US3745039A - Electroless cobalt plating bath and process - Google Patents

Electroless cobalt plating bath and process Download PDF

Info

Publication number
US3745039A
US3745039A US00193582A US3745039DA US3745039A US 3745039 A US3745039 A US 3745039A US 00193582 A US00193582 A US 00193582A US 3745039D A US3745039D A US 3745039DA US 3745039 A US3745039 A US 3745039A
Authority
US
United States
Prior art keywords
cobalt
substrate
bath
nickel
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00193582A
Inventor
N Feldstein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Application granted granted Critical
Publication of US3745039A publication Critical patent/US3745039A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Definitions

  • Cobalt is one of the metals which has been deposited by electroless techniques.
  • One type of bath which has been used for electroless deposition of cobalt contains (a) a salt that furnishes cobalt ions, (b) a complexing agent for cobalt ions to prevent formation of undesired precipitates, (c) ammonium hydroxide which provides hydroxyl ions to maintain an alkaline pH and also aids in complexing the cobalt ions, and (d) a hypophosphite which serves as a reducing agent for the cobalt compounds.
  • Other reducing agents such as amine boranes have also been tried in these baths.
  • Thin metallic films of cobalt or of cobalt-phosphorus alloys are of interest because of their magnetic properties. Some of the applications, such as high density recording systems in which these films may be used, require uniformity of magnetic properties. Cobalt films deposited by previously-known methods are not always satisfactory for such applications.
  • cobalt deposits are harder and are more readily passivated.
  • a linear polyphosphate is a salt in which the phosphate anion has the formula (P O)
  • An example of a preferred deposition bath is as follows.
  • the amount of dimethylamine borane is based on room temperature operation. If the temperature is raised, the amount of borane can be decreased.
  • methylamine borane can be used as the reducing agent, and, since this substance is a stronger reducing agent than the corresponding dimethyl compound, smaller amounts are required.
  • the reducing agent in this example may be a substituted amine borane where the side chain is of low molecular weight such as methyl or ethyl.
  • Other specific examples are monoethyland diethylamine borane. Tertiary butyl amine borane may also be used.
  • Example I The preferred composition of Example I may be varied as follows:
  • cobalt-boron deposits of the present invention are self-initiating on substrates made of chromiurn, aluminum, molybdenum, tungsten, silver, copper and gold or any combination thereof.
  • Cobalt-boron deposits made with the baths of the present invention are also suitable for printed circuits and other similar applications.
  • a pattern of the cobalt-boron is deposited on an activated, insulating substrate and a layer of copper or nickel is then deposited electrolytically on the cobalt-boron film.
  • Sodium hypophosphite may also be used as the reducing agent in the bath of the present invention.
  • a preferred example using this type of reducing agent is as follows:
  • Example II Na P O JOH O g./l 70 CoSO .7H O g./l 50 NH OH conc. (approx. 58%) cc./l 7.5 Nafl POgH O g./1 26
  • This bath may be used at room temperature, although it has a slower plating rate. The plating rate may be increased by raising the temperature.
  • the cobalt deposits as a cobalt-phosphorus alloy.
  • cobalt-phosphorus baths of the present system which includes a polyphosphate complexing agent, will not deposit spontaneously on insulating substrates (or other non-catalytic surfaces) even after these surfaces have been sensitized and activated in conventional manner with palladium. It has now been unexpectedly found, however, that if even small controlled amounts of nickel ion are present in the baths, the cobalt-phosphorus baths with polyphosphate complexing agent will deposit metal spontaneously on palladium-activated substrates. The cobalt phosphorus will also deposit if a thin strike of nickel is first deposited on the substrate. By thin strike is meant at least about 500 A. This is unexpected since, without nickel being present, the baths will not deposit on palladium which is a stronger catalyst than nickel.
  • a glass surface is carefully cleaned, then sensitized by dipping in an aqueous sensitizing solution containing about 30 gms. of SnCl -2H O and 40 cc. concentrated hydrochloric acid per liter. After thorough rinsing, the sensitized surface is activated by treating with an aqueous solution containing 1 gm. per liter of palladium chloride and 1 cc. per liter of concentrated hydrochloric acid. The sensitized and activated sub strate is then utilized to deposit cobalt-phosphorus alloy as described below.
  • This bath was tested by adding varying amounts of NISO4'6HZO.
  • the various ingredients of these baths other than the nickel salt can be varied within the limits indicated in the previous examples in which no nickel compound was present. As the temperature of the bath rises, the amount of nickel needed to initiate good cobalt-phosphorus deposition decreases. However, even at room temperature, deposition can readily be initiated when the cobalt salt 4 concentration is relatively low, for example, like that of Table III above.
  • the cobalt can be obtained from soluble salts other than the sulfate and can be used in any amount up to saturation. As the cobalt concentration increases, the amount of nickel needed to initiate deposition decreases.
  • Example II The composition of Example II may be varied as follows:
  • tripolyphosphate P O
  • Other metals such as nickel, iron, molybdenum and tungsten can be co-deposited with cobalt using the baths of the present invention, by incorporating ions such as Ni+ Fe+ M005 and W05
  • ammonium hydroxide has been given as an example of an agent which both aids in maintaining an alkaline pH and serves as a complexing agent, amines such as ethylene diamine can be substituted for the ammonium hydroxide.
  • An aqueous plating bath for the electroless deposition of cobalt-phosphorus alloy comprising:
  • a method of depositing a cobalt-phosphorus alloy on a non-catalytic substrate comprising sensitizing said substrate and activating said substrate with palladium and then treating said activated substrate with a solution at about 20 C. comprising:
  • a method of depositing a cobalt-phosphorus alloy on a non-catalytic substrate comprising sensitizing said substrate and activating said substrate with palladium and then treating said activated substrate with a solution comabout 40 C. comprising:
  • a method of depositing a cobalt-phosphorus alloy on a non-catalytic substrate comprising sensitizing said substrate and activating said substrate with palladium and then treating said activated substrate with a solution comprising:
  • a method of depositing a cobalt-phosphorus alloy on a non-catalytic substrate comprising sensitizing said substrate and activating said substrate with palladium, depositing a thin strike of nickel having a thickness of at least about 500 A. on said substrate, and then treating said substrate with a solution comprising:

