US3826650A - Epoxy photopolymer duplicating stencil - Google Patents
Epoxy photopolymer duplicating stencil Download PDFInfo
- Publication number
- US3826650A US3826650A US28362972A US3826650A US 3826650 A US3826650 A US 3826650A US 28362972 A US28362972 A US 28362972A US 3826650 A US3826650 A US 3826650A
- Authority
- US
- United States
- Prior art keywords
- epoxy
- stencil
- diazonium
- photosensitive
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004593 Epoxy Substances 0.000 title description 69
- 239000000203 mixture Substances 0.000 abstract description 34
- 239000000463 material Substances 0.000 abstract description 33
- 239000002904 solvent Substances 0.000 abstract description 22
- 239000012954 diazonium Substances 0.000 abstract description 13
- 238000006116 polymerization reaction Methods 0.000 abstract description 12
- 229910052751 metal Inorganic materials 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 9
- 230000005855 radiation Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 7
- 239000004677 Nylon Substances 0.000 abstract description 3
- 229920001778 nylon Polymers 0.000 abstract description 3
- -1 aryl diazonium Chemical compound 0.000 description 41
- 238000000034 method Methods 0.000 description 39
- 239000000178 monomer Substances 0.000 description 34
- 150000001875 compounds Chemical class 0.000 description 26
- 239000007788 liquid Substances 0.000 description 16
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 12
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- 150000001450 anions Chemical class 0.000 description 11
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- 238000000576 coating method Methods 0.000 description 10
- 229910052736 halogen Inorganic materials 0.000 description 10
- 150000002367 halogens Chemical class 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000011161 development Methods 0.000 description 9
- 150000001989 diazonium salts Chemical class 0.000 description 9
- 238000010894 electron beam technology Methods 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000002841 Lewis acid Substances 0.000 description 6
- 239000000460 chlorine Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-O diazynium Chemical group [NH+]#N IJGRMHOSHXDMSA-UHFFFAOYSA-O 0.000 description 6
- 150000007517 lewis acids Chemical class 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- IBSQPLPBRSHTTG-UHFFFAOYSA-N 1-chloro-2-methylbenzene Chemical compound CC1=CC=CC=C1Cl IBSQPLPBRSHTTG-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
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- 125000003700 epoxy group Chemical group 0.000 description 4
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- 208000019585 progressive encephalomyelitis with rigidity and myoclonus Diseases 0.000 description 4
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 3
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- 238000005530 etching Methods 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000000466 oxiranyl group Chemical group 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 238000012216 screening Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- SVDAJTZKOJZQFC-UHFFFAOYSA-N 2,4-dichlorobenzenediazonium Chemical compound ClC1=CC=C([N+]#N)C(Cl)=C1 SVDAJTZKOJZQFC-UHFFFAOYSA-N 0.000 description 2
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 2
- ICMFHHGKLRTCBM-UHFFFAOYSA-N 4-nitrobenzenediazonium Chemical compound [O-][N+](=O)C1=CC=C([N+]#N)C=C1 ICMFHHGKLRTCBM-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000003282 alkyl amino group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 125000001769 aryl amino group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000012018 catalyst precursor Substances 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000012442 inert solvent Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 2
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- VKEUUMXWKXDGFG-UHFFFAOYSA-N 2,5-diethoxy-4-(4-methylphenyl)benzenediazonium Chemical compound C1=C([N+]#N)C(OCC)=CC(C=2C=CC(C)=CC=2)=C1OCC VKEUUMXWKXDGFG-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- AYTSDBGAHOKDHJ-UHFFFAOYSA-N 2-nitrobenzenediazonium Chemical compound [O-][N+](=O)C1=CC=CC=C1[N+]#N AYTSDBGAHOKDHJ-UHFFFAOYSA-N 0.000 description 1
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- UPMZXBCYMCZOIG-UHFFFAOYSA-N 6-[(4-methyl-7-oxabicyclo[4.1.0]heptan-3-yl)methoxy]-6-oxohexanoic acid Chemical compound C1C(COC(=O)CCCCC(O)=O)C(C)CC2OC21 UPMZXBCYMCZOIG-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 125000004054 acenaphthylenyl group Chemical group C1(=CC2=CC=CC3=CC=CC1=C23)* 0.000 description 1
- HXGDTGSAIMULJN-UHFFFAOYSA-N acetnaphthylene Natural products C1=CC(C=C2)=C3C2=CC=CC3=C1 HXGDTGSAIMULJN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
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- 150000001768 cations Chemical class 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
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- 150000002500 ions Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 229940095102 methyl benzoate Drugs 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000825 pharmaceutical preparation Substances 0.000 description 1
- 229940127557 pharmaceutical product Drugs 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
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- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- RSRNHSYYBLEMOI-UHFFFAOYSA-M primuline Chemical compound [Na+].S1C2=C(S([O-])(=O)=O)C(C)=CC=C2N=C1C(C=C1S2)=CC=C1N=C2C1=CC=C(N)C=C1 RSRNHSYYBLEMOI-UHFFFAOYSA-M 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 239000012048 reactive intermediate Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
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- 238000001228 spectrum Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000003107 substituted aryl group Chemical group 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/08—Saturated oxiranes
- C08G65/10—Saturated oxiranes characterised by the catalysts used
- C08G65/105—Onium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/08—Saturated oxiranes
- C08G65/10—Saturated oxiranes characterised by the catalysts used
- C08G65/12—Saturated oxiranes characterised by the catalysts used containing organo-metallic compounds or metal hydrides
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
- G03C5/60—Processes for obtaining vesicular images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/016—Diazonium salts or compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31971—Of carbohydrate
- Y10T428/31993—Of paper
Definitions
- a stencil is prepared from a support such as paper, silk or nylon, metal or metal coated material which is coated with an epoxy-diazonium composition, the surface of the material is exposed to an energy source, preferably actinic radiation, in an image wise manner to effect polymerization of said composition and unpolymerized composition is removed, preferably by washing with a solvent.
- an energy source preferably actinic radiation
- Duplicating paper or the like has been cut, die-impressed and embossed in the preparation of stencils for use on mimeograph and other types of duplicating machines.
- an electrolytic method of marking metals through a die-impressed pressure sensitive resist or engraved plastic resist has been widely accepted by the metal marking industry and is now preferred in contrast to the older methods utilizing steel die stamps, acid and ink stamps, and pantograph or engraving tools.
- Such electrolytic method has utilized a die-impressed pressure sensitive paper stencil which has been reinforced with various types of synthetic or natural resins and waxes adapted to be readily displaced by pressure rolling or by impact against electrotype or etched plates.
- a liquid marking medium which may be either an ink or an electrolytic fluid, for example, is then applied to the stencil sheet and will pass through the porous fibrous layer where thus exposed and mark an underlying work surface accordingly.
- Stencils of the type above discussed are very convenient of use and give satisfactory results when first employed. They are, however, not very long-lived and the results obtained from any one stencil tend to become less and less satisfactory until the stencil must eventually be discarded. Many interested in the stencil problem has attempted to solve it through the technique of applying water soluble colloids containing photosensitive compounds to a supported porous member. After the coating has dried, a photonegative or a photopositive transparency is placed in contact with the coating, and by exposure to a proper light source, some curing of the light exposed coating may be caused to take place. The unexposed area may then be Washed out with water and the exposed area treated in a hardening solution.
- the present invention relates to novel duplicating stencils and their preparation from coating materials which include a polymerizable epoxy monomer and a photosensitive catalyst.
- This invention relates then to the use of a process for polymerizing epoxy monomers and more particularly to a process for effecting the photopolymerization of epoxy monomers by use of organic compounds which are photosensitive and release an active catalyst upon application of energy.
- This material is used as a coating material to produce a stencil.
- epoxy monomer or prepolymer in the description of this invention includes any molecule containing one or more 1,2-epoxy or oxirane rings, whether the molecule consists of a small grouping of atoms or of a chain of repeating units as in commercial resins.
- this invention includes the treatment of commercial epoxy resins, sometimes referred to as prepolymers, which consist of smaller molecular units which have been linked together to give longer chains with pendant epoxy groups which are capable of further polymerization.
- epoxy compounds treated in the present invention regardless of whether they are referred to as monomers, resins or prepolymers will contain the 1,2-epoxy or oxirane ring structure which will be identified hereinafter as an epoxy ring and where R R R and R, can be alkyl, aryl, 'alkoxy, alkenyl, halogen and hydrogen.
- the method of the present invention proposes the use of novel aryldiazonium compounds as photosensitive agents, which upon exposure to an energy source, such as radiation or electron beam scanning, releases an active catalyst which initiates the polymerization of epoxy monomers to produce epoxy polymers.
- an energy source such as radiation or electron beam scanning
- many of similar such photosensitive compounds proposed by the prior art for example aryl diazonium fluoroborates, tend to be chemically unstable resulting in disadvantages of extremely short pot life and being potentially explosively hazardous. It has been discovered herein that the catalyst activity and resulting usefulness of aryldiazonium compounds cannot be determined on a random basis.
- aryldiazonium compounds which upon admixture with an epoxy monomer or prepolymer followed by application to a stencil and subsequent exposure to an energy source release an active catalyst which effects the polymerization of the epoxy monomer.
- This new class of photosensitive compounds possess the properties of increased speed and efficiency in catalyzing polymerization and in yielding epoxy polymers which possess inherent superior toughness, abrasion resistance, and resistance to chemical attack.
- the photosensitive latent curing agents utilized in accordance with the present invention may be classified as aromatic diazonium salts of a complex anion, this anion being selected from the group consisting of haloantimonates, haloarsenates, halobismuthates, haloferrates, halostannates and halophosphates wherein each halogen atom is a lower atomic weight halogen selected from the group consisting of fluorine and chlorine, the latent curing agent initially having had substantially no application of energy thereto.
- the preferred photosensitive compounds of the present invention can be defined by the following formula:
- MX is a halogen containing complex anion selected from the group consisting of hexachlorostannate IV, tetrachloroferrate III, hexafluorophosphate, hexafluoroarsenate V, hexachloroantimonate V, hexafiuoroantimonate V and pentachlorobismuthate III; and Y is selected from at least one of the group consisting of nitro, halogen, N-morpholino, alkyl, alkoxy, aryl, amino, arylamino, alkylamino and arylmercapto and arylthio radicals, indicating the variety of substituted aryl compounds which may carry the diazonium group forming the cation in the photosensitive aromatic diazonium salts having the formula shown above.
- n is equal to the oxidation state of the element M and m is equal to the number of halogen atoms which are given up upon application of energy such as actinic radiation to yield a Lewis acid, m thus being the number of diazonium groups in the diazonium salt as determined by the net charge on the complex anion n+m)-
- photosensitive compounds which can be used in the present invention include:
- the diazonium compounds of the present invention may be prepared from procedures known in the art and such preparation forms no part of the present invention.
- the chlorometallic complexes may be prepared for example in accordance with the method set forth by Lee et al. in Journal of the American Chemical Society, 83, 1928 (1961).
- Diazonium hexafiuorophosphates can be prepared by diazotizing the corresponding aniline with NOPF an HCl-NaNO combination with subsequent addition of HPF or a PP; salt, or by addition of such a hexafluorophosphate salt to another diazonium salt to effect precipitation.
- the N-morpholino complexes can be prepared either from the aniline derivative or by adding an aqueous solution of the desired inorganic complex salt to a solution of p-Nmorpholinobenzenediazonium fiuoroborate.
- R R R and R can be alkyl, aryl, alkoxy, alkenyl, halogen and hydrogen.
- monomers include, but are not limited to, ethylene oxide and homologues thereof; glycidic and glycidyl esters; glycidyl (2,3-epoxypropyl) methacrylates, acrylates and crotonates; and allyl glycidyl ethers.
- commercial synthetic resins as heretofore defined can be employed. Examples of such resins can be those derived from the diglycidyl ether of bisphenol A, epoxidized polyolefins and epoxylated novolacs.
- Such epoxies may preferably also include the copolymer of glycidyl methacrylate and allyl glycidyl ether prepared as disclosed in the Schlesinger et al. copending application Ser. No. 297,829, filed Oct. 16, 1972 entitled Copolymer of Glycidyl Methacrylate and Allyl Glycidyl Ether and Polymerization Thereof the disclosure of which is incorporated herein by the foregoing reference.
- Lewis Acid an electron pair acceptor such as PF FeCl AsF SbF SnCL; and BiCl
- the Lewis Acid produced in equation I initiates or catalyzes the photopolymerization process depicted in equation II, wherein the epoxy monomer is polymerized as the result of the action of applied energy. While not essential to the functioning of the present invention, it is believed that certain intermediates such as carboniu-m ions are formed during photolysis of the diazonium compound which aid in the polymerization reaction.
- a general application of the process embodied by equations I and II in the preparation of a stencil can be as follows: a diazonium compound, as heretofore defined, is admixed, with or without the use of a suitable solvent, with an epoxy monomer. The mixture is thereafter coated on a suitable substrate to prepare a stencil. After evaporating solvent which may be present, the stencil is exposed, for example, to ultraviolet light through a mask or negative. When the light strikes the stencil the diazonium compound decomposes to yield a catalyst in the form of a Lewis Acid which initiates the polymerization of the epoxy monomer. The resulting polymer is resistive to most solvents and chemicals in the exposed areas.
- the energy source required for effective decomposition of the latent catalysts employed in the invention may be energy applied by bombardment with charged particles, notably by high-energy electron beam irradiation.
- the electron beam is used as a pen to scan the desired pictorial or alphanumeric information on the epoxy layer after which development and processing is the same as when electromagnetic radiation is the energy source.
- the catalyst precursors described hereinbelow are primarily photosensitive and the required energy is preferably imparted by actinic irradiation which is most eifective at those regions of the electromagnetic spectrum at which there is high absorption of electromagnetic energy by the particular catalyst precursor used. More than one of these types of energy may be applied to the same system: e.g.
- the preferred energy, actinic radiation can be any produced by any suitable source such as a mercury, xenon, carbon are or tungsten filament lamp.
- the only limitations placed on the type of instrumentation used is that it must have a frequency range and energy level sufficient to impart to the monomer or prepolymer system energy at a high enough intensity to reach the decomposition level of the photosensitive compounds. Table I below lists some of the photosensitive compounds of the present invention including absorption maxima in acetonitrile.
- N NSbC1u Pentaehlorobismuthate, 285, 318 III 285, 313
- the procedures for admixing the photosensitive compounds of the present invention with epoxy monomers are relatively simple and can be carried out in the following manner.
- An epoxy monomer, resin. or prepolymer as heretofore defined containing oxirane groups is combined with a photosensitive aryldiazonium compound of the present invention.
- Suitable inert solvents may be employed if desired in effecting this mixture.
- a suitable inert solvent is meant one that does not react appreciably with the monomer or the aryldiazonium compound before exposure to actinic radiation.
- solvents examples include acetone, methyl benzoate, aoetonitrile, butyronitrile, benzonitrile, toluene, o-chlorotoluene, xylene, methyl ethyl ketone, cellosolve ether, monochlorobenzene, trichloroethylene, anisole, tetrachloroethane, dichlorobenzene, and propylene carbonate. Mixtures of these solvents have been found useful in the present invention.
- a liquid epoxy may serve as solvent for another epoxy, liquid or solid in nature. It is to be understood, however, that the use of solvents is not mandatory in carrying out the present invention. The exact amount of solvent necessary will depend upon the particular photosensitive compound employed. However, the solvent is used in sufiicient quantity to dissolve both the aryldiazonium compound and the epoxy monomer.
