US3887392A - Material treatment method - Google Patents

Material treatment method Download PDF

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Publication number
US3887392A
US3887392A US418369A US41836973A US3887392A US 3887392 A US3887392 A US 3887392A US 418369 A US418369 A US 418369A US 41836973 A US41836973 A US 41836973A US 3887392 A US3887392 A US 3887392A
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Prior art keywords
solvent
carrier sheet
substrate
microwave energy
sheet
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Expired - Lifetime
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US418369A
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Arthur Y C Tang
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General Diode Corp
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General Diode Corp
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Priority to US418369A priority Critical patent/US3887392A/en
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Publication of US3887392A publication Critical patent/US3887392A/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/80—Apparatus for specific applications
    • H05B6/806—Apparatus for specific applications for laboratory use

Definitions

  • ABSTRACT Disclosed is a material treatment method including the steps of impregnating a porous carrier sheet with a treating material, positioning the sheet in contact with a material substrate, and inducing transfer of the treating material by applying microwave energy to the impregnated sheet. Deposition,cleansing and cooking operations are possible with the method described.
  • This invention relates to a method for transferring materials and, more particularly, to a method for transferring materials under the influence of microwave energy.
  • a material substrate is coated with a treating substance and then heat is applied to induce some interaction between the substrate and the substance.
  • the coating of the substrate with the treating substance is a time consuming manual operation. This operation could be simplified if the treating substance could be applied via a preimpregnated sheet material.
  • the requirement for subsequent ap plication of heat generally renders the use of heat sensitive sheet materials impractical.
  • This invention is characterized by a material treatment method involving the transfer of a treating material.
  • a material to undergo a controlled transfer is impregnated in a carrier vehicle which is brought in contact with a substrate.
  • Microwave energy is then applied to the carrier to induce heating and resultant transfer of the treating material.
  • the treating material includes an organic substance that will generate heat as a result of the application of the microwave energy.
  • a cleansing operation can be performed on a material substrate by covering the substrate with a carrier impregnated with a suitable solvent and applying microwave energy vaporize the solvent and carry off the contaminants from the surface of the substrate.
  • deposition processes can be performed by covering a substrate with a carrier impregnated with a deposition compound and then applying microwave energy to heat the compound and induce deposition thereof on the substrate.
  • Crystalline substrate materials such as, for example, silicon wafers utilized for manufacturing semiconductors, are often contaminated with grease, oils or dirt during the manufacturing process.
  • the subject method can be utilized to clean the wafers as follows: A cloth or porous paper sheet is first soaked in a solvent treating material such as alcohol. The solvent impregnated sheet is then placed on an array of the wafers either then positioned or moved thereafter into a microwave oven. In response to the microwave energy, the alcohol which has mixed with the oils and dirt will vaporize and carry off the contaminants.
  • Example 2 Considering agent hard surface materials such as the semiconductor wafers described above, coating operations also are possible.
  • a primary treating material oxide such as boric acid or phosphorus pentoxide can be mixed with an organic binder such as a celluloid. The mixture is then impregnated into a porous sheet which is then placed on the wafers. Again the wafer can be covered after being positioned in a microwave oven or can be placed therein subsequently, for example, by conveyor belt. When microwave energy is applied the binder is heated burned inducing the release of oxygen from the treating material. Depending upon which of the above materials was employed either boron or phosphorus will remain coated on the silicon wafers.
  • Example 3 Household uses for the subject method also exist.
  • an absorbent sheet of material such as paper or synthetic cloth
  • the impregnated sheet can be placed on a cut of meat to be cooked in a microwave oven.
  • Moisture that would normally be driven out of the meat is combined with the oil and thus the transfer of moisture from the meat is controlled.
  • the heating of the oil in the paper facilitates browning of the meat.
  • Some meats, containing little oil tend to steam and turn gray rather than brown when cooked in microwave ovens. Utilization of the subject method prevents such steaming. Furthermore, mositure loss is prevented thereby producing a more palatable final product.
  • seasoning steps can be eliminated by adding suitable food seasonings salt, pepper, etc., to the material impregnated in the carrier sheet. The added seasoning will then be transferred to the product along with the cooking oil released by the microwave heating.
  • a method of cleaning a material substrate, having impurities which are capable of being dissolved in and co-vaporized with solvent on the application thereto of microwave energy consisting essentially of: providing a porous carrier sheet; impregnating said carrier sheet with said solvent; positioning said impregnated carrier sheet in contact with said material substrate; applying microwave energy to said impregnated carrier sheet so as to generate heat therein and thereby as semiconductors vaporize lmpumles and Sam Solvent and remove 3.
  • a device according to claim 1 wherein said solvent the same from said material substrate.
  • a device according to claim 1 wherein said substrate material comprises silicon wafer material for use 5 comprises alcohol.