Abstract

ELECTROLESS DEPOSITION OF COBALT FROM AN AQUEOUS ALKALINE BATH ON A PALLADIUM ACTIVATED SUBSTRATE. BATH CONTAINS HYPOPHOSPHITE AS REDUCING AGENT, LINEAR POLYPHOSPHATE ANION AND AMMONIUM HYDROXIDE AS COMPLEXING AGENTS AND SMALL CONTROLLED AMOUNTS OF NICKEL ION. COBALT WILL ALSO DEPOSIT WITHOUT IONS BEING IN BATH BY PROVIDING NICKEL ON SUBSTRATE.

Description

United States Patent O 3,745,639 ELECTROLESS COBALT PLATBNG BATH AND PROCESS Nathan Feidstein, Kendall Park, Nul assignor to RCA Corporation No Drawing. Continuation-impart of application fier. No. 372,750, Oct. 30, 1969. This application Oct. 28, 1971, Ser. No. 193,582
int. Ci. C23c 3/02 U.S. Cl. 117-47 R 5 Claims ABSTRACT OF THE DESCLOSURE Electroless deposition of cobalt from an aqueous alkaline bath on a palladium activated substrate. Bath contains hypophosphite as reducing agent, linear polyphosphate anion and ammonium hydroxide as complexing agents and small controlled amounts of nickel ion. Cobalt will also deposit without nickel ions being in bath by providing nickel strike on substrate.
This application is a continuation-in-part of application Ser. No. 872,750 filed Oct. 30, 1969 and now abandoned.
BACKGROUND OF THE INVENTION It has been well known that a number of metals may be deposited autocatalytically on various substrates, including some which are non-metallic, from a plating bath, without the use of an electric current. This type of process has become known as electroless deposition. Some substrates require pro-treatment as with a catalyst, such as a palladium salt, prior to deposition of the metal. Other substrates themselves exert suificient catalytic action without further preparatory treatment.
Cobalt is one of the metals which has been deposited by electroless techniques. One type of bath which has been used for electroless deposition of cobalt contains (a) a salt that furnishes cobalt ions, (b) a complexing agent for cobalt ions to prevent formation of undesired precipitates, (c) ammonium hydroxide which provides hydroxyl ions to maintain an alkaline pH and also aids in complexing the cobalt ions, and (d) a hypophosphite which serves as a reducing agent for the cobalt compounds. Other reducing agents such as amine boranes have also been tried in these baths.
Most of the baths that have previously been reported for electroless deposition of cobalt have operated at elevated temperatures (about 50 C.). At these temperatures it is difiicult to maintain good control of the temperature and of the composition of the deposit.
Thin metallic films of cobalt or of cobalt-phosphorus alloys are of interest because of their magnetic properties. Some of the applications, such as high density recording systems in which these films may be used, require uniformity of magnetic properties. Cobalt films deposited by previously-known methods are not always satisfactory for such applications.
In comparison with films of other magnetic materials, such as nickel, cobalt deposits are harder and are more readily passivated.
DESCRIPTION OF PREFERRED EMBODIMENT In the baths of the present invention, complexing agents including linear polyphosphate anions contribute to obtaining improved cobalt films. A linear polyphosphate is a salt in which the phosphate anion has the formula (P O An example of a preferred deposition bath is as follows.
3,745,039 Patented July 110, 1973 Example I N34P207-1OHzO g./l 70 COSO .7H O g./l 50 NH OH cone. (approx. 58%) cc./l 7.5 g./l 1.5
In the above bath composition the amount of dimethylamine borane is based on room temperature operation. If the temperature is raised, the amount of borane can be decreased. Also, methylamine borane can be used as the reducing agent, and, since this substance is a stronger reducing agent than the corresponding dimethyl compound, smaller amounts are required. In general, the reducing agent in this example may be a substituted amine borane where the side chain is of low molecular weight such as methyl or ethyl. Other specific examples are monoethyland diethylamine borane. Tertiary butyl amine borane may also be used.
