US3485597A - Electroless deposition of nickel-phosphorus based alloys - Google Patents

Electroless deposition of nickel-phosphorus based alloys Download PDF

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US3485597A
US3485597A US736892*A US3485597DA US3485597A US 3485597 A US3485597 A US 3485597A US 3485597D A US3485597D A US 3485597DA US 3485597 A US3485597 A US 3485597A
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nickel
electroless
phosphorus
tungsten
bath
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US736892*A
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Fred Pearlstein
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US Department of Army
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48Coating with alloys
    • C23C18/50Coating with alloys with alloys based on iron, cobalt or nickel
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12729Group IIA metal-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12778Alternative base metals from diverse categories

Definitions

  • This invention is a divisional application of my copending application Ser. No. 407,941, filed Oct. 30, 1964, for Electroless Deposition of Nickel-Phosphorus Based Alloys, now abandoned and relates to electroless deposition and more particularly concerns the electroless de position of nickel-phosphorus alloys containing tungsten, zinc, tin, rhenium and molybdenum.
  • Nickel coatings have long been used for improving the appearance of steel products and yet protecting the basis metal from harmful or corrosive attacks. Until recently, nickel plating was accomplished by an electrodeposition process which suffered essentially in the poor throwing power of the electrodeposited nickel making it difiicult to achieve uniformly of coating on irregularly shaped objects.
  • a further interesting feature of electroless deposited nickel resides in the fact that it can be readily applied directly over properly activated non-conductors.
  • the prior art electroless technique is restrictive in that vary few metals can be deposited thereby.
  • improved tarnish resistance there are many applications wherein improved tarnish resistance,
  • Another object of th invention is to provide bath solutions for the electroless deposition of nickel-phosphorus alloys containing other metals.
  • the effective range of pH is between 7 and 10 although a pH of '8.2 is preferred.
  • the bath temperature range is between about to C. with 98 C. being most desirable.
  • the amount of tungsten in the electroless deposit is about 13% with the balance being about 94% nickel and 6% phosphorus when using the preferred bath of Table I above.
  • Rhenium as KReO4. Zinc as ZnSO4-7Hz0.
  • N orE.-Xmetal salt which is the source of metal codcpositing with Ni.
  • the preferred pH for the electroless plating from the ammoniated alkaline citrate bath is 9.0 at a bath temperature of 98 C.
  • the effective pH and temperature ranges will be about 8 to 10 and 90 to 100 C. respectively.
  • the pH is maintained by periodic additions of NH OH.
  • any combination of tungsten, tin, rhenium, zinc and molybdenum may be codeposited electrolessly with nickel-phosphorus.
  • nickel-phosphorus-rhenium-tungsten may be electroless deposited from both an unammoniated and an ammoniated alkaline citrate bath.
  • the nickel-phosphorus-zinc coating was found to be 100 miilivolts more active in potential than conventional electroless nickel deposits. This property is useful for sacrificial protection of certain metals.
  • An article of manufacture comprising a basis metal structure having an electroless deposited coating thereon, said coating consisting essentially of an alloy of nickel, phosphorus and at least one element selected from the group consisting of tungten, molybdenum, rhenium, beryllium, rhodium, palladium, and platinum, said alloy being characterized as a nickel-phosphorus based alloy wherein nickel is present in major proportions and phosphorus is present in minor proportions, and wherein said element is present in an amount ranging between greater than 1% to about 2.
  • An article according to claim 1 ment comprises tungsten.
  • An article according to ment comprises molybdenum.
  • An article according to ment comprises rhenium.
  • An article according to ment comprises beryllium.
  • An article according to ment comprises rhodium.
  • An article according to ment comprises palladium.
  • An article according to ment comprises platinum.