- the epoxy compounds listed in Table II illustrate the variety of epoxy compounds suitable for use in the present invention; however, the epoxy compounds listed in the above table are by no means limiting. Further, as illustrated hereinbelow, the epoxy compound may be solid or liquid.
- the amount of photosensitive compound employed in the admixture need not be specifically ascertained but is generally related to the amount of epoxy monomer being polymerized. It has been found that quite satisfactory results are obtained by using from about one to about ten parts by weight of aryldiazonium compound to each one hundred parts by weight of the dry epoxy monomer. Additionally, the photosensitivity of the diazonium compound, and hence the speed of photopolymerization may be further enhanced by the inclusion of certain photosensitizers known in the art of the chemistry of diazonium compounds. Among such sensitizers, but not limited to these, are anthraquinone, l-chloroanthraquinone, primuline, acenaphthylene, naphthalene and anthracene.
- FIG. 1 diagrammatically illustrates the layer of permeable supporting base material coated with a layer of a light sensitive epoxy monomer, prepolymer, or resin;
- FIG. 2 diagrammatically illustrates such permeable material coated on both sides with layers of such epoxy material
- FIG. 3 shows the manner in which such material may be exposed to light passing through an appropriate negative to produce exposed and unexposed areas
- FIGS. 4 and 5 illustrate the production of a finished stencil through solvent development
- FIG. 6 corresponds to FIG. 5 but with both sides of the permeable supporting base coated with the resin;
- FIG. 7 schematically illustrates the duplicating stencil in operation.
- an impervious film or layer of an epoxy monomer, prepolymer, or resin is employed on a sheet of pervious material such as Yoshino long fiber paper, such resin being photosensitive and rendered insoluble due to photochemical action upon exposure to light.
- the photosensitive epoxy containing material may be applied to one or both sides of such pervious material in a conventional manner, such as by whirl coating, weir coating or by roll coating on automatic equipment. It may be applied, for instance, simply by immersing the supporting medium therein and wiping off the surplus through fixed wiping bars. Conventional spraying techniques familiar in the paint industry may be employed, but this will ordinarily require that the pervious supporting medium be supported in an appropriate frame.
- the photosensitive coated material comprises a permeable supporting base 10 of sheet material such as Yoshino long fiber paper coated on one side with the preferred light sensitive epoxy containing material 11, or, alternatively as shown in FIG. 2, such permeable sheet material may be coated on both sides with the epoxy containing material as a film or layer 11.
- the coated material of FIG. 1 is exposed to light passing through negative 8 having a light impermeable area 12, the coating 11 will include exposed and unexposed areas corresponding to the light transmitting and light impermeable areas of the negative.
- the unexposed region 13 remains soluble and may be Washed out by appropriate solvent development as shown in FIG.
- the stencil design will be formed by solvent development of the underexposed regions 15 and 16 on directly opposite sides of permeable sheet 10.
- both sides of sheet 10 are thus coated with the epoxy resist layers, it is especially important that sheet 10 be thin and of good light transmitting quality so that the epoxy material on the underside of the sheet will be exposed sufiiciently to render the same insoluble.
- the epoxy material on the underside of the sheet will, moreover, in such cases likewise preferably be in the form of a relatively thin film.
- the epoxy containing material has been applied as a film as thin as the permeable sheet itself and up to a thickness of 0.01 inch.
- the epoxy containing film should have a thickness of from about 0.0002 to 0.002 inch.
- the permeable supporting sheet will preferably be from /2 mil to 1 mil in thickness for the production of fine line stencils and from 1 to 3 mils in thickness for production of broad line stencils.
- a sheet of tissue paper was impregnated with the above solution. After drying, the impregnated paper was exposed through a transparency image and a half-tone to a Gates Raymaster lamp for two minutes and then developed in acetone. A reversed photoresist image of the copy was left on the paper. The image on the paper was duplicated by superimposing the stencil on a sheet of This example illustrates a preferred embodiment of the invention wherein the epoxy material is applied to one side of a permeable base material.
- Example I The procedure of Example I was repeated employing the above formulation except that the paper was exposed for 30 seconds. The results obtained were the same as in Example I.
- the above formulation was applied to one side of a sheet of paper and the coated paper exposed to actinic radiation through a positive transparency image employing the procedure of Example I. It is heated for 3 minutes at 100 C., prior to development.
- the stencil With the photopolymer stencil image thus prepared, the stencil is employed for duplicating with the photopolymer side held toward the copy medium.
- the paper side, held away from the copy medium is inked with the ink passing through the stencil spaces to print while the polymer coating prevents absorption in non-image areas of the stencil as illustrated in FIG. 7 of the drawing.
- the coated stencil was then exposed through a negative to a 360 watt high pressure mercury lamp at a distance of three inches for five seconds.
- the unexposed area was removed by passage through absorbent rollers to remove the unexposed liquid and copies were duplicated by passage of ink through these unexposed areas.
- the above formulation was applied to aluminum coated paper. After drying, the coated sample was exposed to a raster line scan pattern of an electron beam in a commercially available electron microprobe. With a beam potential of 20 kv., a charge of 10 coulombs/ cm. was used to eifect insolubilization of the areas receiving the electron beam. After development as in Example I, the aluminum was removed from the unexposed areas by etching in 10% sodium hydroxide solution, thus yielding the stencil.
- Example V The procedure of Example V was repeated employing the above formulation except that a charge of 10- eoulombs/cm. was employed to elfect insolubilization of the areas receiving the beam. After development in trichloroethylene, the stencil was prepared as in Example VI.
- excellent stencils may be produced using various substances as the supporting medium.
- supports are paper, silk, glass fi-ber, nylon, rayon, acrylic resins, polyester resins, linen, cotton, wool, metal cloth, metal-coated paper, metalcoated fabrics etc. They should, of course, be selected to provide the proper uniform distribution of voids or inter stices for passage of the marking material therethrough. Likewise, they should be selected to satisfactorily efiect the desired application of the energy source and etching where such is desired.
- the method of producing stencils is suitable for use with any copy which lends itself to photographing and from which a photonegative or photopositive transparency may be prepared. Where the number of copies desired is sufficient to justify, entire pages of print, for example, may be reproduced with excellent detail and stencils produced in accordance with the invention may readily be applied to the silk screen process.
- the new stencils are especially useful for employment with electrolytes for electrolytic etching and marking, particularly of metals. They have proved extremely wear-resistant, are not hydrophilic, and produce very sharp and definite outlines.
- the stencil image is formed by washing the stencil sheet in a suitable developing solvent that will remove the material in the unexposed areas, but leave the exposed (polymerized) areas together with etching to remove metal in the unexposed areas where such are employed.
- the unpolymerized epoxy monomer is removed from areas corresponding to the printed matter.
- the image may be duplicated by the passage of ink through these areas of the stencil.
- the developing solvent is not necessary if a liquid epoxy monomer system is used as in Example IV. In such a situation the unexposed area is removed by blotting to absorb the unexposed liquid monomer.
- the development i.e., solvent washing step can be eliminated if the ink chosen for the duplication process contains a solvent that would dissolve through the unexposed areas when the first few copies are printed.
- a process for producing a stencil which comprises (1) applying a composition comprising a liquid epoxy monomer or prepolymer and an aromatic diazonium 1 1 salt of a complex anion, said anion being selected from the group consisting of haloantimonates, haloarsenates, halobismuthates, haloferrates, halostannates and halophosphates wherein each halogen is selected from the group consisting of fluorine and chlorine to a permeable base substrate;
- composition contains from about 1 percent to about percent by weight of photosensitive aromatic diazonium salt based on the dry weight of the epoxy monomer.