The preferred composition of Example I may be varied as follows:
COSO JH O ..g./l 7.6-50 N21 P O .10H O g./l 2014() NH OH (approx. 58%) cc./l 2.3-30 (CH NHBH g./l 0.23-5
These baths operate at room temperature or above and yield cobalt-boron deposits on a wide variety of metals autocatalytically, including palladium-activated substrates. It has been found that cobalt-boron deposits of the present invention are self-initiating on substrates made of chromiurn, aluminum, molybdenum, tungsten, silver, copper and gold or any combination thereof.
Cobalt-boron deposits made with the baths of the present invention are also suitable for printed circuits and other similar applications. A pattern of the cobalt-boron is deposited on an activated, insulating substrate and a layer of copper or nickel is then deposited electrolytically on the cobalt-boron film.
Sodium hypophosphite may also be used as the reducing agent in the bath of the present invention. A preferred example using this type of reducing agent is as follows:
Example II Na P O JOH O g./l 70 CoSO .7H O g./l 50 NH OH conc. (approx. 58%) cc./l 7.5 Nafl POgH O g./1 26 This bath, like that of Example I, may be used at room temperature, although it has a slower plating rate. The plating rate may be increased by raising the temperature. The cobalt deposits as a cobalt-phosphorus alloy.
It has been found in accordance with the present invention that cobalt-phosphorus baths of the present system which includes a polyphosphate complexing agent, will not deposit spontaneously on insulating substrates (or other non-catalytic surfaces) even after these surfaces have been sensitized and activated in conventional manner with palladium. It has now been unexpectedly found, however, that if even small controlled amounts of nickel ion are present in the baths, the cobalt-phosphorus baths with polyphosphate complexing agent will deposit metal spontaneously on palladium-activated substrates. The cobalt phosphorus will also deposit if a thin strike of nickel is first deposited on the substrate. By thin strike is meant at least about 500 A. This is unexpected since, without nickel being present, the baths will not deposit on palladium which is a stronger catalyst than nickel.
The following is an example of carrying out this feature of the present invention. A glass surface is carefully cleaned, then sensitized by dipping in an aqueous sensitizing solution containing about 30 gms. of SnCl -2H O and 40 cc. concentrated hydrochloric acid per liter. After thorough rinsing, the sensitized surface is activated by treating with an aqueous solution containing 1 gm. per liter of palladium chloride and 1 cc. per liter of concentrated hydrochloric acid. The sensitized and activated sub strate is then utilized to deposit cobalt-phosphorus alloy as described below.
To test the effect of nickel on initiating cobalt deposition, bath were made up to be used at 20 C. and 40 C. as set forth below. The source of cobalt was CoSO -7H O but it may be any soluble cobalt salt. Therefore, the cobalt is expressed in terms of Co++.
For use at For use at 20 C. 40 0.
g NfliPgOqlOHgO, g./l 9O 9O NaHzPOz-Hz g./l 25 25 NH-iOH (58%), ce./l 30 105 Using the above compositions, controlled additions of of NiSO -6H O were made with the following results. In the tables the nickel concentration is expressed as Ni++ since the nickel could be supplied by any soluble nickel salt.
TABLE I Results at 20 C. on Palladium-activated Substrate Approximate time to initi- I Concentration of added nickel as Ni++ ate platin Uniformity in g./l. (minutes of plating None 0. 223 13 Poor. 0. 446 13 Do. 0. 892 4 Acceptable.
1. 34 2 Good. 1. 78 2 D0. 2. 23 1. Do.
I No indication.
TABLE II Results at 40 C. on Palladium-activated Substrate Approximate time to initi- Concentration of added nickel as Ni++ ate platin Uniformity in g./1. (minutes of plating Very poor.
3 Poor. 3 Do. 0. 5 Good. 11.2 10' 0.5 Do.
In order to further test the effects on self-initiation of a cobalt-phosphorus bath containing much smaller amounts of cobalt, the following bath was prepared.