Description

United States Patent Oflice U.S. Cl. 29-194 Claims ABSTRACT OF THE DISCLOSURE Articles of manufacture made from a basis metal having an electrolessly deposited nickel-phosphorus based alloy coating thereon, the alloy containing from more than 1% to about 45% of an element which is codeposited with the alloy, the element being tungsten, rhenium, berylluim, rhodium, palladium, platinum, tin, zinc, molybdenum or gold. The nickel predominates the phosphorus in quantity.
The invention described herein may be manufactured and used by or for the Government for governmental purposes without the payment to one of any royalty thereon.
This invention is a divisional application of my copending application Ser. No. 407,941, filed Oct. 30, 1964, for Electroless Deposition of Nickel-Phosphorus Based Alloys, now abandoned and relates to electroless deposition and more particularly concerns the electroless de position of nickel-phosphorus alloys containing tungsten, zinc, tin, rhenium and molybdenum.
Nickel coatings have long been used for improving the appearance of steel products and yet protecting the basis metal from harmful or corrosive attacks. Until recently, nickel plating was accomplished by an electrodeposition process which suffered essentially in the poor throwing power of the electrodeposited nickel making it difiicult to achieve uniformly of coating on irregularly shaped objects.
In the prior art, a chemical nickel plating process was developed based on the reduction of nickel salts by hypophosphite, and is represented approximately by the following reaction:
catalytic Ni++ 2H PO2' 21120 Ni ZHPO 411+ H2 sur on The electroless deposition of nickel, or more correctly, nickel-phosphorus alloys, occurs wherever the basis metal is in contact with the electroless plating solution and provides excellent deposition uniformity. I have plated numerous small, intricately shaped steel components, such, for example, as timing mechanisms, very successfully, with the electroless process, whereas the electrodeposition process was ineffective in plating such mechanisms. Similarly, the interiors of long, narrow tubes can readily be plated with the elecroless nickel process whereas it is virtually an impossible task to be accomplished by standard electrodeposition methods. Further, the hardness of electroless deposited nickel is greater than that of electrodeposited nickel and can be further increased by additional heat treatment. A further interesting feature of electroless deposited nickel resides in the fact that it can be readily applied directly over properly activated non-conductors. However, the prior art electroless technique is restrictive in that vary few metals can be deposited thereby. In addition, there are many applications wherein improved tarnish resistance,
3,485,597 Patented Dec. 23, 1969 to acid attack, ductlity, corrosion protection of a basis metal, high temperature oxidation resistanc and wear resistance would be desirable.
It is therefore a principal object of this invention to provide new and useful electroless nickel-phosphorus based alloys containing other metals.
Another object of th invention is to provide bath solutions for the electroless deposition of nickel-phosphorus alloys containing other metals.
Other and further objects of the invention will be apparent to those skilled in the art upon study of this disclosure.
Briefly, and in accordance with my invention, I have discovered that tarnish-resistant and/or corrosion resistant alloys can be successfully electroless plated onto the basis metals normally employed in electroless nickel deposition.
More specifically, I have found that when sodium tungsten is added to the prior art acid-citrate electroless nickel solution bath and the pH of the bath is raised above about 7, substantial tungsten content is detected in deposits. In order to prevent the precipitation of nickel salts at higher pH values, the concentration of the nickel salts is decreased to about 20% of the usual concentration (35 g./l. of NiSO -6H O) and the remaining replaced by an atomic equivalent of tungsten obtained from sodium tungstate.
In Table I it will be seen that I have successfully electroless plated nickel-phosphorus alloys containing tungsten from an unammoniated alkaline citrate bath solution.
TABLE L-NICKEL-PHOSPHORUS ALLOY OF TUNGSTEN FROM UNAMMONIATED ALKALINE CITRATE BATH The effective range of pH is between 7 and 10 although a pH of '8.2 is preferred. The bath temperature range is between about to C. with 98 C. being most desirable. The amount of tungsten in the electroless deposit is about 13% with the balance being about 94% nickel and 6% phosphorus when using the preferred bath of Table I above.
' Sirninlarly, I have found that tin, zinc, rhenium, beryllium and rhodium may be electroless deposited with the nickel-phosphorus when the appropriate metal salt is used in place of sodium tungstate in the exampl of Table I above. See Table II.
