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Patentes

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Patente citante Fecha de presentación Fecha de emisión Cesionario original Título
US399086231 Ene 19759 Nov 1976The Gates Rubber CompanyLiquid heat exchanger interface and method
US41016919 Sep 197618 Jul 1978Union Carbide CorporationEnhanced heat transfer device manufacture
US414896912 Sep 197710 Abr 1979Exxon Research & Engineering Co.Polyparabanic acid/copper foil laminates obtained by direct solution casting
US422382629 Ene 197923 Sep 1980Usui Kokusai Sangyo Kabushiki KaishaMethod of brazing stainless steels
US422691318 Dic 19787 Oct 1980Exxon Research & Engineering Co.Polyparabanic acid/copper foil laminates obtained by direct solution casting
US459669120 Sep 198424 Jun 1986GTE Products CorporationProcess for forming a laminated strip containing a brazing alloy
US466324328 Oct 19825 May 1987Union Carbide CorporationFlame-sprayed ferrous alloy enhanced boiling surface
US468751115 May 198618 Ago 1987GTE Products CorporationMetal matrix composite powders and process for producing same
US541367423 Dic 19929 May 1995UOPEvaporation for solids concentration
US57594005 Nov 19962 Jun 1998Advance Waste ReductionReticulated foam structured fluid treatment element
US68960397 May 200424 May 2005Thermal Corp.Integrated circuit heat pipe heat spreader with through mounting holes
US699415226 Jun 20037 Feb 2006Thermal Corp.Brazed wick for a heat transfer device
US702875927 Ene 200418 Abr 2006Thermal Corp.Heat transfer device and method of making same
US70287601 Mar 200518 Abr 2006Thermal Corp.Integrated circuit heat pipe heat spreader with through mounting holes
US707357218 Jun 200311 Jul 2006Flooded evaporator with various kinds of tubes
US71248096 Abr 200524 Oct 2006Thermal Corp.Brazed wick for a heat transfer device
US713744310 Feb 200521 Nov 2006Thermal Corp.Brazed wick for a heat transfer device and method of making same
US73605817 Nov 200522 Abr 20083M Innovative Properties CompanyStructured thermal transfer article
US76958087 Nov 200513 Abr 20103M Innovative Properties CompanyThermal transfer coating
US78168261 Feb 200619 Oct 2010Siemens AktiengesellschaftThermosyphon cooled superconductor