantages of the present invention will become apparent upon consideration of the following detailed description of one specific embodiment thereof, especially when taken in conjunction with the accompanying drawing, wherein:

Figure 1 is a front elevational view of the blank from which a plurality of packages of the present invention may be formed;

Figure 2 is a side view in elevation of a partially fabricated package;

Figure 3 is a side view of a fully fabricated package with a semi-conductor device disposed therein; and

Figure 4 is a front elevational view of the aperture panel with a semi-conductor device arranged thereon.

Referring specifically to Figure 1 of the accompanying drawings, there are illustrated a plurality of blanks from which the packages or semi-conductor device holders of the present invention may be fabricated. A number of the blanks are formed from a continuous sheet which is divided into individual blanks by parallel tear lines 1, formed by a plurality of short discontinuous scores or cuts along the division line between the various blanks. Each of the blanks comprises main panels 2, 3, 4 and 5, arranged from the top to the bottom in Figure l in the order recited, all of the panels being of approximately the same length and of the same width since the division fines 1 are parallel with one another. The panels 2 and 3 are separated by a fold line 6 while the main panels 3 and 4 are separated by two intermediate panels 7 and 8. The panel 7 is defined by a first fold line 9 which it shares in common with panel 3, and a second fold line 11 which it shares in common with panel 8. The panel 8 is further defined by a fold line 12 which it shares in common with the main panel 4. The panel 8 has a longer length than panel 7 for purposes which will become apparent as the description proceeds. The main panels 4 and 5 are separated by a relatively narrow is defined by a fold line 14 which it shares in common with the main panel 4 and a fold line 16 which it shares in common with the main panel 5.

All of the panels, except the panel 3, are perfectly plain soas to provide unbroken continuous surfaces suitable to receive printing thereon such as advertising or directions or other matter. The panel 3 is provided with two cut lines 18 and 19 which are mutually parallel to the perforated lines 1 and which are disposed equal distances on opposite of the panel 3. The lines 18 and 19 are located in the upper third portion, as viewed in Figure 1 of the panel. There are further provided cut lines 20 and 21 which are mutually perpendicular to cut lines 18 and 19. The line 20 is disposed above the cut line 21, as viewed in Figure 1, and subsists only between the lines 18 and 19 while the line 21 extends between and outwardly from the individual packages easily separable sides of the longitudinal center line.

3 cut lines 18 and 19. The lines 18, 19, 20 and 21 define an aperture 17, which is adapted to partly receive a transistor or other small body. The portion of the panel 3 subsisting between the cut lines 18, 19 and 20 is a tab 23 connected to the panel only at its upper edge. The

cut lines 18, 19 and 21 define below the line 21 a further tab 22 which is connected to the main panel along only its lower edge.

In order to form the holder of the present invention, it is not necessary to divide the various main strips from one another along the lines 1 and, in fact, large numbers of these connected blanks may be folded and assembled in a single folding and assembling operation. In assembling the holders, and reference is now made to Figure 2 of the accompanyingdrawing, the main panel 2 is folded clockwise and downwardly along the fold line 6 while the intermediate panel 7 is folded clockwise and upwardly along the fold line 9 from the bottom of the panel 3. This now provides the arrangement illustrated in Figure 2 and in order to maintain the relative positions of the panels 2, 3 and 7 a conventional staple 24 or other suitable fastening means, is driven through these three panels and crimped over adjacent one edge, preferably the outer edge of the panel 2. Thereafter, the remainder of the blanks may be folded counterclockwise, as viewed in Figure 2, along the various fold lines 11, 12, 14 and 16, and the bottom edge of the panel 5 is inserted between the panels 7 and 3 to complete the package (see Figure 3). Since the panel 8 is longer than the panel 7, the fold line 12 may be disposed immediately below the fold line 9. Further, since the panel 5 can only be inserted a short distance into the region between the panels 7 and 3, the panel 5 is bowed outwardly as shown in Figure 3.

