US3914520A - Method for plating of plastic - Google Patents
Method for plating of plastic Download PDFInfo
- Publication number
- US3914520A US3914520A US34210073A US3914520A US 3914520 A US3914520 A US 3914520A US 34210073 A US34210073 A US 34210073A US 3914520 A US3914520 A US 3914520A
- Authority
- US
- United States
- Prior art keywords
- plastic
- carried out
- metal
- absorbed moisture
- nylon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Definitions
- plastic articles have been metal plated by an electroless process in which the metal is chemically reduced and deposited on an activated surface of the plastic base.
- the general process has become of increasing importance for producing articles which have decorative, electrical or other properties.
- Some of the advantages of the plastic base are its electrical insulating properties, its relatively low cost, its moldability and the like.
- the metal can be applied on the plastic surface in a predetermined pattern which can be further processed by electroplating or other techniques to provide metal surfaces useful for electrical circuits, decorative designs and the like.
- the invention is directed to a method of pretreating a plastic surface to provide sites for activation by a catalytic material and for subsequent metal plating by an electroless process. More particularly, the invention is directed to a method of treating plastic having a hydrophilic surface and absorbed moisture in which at least a portion of the moisture is removed under evaporative conditions to provide a surface having an affinity for water and subsequently the plastic surface is activated through the use of a hot, aqueous medium which serves as a vehicle for seeding the plastic surface with an active material.
- the activating step is carried out at an elevated temperature to thermally expand the plastic surface.
- the step of evaporatively removing moisture from the surface of the plastic is particularly important with plastics having significant amounts of moisture such as the conventional polyamides so as to provide sites on the surface for treatment by the aqueous activating medium.
- the activated plastic surface can be readily processed by conventional electroless metal deposition techniques to provide the desired plating.
- Another advantage is the formation of platable surfaces from plastics having a relatively high moisture content which have not always been readily platable with satisfactory results.
- polyamides such as nylon can be plated to form coatings having good adhesion to the underlying plastic.
- the invention is directed to the method of treating plastic to provide activated sites for plating by a metal in an electroless process.
- the method involves treating of plastic having absorbed moisture under evaporative conditions to remove at least a portion of the moisture to provide a surface having an affinity for water, treating the dry surface with an aqueous activating medium to provide an activated surface, and electrolessly plating metal on the activated surface.
- the evaporation of absorbed moisture is carried out in the presence of a desiccant which aids in the removal of substantial amounts of the moisture.
- the plastic surface having an affinity for water is advantageously heated at an elevated temperature in the presence of an aqueous impregnating solution of a catalytic material such as a soluble salt of a noble metal to seed and form sites on the plastic surface with the catalytic material.
- a catalytic material such as a soluble salt of a noble metal
- the impregnated surface is subsequently treated with an aqueous solution of a reducing agent such as stannous chloride to convert the catalytic material to an active form for subsequent treatment in the electroless plating bath.
- a plastic such as polyamide, vinyl chloride polymer, acrylic, cellulosic and the like having significant amounts of absorbed moisture is treated under evaporative conditions to remove at least a portion of the absorbed moisture.
- the plastic surface is hydrophilic (inherently or converted thereto by a conditioner as with ABS) with polar groups which aid in the absorption of water.
- the method is also advantageously carried out with a plastic having a water absorption of at least about 0.3% as measured over a 24- hour period on a V5 inch thick sample. Plastics having such characteristics are described in Modern Plastics Encyclopedia, McGraw-Hill, Inc., 1970.
- the plastic is a polyamide having a water absorption value of at least 1% such as 6 nylon, 6/6 nylon and the like.
- the plastic is treated under evaporative conditions to remove at least a portion of the absorbed mositure and thereby to provide a surface having an affinity for water with sites capable of attracting and retaining catalytic material from an aqueous medium.
- Removal of moisture as a vapor can be carried out in a desiccator with a desiccant such as silica gel or other dehydrating medium, by vaccum or the like at a temperature and for a time sufficient to form a surface with an affinity for water.
- the evaporative conditions include the use of a desiccant such as silica gel and are carried out under ambient or slightly elevated temperatures. With a nylon, representative conditions include silica gel as a desiccant, a temperature of -75F. and a time of about 16 hours. In this step, the moisture content of the plastic is reduced in respect to that at ambient temperatures (70F).
- the plastic Prior to the mositure removal, the plastic can be treated by the use of an acid or mechanical roughening agent to form irregular surfaces on the plastic.
- the treatment can be carried out under conditions to increase the wetability of the plastic surface, which after dehydration is carried out with an aqueous activating medium.