- a process for producing a stencil which comprises applying a composition comprising a liquid polymerizable epoxy containing material and a photosensitive aryl diazonium compound having the formula:
- MX is a halogen containing complex anion selected from the group consisting of hexachlorostannate IV, tetrachloroferrate III, hexafluorophosphate, hexafiuoroarsenate V, hexachloroantimonate V, hexafiuoroantimonate V and pentachlorobismuthate III;
- X is the halogen, n is the oxidation state of M, m is the number of diazonium groups in the diazonium compounds as determined by the net charge on said complex anion, and Y is selected from at least one of the group consisting of halogen, nitro, N-morpholino, alkyl, alkoxy, aryl, amino, aryl amino, alkylamino and arylmercapto and arylthio radicals to a permeable supporting base; exposing a portion of said composition through a screening means to elec tromagnetic radiation of pre
- composition ocntains from about 1 percent to about 10 percent by weight of photosensitive aryldiazonium compound based on the dry weight of the epoxy monomer.
- screening means includes projecting an image onto said permeable base having said composition.
- a stencil comprising a permeable supporting base having applied to portions of at least one surface thereof as the non-image area, a photopolymerized hardened, organic solvent-insoluble reaction product of an epoxy monomer or prepolymer and an aromatic diazonium salt of a complex anion, said anion being selected from the group consisting of haloantimonates, haloarsenates, halobismuthates, haloferrates, halostannates and halophosphates wherein each halogen is selected from the group consist-- ing of fluorine and chlorine.
Abstract
A STENCIL IS PREPARED FROM A SUPPORT SUCH AS PAPER, SILK OR NYLON, METAL OR METAL COATED MATERIAL WHICH IS COATED WITH AN EPOXY-DIAZONIUM COMPOSITION, THE SURFACE OF THE MATERIAL IS EXPOSED TO AN ENERGY SOURCE, PREFERABLY ACTINIC RADIATION, IN AN IMAGE WISE MANNER TO EFFECT POLYMERIZATION OF SAID COMPOSITION AND UNPOLYMERIZED COMPOSITION IS REMOVED, PREFERABLY BY WASHING WITH A SOLVENT.
Description
y 1974 s. I. SCHLESINGER 3,826,
EPOXY PHOTOPOLYMER DUPLICATING STENCIL Filed Aug. 25. 1972 LIGHT-SENSIT IVE E POX Y M AT E R I A L illlllllllllnnllnun l0 PERMEABLE SUPPORTING BASE LIGHT-SENSITIVE EPOXY MAT E R IA L I 1 PERM EABLE SUPPORTING BASE EXPOSURE 2} SUBJECT 8 /2 IL, UNEXPOSED AREA or EPOXY MATERIAL IIIIIIIIIIIIIIIIIIIIIIA EXPOSED EPOXY MATERIAL PERMEABLE SUPPORTING BASE FL -EI UNEXPOSED AREA IIIIIIIIIIIIIIIIIIIIIII N s 0 Lu 8 2 E D N A E A PERM EABLE SUPPORTING BASE WASHED ou'r AREA SOLVENT DEVELOPMENT any I m mmsm INSOLUBLE RESIN RESIST VIIIflIIII/IIIIIIIIIIIIIA PERM EABLE SUPPORTING BASE I NSOLU BLE RESIN RESIST PE RM EABLE SUPPORTING BASE INSOLUBLE RESIN RESIST PERM EABLE SUPPORTING BASE INSOLUBLEIZED RESIN AREA II PREVENTS INK FLOW WASHED OUT AREA I4 ALLows INK FLOW FOR PRINTING COPY PAPER OR OTHER MEDIUM FOR RECEIVING PRINTING INK F1 7 FROM STENCIL IMAGE United States Patent 3,826,650 EPOXY PHOTOPOLYMER DUPLICATING STENCIL Sheldon I. Schlesinger, Hightstowu, N.J., assiguor to American Can Company, Greenwich, Conn. Continuation-impart of application Ser. No. 753,869, Aug. 20, 1968, now Patent No. 3,708,296, dated Jan. 2, 1973. This application Aug. 25, 1972, Ser. No. 283,629 The portion of the term of the patent subsequent to Jan. 2, 1990, has been disclaimed Int. Cl. G03c 1/70 US. Cl. 96-351 19 Claims ABSTRACT OF THE DISCLOSURE A stencil is prepared from a support such as paper, silk or nylon, metal or metal coated material which is coated with an epoxy-diazonium composition, the surface of the material is exposed to an energy source, preferably actinic radiation, in an image wise manner to effect polymerization of said composition and unpolymerized composition is removed, preferably by washing with a solvent.
CROSS-REFERENCE TO RELATED APPLICATION This application is a continuation-in-part of my pending application Ser. No. 753,869, filed Aug. 20, 1968, now US. Pat. 3,708,296, issued Jan. 2, 1973.
BACKGROUND OF THE INVENTION Duplicating paper or the like has been cut, die-impressed and embossed in the preparation of stencils for use on mimeograph and other types of duplicating machines. Further, an electrolytic method of marking metals through a die-impressed pressure sensitive resist or engraved plastic resist has been widely accepted by the metal marking industry and is now preferred in contrast to the older methods utilizing steel die stamps, acid and ink stamps, and pantograph or engraving tools. Such electrolytic method has utilized a die-impressed pressure sensitive paper stencil which has been reinforced with various types of synthetic or natural resins and waxes adapted to be readily displaced by pressure rolling or by impact against electrotype or etched plates. After dieimpressing, a liquid marking medium which may be either an ink or an electrolytic fluid, for example, is then applied to the stencil sheet and will pass through the porous fibrous layer where thus exposed and mark an underlying work surface accordingly.
Stencils of the type above discussed are very convenient of use and give satisfactory results when first employed. They are, however, not very long-lived and the results obtained from any one stencil tend to become less and less satisfactory until the stencil must eventually be discarded. Many interested in the stencil problem has attempted to solve it through the technique of applying water soluble colloids containing photosensitive compounds to a supported porous member. After the coating has dried, a photonegative or a photopositive transparency is placed in contact with the coating, and by exposure to a proper light source, some curing of the light exposed coating may be caused to take place. The unexposed area may then be Washed out with water and the exposed area treated in a hardening solution.
It will be appreciated that While the techniques described above have certain advantages, they have certain features which are not good for the instant purposes. Colloidal proteins which have been light sensitized with bichromates produce fairly well-defined copy but since they are hydrophilic they never become truly water impermeable but will imbide water (including electrolytes) and thus serve as electrical conductors. This renders them un- 3,826,650. Patented July 30, 1974 suitable for electrolytic and other types of stencil work. There is a continued need for stencils that are devoid of the problems discussed and for methods for their preparation.
SUMMARY OF THE lNVEN'lTION The present invention relates to novel duplicating stencils and their preparation from coating materials which include a polymerizable epoxy monomer and a photosensitive catalyst.
This invention relates then to the use of a process for polymerizing epoxy monomers and more particularly to a process for effecting the photopolymerization of epoxy monomers by use of organic compounds which are photosensitive and release an active catalyst upon application of energy. This material is used as a coating material to produce a stencil.
The term epoxy monomer or prepolymer in the description of this invention includes any molecule containing one or more 1,2-epoxy or oxirane rings, whether the molecule consists of a small grouping of atoms or of a chain of repeating units as in commercial resins. Thus, this invention includes the treatment of commercial epoxy resins, sometimes referred to as prepolymers, which consist of smaller molecular units which have been linked together to give longer chains with pendant epoxy groups which are capable of further polymerization. All of the epoxy compounds treated in the present invention regardless of whether they are referred to as monomers, resins or prepolymers will contain the 1,2-epoxy or oxirane ring structure which will be identified hereinafter as an epoxy ring and where R R R and R, can be alkyl, aryl, 'alkoxy, alkenyl, halogen and hydrogen.
In order to effect the polymerization of the above defined monomers, it is necessary to open the epoxy ring through cleavage of a carbon-oxygen bond. A reactive intermediate is then formed, which can subsequently open up another epoxy ring. This reaction may repeat itself many times in a chain reaction to form a polymer of repeating ether units.
