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Patente citante Fecha de presentación Fecha de emisión Cesionario original Título
US56073418 Ago 19944 Mar 1997Method and structure for polishing a wafer during manufacture of integrated circuits
US56182275 Sep 19958 Abr 1997Mitsubushi Materials Corporation
Mitsubushi Materials Silicon Corporations
Apparatus for polishing wafer
US57022908 Abr 199630 Dic 1997Block for polishing a wafer during manufacture of integrated circuits
US573317525 Abr 199431 Mar 1998Polishing a workpiece using equal velocity at all points overlapping a polisher
US583680725 Abr 199617 Nov 1998Method and structure for polishing a wafer during manufacture of integrated circuits
US595137327 Oct 199514 Sep 1999Applied Materials, Inc.Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning
US613671526 Jul 199924 Oct 2000Applied Materials, Inc.Circumferentially oscillating carousel apparatus for sequentially polishing substrates
US709754418 Feb 200029 Ago 2006Applied Materials Inc.Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US723809013 Oct 20043 Jul 2007Applied Materials, Inc.Polishing apparatus having a trough
US725563210 Ene 200614 Ago 2007Applied Materials, Inc.Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US76149397 Jun 200710 Nov 2009Applied Materials, Inc.Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US807989416 Oct 200920 Dic 2011Applied Materials, Inc.Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion