US4156124A - Image transfer laser engraving - Google Patents

Image transfer laser engraving Download PDF

Info

Publication number
US4156124A
US4156124A US05/787,471 US78747177A US4156124A US 4156124 A US4156124 A US 4156124A US 78747177 A US78747177 A US 78747177A US 4156124 A US4156124 A US 4156124A
Authority
US
United States
Prior art keywords
mask
laser beam
work piece
apparatus recited
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US05/787,471
Inventor
John A. Macken
Paul N. Palanos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Optical Engineering Inc
Original Assignee
Optical Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optical Engineering Inc filed Critical Optical Engineering Inc
Priority to US05/787,471 priority Critical patent/US4156124A/en
Application granted granted Critical
Publication of US4156124A publication Critical patent/US4156124A/en
Assigned to BANK OF AMERICA NATIONAL TRUST AND SAVINGS ASSOCIATION reassignment BANK OF AMERICA NATIONAL TRUST AND SAVINGS ASSOCIATION SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LASERCRAFT INCORPORATED
Anticipated expiration legal-status Critical
Assigned to UTICA ENTERPRISES, INC. A CORPORATION OF MICHIGAN, CARTER, THOMAS, WANCZYK, STEFAN reassignment UTICA ENTERPRISES, INC. A CORPORATION OF MICHIGAN SECURITY AGREEMENT Assignors: OPTICAL ENGINEERING, INC. A CORPORATION OF CALIFORNIA
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44BMACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B7/00Machines, apparatus or hand tools for branding, e.g. using radiant energy such as laser beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks

Definitions

  • This invention relates to a method of engraving materials using a laser and a mask which is spatially removed from the parts to be engraved.
  • lasers can develop sufficient power densities to vaporize certain materials.
  • Lasers such as high-power carbon dioxide lasers can vaporize many materials such as wood, plastic and rubber, relatively efficiently. Once the output from a laser is focused to a power density greater than approximately 10,000 watts per centimeter, it is possible to remove material from the surface of organic solids even when the laser beam is rapidly scanned across the surface. Of course, areas not struck by the laser beam are not vaporized.
  • the use of the laser offers the potential of producing very intricate engravings in the proper material.
  • One method of selectively engraving areas of a material is to manipulate the laser beam along the areas to be removed, using the laser much like a wood carver uses a knife. However, this method does not lend itself to mass production.
  • Another method of laser engraving uses a thin metal mask which is placed in contact with the part to be engraved. As the laser beam scans back and forth the beam penetrates to and vaporizes the part to be engraved only in the area which is not protected by the metal mask. Inasmuch as metals can withstand high laser power densities without being damaged, metal masks are not affected by the laser. This process, however, cannot produce detailed contours; moreover this process is not well suited for mass production inasmuch as fragile metal masks must be placed on and removed from the materials which are to be engraved.
  • FIG. 1 is a perspective view of an image transfer laser engraving system using transparent masks.
  • FIG. 2 is a cross-sectional view of a portion of the system shown in FIG. 1.
  • FIG. 3 is a cross-sectional view of an image transfer laser engraving system using a reflecting mask.
  • FIG. 4 is a cross-sectional view of a reflecting mask which includes a mirrored substrate and an absorbing coating.
  • FIG. 5 is a cross-sectional view of a reflecting mask which includes a mirrored substrate and diffusely reflecting areas.
  • FIG. 6 is a cross-sectional view of a reflecting mask which includes an absorbing coating and a reflecting area on a suitable substrate.
  • a laser 20 is shown in schematic representation.
  • Laser 20 emits beam 19.
  • Beam 19 passes through a suitable optical or focal system represented by lens 15, such that the beam is concentrated as it reaches the position of the transparent mask 13. It is not necessary for beam 19 to be precisely focused on the surface of the mask 13, but merely concentrated to a power density which is suitable for laser engraving the subject material while not damaging the mask material.
  • Transparent mask 13 has reflecting areas 18 which block the beam.
  • the beam passes through a transparent area in mask 13, it passes through another optical system represented by lenses 16 and 17. These lenses are arranged to transfer an image of transparent mask 13 to the part 14 which is to be engraved. The image is transferred with unity magnification and the same orientation as mask 13.
  • tables 11 and 12 supporting transparent masks 13 and work pieces 14 rotate and translate together while laser 20 and lenses 15, 16 and 17 are stationary.
  • the mechanism could be arranged so that the entire area of transparent mask 13 is scanned by laser beam 19 in the spiral scan pattern characteristic of this type of arrangement.
  • the beam which passes through mask 13 in the area not coated with reflecting coating 18 is transferred onto the part to be engraved.
  • the areas in the mask represented by reflecting coating 18 permit no engraving to take place in the areas where the reflecting coating is imaged on the work piece. That is, reflecting coating 18 prevents beam 19 from impinging upon and engraving work piece 14.
  • reflecting coating 18 By making reflecting coating 18 partially transparent, thereby allowing a reduced intensity of laser beam 19 to strike certain areas on work piece 14, various contours can be produced. That is, the depth of the engraving on the sample is proportional to the intensity of the laser beam on the work piece. The beam intensity is also proportional to the beam transmission or transparency of the corresponding area in mask 13.
  • reflection mask 30 is used.
  • This type of mask is more suitable for use with lasers which emit at long wavelengths, such as the carbon dioxide laser.
  • This type of laser emits a beam having a wavelength of 10 microns and suffers from the problem that there are no suitable materials to use as the window material in the transmission mask.
  • Common window materials such as glass and quartz do not transmit at long infrared wavelengths. Only materials such as sodium chloride which is hygroscopic, or germanium which is very expensive and not available in large sizes, can be used for long wavelength infrared windows. Therefore, there are circumstances which would make a transmission mask undesirable. Details of the construction of a reflection mask are given infra.
  • mask 30 contains areas 32 which are specularly reflecting, e.g. mirrored. Other areas of reflection mask 30 do not specularly reflect because they either absorb or scatter the incident light.
  • the materials used to make the mask are chosen so that they can withstand the laser power densities required for engraving the sample.
  • laser 20 emits a beam 19 which passes through lens system 15 which concentrates the laser light.
  • the concentrated beam is projected between tables 11 and 12 where it strikes turning mirror 21 which reflects the light onto reflecting mask 30.
  • the beam strikes mirrored area 32 of mask 30, the light is specularly reflected off the mask through a suitable optical system including, for example, lenses 22 and 23 to reach the work piece 14.
  • Lenses 22 and 23 differ from lenses 16 and 17 (FIG. 2) inasmuch as they not only focus the laser light but also introduce a net deflection to the laser light so that they act both as lenses and prisms.
  • the lenses 22 and/or 23 have this "wedge" incorporated into their design, the addition of the "wedge” permits the beam to impinge upon work piece 14 perpendicular to the surface thereof. If the work piece is tilted at the angle in order to be perpendicular to the direction of the laser light as it is reflected from mask 30 to lens 22, the reflecting mask and the sample being engraved are not in the same plane. This condition, i.e. nonparallel, produces a defocusing effect which blurs the image in at least some areas of work piece 14. Like transmitting mask 13 (FIGS. 1 and 2), reflecting mask 30 modulates laser beam 19.
  • tables 11 and 12 To accurately transfer the image contained in or on the mask to the sample, tables 11 and 12 must be held stationary relative to each other while laser beam 19 scans the table surfaces. There are many ways of holding these two surfaces fixed in relation to each other while scanning with the laser beam. For example, as suggested in FIGS. 1 and 2, tables 11 and 12 are rigidly attached to each other by means of a suitable axis arrangement. The axis arrangement also assures that the tables remain separated by a fixed amount. In this embodiment laser 20, and thus laser beam 19, is held stationary while the tables rotate rapidly. In addition, tables 11 and 12 also translate slowly to produce the effect of a spiral scan by laser beam 19.
  • the translating motion can be accomplished by moving laser beam 19 and/or lens systems.
  • other mechanical apparatus can be utilized to produce a zig-zag type of overlapping scan or a raster scan. These approaches require only mechanical skill to produce the design and do not depart from the spirit of this invention.
  • optical systems comprising an even number of lenses e.g. two, are shown.
  • lenses 16 and 17 in FIG. 2, and lenses 22 and 23 in FIG. 3 transfer the image of the respective mask 13 or 30 onto samples 14 to be engraved.
  • These lenses are preferably of equal focal length and are positioned so that the image produced on the sample is the same size (unity magnification) as the mask. If only one lens is used, or if an odd number of lenses is used, the image produced on work piece 14 would be inverted and reversed relative to the mask.
  • the laser beam is focused to an extremely fine point as it passes through or is reflected from the mask so that the resolution obtainable in the engraving is equal to the minimum spot size of the laser beam on the mask.
  • the laser beam can be enlarged from the extremely small size without degrading the resolution of the engraving process. That is, with two lenses the image of the mask remains stationary when it is projected on the sample, even when the mask and the sample move relative to the lenses.
  • the projected image With a single lens, the projected image "moves" in the opposite direction when the mask and the sample are moved relative to the lens. Consequently, with a single lens there is a smearing effect which limits the resolution to the spot size of the laser beam on the mask.
  • FIGS. 4, 5 and 6 are cross-sectional views of different constructions of reflection masks.
  • mask 30 comprises a suitable substrate which includes mirrored surface 31 and absorbing coating 32 arranged to define a selected pattern.
  • Coating 32 typically comprises material such as paint, glass frit silk screened onto a flat polished substrate, anodizing on a mirrored substrate such as aluminum, or the like. Tests indicate that an anodized aluminum substrate makes a very absorbent coating which can withstand high laser power densities.
  • FIG. 5 shows a somewhat different reflective mask.
  • Substrate material of mask 30 again has a polished, specularly reflecting surface 31.
  • diffusely reflecting surface 33 is used to diminish the intensity of the laser light which falls within the acceptance angle of lens 22 in FIG. 3.
  • many techniques such as chemical etching, sandblasting, or flame spraying a metallic powder are known.
  • FIG. 6 shows another structural configuration for reflecting templates.
  • the substrate of mask 30 is a material, such as aluminum, which can be anodized.
  • An absorbing coating 34 such as an anodized layer, which withstands the laser power and has a glossy surface covers the entire surface of the substrate.
  • Glossy absorbent coating 34 is overcoated with a pattern comprising reflecting layer 35, such as vapor-deposited copper or chemically deposited silver. This produces a mask which includes a uniformly specularly reflecting pattern formed from a thin metal coating which is backed by a light absorbent layer
  • the reflecting coating is, typically, etched away in selected areas using well known techniques employing photo resist and chemical etching to reveal the absorbing coating beneath.
  • the example was given in which the surface of mask 30 was either strongly absorbent or highly reflecting. However, if contours are to be produced, it is necessary to be able to make intermediate levels of reflectivity. This can be accomplished by controlling the thickness of the coating layers such that the absorbing coating is thin enough to allow some reflection from the substrate or conversely such that the reflecting coating is thin enough to allow some absorption by the substrate layer.
  • the absorbent or reflective layer can comprise a dot pattern with varying density to produce the effect of varying degrees of reflectivity.
  • the dot pattern can be established in layers 32, 33, 34 or 35 as desired. To be useful for laser engraving, the dot pattern should be considerably finer than the resolution of the laser engraving system. If this is the case, the individual high and low reflectivity areas in the dot patterns will be too fine to be reproduced in the engraving and only the average reflectivity of this dot pattern will remain. Therefore, by changing the density of the dot patter, it is possible to produce the equivalent of varying reflectivity.
  • curved mirrors are the optical equivalent to lenses. Therefore, the optical system used with the invention can also be made using curved mirrors if the proper modifications are made. Also it has been implied that the laser beam is approximately circular in shape when it strikes the mask and the sample being engraved. However, for some applications it is more desirable that the laser beam be brought to a line focus. In this case, lens 15 in FIGS. 1, 2 and 3 is a cylindrical lens to produce a line focus on the mask. Conversely, of course, additional optics can be inserted to produce a line focus. These techniques are well known to those skilled in the art, and do not depart from the spirit of this invention. Moreover, this description is intended to be illustrative only and not limitative of the invention. The scope of the invention is defined only by the claims appended hereto.