The method of the present invention proposes the use of novel aryldiazonium compounds as photosensitive agents, which upon exposure to an energy source, such as radiation or electron beam scanning, releases an active catalyst which initiates the polymerization of epoxy monomers to produce epoxy polymers. However, many of similar such photosensitive compounds proposed by the prior art, for example aryl diazonium fluoroborates, tend to be chemically unstable resulting in disadvantages of extremely short pot life and being potentially explosively hazardous. It has been discovered herein that the catalyst activity and resulting usefulness of aryldiazonium compounds cannot be determined on a random basis. Moreover, it has been unexpectedly discovered that many aryldiazonium compounds do not possess the requisite properties necessary to catalyze the wide variety of epoxy monomers previously defined herein. Accordingly, it is desirable to identify and discover new and improved epoxy monomer catalyzing agents useful in the photopolymerization process which are not subject to and overcome the deficiencies now existing in the art.
Accordingly, a new and improved class of aryldiazonium compounds has been discovered which upon admixture with an epoxy monomer or prepolymer followed by application to a stencil and subsequent exposure to an energy source release an active catalyst which effects the polymerization of the epoxy monomer. This new class of photosensitive compounds possess the properties of increased speed and efficiency in catalyzing polymerization and in yielding epoxy polymers which possess inherent superior toughness, abrasion resistance, and resistance to chemical attack.
The photosensitive latent curing agents utilized in accordance with the present invention may be classified as aromatic diazonium salts of a complex anion, this anion being selected from the group consisting of haloantimonates, haloarsenates, halobismuthates, haloferrates, halostannates and halophosphates wherein each halogen atom is a lower atomic weight halogen selected from the group consisting of fluorine and chlorine, the latent curing agent initially having had substantially no application of energy thereto. The preferred photosensitive compounds of the present invention can be defined by the following formula:
where MX is a halogen containing complex anion selected from the group consisting of hexachlorostannate IV, tetrachloroferrate III, hexafluorophosphate, hexafluoroarsenate V, hexachloroantimonate V, hexafiuoroantimonate V and pentachlorobismuthate III; and Y is selected from at least one of the group consisting of nitro, halogen, N-morpholino, alkyl, alkoxy, aryl, amino, arylamino, alkylamino and arylmercapto and arylthio radicals, indicating the variety of substituted aryl compounds which may carry the diazonium group forming the cation in the photosensitive aromatic diazonium salts having the formula shown above. In the above formula it will be understood that n is equal to the oxidation state of the element M and m is equal to the number of halogen atoms which are given up upon application of energy such as actinic radiation to yield a Lewis acid, m thus being the number of diazonium groups in the diazonium salt as determined by the net charge on the complex anion n+m)- Specific examples of photosensitive compounds which can be used in the present invention include:
p-nitrobenzenediazonium hexafluorophosphate o-nitrobenzenediazonium hexafluorophosphate 2,5-dichlorobenzenediazonium hexafluorophosphate p-N-morpholinobenzenediazonium hexafluorophosphate 2,5-diethoxy-4-(p-tolyl) benzenediazonium hexafiuorophosphate 2-chloro-4- dimethylamino) -5-methoxyb enzenediazonium hexafluorophosphate 2,5 -diethoxy-4-(p-tolymercapto) benzenediazonium hexafluorophosphate 2,S-dimethoxy-4-N-morpholinobenzenediazonium hexafluorophosphate 4-(dimethylamino)naphthalene diazonium hexafluorophosphate 2,S-diethoxy-4-ethoxyphenylbenzenediazonium hexafiuorophosphate 2,5-diethoxy-4-(p-tolyl)benzenediazonium hexafiuoroarsenate p-nitrobenzene diazonium hexafiuoroarsenate p-Nmorpholinobenzenediazonium hexafluoroarsenate 2,5 -diethoxy-4- p-tolyl) benzenediazonium hexafluoroantimonate 4. 2,4-dichlorobenzenediazonium hexachloroantimonate p-nitrobenzene diazonium hexa-fluoroantimonate p-N-morpholinobenzenediazonium hexafluoroantimonate 2,5-dichlorobenzenediazonium hexachloroantimonate 2,S-dichlorobenzenediazonium hexafiuoroantimonate 2,4-dichlorobenzenediazonium pentachlorobismuthate III o-nitrobenzenediazonium pentachlorobismuthate III 2,4-dichlorobenzenediazonium tetrachloroferrate III.
The diazonium compounds of the present invention may be prepared from procedures known in the art and such preparation forms no part of the present invention. Thus the chlorometallic complexes may be prepared for example in accordance with the method set forth by Lee et al. in Journal of the American Chemical Society, 83, 1928 (1961). Diazonium hexafiuorophosphates can be prepared by diazotizing the corresponding aniline with NOPF an HCl-NaNO combination with subsequent addition of HPF or a PP; salt, or by addition of such a hexafluorophosphate salt to another diazonium salt to effect precipitation. The N-morpholino complexes can be prepared either from the aniline derivative or by adding an aqueous solution of the desired inorganic complex salt to a solution of p-Nmorpholinobenzenediazonium fiuoroborate.
The epoxy monomers which can be employed in the present invention can be defined by the following formula:
where R R R and R; can be alkyl, aryl, alkoxy, alkenyl, halogen and hydrogen. Specific examples of such monomers include, but are not limited to, ethylene oxide and homologues thereof; glycidic and glycidyl esters; glycidyl (2,3-epoxypropyl) methacrylates, acrylates and crotonates; and allyl glycidyl ethers. Additionally, commercial synthetic resins as heretofore defined can be employed. Examples of such resins can be those derived from the diglycidyl ether of bisphenol A, epoxidized polyolefins and epoxylated novolacs. Combinations of the above epoxies may be used and additionally they may be in solid or liquid form. Such epoxies may preferably also include the copolymer of glycidyl methacrylate and allyl glycidyl ether prepared as disclosed in the Schlesinger et al. copending application Ser. No. 297,829, filed Oct. 16, 1972 entitled Copolymer of Glycidyl Methacrylate and Allyl Glycidyl Ether and Polymerization Thereof the disclosure of which is incorporated herein by the foregoing reference.
The overall reaction which occurs in carrying out the present invention can be depicted by the following equatrons:
MXM T mNi MX m actjxflc m (Lewis Acid Y radiation (II) MXn epoxy monomer polymer where MX J is a complex anion as defined previously, and Y is as defined previously. It will be seen that in equation I, exposure of the particular aryldiazonium photosensitive compound of the present invention produces a Lewis Acid represented by the formula MX By Lewis Acid is meant an electron pair acceptor such as PF FeCl AsF SbF SnCL; and BiCl The Lewis Acid produced in equation I initiates or catalyzes the photopolymerization process depicted in equation II, wherein the epoxy monomer is polymerized as the result of the action of applied energy. While not essential to the functioning of the present invention, it is believed that certain intermediates such as carboniu-m ions are formed during photolysis of the diazonium compound which aid in the polymerization reaction.
A general application of the process embodied by equations I and II in the preparation of a stencil can be as follows: a diazonium compound, as heretofore defined, is admixed, with or without the use of a suitable solvent, with an epoxy monomer. The mixture is thereafter coated on a suitable substrate to prepare a stencil. After evaporating solvent which may be present, the stencil is exposed, for example, to ultraviolet light through a mask or negative. When the light strikes the stencil the diazonium compound decomposes to yield a catalyst in the form of a Lewis Acid which initiates the polymerization of the epoxy monomer. The resulting polymer is resistive to most solvents and chemicals in the exposed areas. The unexposed areas can be washed away with suitable solvents to leave a reversal image in the form of an epoxy polymer which produces the stencil design. With certain solventless liquid epoxies, however, it is possible to remove the unexposed material by blotting away the liquid. That is, the unexposed liquid epoxy may be removed from the exposed (now solid) epoxy resin by pressing between absorbent sheets.