Abstract

Disclosed is a material treatment method including the steps of impregnating a porous carrier sheet with a treating material, positioning the sheet in contact with a material substrate, and inducing transfer of the treating material by applying microwave energy to the impregnated sheet. Deposition, cleansing and cooking operations are possible with the method described.

Description

atent 1 Unite @QMQS Tang [451 June 3,1975
[ MATERIAL TREATMENT METHOD [73] Assignee: General Diode Corporation,
Framingham, Mass.
[22] Filed: Nov. 23, 1973 [21] Appl. No.: 418,369
[52] U.S. Cl 134/1; 134/40 [51] Int. Cl B08b 7/00 [58] Field of Search 156/230; 426/237, 246, 426/241, 289, 272, 273, 289, 502, 383, 250; 134/1, 40
[56] References Cited UNITED STATES PATENTS 2,878,188 3/1959 Ca1lahan.... 134/40 2,949,121 8/1960 Kearney 134/1 3,121,650 2/1904 Meisner 156/240 3,257,021 6/1966 Brockett 156/240 3,434,902 3/1969 Bliss 156/230 3,445,310 5/1969 Danielson 156/230 3,447,989 6/1969 Yamashita 156/383 3,454,458 7/1969 Borregard 156/230 3,459,626 8/1969 3,462,329 8/1969 3,551,241 12/1970 3,554,832 l/197l 3,600,256 8/1971 Tosaka 156/230 Primary ExaminerSamih N. Zaharna Assistant Examiner-Ernest G. Therkorn Attorney, Agent, or Firm.lohn E. Toupal [57] ABSTRACT Disclosed is a material treatment method including the steps of impregnating a porous carrier sheet with a treating material, positioning the sheet in contact with a material substrate, and inducing transfer of the treating material by applying microwave energy to the impregnated sheet. Deposition,cleansing and cooking operations are possible with the method described.
3 Claims, No Drawings MATERIAL TREATMENT METHOD BACKGROUND OF THE INVENTION This invention relates to a method for transferring materials and, more particularly, to a method for transferring materials under the influence of microwave energy.
In many processes a material substrate is coated with a treating substance and then heat is applied to induce some interaction between the substrate and the substance. Often, the coating of the substrate with the treating substance is a time consuming manual operation. This operation could be simplified if the treating substance could be applied via a preimpregnated sheet material. However, the requirement for subsequent ap plication of heat generally renders the use of heat sensitive sheet materials impractical.
It is an object of this invention, therefore, to provide a simplified method of first coating a material substrate with a treating substance and then inducing transfer thereof by the application of heat.
SUMMARY OF THE INVENTION This invention is characterized by a material treatment method involving the transfer of a treating material. A material to undergo a controlled transfer is impregnated in a carrier vehicle which is brought in contact with a substrate. Microwave energy is then applied to the carrier to induce heating and resultant transfer of the treating material. Preferably, the treating material includes an organic substance that will generate heat as a result of the application of the microwave energy. Different processes are possible with the subject method depending upon the particular choice of treating material and substrate. For example, a cleansing operation can be performed on a material substrate by covering the substrate with a carrier impregnated with a suitable solvent and applying microwave energy vaporize the solvent and carry off the contaminants from the surface of the substrate. Similarly deposition processes can be performed by covering a substrate with a carrier impregnated with a deposition compound and then applying microwave energy to heat the compound and induce deposition thereof on the substrate. Still other features of the present invention will become more apparent upon a perusal of the following description which includes several preferred material treatment examples of the subject invention.
DESCRIPTION OF THE PREFERRED METHODS Example 1 Crystalline substrate materials such as, for example, silicon wafers utilized for manufacturing semiconductors, are often contaminated with grease, oils or dirt during the manufacturing process. The subject method can be utilized to clean the wafers as follows: A cloth or porous paper sheet is first soaked in a solvent treating material such as alcohol. The solvent impregnated sheet is then placed on an array of the wafers either then positioned or moved thereafter into a microwave oven. In response to the microwave energy, the alcohol which has mixed with the oils and dirt will vaporize and carry off the contaminants.
Example 2 Considering agent hard surface materials such as the semiconductor wafers described above, coating operations also are possible. For example, a primary treating material oxide such as boric acid or phosphorus pentoxide can be mixed with an organic binder such as a celluloid. The mixture is then impregnated into a porous sheet which is then placed on the wafers. Again the wafer can be covered after being positioned in a microwave oven or can be placed therein subsequently, for example, by conveyor belt. When microwave energy is applied the binder is heated burned inducing the release of oxygen from the treating material. Depending upon which of the above materials was employed either boron or phosphorus will remain coated on the silicon wafers.
The method given in examples 1 and 2 above can be used in sequence very effectively during the manufacture of semiconductor materials or other materials requiring initial cleaning followed by a coating process.
Example 3 Household uses for the subject method also exist. For example, an absorbent sheet of material such as paper or synthetic cloth, can be impregnated with edible oil, such as corn, olive or peanut oil, and placed on a substrate of food to be cooked. For example, the impregnated sheet can be placed on a cut of meat to be cooked in a microwave oven. Moisture that would normally be driven out of the meat is combined with the oil and thus the transfer of moisture from the meat is controlled. Furthermore, the heating of the oil in the paper facilitates browning of the meat. Some meats, containing little oil tend to steam and turn gray rather than brown when cooked in microwave ovens. Utilization of the subject method prevents such steaming. Furthermore, mositure loss is prevented thereby producing a more palatable final product.
According to a further feature of this method, certain procedures generally used while cooking can be eliminated. For example, seasoning steps can be eliminated by adding suitable food seasonings salt, pepper, etc., to the material impregnated in the carrier sheet. The added seasoning will then be transferred to the product along with the cooking oil released by the microwave heating.
An added benefit derived from the use of the method described under example 3 results from the retention of moisture in the meat. It has been found that moisture tends to carry harmful radiation out of exhaust passages from the microwave cooking apparatus. Thus the potentially dangerous release of microwave energy and the inefficiency caused by the release of such energy is prevented.
Obviously, many modifications and variations of the present invention are possible in light of the above teachings. For example, it will be readily apparent that the treatment method disclosed can be used in processes other than those specifically described. It is to be understood, therefore, that the invention can be practiced otherwise than as specifically described.
What is claimed is:
l. A method of cleaning a material substrate, having impurities which are capable of being dissolved in and co-vaporized with solvent on the application thereto of microwave energy, the method consisting essentially of: providing a porous carrier sheet; impregnating said carrier sheet with said solvent; positioning said impregnated carrier sheet in contact with said material substrate; applying microwave energy to said impregnated carrier sheet so as to generate heat therein and thereby as semiconductors vaporize lmpumles and Sam Solvent and remove 3. A device according to claim 1 wherein said solvent the same from said material substrate.
2. A device according to claim 1 wherein said substrate material comprises silicon wafer material for use 5 comprises alcohol.

Claims (3)

1. A METHOD OF CLEANING A MATERIAL SUBSTRATE, HAVING IMPURILIES WHICH ARE CAPABLE OF BEING DISSOLVED IN AND CO-VAPORIZED WITH SOLVENT ON THE APPLICATION THERETO OF MICROWAVE ENERGY THE METHOD CONSISTING ESSENTIALLY OF: PROVIDING A POROUS CARRIER SHEET; IMPREGNATING SAID CARRIER SHEET WITH SAID SOLVENT; POSITIONING SAID IMPREGNATING SAID CARRIER SHET WITH SAID SOLVENT MATERIAL SUBSTRATE; APPLYING MICROWAVE ENERGY TO SAID IMPREGNATED CARRIER SHEET SO AS TO GENERATED HEAT THEREIN AND THEREBY VAPORIZE SAID IMPURITIES AND SAID SOLVENT AND REMOVE THE SAME FROM SAID MATERIAL SUBSTRATE.
1. A method of cleaning a material substrate, having impurities which are capable of being dissolved in and co-vaporized with solvent on the application thereto of microwave energy, the method consisting essentially of: providing a porous carrier sheet; impregnating said carrier sheet with said solvent; positioning said impregnated carrier sheet in contact with said material substrate; applying microwave energy to said impregnated carrier sheet so as to generate heat therein and thereby vaporize said impurities and said solvent and remove the same from said material substrate.
2. A device according to claim 1 wherein said substrate material comprises silicon wafer material for use as semiconductors.
US418369A 1973-11-23 1973-11-23 Material treatment method Expired - Lifetime US3887392A (en)