Abstract

The invention relates to a non-contact laser engraving apparatus and process. A laser beam is directed onto a work piece by a mask arrangement. The mask can be transparent or reflective. Optical means are used to transfer the laser beam and thus the image produced by the mask onto the work piece. In one embodiment parallel support tables hold the mask and the work piece in fixed, spaced apart, parallel arrangement. The support tables and/or the laser beam source are moved relative to each other such that the beam scans the mask and thus the work piece.

Description

BACKGROUND
1. Field of the Invention
This invention relates to a method of engraving materials using a laser and a mask which is spatially removed from the parts to be engraved.
2. Prior Art
It is well known that lasers can develop sufficient power densities to vaporize certain materials. Lasers such as high-power carbon dioxide lasers can vaporize many materials such as wood, plastic and rubber, relatively efficiently. Once the output from a laser is focused to a power density greater than approximately 10,000 watts per centimeter, it is possible to remove material from the surface of organic solids even when the laser beam is rapidly scanned across the surface. Of course, areas not struck by the laser beam are not vaporized. The use of the laser offers the potential of producing very intricate engravings in the proper material. One method of selectively engraving areas of a material is to manipulate the laser beam along the areas to be removed, using the laser much like a wood carver uses a knife. However, this method does not lend itself to mass production.
Another method of laser engraving uses a thin metal mask which is placed in contact with the part to be engraved. As the laser beam scans back and forth the beam penetrates to and vaporizes the part to be engraved only in the area which is not protected by the metal mask. Inasmuch as metals can withstand high laser power densities without being damaged, metal masks are not affected by the laser. This process, however, cannot produce detailed contours; moreover this process is not well suited for mass production inasmuch as fragile metal masks must be placed on and removed from the materials which are to be engraved.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view of an image transfer laser engraving system using transparent masks.
FIG. 2 is a cross-sectional view of a portion of the system shown in FIG. 1.
FIG. 3 is a cross-sectional view of an image transfer laser engraving system using a reflecting mask.
FIG. 4 is a cross-sectional view of a reflecting mask which includes a mirrored substrate and an absorbing coating.
FIG. 5 is a cross-sectional view of a reflecting mask which includes a mirrored substrate and diffusely reflecting areas.
FIG. 6 is a cross-sectional view of a reflecting mask which includes an absorbing coating and a reflecting area on a suitable substrate.
BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring concurrently to FIGS. 1 and 2, a laser 20 is shown in schematic representation. Laser 20 emits beam 19. Beam 19 passes through a suitable optical or focal system represented by lens 15, such that the beam is concentrated as it reaches the position of the transparent mask 13. It is not necessary for beam 19 to be precisely focused on the surface of the mask 13, but merely concentrated to a power density which is suitable for laser engraving the subject material while not damaging the mask material. Transparent mask 13 has reflecting areas 18 which block the beam. When the beam passes through a transparent area in mask 13, it passes through another optical system represented by lenses 16 and 17. These lenses are arranged to transfer an image of transparent mask 13 to the part 14 which is to be engraved. The image is transferred with unity magnification and the same orientation as mask 13.
If only one lens is used for this function, the image transferred to work piece 14 will be reversed from the orientation of the mask. This reverse orientation causes problems which will be explained in greater detail infra. Part 14 which is to be engraved is positioned at the point where the two transfer lenses reimage transparent mask 13. Conversely, of course, the optical system is effective to reimage mask 13 at work piece 14.
In the example shown in FIGS. 1 and 2, tables 11 and 12 supporting transparent masks 13 and work pieces 14 rotate and translate together while laser 20 and lenses 15, 16 and 17 are stationary. The mechanism could be arranged so that the entire area of transparent mask 13 is scanned by laser beam 19 in the spiral scan pattern characteristic of this type of arrangement. The beam which passes through mask 13 in the area not coated with reflecting coating 18 is transferred onto the part to be engraved. The areas in the mask represented by reflecting coating 18 permit no engraving to take place in the areas where the reflecting coating is imaged on the work piece. That is, reflecting coating 18 prevents beam 19 from impinging upon and engraving work piece 14.
By making reflecting coating 18 partially transparent, thereby allowing a reduced intensity of laser beam 19 to strike certain areas on work piece 14, various contours can be produced. That is, the depth of the engraving on the sample is proportional to the intensity of the laser beam on the work piece. The beam intensity is also proportional to the beam transmission or transparency of the corresponding area in mask 13.
Referring now to FIG. 3 there is shown a variation of this technique in which reflection mask 30 is used. This type of mask is more suitable for use with lasers which emit at long wavelengths, such as the carbon dioxide laser. This type of laser emits a beam having a wavelength of 10 microns and suffers from the problem that there are no suitable materials to use as the window material in the transmission mask. Common window materials such as glass and quartz do not transmit at long infrared wavelengths. Only materials such as sodium chloride which is hygroscopic, or germanium which is very expensive and not available in large sizes, can be used for long wavelength infrared windows. Therefore, there are circumstances which would make a transmission mask undesirable. Details of the construction of a reflection mask are given infra. However, in general, mask 30 contains areas 32 which are specularly reflecting, e.g. mirrored. Other areas of reflection mask 30 do not specularly reflect because they either absorb or scatter the incident light. The materials used to make the mask are chosen so that they can withstand the laser power densities required for engraving the sample.
In FIG. 3, laser 20 emits a beam 19 which passes through lens system 15 which concentrates the laser light. The concentrated beam is projected between tables 11 and 12 where it strikes turning mirror 21 which reflects the light onto reflecting mask 30. When the beam strikes mirrored area 32 of mask 30, the light is specularly reflected off the mask through a suitable optical system including, for example, lenses 22 and 23 to reach the work piece 14. Lenses 22 and 23 (FIG. 3) differ from lenses 16 and 17 (FIG. 2) inasmuch as they not only focus the laser light but also introduce a net deflection to the laser light so that they act both as lenses and prisms. While it is not absolutely necessary that the lenses 22 and/or 23 have this "wedge" incorporated into their design, the addition of the "wedge" permits the beam to impinge upon work piece 14 perpendicular to the surface thereof. If the work piece is tilted at the angle in order to be perpendicular to the direction of the laser light as it is reflected from mask 30 to lens 22, the reflecting mask and the sample being engraved are not in the same plane. This condition, i.e. nonparallel, produces a defocusing effect which blurs the image in at least some areas of work piece 14. Like transmitting mask 13 (FIGS. 1 and 2), reflecting mask 30 modulates laser beam 19. Thus, when the beam strikes mask areas which are not highly specularly reflective, the intensity of the reflected component of the light beam is reduced or eliminated. Consequently, the degree of reflectivity of mask 30 determines how deep the laser cuts will occur in work piece 14. This effect permits contoured patterns to be generated.
