US3710211A - Front contacted electrical component - Google Patents
Front contacted electrical component Download PDFInfo
- Publication number
- US3710211A US3710211A US00122206A US3710211DA US3710211A US 3710211 A US3710211 A US 3710211A US 00122206 A US00122206 A US 00122206A US 3710211D A US3710211D A US 3710211DA US 3710211 A US3710211 A US 3710211A
- Authority
- US
- United States
- Prior art keywords
- layer
- metal
- connecting wires
- condensor
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Insulated Conductors (AREA)
- Resistance Heating (AREA)
Abstract
A pile or layer condensor is provided with external connecting wires on its two frontal sides by pressing the connecting wires into an outer metallic layer which has a lower melting point than an inner metallic layer which contacts the plates of the condensor. The connecting wires are thereby embraced by the outer layer and adhere to the inner layer.
Description
United States Patent 1191 Behn et al. 1451 Jan, 9, 1973 [54] FRONT CONTACTED ELECTRICAL [56] References Cited T COMPONEN UNITED STATES PATENTS [76] Inventors: Reinhard Behn, Balanstr. 95, Mu- 2389018 11/1945 B u d 317/261X :1 ar ,1 Heinrich 2,418,461 4/1947 Becker... .29/492 x Regellsburg, celfhard Hoyle" 2,585,752 2 1952 Dorst ....317 25s x Balanstr- Mumch; Harm! 2,953,673 9/1960 Bouton... ..29/628 Kessler, Dechbettener S11. 19, 3,304,475 2/1967 Gowen ..317/261 Regensburg, all of Germany Primary Examiner-E. A. Goldberg [221 Filed March 1971 Attorney-Hill, Sherman, Meroni, Gross & Simpson [2]] Appl. No.: 122,206
' [57] ABSTRACT Related U.S. Application Data i i A p1le or layer condensor 1s pr0v1ded w1th external Continuation of y 1969, connecting wires on its two frontal sides by pressing abandonedthe connecting wires into an outer metallic layer which has a lower melting point than an inner metallic [30] Foreign Application Priority Data layer which contacts the plates of the condensor. The connecting wires are thereby embraced by the outer July 24, 1968 Germany ..P 17 64 717.5 layer and adhere to the inner layer. [52] U.S. Cl ..3l7/26l, 317/242 1 Cl im, 1 Drawing Figure [51] Int. Cl. ..H01g 1/14 [58] Field of Search ..317/26l, 242, 258; 29/492, 29/628 L ll 1 A RiOZSmml/lll 841,860 filed July 15, 1969 now abandoned.
BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to electrical components, and more particularly to the provision of connecting wires to such components.
2. Description of the Prior Art Pile or layer condensors which are produced from a master condensor wound on a drum by dividing the master condensor in the radial direction and in the circumferential direction have what are termed frontal sides, which sides have a metallic layer applied thereto for commonly connecting the condensor plates of like plurality. Each condensor usually has two such frontal sides. Layer condensors and other electrical elements, such as resistances,'are frequently installed into printed conductor plates in a vertical assembly. Holes are placed into the conductor plate with a standardized screen dimension and it is into these holes that the connecting wires are inserted and soldered during assembly of the particular circuit. The distance of the connecting wires at the building component may vary only in very definite limits due to the predetermined tolerance of the distance and diameters of holes. In order to maintain this screen dimension substantially constant, it is heretofore been a practice to provide space holders at the building element, for example, bottom platelets or cups with perforations. Alternatively, the distance is determined with the aid of a device when the wires are applied, for example with the aid of a gauge when the wires are soldered on. Moreover, in the known methods the distance can be adjusted during a pressing operation, or the distance is produced mechanically only prior to insertion into the conductor plate. These methods are complicated and difficult to perform, and in some cases entail considerable cost.
It is therefore highly desirable and a primary object of the present invention to provide techniques for maintaining the distance of the connecting wires of electrical components such as condensors and resistors initially within a certain tolerance.
SUMMARY OF THE INVENTION According to the invention the distance of the external connecting wires of an electrical component is determined by applying a first contact layer to the component having a higher melting point than a second contact layer which is applied over the first contact layer. The contact wires are then pressed into the metal of the second contact layer whereupon they are embraced thereby and adhere to the first contact layer. Heat is applied to assist in forcing the connecting wires through the second or outer contact layer.
The foregoing shows a possibility of assuring the maintenance of the screen tolerance by the design of the electrical element itself. For example, a so-called layer, pile or stack condensor is actually fabricated in such a manner that partial pieces with the desired capacity are cutout of an annularly coiled body which is wound on a drum and contacted by meansof metal spraying techniques which are known in art per se, two such metal layers being provided, onefor each set of capacitor plates of like polarity. For resistors, two superposed metal layers would be provided where required for each terminal of the resistor.