The energy source required for effective decomposition of the latent catalysts employed in the invention may be energy applied by bombardment with charged particles, notably by high-energy electron beam irradiation. In such an application of energy, the electron beam is used as a pen to scan the desired pictorial or alphanumeric information on the epoxy layer after which development and processing is the same as when electromagnetic radiation is the energy source. However, the catalyst precursors described hereinbelow are primarily photosensitive and the required energy is preferably imparted by actinic irradiation which is most eifective at those regions of the electromagnetic spectrum at which there is high absorption of electromagnetic energy by the particular catalyst precursor used. More than one of these types of energy may be applied to the same system: e.g. ultraviolet light followed by electron beam irradiation, etc. The preferred energy, actinic radiation, can be any produced by any suitable source such as a mercury, xenon, carbon are or tungsten filament lamp. The only limitations placed on the type of instrumentation used is that it must have a frequency range and energy level sufficient to impart to the monomer or prepolymer system energy at a high enough intensity to reach the decomposition level of the photosensitive compounds. Table I below lists some of the photosensitive compounds of the present invention including absorption maxima in acetonitrile.
TABLE IContinued Decomposition Absorpmelting tion point, maxima, Complex type Ring substituents C mu Hexafiuorophosphate p-Chloro 162-164 273 p-Nltro 156 258, 310 N=N P Fe p-(N-morpholino) 162 37 7 2,4,6-triehloru 240-250 294, 337 2,4,6-tribromo 237-250 306 2,5-dimethoxy-4-(p- 167 210,405
tolyl) 2,5-diethoxy-4-p- 147 247,400
tolylmereapto. 2,5-dimethoxy-4- 266, 396
N -morpholino. 2,5-diethoxy-4-p- 136 265, 415
ethoxyphenyl. 2-eh10r0-4-dimethy1- 111 273, 405
amino-5-methoxy. o-Nitro 161,5 2,5-dimeth oxy-4- 168-9 243, 287 ehloro. 392 2,5-dimethoxy-4-p- 146 tolylmercapto. 2,4-dimethyl-6-n1tro- 150 237,290 2-nitro-4-methyL- 164-5 286 2-methyl-4nitro-. 123 262, 319
Hexailuorophosphate 4-dimethy1amino. 148 280,
N=N-PF:
Hexafluoroarsenate, V p-Nitro 141-144 257, 310 p-(N-morpholino) 162 257, 378 III=NASFO Hexafiuoroant'unonate, V p-Nitro -141 257, 308 2,5-dich1oro 161-162. 5 238, 358 111 =NSbF; p(-N-Inolpho1lno) N. 153 254, 374
Hexachloroantimonate, V 2,4-dich1oro 178-180 282, 322
N=NSbC1u Pentaehlorobismuthate, 285, 318 III 285, 313
*By eapaillary tube method. Higher melting points can be obtained in differential thermal analysis apparatus under nitrogen.
In acetonitrile.
The procedures for admixing the photosensitive compounds of the present invention with epoxy monomers are relatively simple and can be carried out in the following manner. An epoxy monomer, resin. or prepolymer as heretofore defined containing oxirane groups is combined with a photosensitive aryldiazonium compound of the present invention. Suitable inert solvents may be employed if desired in effecting this mixture. By a suitable inert solvent is meant one that does not react appreciably with the monomer or the aryldiazonium compound before exposure to actinic radiation. Examples of such solvents include acetone, methyl benzoate, aoetonitrile, butyronitrile, benzonitrile, toluene, o-chlorotoluene, xylene, methyl ethyl ketone, cellosolve ether, monochlorobenzene, trichloroethylene, anisole, tetrachloroethane, dichlorobenzene, and propylene carbonate. Mixtures of these solvents have been found useful in the present invention. Furthermore, a liquid epoxy may serve as solvent for another epoxy, liquid or solid in nature. It is to be understood, however, that the use of solvents is not mandatory in carrying out the present invention. The exact amount of solvent necessary will depend upon the particular photosensitive compound employed. However, the solvent is used in sufiicient quantity to dissolve both the aryldiazonium compound and the epoxy monomer.
. Table II below summarizes some of the epoxy compounds treated by the above process.
N1 Sold commercially by Ciba Pharmaceutical Products, Inc., Summit, t? t iinmercially by Shell Chemical Corporation, New York, New York.
The epoxy compounds listed in Table II illustrate the variety of epoxy compounds suitable for use in the present invention; however, the epoxy compounds listed in the above table are by no means limiting. Further, as illustrated hereinbelow, the epoxy compound may be solid or liquid.
The amount of photosensitive compound employed in the admixture need not be specifically ascertained but is generally related to the amount of epoxy monomer being polymerized. It has been found that quite satisfactory results are obtained by using from about one to about ten parts by weight of aryldiazonium compound to each one hundred parts by weight of the dry epoxy monomer. Additionally, the photosensitivity of the diazonium compound, and hence the speed of photopolymerization may be further enhanced by the inclusion of certain photosensitizers known in the art of the chemistry of diazonium compounds. Among such sensitizers, but not limited to these, are anthraquinone, l-chloroanthraquinone, primuline, acenaphthylene, naphthalene and anthracene.
DETAILED DESCRIPTION OF THE INVENTION To the accomplishment of the foregoing and related ends, said invention then comprises the features hereinafter fully described and particularly pointed out in the claims, the following description and the annexed drawings setting forth in detail certain illustrative embodiments of the invention, these being indicative, however, of but a few of the various ways in which the principle of the invention may be employed.
In the drawing:
FIG. 1 diagrammatically illustrates the layer of permeable supporting base material coated with a layer of a light sensitive epoxy monomer, prepolymer, or resin;
FIG. 2 diagrammatically illustrates such permeable material coated on both sides with layers of such epoxy material;
FIG. 3 shows the manner in which such material may be exposed to light passing through an appropriate negative to produce exposed and unexposed areas;
FIGS. 4 and 5 illustrate the production of a finished stencil through solvent development;
FIG. 6 corresponds to FIG. 5 but with both sides of the permeable supporting base coated with the resin;
FIG. 7 schematically illustrates the duplicating stencil in operation.
Accordingly, an impervious film or layer of an epoxy monomer, prepolymer, or resin is employed on a sheet of pervious material such as Yoshino long fiber paper, such resin being photosensitive and rendered insoluble due to photochemical action upon exposure to light. The photosensitive epoxy containing material may be applied to one or both sides of such pervious material in a conventional manner, such as by whirl coating, weir coating or by roll coating on automatic equipment. It may be applied, for instance, simply by immersing the supporting medium therein and wiping off the surplus through fixed wiping bars. Conventional spraying techniques familiar in the paint industry may be employed, but this will ordinarily require that the pervious supporting medium be supported in an appropriate frame.
As exemplified in FIG. 1 of the drawing which is the preferred embodiment of the invention, the photosensitive coated material comprises a permeable supporting base 10 of sheet material such as Yoshino long fiber paper coated on one side with the preferred light sensitive epoxy containing material 11, or, alternatively as shown in FIG. 2, such permeable sheet material may be coated on both sides with the epoxy containing material as a film or layer 11. When the coated material of FIG. 1 is exposed to light passing through negative 8 having a light impermeable area 12, the coating 11 will include exposed and unexposed areas corresponding to the light transmitting and light impermeable areas of the negative. Thus, as shown in FIGS. 4 and 5, the unexposed region 13 remains soluble and may be Washed out by appropriate solvent development as shown in FIG. 5 to expose the underlying permeable material 10 in a sharply defined area 14 forming the stencil design. Similarly, as shown in FIG. 6, when both sides of the thin permeable layer 10 have been coated with the epoxy containing material, the stencil design will be formed by solvent development of the underexposed regions 15 and 16 on directly opposite sides of permeable sheet 10. When both sides of sheet 10 are thus coated with the epoxy resist layers, it is especially important that sheet 10 be thin and of good light transmitting quality so that the epoxy material on the underside of the sheet will be exposed sufiiciently to render the same insoluble. The epoxy material on the underside of the sheet will, moreover, in such cases likewise preferably be in the form of a relatively thin film.