- the plastic which has been substantially dehydrated is subsequently treated with an aqueous activating medium such as an aqueous solution of a noble metal salt to provide sites on the plastic surface for subsequent treatment in the electroless metal deposition process.
- the aqueous activating medium is an aqueous impregnating solution of a catalytic material such as a noble metal salt.
- aqueous activating solutions are known in the art and can include those providing a single-stage activation as described in US. Pat. No. 3,515,649 or a two-stage activation in which the noble metal salt and reducing agent such as stannous chloride are separately combined to convert the noble metal to its active form with the particular selection of conditions being dependent on the particular plastic and ad hesion desired.
- the treatment is carried out in a two-stage activation in which an aqueous solution of a noble metal such as palladium chloride is applied on the plastic surface and subsequently treated with an aqueous solution of stannous chloride or other suitable reducing agent.
- the treatment is advantageously carried out at an elevated temperature with plastics which are heat expandable to aid in the formation of the activated sites. Temperatures of at least about 100F. are desirable, particularly with a polyamide, although temperatures in the order of about l30212F. and especially about 160-180F. are preferable. Times in the order of 3 minutes are common with nylon treated at temperatures in the order of l70-l75F.
- the treatment with the reducing agent is under reducing conditions sufficient to convert the impregnated noble metal salt to the active form of the metal.
- Representative conditions for treatment by the reducing solution of stannous chloride is a time of about 6 minutes and a temperature in the order of about 70-75F.
- the activated plastic surface having sites on which electrolessly deposited metal can adhere is subsequently treated with a chemical bath containing a soluble salt of the metal selected for deposition.
- Solutions are commercially available for the deposition of metals such as copper, nickel, silver, gold and the like and usually contain various amounts of other components which aid in the formation of a metal layer on the plastic surface.
- An illustration of suitable conditions for plating a nylon which has been activated by the application of a solution of palladium chloride at about l70-175F. and a solution of stannous chloride at a temperature of about 75F. is treatment with an electroless copper plating bath (Copper Mix 328 available from the Shipley Company, Inc., Newton, Mass.) for a time in the order of about 10 minutes.
- the plated plastic part is then conveniently water rinsed, alcohol treated, and air dried. If additional metal is to be applied on the metal surface by electroplating, the part is conveniently stored in a desiccator or in a non-oxidizing atmosphere such as nitrogen prior to electroplating. As described in US. Pat. No. 3,445,350, electroplating conditions are known for plating of metal on a metallized plastic part.
- EXAMPLE 1 A sample of nylon having 6 carbons between the amide linkages was chemically copper plated. The sample having a clean surface was initially treated with a neutral cleaning solution for about 10 minutes at approximately l50F. After a flowing water rinse for about 3 minutes and a distilled water rinse for about 1 minute, the nylon was treated with an alkaline wetting agent for about 2 minutes to remove surface contaminates and again water rinsed. It was then placed in a lab desiccator with a silica gel for about 16 hours.
- Activation of the dehydrated nylon was carried out with a solution of a palladium salt (Shipleys Catalyst 6F) at a temperature of about l70l75F. for about 3 minutes.
- This solution of catalytic material was previously treated to about F. for about A hour, cooled and filtered to remove precipitated material.
- the surface became dark brown.
- a further water rinse was carried out on the nylon after which it was treated with an aqueous solution of stannous chloride for about 6 minutes at room temperature (7075F.).
- the activated surface of the nylon was subsequently treated with a commerical copper plating bath (Shipleys Copper Mix 328) at about 7075F. for about 10 minutes. It was then rinsed in flowing water for about 2 minutes, treated with alcohol and air dried. A bright, shiny layer of copper was formed on the plastic surface. Resistance of the copper layer to removal during manual handling of the article indicated that the copper was firmly adhering to the plastic surface. Further tests in which a plated nylon sleeve was forced into a restrictive aperture in a metal plate revealed that the metal coating continued to adhere to the nylon during deformation of the sleeve and was very satisfactory.
- the plated nylon was subsequently electroplated with tin and exhibited a bright, shiny surface with good adherence properties to the underlying copper and plastic.
- Runs were also made in which nylon samples similar to that of Example 1 were electrolessly plated with copper but without first being subjected to evaporative conditions and the subsequent heating step during activation. When a plated sleeve formed in this manner was inserted into a restrictive aperture as described in Example 1, the metal coating readily separated from the nylon.
- Other runs were made in which other nylon samples similar to that of Example 1 were plated with copper essentially according to the procedure of Example 1, but with the treatment steps with palladium chloride and stannous chloride being reversed so that stannous chloride was first applied. Tests in which a plated sleeve formed in this manner was inserted into a restrictive aperture as described in Example I also revealed that the metal coating readily became separated from the nylon.