BRIEF DESCRIPTION OF THE DRAWING Other objects, features and advantages of the invention will be readily apparent from the following detailed description of a preferred embodiment thereof, taken in conjunction with the accompanying drawing, although variations and modifications may be effected without departing from the spirit and scope of the novel concepts of the disclosure, and in which the single FIGURE illustrates a stack or layer condensor having connecting wires provided according to the invention, the condensor being shown in cross-section.
DESCRIPTION OF THE PREFERRED EMBODIMENT As stated above, the present invention may be employed for a variety of electrical components. Inasmuch as the invention may be advantageously employed for layer type condensors, the description herein is directed to such condensors and the application of the invention to other components will be readily understood by those skilled in the art.
In contacting the electrical components, here a layer condensor, according to the invention, the preferred method comprises the provision of two superposed layers of metal for contacting the connecting wire. The outermost layer of metal is softened by heating and the connecting wire is pressed into the softened metal until it strikes and adheres to the inner metal layer. The inner metal layer has a higher melting point than the outer metal layer and melting of the inner layer is prevented by applying only sufficient heat and pressure to permit pressing of the connecting wire through the outer layer.
The inner layer which is employed for contacting the thin metal condensor plates and which has a high melting point is provided preferably as aluminum and/or copper and the outer contact layer employed for the application of the connecting wires is provided preferably from SnPb, white metal or babbitt metal 10. The contacting of the connecting wires within the outer layer is best accomplished by welding. By an appropriate dosification of the welding energy, the connecting wires can be applied under radial connection such that they completely penetrate the low melting point outer metal layer and adhere to the high melting point inner metal layer, which must not be changed by the welding energy, the surface of the inner layer which is adjacent and contacting the outer layer only adhering to the connecting wire. In this manner, the wire distance is determined. The total tolerance of the distance of botlrconnecting wires results from the coiling precision of the master coil and from the thickness tolerance of the first contact layer which has the high melting point.
Referring to the drawing, a stack or layer capacitor is provided with connecting wires according to the present invention and includes metallic layers 2 carried by dielectricum foils l in a superposed construction. Alternate layers overlap on opposite sides of the condensor, the frontal sides, to which is applied a first metallic layer 3 having a high melting point, for example, aluminum and/or copper.
Second frontal metallic contact layers 4 are applied over the layers 3 from a metal having a lower melting point, for example, SnPb, white metal or babbitt metal 10. The frontal layers 4 are softened by heating and the connecting wires 5 are pressed into the layers 4 and thereby welded thereto. The connecting wires 5 are pressed into layers 4 until they contact the inner layer a 3, which through controlled application of heat is not softened dueto its higher melting point. Thus, the
overall wire diameter A and/or the screen dimension R can be maintained simply in all layer capacitors in a rather exact reproducability.
' In a layer condensor as illustrated herein, the layers have a width B with a tolerance of 1: 0.05 mm. The foil width has no influence when determining the total tolerance A l but the winding width B does has such an influence. The latter is wider in view of the stag- Al=Al,+2.Al
With the aid of appropriate means, the conditions of wire feed, quantity of gas passing through and the size of the spray cone for applying the layers can be maintained constant and thus the imprecision-of the layer thickness Al, can easily be maintainedwithin i 0.1 mm, I
so that for the wire distance AI i 0.25 mm results as Y the overall thickness.
Generally then there has been described techniques for securing connecting wires to electrical components whereby a highly precise arrangement of the connecting wires in accordance with the distance between the wires is achieved for aiding the application of such components as building blocks of electrical circuit assemblies.