Referring concurrently to FIGS. 1, 2 and 3, masks 13 and 30 are supported by table 11, while sample or work piece 14 is supported by table 12. To accurately transfer the image contained in or on the mask to the sample, tables 11 and 12 must be held stationary relative to each other while laser beam 19 scans the table surfaces. There are many ways of holding these two surfaces fixed in relation to each other while scanning with the laser beam. For example, as suggested in FIGS. 1 and 2, tables 11 and 12 are rigidly attached to each other by means of a suitable axis arrangement. The axis arrangement also assures that the tables remain separated by a fixed amount. In this embodiment laser 20, and thus laser beam 19, is held stationary while the tables rotate rapidly. In addition, tables 11 and 12 also translate slowly to produce the effect of a spiral scan by laser beam 19. Conversely of course the translating motion can be accomplished by moving laser beam 19 and/or lens systems. Besides a spiral scan, other mechanical apparatus can be utilized to produce a zig-zag type of overlapping scan or a raster scan. These approaches require only mechanical skill to produce the design and do not depart from the spirit of this invention.
It should also be noted that optical systems comprising an even number of lenses e.g. two, are shown. For example, lenses 16 and 17 in FIG. 2, and lenses 22 and 23 in FIG. 3, transfer the image of the respective mask 13 or 30 onto samples 14 to be engraved. These lenses are preferably of equal focal length and are positioned so that the image produced on the sample is the same size (unity magnification) as the mask. If only one lens is used, or if an odd number of lenses is used, the image produced on work piece 14 would be inverted and reversed relative to the mask.
This latter approach is acceptable if the laser beam is focused to an extremely fine point as it passes through or is reflected from the mask so that the resolution obtainable in the engraving is equal to the minimum spot size of the laser beam on the mask. However, if two lenses are, or if an even number of lenses are used, used the laser beam can be enlarged from the extremely small size without degrading the resolution of the engraving process. That is, with two lenses the image of the mask remains stationary when it is projected on the sample, even when the mask and the sample move relative to the lenses. However, with a single lens, the projected image "moves" in the opposite direction when the mask and the sample are moved relative to the lens. Consequently, with a single lens there is a smearing effect which limits the resolution to the spot size of the laser beam on the mask.
FIGS. 4, 5 and 6 are cross-sectional views of different constructions of reflection masks. Referring to FIG. 4, mask 30 comprises a suitable substrate which includes mirrored surface 31 and absorbing coating 32 arranged to define a selected pattern. Coating 32 typically comprises material such as paint, glass frit silk screened onto a flat polished substrate, anodizing on a mirrored substrate such as aluminum, or the like. Tests indicate that an anodized aluminum substrate makes a very absorbent coating which can withstand high laser power densities.
FIG. 5 shows a somewhat different reflective mask. Substrate material of mask 30 again has a polished, specularly reflecting surface 31. However, instead of an absorbing coating, diffusely reflecting surface 33 is used to diminish the intensity of the laser light which falls within the acceptance angle of lens 22 in FIG. 3. To make diffusely reflecting surface 33, many techniques, such as chemical etching, sandblasting, or flame spraying a metallic powder are known.
FIG. 6 shows another structural configuration for reflecting templates. In this embodiment, the substrate of mask 30 is a material, such as aluminum, which can be anodized. An absorbing coating 34, such as an anodized layer, which withstands the laser power and has a glossy surface covers the entire surface of the substrate. Glossy absorbent coating 34 is overcoated with a pattern comprising reflecting layer 35, such as vapor-deposited copper or chemically deposited silver. This produces a mask which includes a uniformly specularly reflecting pattern formed from a thin metal coating which is backed by a light absorbent layer The reflecting coating is, typically, etched away in selected areas using well known techniques employing photo resist and chemical etching to reveal the absorbing coating beneath.
In FIGS. 4, 5 and 6, the example was given in which the surface of mask 30 was either strongly absorbent or highly reflecting. However, if contours are to be produced, it is necessary to be able to make intermediate levels of reflectivity. This can be accomplished by controlling the thickness of the coating layers such that the absorbing coating is thin enough to allow some reflection from the substrate or conversely such that the reflecting coating is thin enough to allow some absorption by the substrate layer.
Similarly, in the reflecting mask shown in FIG. 5, different amounts of reflection can be accomplished by different degrees of roughness in the diffusing areas. Alternatively, in making a reflecting mask, the absorbent or reflective layer can comprise a dot pattern with varying density to produce the effect of varying degrees of reflectivity. The dot pattern can be established in layers 32, 33, 34 or 35 as desired. To be useful for laser engraving, the dot pattern should be considerably finer than the resolution of the laser engraving system. If this is the case, the individual high and low reflectivity areas in the dot patterns will be too fine to be reproduced in the engraving and only the average reflectivity of this dot pattern will remain. Therefore, by changing the density of the dot patter, it is possible to produce the equivalent of varying reflectivity.
It should be obvious to those skilled in the art that curved mirrors are the optical equivalent to lenses. Therefore, the optical system used with the invention can also be made using curved mirrors if the proper modifications are made. Also it has been implied that the laser beam is approximately circular in shape when it strikes the mask and the sample being engraved. However, for some applications it is more desirable that the laser beam be brought to a line focus. In this case, lens 15 in FIGS. 1, 2 and 3 is a cylindrical lens to produce a line focus on the mask. Conversely, of course, additional optics can be inserted to produce a line focus. These techniques are well known to those skilled in the art, and do not depart from the spirit of this invention. Moreover, this description is intended to be illustrative only and not limitative of the invention. The scope of the invention is defined only by the claims appended hereto.