C0++ g /l 1.6 Na P O -10H O g./l 25.0 NaH PO -H O g./l.. 20.0 NH OH (58%) cc./l 8
This bath was tested by adding varying amounts of NISO4'6HZO.
I No plating after 10 minutes.
The various ingredients of these baths other than the nickel salt can be varied within the limits indicated in the previous examples in which no nickel compound was present. As the temperature of the bath rises, the amount of nickel needed to initiate good cobalt-phosphorus deposition decreases. However, even at room temperature, deposition can readily be initiated when the cobalt salt 4 concentration is relatively low, for example, like that of Table III above.
The cobalt can be obtained from soluble salts other than the sulfate and can be used in any amount up to saturation. As the cobalt concentration increases, the amount of nickel needed to initiate deposition decreases.
The composition of Example II may be varied as follows:
CoSO -7H O g./l 7.6-50 Na P O -10H O g./l 20-140 NH OH (approx. 58%) cc./l 2.3-30 NaH PO -H o g./l 5-50 Sodium pyrophosphate is only one example of a compound containing a polyphosphate ion that can be used in the baths of the present invention. Another example is a tripolyphosphate (P O Other metals such as nickel, iron, molybdenum and tungsten can be co-deposited with cobalt using the baths of the present invention, by incorporating ions such as Ni+ Fe+ M005 and W05 Although ammonium hydroxide has been given as an example of an agent which both aids in maintaining an alkaline pH and serves as a complexing agent, amines such as ethylene diamine can be substituted for the ammonium hydroxide.
I claim:
1. An aqueous plating bath for the electroless deposition of cobalt-phosphorus alloy comprising:
co++ g./l 1.610 Na P O -10H O g./l 20-140 NH4OH (58% cc./l 2.3 NaH PO -H O g./l 5-50 Ni++ g./l 0.0s5 2.23
2. A method of depositing a cobalt-phosphorus alloy on a non-catalytic substrate comprising sensitizing said substrate and activating said substrate with palladium and then treating said activated substrate with a solution at about 20 C. comprising:
Co g./l 1.6l0 N34P207 g./1 NH OH (58%) CC./i 2.3-30 NaH Po 'H O g./l 5-50 Ni g./1 0.892-about 2.23
3. A method of depositing a cobalt-phosphorus alloy on a non-catalytic substrate comprising sensitizing said substrate and activating said substrate with palladium and then treating said activated substrate with a solution comabout 40 C. comprising:
Co g./l 1.6-10 Na P O -10H O g./l 20-140 NH OH (58%) cc./l 2.3-30 NaH PO -H O g./l 55O Ni++ g./1
About 0.055about 0.22
4. A method of depositing a cobalt-phosphorus alloy on a non-catalytic substrate comprising sensitizing said substrate and activating said substrate with palladium and then treating said activated substrate with a solution comprising:
Co g./l 1.6-10 Na P O -10H O g./l 20-140 NH OI-I (58%) cc./l 2.3-105 NEtHgPOz'HgO g./.1 5-50 Ni++ g./c 0.0275 to about 2.23
5. A method of depositing a cobalt-phosphorus alloy on a non-catalytic substrate comprising sensitizing said substrate and activating said substrate with palladium, depositing a thin strike of nickel having a thickness of at least about 500 A. on said substrate, and then treating said substrate with a solution comprising:
Co++ g./l 1.6- N21 P O '10H- O g./l -140 NH OH (58%) cc./l 2.3-
NQHgPOg'HzO g./l
References Cited UNITED STATES PATENTS 3,627,545 12/1971 Mallory, Jr. et a1.
117-130 E X 2,532,284 12/1950 Brenner et a1. 117-130 E X 3,423,214 1/1969 Koretzky 106-1 6 3,370,979 2/1968 Schmeckenbecher 106-1 X 2,690,401 9/1954 Gutzeit et a1 117-47 A 2,287,400 3/1958 Eisenberg et a1. 117-130 E 3,666,529 5/1972 Wright et a1 117-50 3,024,134 3/1962 Nixon et a] 117-130 E 3,597,267 8/1971 Mallory, Jr. et a1. 106-1 X 3,607,389 9/1971 Canegallo et a1. 117-130 E X ALFRED L. LEAVITT, Primary Examiner 10 J. R. BATTEN, JR., Assistant Examiner US. Cl. X.R.
106-1; 117-50, 71 R, E, 130 B, R; 204-38 5
US00193582A 1971-10-28 1971-10-28 Electroless cobalt plating bath and process Expired - Lifetime US3745039A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19358271A 1971-10-28 1971-10-28