NOTE.-A11 bath solutions were operated at 98 C. and pH=8.2.
These alloys however require that the bath solution be stabilized against decomposition such as by the addition of about 0.2 ml./l. of a solution of 10 g./l. of mercaptobenzothiazole in 2 N NaOH.
In addition, I have found that a number of metals, including rhenium, zinc, molybdenum and tin, can be codeposited with nickel-phosphorus using an ammoniated alkaline citrate bath. See the examples of Table III,
TABLE III Bath Composition Content of Effective Preferred Deposit from Preferred Bath Composition D Tungsten as NazWO4'2HzO 20-80 moi percent 60 moi percent 12% Tungsten.
Rhenium as KReO4. Zinc as ZnSO4-7Hz0.
10-40 moi percent.
1-20 moi percent 4 moi percent 45% Rhonium.
. 20 moi percent 8% Zinc.
Tin as NagSn -3HzO 5-20 mol percent. moi percent. 2% Till. Molybdenum as Na MoO 0.1-0.4 moi percen 0.2 moi percent- 6% Molybdenum. Palladium as PdClz 0. 1-1. 0 moi percent. 0.7 moi percent. 5% Palladium. Platinum as HPtCli 3H2O... 0.1-1.0 moi percent. 0. 4. mol percent 1% Platinum. Gold as HAuO14-3H2O 0.1-1.0 moi percent 0. 4 moi percent. 1% Gold.
Balance being Ni-i-P.
N orE.-Xmetal salt which is the source of metal codcpositing with Ni.
The preferred pH for the electroless plating from the ammoniated alkaline citrate bath is 9.0 at a bath temperature of 98 C. The effective pH and temperature ranges will be about 8 to 10 and 90 to 100 C. respectively. The pH is maintained by periodic additions of NH OH. Further, any combination of tungsten, tin, rhenium, zinc and molybdenum may be codeposited electrolessly with nickel-phosphorus. For example, nickel-phosphorus-rhenium-tungsten may be electroless deposited from both an unammoniated and an ammoniated alkaline citrate bath.
Salt Spray Corrosion tests were performed on steel panels coated with 0.3 .mil of some of the deposits shown in Tables I and III. My nickel-phosphorus-tin and nickelphosphorus-rhenium deposits exhibited superior corrosion protection of the steel substrate as compared to the standard electroless nickel deposit. My nickel-phosphorustin and particularly my nickel-phosphorus-tungsten deposits provided superior tarnish resistance qualities.
Acid resistance tests performed on the aforementioned panels revealed that my nickel-phosphorus-tungsten deposit has superior reistance to 50% nitric acid attack over conventional electroless-nickel coated panels.
The nickel-phosphorus-zinc coating was found to be 100 miilivolts more active in potential than conventional electroless nickel deposits. This property is useful for sacrificial protection of certain metals.
It is apparent that m the foregoing description of my invention, new bath compositions are described for yielding electroless deposited alloys which are useful for providing superior corrosion protective properties to a basis metal and for imparting excellent tarnish resistant properties thereto.
I claim:
1. An article of manufacture comprising a basis metal structure having an electroless deposited coating thereon, said coating consisting essentially of an alloy of nickel, phosphorus and at least one element selected from the group consisting of tungten, molybdenum, rhenium, beryllium, rhodium, palladium, and platinum, said alloy being characterized as a nickel-phosphorus based alloy wherein nickel is present in major proportions and phosphorus is present in minor proportions, and wherein said element is present in an amount ranging between greater than 1% to about 2. An article according to claim 1 ment comprises tungsten.
3. An article according to ment comprises molybdenum.
4. An article according to ment comprises rhenium.
5. An article according to ment comprises beryllium.
6. An article according to ment comprises rhodium.
7. An article according to ment comprises palladium.
8. An article according to ment comprises platinum.
9. An article according to claim 2 wherein said tungsten comprises at least 13% by weight of said coating.
10. An article according to claim 4 wherein said rhenium comprises at least 45% by weight of said coating.
wherein said eleclaim 1 wherein said eleclaim 1 wherein said eleclaim 1 wherein said eleclaim 1 wherein said eleclaim 1 wherein said ele claim 1 wherein said ele- References Cited UNITED STATES PATENTS 2,828,227 3/1958 Eisenberg 117-130 2,995,473 8/1961 Levi 117-130 X 3,077,285 2/1963 Budininkas 29-l96.6 X 3,178,311 4/1965 Cann 117-130 X 3,202,538 8/1965 Beynon 117-130 X 3,234,031 2/1966 Z'rrngiebl et al. 106-1 3,370,979 2/1968 Schmeckenbecher 117-130 X L. DEWAYNE RUTLEDGE, Primary Examiner E. L. WEISE, Assistant Examiner US. Cl. X.R.
US736892*A 1964-10-30 1968-05-01 Electroless deposition of nickel-phosphorus based alloys Expired - Lifetime US3485597A (en)