We claim as our invention:
1. A stacked layer type capacitor for being supported on its lead wires in spaced apart openings on a printed circuit board comprising: a plurality of planar stacked dielectric layers, a metal coating on each of the dielectric layers forming plates of the capacitor, a pair of first planar metal layers having a relatively high melting point each contacting alternate plates of said capacitor at opposite edges thereof, the plane of said first planar metal layers being perpendicular to the stacked layers, a second planar metal layer having a relatively low melting point overlying each of said pair of first metal layers and extending substantially across the entire thickness of said capacitor, a lead wire embedded in each of the relatively low melting point metal layers and having a longitudinal surface thereof contacting ,the relatively high melting point metal and being welded thereto such that each of the lead wires extends from the stacked layers in generally the same direction and have lateral spacing between their longitudinal axis which is determined by the'lateral spacing between the external surfaces of the high melting point metal.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1764717 | 1968-07-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3710211A true US3710211A (en) | 1973-01-09 |
Family
ID=5698097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00122206A Expired - Lifetime US3710211A (en) | 1968-07-24 | 1971-03-08 | Front contacted electrical component |
Country Status (8)
Country | Link |
---|---|
US (1) | US3710211A (en) |
JP (1) | JPS5522931B1 (en) |
BE (1) | BE736531A (en) |
ES (1) | ES369720A1 (en) |
FR (1) | FR2013601A1 (en) |
GB (1) | GB1224124A (en) |
NL (1) | NL6910723A (en) |
SE (1) | SE339051B (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52125755A (en) * | 1976-04-14 | 1977-10-21 | Matsushita Electric Ind Co Ltd | Method of manufacturing capacitor |
DE2843581A1 (en) * | 1978-10-05 | 1980-04-10 | Siemens Ag | ELECTRIC LAYER CAPACITOR AND METHOD FOR PRODUCING IT |
US4648006A (en) * | 1985-03-26 | 1987-03-03 | Illinois Tool Works Inc. | Plastic chip capacitor for surface mounting |
US4656557A (en) * | 1985-02-11 | 1987-04-07 | Siemens Aktiengesellschaft | Electrical layer capacitor and method for the manufacture thereof |
US4695921A (en) * | 1985-11-04 | 1987-09-22 | The United States Of America As Represented By The Secretary Of The Navy | Film chip capacitor |
US4777558A (en) * | 1986-10-23 | 1988-10-11 | Marcon Electronics Co., Ltd. | Electronic device |
EP0431625A2 (en) * | 1989-12-07 | 1991-06-12 | Siemens Aktiengesellschaft | Varistor of high capacity |
US5144523A (en) * | 1990-06-08 | 1992-09-01 | Compagnie Europeenne De Composants Electroniques Lcc | Foil capacitor and method for the manufacture of such a capacitor |
US5567995A (en) * | 1994-10-20 | 1996-10-22 | The United States Of America As Represented By The Secretary Of The Air Force | Multi winding spiral generator |
US6144547A (en) * | 1997-11-24 | 2000-11-07 | Avx Corporation | Miniature surface mount capacitor and method of making same |
US6462933B2 (en) * | 2000-02-03 | 2002-10-08 | Yutaka Takeshima | Thin film multilayer capacitor and mounting method therefor |
US6678927B1 (en) | 1997-11-24 | 2004-01-20 | Avx Corporation | Miniature surface mount capacitor and method of making same |
US20060238034A1 (en) * | 2003-03-20 | 2006-10-26 | Radiance Technologies, Inc. | Apparatus and method for generating high voltages using a voltage inversion generator and multiple closed-path ferrites |
US20100033894A1 (en) * | 2008-08-11 | 2010-02-11 | Vishay Sprague, Inc. | High voltage capacitors |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4477953A (en) * | 1981-07-06 | 1984-10-23 | Lobo Edward M | Wound capacitor end connections and method of obtaining same |
US4604676A (en) * | 1984-10-02 | 1986-08-05 | Murata Manufacturing Co., Ltd. | Ceramic capacitor |
DE3543653A1 (en) * | 1985-12-11 | 1987-06-19 | Standard Elektrik Lorenz Ag | ELECTRIC CAPACITOR |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2389018A (en) * | 1943-10-04 | 1945-11-13 | Du Pont | Terminal fastening for electrical capacitors |
US2418461A (en) * | 1943-12-31 | 1947-04-08 | Bell Telephone Labor Inc | Resistor |
US2585752A (en) * | 1948-05-26 | 1952-02-12 | Sprague Electric Co | Production of discontinuous, conducting coatings upon insulating surfaces |