- the invention provides a useful method for plating polyamide plastics with metal and provides advantages over the prior art. As demonstrated with nylon, the same performance is not evident when tests are made without use of the invention.
- a method of plating metal on a polyamide plastic surface having absorbed moisture which comprises removing under evaporative conditions at least a portion of the absorbed moisture to provide a dry surface, heating the plastic in an aqueous impregnating solution of a catalytic material at an elevated temperature of at least 100F. to impregnate the surface with the catalytic material, treating the impregnated surface with an aqueous solution of a reducing agent to activate said catalytic material, and electrolessly depositing metal on the activated surface.
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34210073 US3914520A (en) | 1971-04-05 | 1973-03-16 | Method for plating of plastic |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13142871A | 1971-04-05 | 1971-04-05 | |
US34210073 US3914520A (en) | 1971-04-05 | 1973-03-16 | Method for plating of plastic |
Publications (1)
Publication Number | Publication Date |
---|---|
US3914520A true US3914520A (en) | 1975-10-21 |
Family
ID=26829459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US34210073 Expired - Lifetime US3914520A (en) | 1971-04-05 | 1973-03-16 | Method for plating of plastic |
Country Status (1)
Country | Link |
---|---|
US (1) | US3914520A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4131698A (en) * | 1977-12-16 | 1978-12-26 | Rca Corporation | Pretreatment of polyvinyl chloride plastics for electroless deposition |
US5395651A (en) * | 1989-05-04 | 1995-03-07 | Ad Tech Holdings Limited | Deposition of silver layer on nonconducting substrate |
US5595787A (en) * | 1989-07-29 | 1997-01-21 | Deutsche Automobilgesellschaft Mbh | Chemical metallization of electrically non-conducting porous substrates |
US20040020947A1 (en) * | 2000-11-10 | 2004-02-05 | Denis Delbarre | Cask for drawing off liquids under the effect of pressure |
CN111757916A (en) * | 2017-12-31 | 2020-10-09 | 乐天化学株式会社 | Thermoplastic resin composition and molded article formed therefrom |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2690402A (en) * | 1952-04-01 | 1954-09-28 | Gen Am Transport | Processes of chemical nickel plating of nonmetallic bodies |
US3501332A (en) * | 1967-04-28 | 1970-03-17 | Shell Oil Co | Metal plating of plastics |
US3523824A (en) * | 1966-12-29 | 1970-08-11 | Ibm | Metallization of plastic materials |
US3524754A (en) * | 1967-04-28 | 1970-08-18 | Shell Oil Co | Metal plating of plastics |
-
1973
- 1973-03-16 US US34210073 patent/US3914520A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2690402A (en) * | 1952-04-01 | 1954-09-28 | Gen Am Transport | Processes of chemical nickel plating of nonmetallic bodies |
US3523824A (en) * | 1966-12-29 | 1970-08-11 | Ibm | Metallization of plastic materials |
US3501332A (en) * | 1967-04-28 | 1970-03-17 | Shell Oil Co | Metal plating of plastics |
US3524754A (en) * | 1967-04-28 | 1970-08-18 | Shell Oil Co | Metal plating of plastics |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4131698A (en) * | 1977-12-16 | 1978-12-26 | Rca Corporation | Pretreatment of polyvinyl chloride plastics for electroless deposition |
US5395651A (en) * | 1989-05-04 | 1995-03-07 | Ad Tech Holdings Limited | Deposition of silver layer on nonconducting substrate |
US5747178A (en) * | 1989-05-04 | 1998-05-05 | Adtech Holding | Deposition of silver layer on nonconducting substrate |
US5965204A (en) * | 1989-05-04 | 1999-10-12 | Ad Tech Holdings Limited | Deposition of silver layer on nonconducting substrate |
US6224983B1 (en) | 1989-05-04 | 2001-05-01 | Ad Tech Holdings Limited | Deposition of silver layer on nonconducting substrate |
US5595787A (en) * | 1989-07-29 | 1997-01-21 | Deutsche Automobilgesellschaft Mbh | Chemical metallization of electrically non-conducting porous substrates |
US20040020947A1 (en) * | 2000-11-10 | 2004-02-05 | Denis Delbarre | Cask for drawing off liquids under the effect of pressure |
US20050230435A1 (en) * | 2000-11-10 | 2005-10-20 | Denis Delbarre | Cask for drawing off liquids under the effect of pressure |
US7168596B2 (en) * | 2000-11-10 | 2007-01-30 | Odin (A French Limited Company) | Cask for drawing off liquids under the effect of pressure |