Publications (1)

Publication Number Publication Date
US3745039A true US3745039A (en) 1973-07-10

Family

ID=22714221

Family Applications (1)

Application Number Title Priority Date Filing Date
US00193582A Expired - Lifetime US3745039A (en) 1971-10-28 1971-10-28 Electroless cobalt plating bath and process

Country Status (1)

Country Link
US (1) US3745039A (en)

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3917464A (en) * 1973-07-20 1975-11-04 Us Army Electroless deposition of cobalt boron
US3993801A (en) * 1975-02-18 1976-11-23 Surface Technology, Inc. Catalytic developer
US4084023A (en) * 1976-08-16 1978-04-11 Western Electric Company, Inc. Method for depositing a metal on a surface
US4157262A (en) * 1976-04-28 1979-06-05 Fuji Photo Film Co., Ltd. Intensification of photographic silver images by physical development and improvement in physical developer solution for use therein
US4250225A (en) * 1974-10-28 1981-02-10 Fuji Photo Film Co., Ltd. Process for the production of a magnetic recording medium
US4278477A (en) * 1980-03-19 1981-07-14 Amchem Products, Inc. Metal treatment
US20030190426A1 (en) * 2002-04-03 2003-10-09 Deenesh Padhi Electroless deposition method
US20040217005A1 (en) * 2002-07-24 2004-11-04 Aron Rosenfeld Method for electroplating bath chemistry control
WO2005038084A2 (en) * 2003-10-17 2005-04-28 Applied Materials, Inc. Selective self-initiating electroless capping of copper with cobalt-containing alloys
US20050095830A1 (en) * 2003-10-17 2005-05-05 Applied Materials, Inc. Selective self-initiating electroless capping of copper with cobalt-containing alloys
US20050101130A1 (en) * 2003-11-07 2005-05-12 Applied Materials, Inc. Method and tool of chemical doping CoW alloys with Re for increasing barrier properties of electroless capping layers for IC Cu interconnects
US20050124158A1 (en) * 2003-10-15 2005-06-09 Lopatin Sergey D. Silver under-layers for electroless cobalt alloys
US20050136185A1 (en) * 2002-10-30 2005-06-23 Sivakami Ramanathan Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
US20050164497A1 (en) * 2004-01-26 2005-07-28 Sergey Lopatin Pretreatment for electroless deposition
US20050161338A1 (en) * 2004-01-26 2005-07-28 Applied Materials, Inc. Electroless cobalt alloy deposition process
US20050170650A1 (en) * 2004-01-26 2005-08-04 Hongbin Fang Electroless palladium nitrate activation prior to cobalt-alloy deposition
US20050181226A1 (en) * 2004-01-26 2005-08-18 Applied Materials, Inc. Method and apparatus for selectively changing thin film composition during electroless deposition in a single chamber
US20050253268A1 (en) * 2004-04-22 2005-11-17 Shao-Ta Hsu Method and structure for improving adhesion between intermetal dielectric layer and cap layer
US20060240187A1 (en) * 2005-01-27 2006-10-26 Applied Materials, Inc. Deposition of an intermediate catalytic layer on a barrier layer for copper metallization
US20060252252A1 (en) * 2005-03-18 2006-11-09 Zhize Zhu Electroless deposition processes and compositions for forming interconnects
US20060264043A1 (en) * 2005-03-18 2006-11-23 Stewart Michael P Electroless deposition process on a silicon contact
US20070066059A1 (en) * 2005-09-20 2007-03-22 Enthone Inc. Defectivity and process control of electroless deposition in microelectronics applications
US20070071888A1 (en) * 2005-09-21 2007-03-29 Arulkumar Shanmugasundram Method and apparatus for forming device features in an integrated electroless deposition system
WO2007035731A2 (en) * 2005-09-20 2007-03-29 Enthone Inc. Defectivity and process control of electroless deposition in microelectronics applications
US7651934B2 (en) 2005-03-18 2010-01-26 Applied Materials, Inc. Process for electroless copper deposition
US9962522B2 (en) 2014-10-29 2018-05-08 Professional Plating, Inc. Braid plating method for torsional stiffness
US10448973B2 (en) 2016-10-14 2019-10-22 Pacesetter, Inc. Catheter-based system for delivery and retrieval of a leadless pacemaker
US10960217B2 (en) 2017-03-31 2021-03-30 Pacesetter, Inc. Catheter-based delivery system for delivering a leadless pacemaker and employing a locking hub