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2366884A1 (en) * 1976-10-09 1978-05-05 Koelsch Foelzer Werke Ag PROCESS FOR TREATING SURFACES WITH LIQUIDS, ESPECIALLY FOR THE APPLICATION OF LIQUIDS ON SURFACES OR FOR THE ELIMINATION OF LIQUIDS COVERING SURFACES
US5490882A (en) * 1992-11-30 1996-02-13 Massachusetts Institute Of Technology Process for removing loose powder particles from interior passages of a body
US5660621A (en) * 1995-12-29 1997-08-26 Massachusetts Institute Of Technology Binder composition for use in three dimensional printing
US5775402A (en) * 1995-10-31 1998-07-07 Massachusetts Institute Of Technology Enhancement of thermal properties of tooling made by solid free form fabrication techniques
US5814161A (en) * 1992-11-30 1998-09-29 Massachusetts Institute Of Technology Ceramic mold finishing techniques for removing powder
US6036777A (en) * 1989-12-08 2000-03-14 Massachusetts Institute Of Technology Powder dispensing apparatus using vibration
US6261853B1 (en) 2000-02-07 2001-07-17 Therma-Wave, Inc. Method and apparatus for preparing semiconductor wafers for measurement
US20030145391A1 (en) * 2002-02-04 2003-08-07 Hollingsworth Paul K. Method for cleaning carpet and other surfaces
US6714300B1 (en) 1998-09-28 2004-03-30 Therma-Wave, Inc. Optical inspection equipment for semiconductor wafers with precleaning
US6861619B1 (en) 2000-02-07 2005-03-01 Therma-Wave, Inc. Method and apparatus for preparing semiconductor wafers for measurement
US20050159326A1 (en) * 2002-02-04 2005-07-21 Hollingsworth Paul K. Method for cleaning carpet and other surfaces

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2878188A (en) * 1955-02-08 1959-03-17 Detrex Chem Ind Safety glass cleaning
US2949121A (en) * 1956-10-03 1960-08-16 Detrex Chem Ind Cleaning apparatus
US3121650A (en) * 1960-07-28 1964-02-18 Minnesota Mining & Mfg Right-reading reproduction of printed originals
US3257021A (en) * 1963-06-04 1966-06-21 Continental Can Co Closure seal with semi-adherent and removable liner
US3434902A (en) * 1965-07-20 1969-03-25 Diamond Int Corp Method and system for transferring heat-activated labels
US3445310A (en) * 1965-08-13 1969-05-20 Minnesota Mining & Mfg Screen printing process and product
US3447989A (en) * 1965-12-20 1969-06-03 Matsushita Electric Ind Co Ltd Method of thermographic reproduction
US3454458A (en) * 1966-05-20 1969-07-08 Ernst Borregard Dry transfer sheet for transferring images having varied surface characteristics
US3459626A (en) * 1964-11-06 1969-08-05 Morgan Adhesives Co Label carrier and release laminate
US3462329A (en) * 1965-12-23 1969-08-19 Tee Pak Inc Production of polyethylene film laminate packages
US3551241A (en) * 1967-08-23 1970-12-29 Formica Corp Process for producing a decorative laminate comprising transferring a film of a transparent noble thermosetting resin to a decorative sheet from a flexible release transfer sheet and removing the flexible release sheet after the heat and pressure consolidation step
US3554832A (en) * 1968-05-29 1971-01-12 Rca Corp Process for handling and mounting semiconductor dice
US3600256A (en) * 1967-04-22 1971-08-17 Canon Camera Co Hot stamping leaf for concealing indicia and method of using