Claims (11)

Having thus described the invention, what is claimed is:
1. Laser engraving apparatus comprising:
source means for a laser beam;
first and second support tables having support means for holding said tables fixed in spatial orientation to each other;
at least one mask having an image thereon supported by said first support table;
at least one work piece supported by said second support table;
first optical means for directing and controlling said laser beam such that said laser beam impinges upon said mask;
second optical means for directing said laser beam from said mask to said work piece to thereby project said image onto said work piece, said second optical means including an even number of focusing elements between said first and second tables whereby said image is projected onto said work piece with the same orientation as it appears on said mask; and
said support means including means for rotating said first and second support tables in synchronism and means for separating said first and second support tables a preselected distance to cooperate with the positioning and focal lengths of said focusing elements whereby said image is projected onto said work piece with unity magnification.
2. The apparatus recited in claim 1 wherein said mask is at least partially transparent to said laser beam whereby said image of said mask is projected onto said work piece when said laser beam is transmitted through said mask.
3. The apparatus recited in claim 1 wherein said mask is at least partially nonspecularly reflective of said laser beam whereby an image of said mask is projected onto said work piece when reflected portions of said laser beam are reflected from said mask and directed to said work piece.
4. The apparatus recited in claim 3 wherein said nonspecularly reflective mask includes portions thereof which are absorptive of said laser beam.
5. The apparatus recited in claim 3 wherein said nonspecularly reflective mask includes:
a substrate;
a layer of absorptive material on a surface of said substrate; and
a patterned layer of reflective material on said layer of absorptive material.
6. The apparatus recited in claim 1 wherein said mask includes at least one specularly reflecting area and at least one nonspecularly reflecting area.
7. The apparatus recited in claim 2 wherein said mask is selectively partially transparent to thereby produce contours on said work piece when said laser beam is directed to said work piece.
8. The apparatus recited in claim 3 wherein said nonspecularly reflective mask includes portions thereof which scatter said laser beam.
9. The apparatus recited in claim 3 wherein said mask is selectively partially reflective to thereby produce contours on said work piece when said laser beam is directed to said work piece by said optical means.
10. The apparatus recited in claim 1 including means for translating said tables to produce the effect of scanning by said laser beam.
11. The apparatus recited in claim 1 including means for controllably moving said focusing elements to produce the effect of scanning by said laser beam.
US05/787,471 1977-04-14 1977-04-14 Image transfer laser engraving Expired - Lifetime US4156124A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US05/787,471 US4156124A (en) 1977-04-14 1977-04-14 Image transfer laser engraving

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/787,471 US4156124A (en) 1977-04-14 1977-04-14 Image transfer laser engraving

Publications (1)

Publication Number Publication Date
US4156124A true US4156124A (en) 1979-05-22

Family

ID=25141591

Family Applications (1)

Application Number Title Priority Date Filing Date
US05/787,471 Expired - Lifetime US4156124A (en) 1977-04-14 1977-04-14 Image transfer laser engraving

Country Status (1)

Country Link
US (1) US4156124A (en)