Cited By (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3917464A (en) * 1973-07-20 1975-11-04 Us Army Electroless deposition of cobalt boron
US4250225A (en) * 1974-10-28 1981-02-10 Fuji Photo Film Co., Ltd. Process for the production of a magnetic recording medium
US3993801A (en) * 1975-02-18 1976-11-23 Surface Technology, Inc. Catalytic developer
US4157262A (en) * 1976-04-28 1979-06-05 Fuji Photo Film Co., Ltd. Intensification of photographic silver images by physical development and improvement in physical developer solution for use therein
US4084023A (en) * 1976-08-16 1978-04-11 Western Electric Company, Inc. Method for depositing a metal on a surface
US4278477A (en) * 1980-03-19 1981-07-14 Amchem Products, Inc. Metal treatment
US20030190426A1 (en) * 2002-04-03 2003-10-09 Deenesh Padhi Electroless deposition method
US20040217005A1 (en) * 2002-07-24 2004-11-04 Aron Rosenfeld Method for electroplating bath chemistry control
US20050136185A1 (en) * 2002-10-30 2005-06-23 Sivakami Ramanathan Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
US20050124158A1 (en) * 2003-10-15 2005-06-09 Lopatin Sergey D. Silver under-layers for electroless cobalt alloys
US7064065B2 (en) 2003-10-15 2006-06-20 Applied Materials, Inc. Silver under-layers for electroless cobalt alloys
WO2005038084A2 (en) * 2003-10-17 2005-04-28 Applied Materials, Inc. Selective self-initiating electroless capping of copper with cobalt-containing alloys
WO2005038084A3 (en) * 2003-10-17 2005-09-01 Applied Materials Inc Selective self-initiating electroless capping of copper with cobalt-containing alloys
US20050136193A1 (en) * 2003-10-17 2005-06-23 Applied Materials, Inc. Selective self-initiating electroless capping of copper with cobalt-containing alloys
US20050095830A1 (en) * 2003-10-17 2005-05-05 Applied Materials, Inc. Selective self-initiating electroless capping of copper with cobalt-containing alloys
WO2005038085A3 (en) * 2003-10-17 2005-07-07 Applied Materials Inc Selective self-initiating electroless capping of copper with cobalt-containing alloys
WO2005038085A2 (en) * 2003-10-17 2005-04-28 Applied Materials, Inc. Selective self-initiating electroless capping of copper with cobalt-containing alloys
US7205233B2 (en) 2003-11-07 2007-04-17 Applied Materials, Inc. Method for forming CoWRe alloys by electroless deposition
US20050101130A1 (en) * 2003-11-07 2005-05-12 Applied Materials, Inc. Method and tool of chemical doping CoW alloys with Re for increasing barrier properties of electroless capping layers for IC Cu interconnects
US20050181226A1 (en) * 2004-01-26 2005-08-18 Applied Materials, Inc. Method and apparatus for selectively changing thin film composition during electroless deposition in a single chamber
US20050161338A1 (en) * 2004-01-26 2005-07-28 Applied Materials, Inc. Electroless cobalt alloy deposition process
US20050170650A1 (en) * 2004-01-26 2005-08-04 Hongbin Fang Electroless palladium nitrate activation prior to cobalt-alloy deposition
US7256111B2 (en) 2004-01-26 2007-08-14 Applied Materials, Inc. Pretreatment for electroless deposition
US20050164497A1 (en) * 2004-01-26 2005-07-28 Sergey Lopatin Pretreatment for electroless deposition
US20050253268A1 (en) * 2004-04-22 2005-11-17 Shao-Ta Hsu Method and structure for improving adhesion between intermetal dielectric layer and cap layer
US20060240187A1 (en) * 2005-01-27 2006-10-26 Applied Materials, Inc. Deposition of an intermediate catalytic layer on a barrier layer for copper metallization
US20060264043A1 (en) * 2005-03-18 2006-11-23 Stewart Michael P Electroless deposition process on a silicon contact
US7651934B2 (en) 2005-03-18 2010-01-26 Applied Materials, Inc. Process for electroless copper deposition