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Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2522939A1 (en) * 1974-05-24 1975-12-04 Richardson Chemical Co POLYMETALLIC NICKEL ALLOYS CONTAINING NICKEL AND SUITABLE COATING STRIPS
US3971861A (en) * 1974-10-25 1976-07-27 Handy Chemicals Limited Alloy plating system
US4167416A (en) * 1976-10-19 1979-09-11 Alfachimici S.P.A. Composition for the electroless deposition of nickel base alloys
US4361602A (en) * 1980-09-13 1982-11-30 Agency Of Industrial Science & Technology Method for production of positive electrode for electrolysis of water
US4632857A (en) * 1974-05-24 1986-12-30 Richardson Chemical Company Electrolessly plated product having a polymetallic catalytic film underlayer
US20040126548A1 (en) * 2001-05-28 2004-07-01 Waseda University ULSI wiring and method of manufacturing the same
US20060278123A1 (en) * 2003-05-09 2006-12-14 Basf Aktiengesellschaft Composition for the currentless deposition of ternary materials for use in the semiconductor industry
DE102006020988A1 (en) * 2006-05-04 2007-11-08 Nanogate Ag Precious metal-containing nickel layer
US20080241406A1 (en) * 2007-03-29 2008-10-02 Ebara Corporation Electroless plating bath and method for producing high-temperature apparatus member using the bath
DE102007053457A1 (en) 2007-11-07 2009-05-14 Nanogate Ag Gold-containing nickel layer
DE102008036211A1 (en) 2008-08-02 2010-02-04 Nanogate Ag Process for the deposition of nickel and precious metal from the same bath
US20120177925A1 (en) * 2011-01-11 2012-07-12 Omg Electronic Chemicals, Llc Electroless plating bath composition and method of plating particulate matter
US8585811B2 (en) 2010-09-03 2013-11-19 Omg Electronic Chemicals, Llc Electroless nickel alloy plating bath and process for depositing thereof
US20160145746A1 (en) * 2013-06-13 2016-05-26 Toyo Kohan Co., Ltd. Palladium plate coated material and method of producing palladium plate coated material
CN106319486A (en) * 2016-09-21 2017-01-11 芜湖扬展新材料科技服务有限公司 Preparing method for titanium alloy with high friction coefficient
CN106498375A (en) * 2016-09-21 2017-03-15 芜湖扬展新材料科技服务有限公司 The preparation method of the high aero titanium alloy of coefficient of friction
CN106637152A (en) * 2016-09-21 2017-05-10 芜湖扬展新材料科技服务有限公司 Preparation method of titanium alloy
CN106637153A (en) * 2016-09-21 2017-05-10 芜湖扬展新材料科技服务有限公司 Preparation method of titanium alloy
CN106637150A (en) * 2016-09-21 2017-05-10 芜湖扬展新材料科技服务有限公司 Manufacturing method for aero titanium alloys
CN106637151A (en) * 2016-09-21 2017-05-10 芜湖扬展新材料科技服务有限公司 Preparation method of aeronautic titanium alloy high in friction coefficient
CN110965052A (en) * 2019-12-25 2020-04-07 廊坊师范学院 Preparation process of medium-temperature chemical nickel-phosphorus plating alloy on metal surface
US10655228B2 (en) * 2013-10-02 2020-05-19 Vallourec Oil And Gas France Abutment for a tubular component overlaid with a metallic composite deposit and method for making it
US11835307B2 (en) 2019-04-12 2023-12-05 Rheem Manufacturing Company Applying coatings to the interior surfaces of heat exchangers