Cited By (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3036005A1 (en) * 1980-09-24 1982-05-06 Siemens AG, 1000 Berlin und 8000 München METHOD FOR PRODUCING A CODE DISC FOR OPTICAL ANGLE STEPPERS OR ANGLE ENCODER
DE3130214A1 (en) * 1981-07-31 1983-02-17 Heidenhain Gmbh Dr Johannes Mask for laser inscription systems
US4392476A (en) * 1980-12-23 1983-07-12 Lazare Kaplan & Sons, Inc. Method and apparatus for placing identifying indicia on the surface of precious stones including diamonds
DE3314963A1 (en) * 1982-04-26 1983-10-27 John Alan Santa Rosa Calif. Macken CUTTING AND ENGRAVING DEVICE USING LASER BEAM
DE3230578A1 (en) * 1982-08-17 1984-02-23 Schott-Zwiesel-Glaswerke Ag, 8372 Zwiesel Method of making release points for gas bubbles in the inside surface of containers for receiving gaseous or gas-saturated liquids, and container with release points of this type
DE3332838A1 (en) * 1982-09-13 1984-03-15 John Alan Santa Rosa Calif. Macken METHOD AND DEVICE FOR ENGRAVING BY LASER BLASTING
FR2546786A1 (en) * 1983-06-01 1984-12-07 Macken John Laser apparatus, especially for cutting paper
US4661679A (en) * 1985-06-28 1987-04-28 Eaton Corporation Semiconductor laser processing with mirror mask
US4713537A (en) * 1985-08-23 1987-12-15 Gretag Aktiengesellschaft Method and apparatus for the fine position adjustment of a laser beam
US4734558A (en) * 1983-05-16 1988-03-29 Nec Corporation Laser machining apparatus with controllable mask
US4758703A (en) * 1987-05-06 1988-07-19 Estee Lauder Inc. System and method for encoding objects
US4803336A (en) * 1988-01-14 1989-02-07 Hughes Aircraft Company High speed laser marking system
US4822975A (en) * 1984-01-30 1989-04-18 Canon Kabushiki Kaisha Method and apparatus for scanning exposure
EP0315228A1 (en) * 1987-11-04 1989-05-10 Peter Gammelin Soldering apparatus
US4842782A (en) * 1986-10-14 1989-06-27 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
US4968868A (en) * 1987-05-13 1990-11-06 Canon Kabushiki Kaisha Projection exposure system
US5053171A (en) * 1986-10-14 1991-10-01 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
US5061840A (en) * 1986-10-14 1991-10-29 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
US5095190A (en) * 1987-03-03 1992-03-10 Canon Kabushiki Kaisha Exposure apparatus
US5113582A (en) * 1990-11-13 1992-05-19 General Electric Company Method for making a gas turbine engine component
US5120395A (en) * 1990-11-13 1992-06-09 General Electric Company Method for making a gas turbine engine component with a textured surface
US5188631A (en) * 1983-11-17 1993-02-23 Visx, Incorporated Method for opthalmological surgery
US5207668A (en) * 1983-11-17 1993-05-04 Visx Incorporated Method for opthalmological surgery
US5210944A (en) * 1990-11-13 1993-05-18 General Electric Company Method for making a gas turbine engine component
US5216808A (en) * 1990-11-13 1993-06-08 General Electric Company Method for making or repairing a gas turbine engine component
US5219343A (en) * 1983-11-17 1993-06-15 Visx Incorporated Apparatus for performing ophthalmogolical surgery
DE4326874A1 (en) * 1993-08-11 1995-02-16 Benecke Kaliko Ag Method of engraving a pattern on a surface of a workpiece
WO1995009068A1 (en) * 1993-09-30 1995-04-06 Cymer Laser Technologies Full field mask illumination enhancement methods and apparatus
US5504301A (en) * 1994-03-21 1996-04-02 Laser Cut Images International, Inc. Apparatus and method for laser engraving thin sheet-like materials
US5507741A (en) * 1983-11-17 1996-04-16 L'esperance, Jr.; Francis A. Ophthalmic method for laser surgery of the cornea
US5649922A (en) * 1995-07-17 1997-07-22 Yavitz; Edward Q. Apparatus and method for altering corneal tissue
US5683600A (en) * 1993-03-17 1997-11-04 General Electric Company Gas turbine engine component with compound cooling holes and method for making the same
US5739502A (en) * 1983-12-27 1998-04-14 General Electric Company Laser intensity redistribution
US5780524A (en) * 1996-05-14 1998-07-14 Olsen; Don E. Micro heating apparatus for synthetic fibers and related methods
US5798202A (en) * 1992-05-11 1998-08-25 E. I. Dupont De Nemours And Company Laser engravable single-layer flexographic printing element
US5804353A (en) * 1992-05-11 1998-09-08 E. I. Dupont De Nemours And Company Lasers engravable multilayer flexographic printing element
US5820624A (en) * 1995-07-17 1998-10-13 Quadrivium, L.L.C. System for altering corneal tissue
US5966307A (en) * 1997-06-10 1999-10-12 Behavior Tech Computer Corporation Laser marker control system
US6009876A (en) * 1997-05-20 2000-01-04 Yavitz; Edward Q. Method for modifying and reshaping collagen beneath the surface of skin
US6121574A (en) * 1997-12-03 2000-09-19 Miyachi Technos Corporation Two-dimensional bar code laser marking method
US6161546A (en) * 1995-07-17 2000-12-19 Quardrivium, L.L.C. System for altering tissue beneath an outer layer of tissue
US6254594B1 (en) 1999-07-30 2001-07-03 Quadrivium, Llc Disposable light source for photothermal treatment of human tissue
US6312450B1 (en) 1997-05-20 2001-11-06 Natural Vision Center, Inc. System and method for improving the appearance of skin
US6337749B1 (en) 1996-05-08 2002-01-08 Benecke-Kaliko Ag Method for generating a control signal for apparatus producing topological depths on a workpiece
US20030060306A1 (en) * 2001-01-11 2003-03-27 Darin Aldrich Laser surface modified golf club heads
US20030201259A1 (en) * 1999-11-11 2003-10-30 Koninklijke Philips Electronics, N.V. Marking of an anodized layer of an aluminium object
US20040031779A1 (en) * 2002-05-17 2004-02-19 Cahill Steven P. Method and system for calibrating a laser processing system and laser marking system utilizing same
US20040104202A1 (en) * 2000-01-28 2004-06-03 Gsi Lumonics, Inc. Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like
US20040159641A1 (en) * 1996-01-05 2004-08-19 Kaplan George R. Laser marking system
US20060108337A1 (en) * 2004-11-11 2006-05-25 Bo Gu Method and system for laser soft marking
US20060189091A1 (en) * 2004-11-11 2006-08-24 Bo Gu Method and system for laser hard marking
US20070138152A1 (en) * 2005-12-20 2007-06-21 Arisawa Mfg. Co., Ltd. Laser ablation apparatus, processing method, and mask therefor
US20080302770A1 (en) * 2007-06-08 2008-12-11 Helios Technology S.R.L. "Machine for removing surfaces of semiconductors and particularly surfaces with integrated circuits"
US8585956B1 (en) 2009-10-23 2013-11-19 Therma-Tru, Inc. Systems and methods for laser marking work pieces
US20150196976A1 (en) * 2012-09-18 2015-07-16 Trumpf Laser Gmbh Machine for Workpiece Processing
US9216476B1 (en) * 2012-03-19 2015-12-22 Tykma, Inc. Enclosure for laser engraving device
US9475149B1 (en) 2015-04-24 2016-10-25 Testrake Aviation, Inc. Optical device and method of making same
US11413704B2 (en) * 2019-07-17 2022-08-16 Fanuc Corporation Adjustment assistance device and laser welding apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3118050A (en) * 1960-04-06 1964-01-14 Alloyd Electronics Corp Electron beam devices and processes
US3396401A (en) * 1966-10-20 1968-08-06 Kenneth K. Nonomura Apparatus and method for the marking of intelligence on a record medium
US3440388A (en) * 1966-04-04 1969-04-22 Monsanto Co Method for machining with laser beam
US3549733A (en) * 1968-12-04 1970-12-22 Du Pont Method of producing polymeric printing plates
US3965327A (en) * 1973-10-10 1976-06-22 Winkler & Dunnebier Maschinenfabrik Und Eisengiesserei Kg Method of cutting material to shape from a moving web by burning

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3118050A (en) * 1960-04-06 1964-01-14 Alloyd Electronics Corp Electron beam devices and processes
US3440388A (en) * 1966-04-04 1969-04-22 Monsanto Co Method for machining with laser beam
US3396401A (en) * 1966-10-20 1968-08-06 Kenneth K. Nonomura Apparatus and method for the marking of intelligence on a record medium
US3549733A (en) * 1968-12-04 1970-12-22 Du Pont Method of producing polymeric printing plates
US3965327A (en) * 1973-10-10 1976-06-22 Winkler & Dunnebier Maschinenfabrik Und Eisengiesserei Kg Method of cutting material to shape from a moving web by burning