US8308858B2 (en) 2005-03-18 2012-11-13 Applied Materials, Inc. Electroless deposition process on a silicon contact
US20100107927A1 (en) * 2005-03-18 2010-05-06 Stewart Michael P Electroless deposition process on a silicon contact
US7659203B2 (en) 2005-03-18 2010-02-09 Applied Materials, Inc. Electroless deposition process on a silicon contact
US7514353B2 (en) 2005-03-18 2009-04-07 Applied Materials, Inc. Contact metallization scheme using a barrier layer over a silicide layer
US20060252252A1 (en) * 2005-03-18 2006-11-09 Zhize Zhu Electroless deposition processes and compositions for forming interconnects
US20060251800A1 (en) * 2005-03-18 2006-11-09 Weidman Timothy W Contact metallization scheme using a barrier layer over a silicide layer
US20070066057A1 (en) * 2005-09-20 2007-03-22 Enthone Inc. Defectivity and process control of electroless deposition in microelectronics applications
US7611988B2 (en) 2005-09-20 2009-11-03 Enthone Inc. Defectivity and process control of electroless deposition in microelectronics applications
WO2007035731A2 (en) * 2005-09-20 2007-03-29 Enthone Inc. Defectivity and process control of electroless deposition in microelectronics applications
WO2007035731A3 (en) * 2005-09-20 2009-05-07 Enthone Defectivity and process control of electroless deposition in microelectronics applications
US7410899B2 (en) 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
US7611987B2 (en) 2005-09-20 2009-11-03 Enthone Inc. Defectivity and process control of electroless deposition in microelectronics applications
US7615491B2 (en) 2005-09-20 2009-11-10 Enthone Inc. Defectivity and process control of electroless deposition in microelectronics applications
US20070066059A1 (en) * 2005-09-20 2007-03-22 Enthone Inc. Defectivity and process control of electroless deposition in microelectronics applications
US20070062408A1 (en) * 2005-09-20 2007-03-22 Enthone Inc. Defectivity and process control of electroless deposition in microelectronics applications
US20070066058A1 (en) * 2005-09-20 2007-03-22 Enthone Inc. Defectivity and process control of electroless deposition in microelectronics applications
US20070071888A1 (en) * 2005-09-21 2007-03-29 Arulkumar Shanmugasundram Method and apparatus for forming device features in an integrated electroless deposition system
US9962522B2 (en) 2014-10-29 2018-05-08 Professional Plating, Inc. Braid plating method for torsional stiffness
US10448973B2 (en) 2016-10-14 2019-10-22 Pacesetter, Inc. Catheter-based system for delivery and retrieval of a leadless pacemaker
US10575872B2 (en) 2016-10-14 2020-03-03 Pacesetter, Inc. Catheter-based system for delivery and retrieval of a leadless pacemaker
US10743916B2 (en) 2016-10-14 2020-08-18 Pacesetter, Inc. Catheter-based system for delivery and retrieval of a leadless pacemaker
US10758271B2 (en) 2016-10-14 2020-09-01 Pacesetter, Inc. Catheter-based system for delivery and retrieval of a leadless pacemaker
US10856905B2 (en) 2016-10-14 2020-12-08 Pacesetter, Inc. Catheter-based system for delivery and retrieval of a leadless pacemaker
US10966753B2 (en) 2016-10-14 2021-04-06 Pacesetter, Inc. Catheter-based system for delivery and retrieval of a leadless pacemaker
US11744613B2 (en) 2016-10-14 2023-09-05 Pacesetter, Inc. Catheter-based system for delivery and retrieval of a leadless pacemaker
US11812992B2 (en) 2016-10-14 2023-11-14 Pacesetter, Inc. Catheter-based system for delivery and retrieval of a leadless pacemaker
US10960217B2 (en) 2017-03-31 2021-03-30 Pacesetter, Inc. Catheter-based delivery system for delivering a leadless pacemaker and employing a locking hub