US7661564B2 (en) | 2000-11-10 | 2010-02-16 | Odin (A French Private Limited Company) | Cask for drawing off liquids under the effect of pressure |
CN111757916A (en) * | 2017-12-31 | 2020-10-09 | 乐天化学株式会社 | Thermoplastic resin composition and molded article formed therefrom |
US20210070935A1 (en) * | 2017-12-31 | 2021-03-11 | Lotte Chemical Corporation | Thermoplastic Resin Composition and Molded Article Formed Therefrom |
US11655335B2 (en) * | 2017-12-31 | 2023-05-23 | Lotte Chemical Corporation | Thermoplastic resin composition and molded article formed therefrom |
CN111757916B (en) * | 2017-12-31 | 2023-05-26 | 乐天化学株式会社 | Thermoplastic resin composition and molded article formed therefrom |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3370974A (en) | Electroless plating on non-conductive materials | |
US4478883A (en) | Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate | |
US3791848A (en) | A method of improving the adherence of a metal deposit to a polyimide surface | |
US3690921A (en) | Method for strongly adhering a metal film on ceramic substrates | |
US3914520A (en) | Method for plating of plastic | |
US2474502A (en) | Metallization of electrically nonconductive fabrics, fibrous materials, and porous materials | |
JPS6354791B2 (en) | ||
US3524754A (en) | Metal plating of plastics | |
JPS60204884A (en) | Pretreatment of plastic material for metal plating | |
US2303871A (en) | Metal coated plastic material and method of producing the same | |
EP0280918A2 (en) | Process for metal plating of substrates | |
DK143609B (en) | PROCEDURE FOR CATALYTIC SENSITIZATION OF NON-METAL SURFACES FOR SUBSEQUENTLY METAL DEPOSIT | |
US3674550A (en) | Method of electroless deposition of a substrate and sensitizing solution therefor | |
JP3475260B2 (en) | Method of forming functional coating on resin products | |
US3725108A (en) | Chemical reduction metal plated diallylphthalate polymer and preparation process | |
US4015992A (en) | Process for activating a non-conductive substrate and composition therefor | |
CN100421912C (en) | Metallization treatment method for plastic surface | |
US2947064A (en) | Method of interconnecting pathway patterns of printed circuit products by chemical deposition | |
US3547692A (en) | Metal coating carbon substrates | |
CN114957768A (en) | Surface modifier before chemical plating and polyphenylene sulfide base material surface functional modification method | |
US3222207A (en) | Process of producing metallic deposits | |
US6541080B1 (en) | Double-dip Pd/Sn crosslinker | |
US3567488A (en) | Process for electroless plating of carboxylic acid copolymers using ammonla | |
GB2091274A (en) | A process for the treatment of polyacetal articles | |
US3953658A (en) | Copper coatings on shaped plastic supports |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SIEMENS AKTIENGESELLSCHAFT, BERLIN AND MUNCHEN, GE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:SCHUH, GOTTFRIED;REEL/FRAME:004038/0813 Effective date: 19810413 |
|
AS | Assignment |
Owner name: ALLIED CORPORATION COLUMBIA ROAD AND PARK AVENUE, Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:BUNKER RAMO CORPORATION A CORP. OF DE;REEL/FRAME:004149/0365 Effective date: 19820922 |
|
AS | Assignment |
Owner name: CANADIAN IMPERIAL BANK OF COMMERCE, NEW YORK AGENC Free format text: SECURITY INTEREST;ASSIGNOR:AMPHENOL CORPORATION;REEL/FRAME:004879/0030 Effective date: 19870515 |
|
AS | Assignment |
Owner name: AMPHENOL CORPORATION, LISLE, ILLINOIS A CORP. OF D Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:ALLIED CORPORATION, A CORP. OF NY;REEL/FRAME:004844/0850 Effective date: 19870602 Owner name: AMPHENOL CORPORATION, A CORP. OF DE, ILLINOIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ALLIED CORPORATION, A CORP. OF NY;REEL/FRAME:004844/0850 Effective date: 19870602 |
|
AS | Assignment |
Owner name: BANKERS TRUST COMPANY, AS AGENT Free format text: SECURITY INTEREST;ASSIGNOR:AMPHENOL CORPORATION, A CORPORATION OF DE;REEL/FRAME:006035/0283 Effective date: 19911118 |
|
AS | Assignment |
Owner name: AMPHENOL CORPORATION A CORP. OF DELAWARE Free format text: RELEASED BY SECURED PARTY;ASSIGNOR:CANADIAN IMPERIAL BANK OF COMMERCE;REEL/FRAME:006147/0887 Effective date: 19911114 |
|
AS | Assignment |
Owner name: AMPHENOL CORPORATION, CONNECTICUT Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANKERS TRUST COMPANY;REEL/FRAME:007317/0148 Effective date: 19950104 |