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2878188A (en) * 1955-02-08 1959-03-17 Detrex Chem Ind Safety glass cleaning
US2949121A (en) * 1956-10-03 1960-08-16 Detrex Chem Ind Cleaning apparatus
US3121650A (en) * 1960-07-28 1964-02-18 Minnesota Mining & Mfg Right-reading reproduction of printed originals
US3257021A (en) * 1963-06-04 1966-06-21 Continental Can Co Closure seal with semi-adherent and removable liner
US3459626A (en) * 1964-11-06 1969-08-05 Morgan Adhesives Co Label carrier and release laminate
US3434902A (en) * 1965-07-20 1969-03-25 Diamond Int Corp Method and system for transferring heat-activated labels
US3445310A (en) * 1965-08-13 1969-05-20 Minnesota Mining & Mfg Screen printing process and product
US3447989A (en) * 1965-12-20 1969-06-03 Matsushita Electric Ind Co Ltd Method of thermographic reproduction
US3462329A (en) * 1965-12-23 1969-08-19 Tee Pak Inc Production of polyethylene film laminate packages
US3454458A (en) * 1966-05-20 1969-07-08 Ernst Borregard Dry transfer sheet for transferring images having varied surface characteristics
US3600256A (en) * 1967-04-22 1971-08-17 Canon Camera Co Hot stamping leaf for concealing indicia and method of using
US3551241A (en) * 1967-08-23 1970-12-29 Formica Corp Process for producing a decorative laminate comprising transferring a film of a transparent noble thermosetting resin to a decorative sheet from a flexible release transfer sheet and removing the flexible release sheet after the heat and pressure consolidation step
US3554832A (en) * 1968-05-29 1971-01-12 Rca Corp Process for handling and mounting semiconductor dice

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2366884A1 (en) * 1976-10-09 1978-05-05 Koelsch Foelzer Werke Ag PROCESS FOR TREATING SURFACES WITH LIQUIDS, ESPECIALLY FOR THE APPLICATION OF LIQUIDS ON SURFACES OR FOR THE ELIMINATION OF LIQUIDS COVERING SURFACES
US6036777A (en) * 1989-12-08 2000-03-14 Massachusetts Institute Of Technology Powder dispensing apparatus using vibration
US5490882A (en) * 1992-11-30 1996-02-13 Massachusetts Institute Of Technology Process for removing loose powder particles from interior passages of a body
US5814161A (en) * 1992-11-30 1998-09-29 Massachusetts Institute Of Technology Ceramic mold finishing techniques for removing powder
US6109332A (en) * 1992-11-30 2000-08-29 Massachusetts Institute Of Technology Ceramic mold finishing
US6112804A (en) * 1995-10-31 2000-09-05 Massachusetts Institute Of Technology Tooling made by solid free form fabrication techniques having enhanced thermal properties
US6354361B1 (en) 1995-10-31 2002-03-12 Massachusetts Institute Of Technology Tooling having advantageously located heat transfer channels
US5775402A (en) * 1995-10-31 1998-07-07 Massachusetts Institute Of Technology Enhancement of thermal properties of tooling made by solid free form fabrication techniques
US5851465A (en) * 1995-12-29 1998-12-22 Massachusetts Institute Of Technology Binder composition for use in three dimensional printing
US5660621A (en) * 1995-12-29 1997-08-26 Massachusetts Institute Of Technology Binder composition for use in three dimensional printing
US6714300B1 (en) 1998-09-28 2004-03-30 Therma-Wave, Inc. Optical inspection equipment for semiconductor wafers with precleaning
US20040100633A1 (en) * 1998-09-28 2004-05-27 Allan Rosencwaig Optical inspection equipment for semiconductor wafers with precleaning
US6930771B2 (en) 1998-09-28 2005-08-16 Therma-Wave, Inc. Optical inspection equipment for semiconductor wafers with precleaning
US20050231719A1 (en) * 1998-09-28 2005-10-20 Allan Rosencwaig Optical inspection equipment for semiconductor wafers with precleaning
US7068370B2 (en) 1998-09-28 2006-06-27 Therma-Wave, Inc. Optical inspection equipment for semiconductor wafers with precleaning
US6261853B1 (en) 2000-02-07 2001-07-17 Therma-Wave, Inc. Method and apparatus for preparing semiconductor wafers for measurement
US6624393B2 (en) 2000-02-07 2003-09-23 Therma-Wave, Inc. Method and apparatus for preparing semiconductor wafers for measurement
US6861619B1 (en) 2000-02-07 2005-03-01 Therma-Wave, Inc. Method and apparatus for preparing semiconductor wafers for measurement
US20030145391A1 (en) * 2002-02-04 2003-08-07 Hollingsworth Paul K. Method for cleaning carpet and other surfaces
US6865762B2 (en) * 2002-02-04 2005-03-15 Paul K. Hollingsworth Method for cleaning carpet and other surfaces
US20050159326A1 (en) * 2002-02-04 2005-07-21 Hollingsworth Paul K. Method for cleaning carpet and other surfaces

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