In utilizing the device for holding transistors or diodes, the package is made ready to receive a device by lifting front panel 5 free of the intermediate panel 7 and folding it backto expose the panel 3. The transistor or diode, which is designated generally by the reference numeral 26, has a plurality of leads 27 which are passed through the aperture 17, behind the flap 22 and down into the region between the panels 2 and 3. The leads 27, by virtue of their resiliency, maintain the panels 2 and 3 spaced apart. The transistor or diode, when so positioned, has its rearwardmost portion, as viewed in Figure 4, or the right hand portion of its body, as viewed in Figure 3, disposed partially in the aperture 17 and in the contact with the flap 23. The portions 28 of the panel 3 disposed above the out line 21 and adjacent the sides of the apertures 17 are also pressed rearwardly as viewed in Figure 4, or to the right, as viewed in Figure 3. As a result, the transistor is cushioned against the flap 23 and portions 28 of the panel 3. The front panel 5 may now be inserted between the panels 3 and 7, and as indicated before. Since it is of the same length as the panels 2 and 3, but is restricted in its downward movement by the staple 24, it bows outwardly to provide a front cover for the device which is spaced from the device 26 and hence provides further cushioning. Upon inspection of Figure 3, it is immediately evident that the device 26 is supported in the panel 3 and held in a spaced relation from the panel 2 by means of its own lead wires 27 and the fiap 23 and also held spaced from the panel 5 due to the bowing thereof. These features contribute to the protection of the device from shock and impact.

Because of the initial construction of the blanks from which the holders of the present invention are fabricated, large blocks of these blanks may be fabricated in a single operation. For example, the various cut lines 18 through 21, the score lines 6, 9, 11, 12, 14 and 16 and the perforated lines 1 may all be formed in a single stamping operation of a series of intermittent operations. The perforated lines 1 allow the various strips to be readily separated before fabrication into individual packages. Alternatively, the perforated lines 1 permit simultaneous folding of a large strip of blanks in order to form a plurality of packages all at once.

Hence it can be seen the units can be stored as large packages in group-lots and the individual units removed, still within their individual packages, for sale, distribution and use singly or in small quantities.

The package of the present invention is capable of various modifications within the scope of the invention. For instance, the panel 2 could take the place of panel 3 with the fold line 9 subsisting under panel 2. In such a case the 'cut lines 18 through 21 would be applied to panel 2 instead of panel 3. Also, other arrangements of cut lines may be employed so long as they define an aperture surrounded by generally resilient flaps.

Although the invention has been described and illus trated with respect to a preferred embodiment of the invention, it will be clear that variations of the general arrangement and of the details of construction may be re sorted to without departing from the true spirit and scope of the invention as defined in the appended claim.

What I claim is:

A container for an electronic device having a cap portion and at least one lead wire projecting from said cap portion, said container being formed from a unitary body of pliable material comprising a front panel, a back panel and first and second intermediate panels disposed between said front and back panels, all of said panels being substantially the same dimensions, said first intermediate panel being disposed between said front panel and said second intermediate panel, one end of each of said front and back panels being interconnected at one end of said container, a pair of relatively small panels arranged serially between and interconnected to the other end of said back panel and one end of said first intermediate panel at the other end of said container, said small panels being disposed adjacent the side of said first intermediate panel remote from said second intermediate panel, a fastener passing through said intermediate panels and the small panel adjacent to said first intermediate panel securing them together, said first intermediate panel having adjacent said one end of said container a first pair of cut lines disposed generally perpendicular to the junctions between panels, a second pair of cut lines disposed generally parallel to the junctions between panels, one of said second pair of cut lines subsisting only between said first pair of cut lines and the other of said second pair of cut lines extending between and outwardly of said first pair of cut lines, the area above said one of said second pair of cut lines and between said first pair of cut lines defining a first flap adapted to be bent towards said second intermediate panel, the area below said other of said second pair of cut lines and between said first pair of cut lines defining a second flap adapted to be bent away from said second intermediate panel, the cap of the electronic device to be contained being adapted to reside in the area between said first and said second pair of cut lines and to be held therein by said flaps, and the lead wire for said electronic device being adapted to reside between said first and said second intermediate panels.

References Cited in the file of this patent UNITED STATES PATENTS 2,049,124 Linderman July 28, 1936 2,059,392 Polacsek Nov. 3, 1936 2,663,412 Cerino Dec. 22, 1953 FOREIGN PATENTS 471,746 Great Britain Sept. 9, 1937

Images