US2953673A (en) * | 1958-04-18 | 1960-09-20 | Bell Telephone Labor Inc | Method of joining wires |
US3304475A (en) * | 1965-06-07 | 1967-02-14 | Scionics Corp | Miniature capacitor and method of making the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR888811A (en) * | 1941-12-10 | 1943-12-23 | Bosch Gmbh Robert | Good electrically conductive joint between thin metal layers and their current conductors |
US2418460A (en) * | 1943-12-31 | 1947-04-08 | Bell Telephone Labor Inc | Resistor |
DE1270140B (en) * | 1963-07-11 | 1968-06-12 | Rosenthal Isolatoren Ges Mit B | Electrical component for use on printed circuit boards |
BE658144A (en) * | 1964-01-10 |
-
1969
- 1969-07-11 NL NL6910723A patent/NL6910723A/xx unknown
- 1969-07-21 ES ES369720A patent/ES369720A1/en not_active Expired
- 1969-07-22 FR FR6924920A patent/FR2013601A1/fr not_active Withdrawn
- 1969-07-23 SE SE10381/69A patent/SE339051B/xx unknown
- 1969-07-23 GB GB36923/69A patent/GB1224124A/en not_active Expired
- 1969-07-24 JP JP5805969A patent/JPS5522931B1/ja active Pending
- 1969-07-24 BE BE736531D patent/BE736531A/xx unknown
-
1971
- 1971-03-08 US US00122206A patent/US3710211A/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2389018A (en) * | 1943-10-04 | 1945-11-13 | Du Pont | Terminal fastening for electrical capacitors |
US2418461A (en) * | 1943-12-31 | 1947-04-08 | Bell Telephone Labor Inc | Resistor |
US2585752A (en) * | 1948-05-26 | 1952-02-12 | Sprague Electric Co | Production of discontinuous, conducting coatings upon insulating surfaces |
US2953673A (en) * | 1958-04-18 | 1960-09-20 | Bell Telephone Labor Inc | Method of joining wires |
US3304475A (en) * | 1965-06-07 | 1967-02-14 | Scionics Corp | Miniature capacitor and method of making the same |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52125755A (en) * | 1976-04-14 | 1977-10-21 | Matsushita Electric Ind Co Ltd | Method of manufacturing capacitor |
DE2843581A1 (en) * | 1978-10-05 | 1980-04-10 | Siemens Ag | ELECTRIC LAYER CAPACITOR AND METHOD FOR PRODUCING IT |
US4376329A (en) * | 1978-10-05 | 1983-03-15 | Siemens Aktiengesellschaft | Method for producing an improved electrical layer capacitor |
US4656557A (en) * | 1985-02-11 | 1987-04-07 | Siemens Aktiengesellschaft | Electrical layer capacitor and method for the manufacture thereof |
US4648006A (en) * | 1985-03-26 | 1987-03-03 | Illinois Tool Works Inc. | Plastic chip capacitor for surface mounting |
US4695921A (en) * | 1985-11-04 | 1987-09-22 | The United States Of America As Represented By The Secretary Of The Navy | Film chip capacitor |
US4777558A (en) * | 1986-10-23 | 1988-10-11 | Marcon Electronics Co., Ltd. | Electronic device |
EP0431625A3 (en) * | 1989-12-07 | 1992-07-08 | Siemens Aktiengesellschaft | Varistor of high capacity |
EP0431625A2 (en) * | 1989-12-07 | 1991-06-12 | Siemens Aktiengesellschaft | Varistor of high capacity |
US5144523A (en) * | 1990-06-08 | 1992-09-01 | Compagnie Europeenne De Composants Electroniques Lcc | Foil capacitor and method for the manufacture of such a capacitor |
US5567995A (en) * | 1994-10-20 | 1996-10-22 | The United States Of America As Represented By The Secretary Of The Air Force | Multi winding spiral generator |
US6144547A (en) * | 1997-11-24 | 2000-11-07 | Avx Corporation | Miniature surface mount capacitor and method of making same |
US6678927B1 (en) | 1997-11-24 | 2004-01-20 | Avx Corporation | Miniature surface mount capacitor and method of making same |
US6462933B2 (en) * | 2000-02-03 | 2002-10-08 | Yutaka Takeshima | Thin film multilayer capacitor and mounting method therefor |
US20060238034A1 (en) * | 2003-03-20 | 2006-10-26 | Radiance Technologies, Inc. | Apparatus and method for generating high voltages using a voltage inversion generator and multiple closed-path ferrites |
US7151330B2 (en) | 2003-03-20 | 2006-12-19 | Radiance Technologies, Inc. | Apparatus and method for generating high voltages using a voltage inversion generator and multiple closed-path ferrites |
US20100033894A1 (en) * | 2008-08-11 | 2010-02-11 | Vishay Sprague, Inc. | High voltage capacitors |
US8125762B2 (en) * | 2008-08-11 | 2012-02-28 | Vishay Sprague, Inc. | High voltage capacitors |
Also Published As
Publication number | Publication date |
---|---|
JPS5522931B1 (en) | 1980-06-19 |
BE736531A (en) | 1970-01-26 |
SE339051B (en) | 1971-09-27 |
GB1224124A (en) | 1971-03-03 |
FR2013601A1 (en) | 1970-04-03 |
NL6910723A (en) | 1970-01-27 |
ES369720A1 (en) | 1971-06-01 |
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