Cited By (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3036005A1 (en) * 1980-09-24 1982-05-06 Siemens AG, 1000 Berlin und 8000 München METHOD FOR PRODUCING A CODE DISC FOR OPTICAL ANGLE STEPPERS OR ANGLE ENCODER
US4392476A (en) * 1980-12-23 1983-07-12 Lazare Kaplan & Sons, Inc. Method and apparatus for placing identifying indicia on the surface of precious stones including diamonds
DE3130214A1 (en) * 1981-07-31 1983-02-17 Heidenhain Gmbh Dr Johannes Mask for laser inscription systems
DE3314963A1 (en) * 1982-04-26 1983-10-27 John Alan Santa Rosa Calif. Macken CUTTING AND ENGRAVING DEVICE USING LASER BEAM
DE3230578A1 (en) * 1982-08-17 1984-02-23 Schott-Zwiesel-Glaswerke Ag, 8372 Zwiesel Method of making release points for gas bubbles in the inside surface of containers for receiving gaseous or gas-saturated liquids, and container with release points of this type
DE3332838A1 (en) * 1982-09-13 1984-03-15 John Alan Santa Rosa Calif. Macken METHOD AND DEVICE FOR ENGRAVING BY LASER BLASTING
FR2532870A1 (en) * 1982-09-13 1984-03-16 Macken John APPARATUS AND METHOD FOR CONTACTLESS LASER ETCHING
US4734558A (en) * 1983-05-16 1988-03-29 Nec Corporation Laser machining apparatus with controllable mask
FR2546786A1 (en) * 1983-06-01 1984-12-07 Macken John Laser apparatus, especially for cutting paper
US5507741A (en) * 1983-11-17 1996-04-16 L'esperance, Jr.; Francis A. Ophthalmic method for laser surgery of the cornea
US5188631A (en) * 1983-11-17 1993-02-23 Visx, Incorporated Method for opthalmological surgery
US5219343A (en) * 1983-11-17 1993-06-15 Visx Incorporated Apparatus for performing ophthalmogolical surgery
US5207668A (en) * 1983-11-17 1993-05-04 Visx Incorporated Method for opthalmological surgery
US5739502A (en) * 1983-12-27 1998-04-14 General Electric Company Laser intensity redistribution
US4822975A (en) * 1984-01-30 1989-04-18 Canon Kabushiki Kaisha Method and apparatus for scanning exposure
US4661679A (en) * 1985-06-28 1987-04-28 Eaton Corporation Semiconductor laser processing with mirror mask
US4713537A (en) * 1985-08-23 1987-12-15 Gretag Aktiengesellschaft Method and apparatus for the fine position adjustment of a laser beam
US4842782A (en) * 1986-10-14 1989-06-27 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
US5061840A (en) * 1986-10-14 1991-10-29 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
US5053171A (en) * 1986-10-14 1991-10-01 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
US5095190A (en) * 1987-03-03 1992-03-10 Canon Kabushiki Kaisha Exposure apparatus
US5196667A (en) * 1987-04-11 1993-03-23 Peter Gammelin Soldering and desoldering device
US4758703A (en) * 1987-05-06 1988-07-19 Estee Lauder Inc. System and method for encoding objects
US4968868A (en) * 1987-05-13 1990-11-06 Canon Kabushiki Kaisha Projection exposure system
EP0315228A1 (en) * 1987-11-04 1989-05-10 Peter Gammelin Soldering apparatus
US4803336A (en) * 1988-01-14 1989-02-07 Hughes Aircraft Company High speed laser marking system
US5210944A (en) * 1990-11-13 1993-05-18 General Electric Company Method for making a gas turbine engine component
US5216808A (en) * 1990-11-13 1993-06-08 General Electric Company Method for making or repairing a gas turbine engine component
US5120395A (en) * 1990-11-13 1992-06-09 General Electric Company Method for making a gas turbine engine component with a textured surface
US5113582A (en) * 1990-11-13 1992-05-19 General Electric Company Method for making a gas turbine engine component
US5804353A (en) * 1992-05-11 1998-09-08 E. I. Dupont De Nemours And Company Lasers engravable multilayer flexographic printing element
US5798202A (en) * 1992-05-11 1998-08-25 E. I. Dupont De Nemours And Company Laser engravable single-layer flexographic printing element
US5683600A (en) * 1993-03-17 1997-11-04 General Electric Company Gas turbine engine component with compound cooling holes and method for making the same
DE4326874C3 (en) * 1993-08-11 1999-11-25 Benecke Kaliko Ag Method of engraving a pattern on a surface of a workpiece
US5886317A (en) * 1993-08-11 1999-03-23 Benecke-Kaliko Ag Process for engraving a structure into the surface of a work piece with a laser
DE4326874A1 (en) * 1993-08-11 1995-02-16 Benecke Kaliko Ag Method of engraving a pattern on a surface of a workpiece
US5601733A (en) * 1993-09-30 1997-02-11 Cymer, Inc. Full field mask illumination enhancement methods and apparatus
WO1995009068A1 (en) * 1993-09-30 1995-04-06 Cymer Laser Technologies Full field mask illumination enhancement methods and apparatus
US5504301A (en) * 1994-03-21 1996-04-02 Laser Cut Images International, Inc. Apparatus and method for laser engraving thin sheet-like materials
US5820624A (en) * 1995-07-17 1998-10-13 Quadrivium, L.L.C. System for altering corneal tissue
US5649922A (en) * 1995-07-17 1997-07-22 Yavitz; Edward Q. Apparatus and method for altering corneal tissue
US6161546A (en) * 1995-07-17 2000-12-19 Quardrivium, L.L.C. System for altering tissue beneath an outer layer of tissue
US20040159641A1 (en) * 1996-01-05 2004-08-19 Kaplan George R. Laser marking system
US20050103760A1 (en) * 1996-01-05 2005-05-19 Kaplan George R. Laser marking system
US20080000885A1 (en) * 1996-01-05 2008-01-03 Kaplan George R Laser marking system
US7655882B2 (en) 1996-01-05 2010-02-02 Lazare Kaplan International, Inc. Microinscribed gemstone
US6337749B1 (en) 1996-05-08 2002-01-08 Benecke-Kaliko Ag Method for generating a control signal for apparatus producing topological depths on a workpiece
US5780524A (en) * 1996-05-14 1998-07-14 Olsen; Don E. Micro heating apparatus for synthetic fibers and related methods
US6312450B1 (en) 1997-05-20 2001-11-06 Natural Vision Center, Inc. System and method for improving the appearance of skin
US6009876A (en) * 1997-05-20 2000-01-04 Yavitz; Edward Q. Method for modifying and reshaping collagen beneath the surface of skin
US5966307A (en) * 1997-06-10 1999-10-12 Behavior Tech Computer Corporation Laser marker control system
US6121574A (en) * 1997-12-03 2000-09-19 Miyachi Technos Corporation Two-dimensional bar code laser marking method
US6254594B1 (en) 1999-07-30 2001-07-03 Quadrivium, Llc Disposable light source for photothermal treatment of human tissue
US20030201259A1 (en) * 1999-11-11 2003-10-30 Koninklijke Philips Electronics, N.V. Marking of an anodized layer of an aluminium object
US6777098B2 (en) * 1999-11-11 2004-08-17 Koninklijke Philips Electronics N.V. Marking of an anodized layer of an aluminium object
US20040104202A1 (en) * 2000-01-28 2004-06-03 Gsi Lumonics, Inc. Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like
US20030060306A1 (en) * 2001-01-11 2003-03-27 Darin Aldrich Laser surface modified golf club heads
US7015418B2 (en) 2002-05-17 2006-03-21 Gsi Group Corporation Method and system for calibrating a laser processing system and laser marking system utilizing same
USRE41924E1 (en) * 2002-05-17 2010-11-16 Gsi Group Corporation Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
US20060054608A1 (en) * 2002-05-17 2006-03-16 Gsi Lumonics Corporation Method and system for calibrating a laser processing system and laser marking system utilizing same
US20040144760A1 (en) * 2002-05-17 2004-07-29 Cahill Steven P. Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein
US20040152233A1 (en) * 2002-05-17 2004-08-05 Chris Nemets Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
US7067763B2 (en) 2002-05-17 2006-06-27 Gsi Group Corporation High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
US20060180580A1 (en) * 2002-05-17 2006-08-17 Gsi Lumonics Corporation High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
US20040031779A1 (en) * 2002-05-17 2004-02-19 Cahill Steven P. Method and system for calibrating a laser processing system and laser marking system utilizing same
US20060186096A1 (en) * 2002-05-17 2006-08-24 Gsi Lumonics Corporation High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
US7119351B2 (en) 2002-05-17 2006-10-10 Gsi Group Corporation Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
US20070031993A1 (en) * 2002-05-17 2007-02-08 Gsi Lumonics Corporation Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
US20040060910A1 (en) * 2002-05-17 2004-04-01 Rainer Schramm High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
US20060189091A1 (en) * 2004-11-11 2006-08-24 Bo Gu Method and system for laser hard marking
US7705268B2 (en) 2004-11-11 2010-04-27 Gsi Group Corporation Method and system for laser soft marking
US20060108337A1 (en) * 2004-11-11 2006-05-25 Bo Gu Method and system for laser soft marking
US20070138152A1 (en) * 2005-12-20 2007-06-21 Arisawa Mfg. Co., Ltd. Laser ablation apparatus, processing method, and mask therefor
US20080302770A1 (en) * 2007-06-08 2008-12-11 Helios Technology S.R.L. "Machine for removing surfaces of semiconductors and particularly surfaces with integrated circuits"
US8585956B1 (en) 2009-10-23 2013-11-19 Therma-Tru, Inc. Systems and methods for laser marking work pieces
US9216476B1 (en) * 2012-03-19 2015-12-22 Tykma, Inc. Enclosure for laser engraving device
US20150196976A1 (en) * 2012-09-18 2015-07-16 Trumpf Laser Gmbh Machine for Workpiece Processing
US10245696B2 (en) * 2012-09-18 2019-04-02 Trumpf Laser Gmbh Machine for workpiece processing
US11167389B2 (en) 2012-09-18 2021-11-09 Trumpf Laser Gmbh Machine for workpiece processing
US9475149B1 (en) 2015-04-24 2016-10-25 Testrake Aviation, Inc. Optical device and method of making same
US11413704B2 (en) * 2019-07-17 2022-08-16 Fanuc Corporation Adjustment assistance device and laser welding apparatus