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JPS5814016B2 (en) * 1978-03-31 1983-03-17 株式会社日立製作所 Substrate metal plate material for directly heated oxide cathode
WO1987005338A1 (en) * 1986-03-04 1987-09-11 Ishihara Chemical Co., Ltd. Palladium-base electroless plating solution
DE3713734A1 (en) * 1987-04-24 1988-11-17 Collardin Gmbh Gerhard METHOD FOR THE DEPOSITION-FREE DEPOSITION OF TERNAEREN, NICKEL AND PHOSPHORUS ALLOYS

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US2828227A (en) * 1956-03-30 1958-03-25 Sylvania Electric Prod Electroless deposition of vanadium alloys
US2995473A (en) * 1959-07-21 1961-08-08 Pacific Semiconductors Inc Method of making electrical connection to semiconductor bodies
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Cited By (39)

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Publication number Priority date Publication date Assignee Title
US4019910A (en) * 1974-05-24 1977-04-26 The Richardson Chemical Company Electroless nickel polyalloy plating baths
US4632857A (en) * 1974-05-24 1986-12-30 Richardson Chemical Company Electrolessly plated product having a polymetallic catalytic film underlayer
DE2522939A1 (en) * 1974-05-24 1975-12-04 Richardson Chemical Co POLYMETALLIC NICKEL ALLOYS CONTAINING NICKEL AND SUITABLE COATING STRIPS
US3971861A (en) * 1974-10-25 1976-07-27 Handy Chemicals Limited Alloy plating system
US4167416A (en) * 1976-10-19 1979-09-11 Alfachimici S.P.A. Composition for the electroless deposition of nickel base alloys
US4361602A (en) * 1980-09-13 1982-11-30 Agency Of Industrial Science & Technology Method for production of positive electrode for electrolysis of water
US20100006326A1 (en) * 2001-05-28 2010-01-14 Nec Electronics Corporation Ulsi wiring and method of manufacturing the same
US20040126548A1 (en) * 2001-05-28 2004-07-01 Waseda University ULSI wiring and method of manufacturing the same
US8784931B2 (en) 2001-05-28 2014-07-22 Waseda University ULSI wiring and method of manufacturing the same
US7850770B2 (en) * 2003-05-09 2010-12-14 Basf Aktiengesellschaft Compositions for the currentless deposition of ternary materials for use in the semiconductor industry
US9062378B2 (en) * 2003-05-09 2015-06-23 Basf Aktiengesellschaft Compositions for the currentless deposition of ternary materials for use in the semiconductor industry
US20110124191A1 (en) * 2003-05-09 2011-05-26 Basf Aktiengesellschaft Compositions for the currentless deposition of ternary materials for use in the semiconductor industry
US20060278123A1 (en) * 2003-05-09 2006-12-14 Basf Aktiengesellschaft Composition for the currentless deposition of ternary materials for use in the semiconductor industry
US20090186240A1 (en) * 2006-05-04 2009-07-23 Nanogate Ag Nickel coat containing precious metals
WO2007128702A1 (en) * 2006-05-04 2007-11-15 Nanogate Ag Nickel layer containing noble metal
DE102006020988A1 (en) * 2006-05-04 2007-11-08 Nanogate Ag Precious metal-containing nickel layer
DE102006020988B4 (en) * 2006-05-04 2012-08-30 Nanogate Ag Noble metal-containing nickel bath, its use for the production of a noble metal-containing nickel layer, noble metal-containing nickel layer and their use
US20080241406A1 (en) * 2007-03-29 2008-10-02 Ebara Corporation Electroless plating bath and method for producing high-temperature apparatus member using the bath
US8012251B2 (en) * 2007-03-29 2011-09-06 Ebara Corporation Electroless plating bath and method for producing high-temperature apparatus member using the bath
DE102007053457A1 (en) 2007-11-07 2009-05-14 Nanogate Ag Gold-containing nickel layer
DE102008036211A1 (en) 2008-08-02 2010-02-04 Nanogate Ag Process for the deposition of nickel and precious metal from the same bath
US8585811B2 (en) 2010-09-03 2013-11-19 Omg Electronic Chemicals, Llc Electroless nickel alloy plating bath and process for depositing thereof
US20120177925A1 (en) * 2011-01-11 2012-07-12 Omg Electronic Chemicals, Llc Electroless plating bath composition and method of plating particulate matter
US8858693B2 (en) * 2011-01-11 2014-10-14 Omg Electronic Chemicals, Llc Electroless plating bath composition and method of plating particulate matter
US10087528B2 (en) * 2013-06-13 2018-10-02 Toyo Kohan Co., Ltd. Palladium plate coated material and method of producing palladium plate coated material
US20160145746A1 (en) * 2013-06-13 2016-05-26 Toyo Kohan Co., Ltd. Palladium plate coated material and method of producing palladium plate coated material
EP3009529A4 (en) * 2013-06-13 2017-01-25 Toyo Kohan Co., Ltd. Palladium plate coated material and production method therefor
US10655228B2 (en) * 2013-10-02 2020-05-19 Vallourec Oil And Gas France Abutment for a tubular component overlaid with a metallic composite deposit and method for making it
CN106498375A (en) * 2016-09-21 2017-03-15 芜湖扬展新材料科技服务有限公司 The preparation method of the high aero titanium alloy of coefficient of friction
CN106637153A (en) * 2016-09-21 2017-05-10 芜湖扬展新材料科技服务有限公司 Preparation method of titanium alloy
CN106637150A (en) * 2016-09-21 2017-05-10 芜湖扬展新材料科技服务有限公司 Manufacturing method for aero titanium alloys
CN106637151A (en) * 2016-09-21 2017-05-10 芜湖扬展新材料科技服务有限公司 Preparation method of aeronautic titanium alloy high in friction coefficient
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