Within the purview of the invention the epoxy containing material has been applied as a film as thin as the permeable sheet itself and up to a thickness of 0.01 inch. Ordinarily, the epoxy containing film should have a thickness of from about 0.0002 to 0.002 inch. The permeable supporting sheet will preferably be from /2 mil to 1 mil in thickness for the production of fine line stencils and from 1 to 3 mils in thickness for production of broad line stencils.
The following formulations and Examples are given to illustrate the instant invention:
EXAMPLE I Formulation:
(a) Epoxy-cresol novolac (ECN 1299) having an average M.W. of 1270 and epoxy equivalent weight of 235 in 50% solution in monochlorobenzene g 16.25 (b) Butyronitrile ml 22.5 (c) p-Nitrobenzenediazonium hexafiuorophosphate g 0.225 (d) Monochlorobenzene ml 17.5
A sheet of tissue paper was impregnated with the above solution. After drying, the impregnated paper was exposed through a transparency image and a half-tone to a Gates Raymaster lamp for two minutes and then developed in acetone. A reversed photoresist image of the copy was left on the paper. The image on the paper was duplicated by superimposing the stencil on a sheet of This example illustrates a preferred embodiment of the invention wherein the epoxy material is applied to one side of a permeable base material.
(a) Glycidyl methacrylate allyl glycidyl ether copolymer in a 60% solution of toluene g 97 (b) Acetonitrile m 95 (c) p Chlorobenzenediazonium hexafluorophosphate g 2.91
The procedure of Example I was repeated employing the above formulation except that the paper was exposed for 30 seconds. The results obtained were the same as in Example I.
EXAMPLE III Formulation:
(a) Bisphenol-A-glycidyl ether polymer having an epoxide equivalent of 250-400 in 50% toluene .g 30.5 (b) Butyronitrile ..-ml 50 (c) p-N-morpholinobenzene diazonium hexafluorophosphate g 0.763
The above formulation was applied to one side of a sheet of paper and the coated paper exposed to actinic radiation through a positive transparency image employing the procedure of Example I. It is heated for 3 minutes at 100 C., prior to development. With the photopolymer stencil image thus prepared, the stencil is employed for duplicating with the photopolymer side held toward the copy medium. The paper side, held away from the copy medium is inked with the ink passing through the stencil spaces to print while the polymer coating prevents absorption in non-image areas of the stencil as illustrated in FIG. 7 of the drawing.
EXAMPLE IV In this example no additional solvent was employed so that the epoxy containing monomers selected were of the liquid type.
Formulation:
(a) 20 parts by weight of an epoxy phenol novolak (b) 6 parts by weight of his (3,4-epoxy-6-methylcyclohexyl methyl) adipate (c) 2 parts by weight of vinyl cyclohexene dioxide ((1) 4 parts by weight of an aliphatic glycidyl ether where the alkyl groups are predominantly C and 10- To 20 parts by weight of this master batch was added 1 part of a 20% solution of p-chlorobenzene diazonium hexafluorophosphate in acetonitrile. The catalyzed formulation was applied to a stencil using a roller coater. The coated stencil was then exposed through a negative to a 360 watt high pressure mercury lamp at a distance of three inches for five seconds. The unexposed area was removed by passage through absorbent rollers to remove the unexposed liquid and copies were duplicated by passage of ink through these unexposed areas.
The following examples illustrate the use of electron beam as the energy source:
EXAMPLE V Formulation:
(a) 75 g. of glycidyl methacrylate-allyl glycidyl ether copolymer (b) 364.3 g. of butyronitrile (c) 60.7 g. of o-chlorotoluene (d) 3.75 g. of 2-5-diethoxy-4-(p-tolylmercapto) benzene diazonium hexafluorophosphate.
The above formulation was applied to aluminum coated paper. After drying, the coated sample was exposed to a raster line scan pattern of an electron beam in a commercially available electron microprobe. With a beam potential of 20 kv., a charge of 10 coulombs/ cm. was used to eifect insolubilization of the areas receiving the electron beam. After development as in Example I, the aluminum was removed from the unexposed areas by etching in 10% sodium hydroxide solution, thus yielding the stencil.
EXAMPLE VI Formulation:
G. (a) Epoxy-cresol novolac (ECN 1299') 75 (b) Butyrom'trile 364.3 (0) o-Chlorotoluene 60.7
(d) 2,5-diethoxy-4(p-tolylmercapto) benzene diazonium hexafluorophosphate 3.75
The procedure of Example V was repeated employing the above formulation except that a charge of 10- eoulombs/cm. was employed to elfect insolubilization of the areas receiving the beam. After development in trichloroethylene, the stencil was prepared as in Example VI.
By means of the present invention, excellent stencils may be produced using various substances as the supporting medium. Examples of such supports are paper, silk, glass fi-ber, nylon, rayon, acrylic resins, polyester resins, linen, cotton, wool, metal cloth, metal-coated paper, metalcoated fabrics etc. They should, of course, be selected to provide the proper uniform distribution of voids or inter stices for passage of the marking material therethrough. Likewise, they should be selected to satisfactorily efiect the desired application of the energy source and etching where such is desired.
The method of producing stencils is suitable for use with any copy which lends itself to photographing and from which a photonegative or photopositive transparency may be prepared. Where the number of copies desired is sufficient to justify, entire pages of print, for example, may be reproduced with excellent detail and stencils produced in accordance with the invention may readily be applied to the silk screen process. The new stencils are especially useful for employment with electrolytes for electrolytic etching and marking, particularly of metals. They have proved extremely wear-resistant, are not hydrophilic, and produce very sharp and definite outlines.
As stated in the above the stencil image is formed by washing the stencil sheet in a suitable developing solvent that will remove the material in the unexposed areas, but leave the exposed (polymerized) areas together with etching to remove metal in the unexposed areas where such are employed. Thus, the unpolymerized epoxy monomer is removed from areas corresponding to the printed matter. The image may be duplicated by the passage of ink through these areas of the stencil.
The developing solvent is not necessary if a liquid epoxy monomer system is used as in Example IV. In such a situation the unexposed area is removed by blotting to absorb the unexposed liquid monomer. With either technique, the development, i.e., solvent washing step can be eliminated if the ink chosen for the duplication process contains a solvent that would dissolve through the unexposed areas when the first few copies are printed.
While there have been shown and described particular embodiments of the invention, it will be obvious to those skilled in the art that various changes and modifications may be made therein without departing from the invention, and, therefore, it is aimed to cover all such changes and modifications as fall within the true spirit and scope of the invention.
What is claimed is:
1. A process for producing a stencil which comprises (1) applying a composition comprising a liquid epoxy monomer or prepolymer and an aromatic diazonium 1 1 salt of a complex anion, said anion being selected from the group consisting of haloantimonates, haloarsenates, halobismuthates, haloferrates, halostannates and halophosphates wherein each halogen is selected from the group consisting of fluorine and chlorine to a permeable base substrate;
(2) exposing at least a portion of said composition to electromagnetic or electron-beam irradiation through an article having opaque and transparent areas, to effect polymerization and to render the exposed areas of said composition insoluble;
(3) removing said unexposed areas of said liquid composition to produce the stencil design.
2. The process of claim 1 wherein said composition contains from about 1 percent to about percent by weight of photosensitive aromatic diazonium salt based on the dry weight of the epoxy monomer.
3. The process of claim 1 wherein said aromatic diazonium salt is a halophosphate.
4. The process of claim 3 wherein said halophosphate is hexafiuorophosphate.
5. The process of claim 1 wherein said irradiation is electromagnetic radiation.
6. The process of claim 1 wherein said irradiation is electron beam irradiation.
7. A process for producing a stencil which comprises applying a composition comprising a liquid polymerizable epoxy containing material and a photosensitive aryl diazonium compound having the formula:
where MX is a halogen containing complex anion selected from the group consisting of hexachlorostannate IV, tetrachloroferrate III, hexafluorophosphate, hexafiuoroarsenate V, hexachloroantimonate V, hexafiuoroantimonate V and pentachlorobismuthate III; X is the halogen, n is the oxidation state of M, m is the number of diazonium groups in the diazonium compounds as determined by the net charge on said complex anion, and Y is selected from at least one of the group consisting of halogen, nitro, N-morpholino, alkyl, alkoxy, aryl, amino, aryl amino, alkylamino and arylmercapto and arylthio radicals to a permeable supporting base; exposing a portion of said composition through a screening means to elec tromagnetic radiation of predetermined intensity and frequency to efiect said polymerization and removing un- 12 polymerized portions of said liquid composition to produce the stencil design.
