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Patente citante Fecha de presentación Fecha de emisión Cesionario original Título
US394224118 Feb 19759 Mar 1976Kabushiki Kaisha Suwa SeikoshaSemiconductor devices and methods of manufacturing same
US40690747 Ene 197617 Ene 1978Method of manufacturing semiconductor devices
US418313411 Dic 197815 Ene 1980Westinghouse Electric Corp.High yield processing for silicon-on-sapphire CMOS integrated circuits
US464377719 Dic 198417 Feb 1987Kabushiki Kaisha ToshibaMethod of manufacturing a semiconductor device comprising resistors of high and low resistances
US519139630 Ene 19892 Mar 1993International Rectifier Corp.High power MOSFET with low on-resistance and high breakdown voltage
US533896112 Feb 199316 Ago 1994International Rectifier CorporationHigh power MOSFET with low on-resistance and high breakdown voltage
US55980186 Jun 199528 Ene 1997International Rectifier CorporationHigh power MOSFET with low on-resistance and high breakdown voltage
US574208726 Oct 199521 Abr 1998International Rectifier CorporationHigh power MOSFET with low on-resistance and high breakdown voltage
US58693713 Nov 19959 Feb 1999STMicroelectronics, Inc.Structure and process for reducing the on-resistance of mos-gated power devices
US60464734 Ago 19974 Abr 2000STMicroelectronics, Inc.Structure and process for reducing the on-resistance of MOS-gated power devices