Similar Documents

Publication Publication Date Title
US4156124A (en) Image transfer laser engraving
US4480169A (en) Non contact laser engraving apparatus
US5296673A (en) Laser machining
US4606601A (en) Single facet wobble free scanner
US4797696A (en) Beam splitting apparatus
CA1194556A (en) Laser apparatus and process for cutting paper
JPH09192857A (en) Laser beam scribing on glass with using nd:yag laser beam
JPH07290263A (en) Laser beam machine and laser beam processing method
JPH01306088A (en) Variable beam laser processing device
JP2662065B2 (en) Optical system for laser marking
CA1325041C (en) Cutting using high energy radiation
JP2002001561A (en) Oval hole machining method and its apparatus
JP2002244060A (en) Laser beam scanner
JPS58190918A (en) Laser scanner
JPS642790A (en) Laser beam machine
JP2002244059A (en) Laser beam scanner
JP3105914B2 (en) Rotating mirror for pulse laser beam expansion
JPS63118275A (en) Marking method
US20010023052A1 (en) Exposure apparatus and laser working method
JPH0241784A (en) Laser beam marking device
JPS61249694A (en) Laser beam machine
KR0161831B1 (en) Laser marking device
JPH10296475A (en) Laser beam machine
JPS60124939A (en) Laser exposure device
JPS63118276A (en) Marking method

Legal Events

Date Code Title Description
AS Assignment

Owner name: BANK OF AMERICA NATIONAL TRUST AND SAVINGS ASSOCIA

Free format text: SECURITY INTEREST;ASSIGNOR:LASERCRAFT INCORPORATED;REEL/FRAME:006002/0024

Effective date: 19911202

AS Assignment

Owner name: UTICA ENTERPRISES, INC. A CORPORATION OF MICHIGAN,

Free format text: SECURITY AGREEMENT;ASSIGNOR:OPTICAL ENGINEERING, INC. A CORPORATION OF CALIFORNIA;REEL/FRAME:011648/0734

Effective date: 20010124

Owner name: CARTER, THOMAS, MICHIGAN

Free format text: SECURITY AGREEMENT;ASSIGNOR:OPTICAL ENGINEERING, INC. A CORPORATION OF CALIFORNIA;REEL/FRAME:011648/0734

Effective date: 20010124

Owner name: WANCZYK, STEFAN, MICHIGAN

Free format text: SECURITY AGREEMENT;ASSIGNOR:OPTICAL ENGINEERING, INC. A CORPORATION OF CALIFORNIA;REEL/FRAME:011648/0734

Effective date: 20010124