8. The process of claim 7 wherein the composition ocntains from about 1 percent to about 10 percent by weight of photosensitive aryldiazonium compound based on the dry weight of the epoxy monomer.
9. The process of claim 7 wherein the composition is subjected to heat after exposureto said electromagnetic radiation.
10. The process of claim 7 wherein the screening means includes projecting an image onto said permeable base having said composition.
11. The process of claim 7 wherein the screening means includes impinging a shadow arrangement onto said permeable base having said composition.
12. The process of claim 7 wherein said unpolymerized portions of said composition is removed without the use of solvent.
13. The process of claim 7 wherein said composition is applied to one side of a permeable supporting base.
14. The process of claim 13 wherein said supporting base is paper.
15. A stencil comprising a permeable supporting base having applied to portions of at least one surface thereof as the non-image area, a photopolymerized hardened, organic solvent-insoluble reaction product of an epoxy monomer or prepolymer and an aromatic diazonium salt of a complex anion, said anion being selected from the group consisting of haloantimonates, haloarsenates, halobismuthates, haloferrates, halostannates and halophosphates wherein each halogen is selected from the group consist-- ing of fluorine and chlorine.
16. A stencil as claimed in claim 15 wherein the permeable substrate has the reaction product applied to both sides thereof.
17. A stencil as claimed in claim 16 in which said substrate is paper.
18. A stencil as claimed in claim 15 wherein the per meable substrate has the reaction product applied to one side thereof.
19. A stencil as claimed in claim 15 in which said substrate is paper.
References Cited UNITED STATES PATENTS 3,708,296 1/1973 Schlesinger 96-33 3,699,025 10/1972 Jenkins et a1. 204-l59.l4
RONALD H. SMITH, Primary Examiner US. Cl. X.R.
9636.4; 10l--128.3; 117-85, 93.31; 204l59.l8, 159.23
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US28362972 US3826650A (en) | 1968-08-20 | 1972-08-25 | Epoxy photopolymer duplicating stencil |
CA179,610A CA1004521A (en) | 1972-08-25 | 1973-08-24 | Epoxy photopolymer duplicating stencil |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US75386968A | 1968-08-20 | 1968-08-20 | |
GB3227270 | 1970-07-02 | ||
FR7027594A FR2098757A5 (en) | 1968-08-20 | 1970-07-27 | |
BE755013 | 1970-08-19 | ||
US28362972 US3826650A (en) | 1968-08-20 | 1972-08-25 | Epoxy photopolymer duplicating stencil |
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US3826650A true US3826650A (en) | 1974-07-30 |
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US28362972 Expired - Lifetime US3826650A (en) | 1968-08-20 | 1972-08-25 | Epoxy photopolymer duplicating stencil |
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Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4002478A (en) * | 1973-03-15 | 1977-01-11 | Kansai Paint Company, Ltd. | Method for forming relief pattern |
US4058401A (en) * | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
US4060656A (en) * | 1973-04-02 | 1977-11-29 | Teijin Limited | Support for photosensitive resin |
US4081276A (en) * | 1976-10-18 | 1978-03-28 | General Electric Company | Photographic method |
US4138255A (en) * | 1977-06-27 | 1979-02-06 | General Electric Company | Photo-curing method for epoxy resin using group VIa onium salt |
US4163912A (en) * | 1977-09-23 | 1979-08-07 | General Electric Company | Electrical insulating sheet material and electric winding made therefrom |
US4175972A (en) * | 1974-05-02 | 1979-11-27 | General Electric Company | Curable epoxy compositions containing aromatic onium salts and hydroxy compounds |
US4199359A (en) * | 1968-05-16 | 1980-04-22 | Xerox Corporation | Photographic screen stencil printing process |
US4256828A (en) * | 1975-09-02 | 1981-03-17 | Minnesota Mining And Manufacturing Company | Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials |
US4291116A (en) * | 1977-10-28 | 1981-09-22 | Tibbetts Charles C | Method of image reproduction and materials therefor |
US4318766A (en) * | 1975-09-02 | 1982-03-09 | Minnesota Mining And Manufacturing Company | Process of using photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials |
US4356050A (en) * | 1979-12-11 | 1982-10-26 | General Electric Company | Method of adhesive bonding using visible light cured epoxies |
US4394403A (en) * | 1974-05-08 | 1983-07-19 | Minnesota Mining And Manufacturing Company | Photopolymerizable compositions |
US4399178A (en) * | 1979-01-12 | 1983-08-16 | Franz Barta Kommanditgesellschaft | Decalcamania picture for applying designs or imprints to objects of glass, ceramics or such-like, process for transferring decalcamania picture of that kind, and apparatus for carrying out said process |
US4582885A (en) * | 1978-07-20 | 1986-04-15 | Minnesota Mining And Manufacturing Company | Shaped plastic articles having replicated microstructure surfaces |
US4882245A (en) * | 1985-10-28 | 1989-11-21 | International Business Machines Corporation | Photoresist composition and printed circuit boards and packages made therewith |
-
1972
- 1972-08-25 US US28362972 patent/US3826650A/en not_active Expired - Lifetime
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4199359A (en) * | 1968-05-16 | 1980-04-22 | Xerox Corporation | Photographic screen stencil printing process |
US4002478A (en) * | 1973-03-15 | 1977-01-11 | Kansai Paint Company, Ltd. | Method for forming relief pattern |
US4060656A (en) * | 1973-04-02 | 1977-11-29 | Teijin Limited | Support for photosensitive resin |
US4175972A (en) * | 1974-05-02 | 1979-11-27 | General Electric Company | Curable epoxy compositions containing aromatic onium salts and hydroxy compounds |
US4058401A (en) * | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
US4394403A (en) * | 1974-05-08 | 1983-07-19 | Minnesota Mining And Manufacturing Company | Photopolymerizable compositions |
US4256828A (en) * | 1975-09-02 | 1981-03-17 | Minnesota Mining And Manufacturing Company | Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials |
US4318766A (en) * | 1975-09-02 | 1982-03-09 | Minnesota Mining And Manufacturing Company | Process of using photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials |
US4081276A (en) * | 1976-10-18 | 1978-03-28 | General Electric Company | Photographic method |
US4138255A (en) * | 1977-06-27 | 1979-02-06 | General Electric Company | Photo-curing method for epoxy resin using group VIa onium salt |
US4163912A (en) * | 1977-09-23 | 1979-08-07 | General Electric Company | Electrical insulating sheet material and electric winding made therefrom |
US4291116A (en) * | 1977-10-28 | 1981-09-22 | Tibbetts Charles C | Method of image reproduction and materials therefor |
US4582885A (en) * | 1978-07-20 | 1986-04-15 | Minnesota Mining And Manufacturing Company | Shaped plastic articles having replicated microstructure surfaces |
US4399178A (en) * | 1979-01-12 | 1983-08-16 | Franz Barta Kommanditgesellschaft | Decalcamania picture for applying designs or imprints to objects of glass, ceramics or such-like, process for transferring decalcamania picture of that kind, and apparatus for carrying out said process |
US4356050A (en) * | 1979-12-11 | 1982-10-26 | General Electric Company | Method of adhesive bonding using visible light cured epoxies |
US4882245A (en) * | 1985-10-28 | 1989-11-21 | International Business Machines Corporation | Photoresist composition and printed circuit boards and packages made therewith |
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