Similar Documents

Publication Publication Date Title
US3745039A (en) Electroless cobalt plating bath and process
US3589916A (en) Autocatalytic gold plating solutions
US3917885A (en) Electroless gold plating process
US4269625A (en) Bath for electroless depositing tin on substrates
Shipley Historical highlights of electroless plating
JPS5913059A (en) Pretreatment for electroless plating
US4525390A (en) Deposition of copper from electroless plating compositions
US4019910A (en) Electroless nickel polyalloy plating baths
US3870526A (en) Electroless deposition of copper and copper-tin alloys
JP2018119209A (en) Electroless copper plating composition
US3993801A (en) Catalytic developer
US2929742A (en) Electroless deposition of nickel
US3853590A (en) Electroless plating solution and process
US3178311A (en) Electroless plating process
US3666527A (en) Method of electroless deposition of metals with improved sensitizer
US3674550A (en) Method of electroless deposition of a substrate and sensitizing solution therefor
US4328266A (en) Method for rendering non-platable substrates platable
US4904506A (en) Copper deposition from electroless plating bath
TW201538788A (en) Catalyst solution for electroless plating
US3841881A (en) Method for electroless deposition of metal using improved colloidal catalyzing solution
GB2121444A (en) Electroless gold plating
US3274022A (en) Palladium deposition
US3697296A (en) Electroless gold plating bath and process
US3198659A (en) Thin nickel coatings
US2827398A (en) Electroless iron plating