US4755911A - Multilayer printed circuit board - Google Patents
Multilayer printed circuit board Download PDFInfo
- Publication number
- US4755911A US4755911A US07/043,464 US4346487A US4755911A US 4755911 A US4755911 A US 4755911A US 4346487 A US4346487 A US 4346487A US 4755911 A US4755911 A US 4755911A
- Authority
- US
- United States
- Prior art keywords
- printed circuit
- dielectric
- porous
- circuit board
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
- Y10T428/31544—Addition polymer is perhalogenated
Definitions
- the present invention relates to printed-wiring boards or printed-circuit boards which are associated with high-speed electrical signals and with short signal transmission delay times. More specifically, due to the use of intermediate dielectric bodies in the multilayer printed-circuit board of this invention, the delay which occurs in transmission of such signals is shortened.
- a multilayer printed circuit board comprising a plurality of individual printed circuit boards laminated together, each individual board being separated from an adjacent board by a layer of a dielectric of porous, expanded PTFE.
- the layer of dielectric may have an adhesive on at least one surface or on both surfaces.
- the adhesive may be in the form of a layer or in the form of discrete dots.
- the layer of dielectric may have an adhesive impregnated within its pores.
- the adhesive may be a fluororesin polymer.
- at least one of the layers of dielectric has additional through holes, in addition to the pores of the porous dielectric.
- FIG. 1 is a perspective view, partly in cross-section, of a multilayer printed circuit board in accordance with one embodiment of the present invention.
- FIGS. 2-4 are side cross-sectional views of porous intermediate dielectric layers utilized in other embodiments of the invention.
- a multilayer printed circuit board comprising a plurality of printed circuit boards laminated together, each board being separated from an adjacent board by a layer of a dielectric of porous, expanded polytetrafluoroethylene (PTFE).
- the dielectric layer may have an adhesive on its surface(s) affixed as a layer or in a pattern of dots. Alternatively, an adhesive may be impregnated within the pores of the porous dielectric.
- the dielectric has additional openings or through holes in it, in addition to the pores of the porous dielectric.
- a multilayer printed circuit board is formed of several individual printed circuit boards with porous intermediate dielectric layers placed between the several individual printed circuit boards.
- the printed circuit board has a very low dielectric constant. It has no significant increase in signal transmission delay time, and the intermediate layers impart to the board improved properties such as thermal and chemical stability.
- the multilayer printed circuit boards of the present invention are provided with several porous intermediate dielectric layers placed between the several individual printed circuit boards, the multilayer board has a dielectric constant approximately that of a single board or lower. As a result, the transmission time of signals through the dielectric layers is not delayed significantly.
- the multilayer printed circuit board can be provided with an adhesive layer, or with an adhesive agent, which is used for attachment of the porous intermediate layers to the individual printed circuit boards.
- the adhesive can be distributed in a dot-like pattern, particularly on the edge portions of the boards.
- the elements of a multilayer printed circuit board can be firmly attached to each other, without causing a delay in the signal transmission time as well as without causing a local increase in the dielectric constant in the areas adjacent to the locations of the circuits or wiring elements.
- FIG. 1 is a perspective view, partly in cross-section, illustrating the structure of a multilayer printed circuit board made in accordance with the present invention.
- a multilayer printed circuit board 1 comprises three separate printed circuit boards 2, 3 and 4, which are held firmly together as an integral unit by means of porous intermediate dielectric layers 5 impregnated with an adhesive composition.
- Printed circuit board 6 is attached to printed circuit board 4 through porous intermediate dielectric layer 8 having on its surfaces adhesive 7 distributed on its surfaces in a dot-like pattern.
- Printed circuit boards 2, 3, 4 and 6 suitable for the purpose of the present invention may be comprised of fluororesin-type printed circuit boards disclosed in Japanese Patent Application Nos. 59-72,472; 59-83,308; and Utility Model Application No. 59-169,574.
- Porous intermediate dielectric layers 5 and 8 which are especially suitable for the same purpose may be comprised of an expanded, porous PTFE obtained by the method described in Japanese Patent Publication (Kokai) No. 51-18,991; and its U.S. counterpart, U.S. Pat. No. 3,593,566.
- the intermediate elements can be made of a foamed porous tetrafluoroethylene resin, or from other similar porous fluororesins.
- FIG. 2 illustrates the porous intermediate dielectric layer 8 which is provided with adhesive composition 7.
- the adhesive composition is distributed on the edges of body 8 in a dot-like manner and is formed, for example, from a fluororesin-type adhesive agent available under the trademark "Lumiflon”.
- the adhesive composition is distributed in a dot-like pattern and is located only on the edge portions of the dielectric layer, the elements can be firmly integrated into a single unit with only a local increase in the value of the dielectric constant in the vicinity of the printed circuit or wiring elements.
- FIGS. 3 and 4 show other modifications of the porous dielectric layers suitable for the purpose of the present invention.
- a fluororesin-type adhesive agent 12 impregnates the edges of body 11 and is applied onto body 11 in a dot-like pattern.
- Printed circuit boards are brought into contact with dielectric body 11 and are attached by heating, which causes leaching and adhesion.
- Additional through holes 13 are shown in the dielectric layers of FIGS. 2 and 3.
- the porous intermediate dielectric layer can be produced by impregnating the entire surface of a prepreg or film with an adhesive composition.
- Several units made of intermediate dielectric layers sandwiched between printed circuit boards can be connected to each other through insulating plates by means of bolts.
- both surfaces of the porous intermediate dielectric layers can be coated with adhesive tapes or other forms of adhesive.
- the effect of the invention resides in that it protects the units from significant delay in the transmission speed of signals and provides multilayer printed circuit boards suitable for high-speed transmission of signals.
- the invention is especially efficient when the porous intermediate dielectric layers are made from expanded, porous PTFE or a similar porous fluororesin which is characterized by having a low dielectric constant, which provides favorable conditions for transmission of signals, and at the same time possesses stable chemical and physical properties. Due to these conditions, a highly reliable multilayer printed circuit board is obtained.
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US07/043,464 US4755911A (en) | 1987-04-28 | 1987-04-28 | Multilayer printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/043,464 US4755911A (en) | 1987-04-28 | 1987-04-28 | Multilayer printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
US4755911A true US4755911A (en) | 1988-07-05 |
Family
ID=21927307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/043,464 Expired - Lifetime US4755911A (en) | 1987-04-28 | 1987-04-28 | Multilayer printed circuit board |
Country Status (1)
Country | Link |
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US (1) | US4755911A (en) |
Cited By (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4854038A (en) * | 1988-03-16 | 1989-08-08 | International Business Machines Corporation | Modularized fabrication of high performance printed circuit boards |
US4864722A (en) * | 1988-03-16 | 1989-09-12 | International Business Machines Corporation | Low dielectric printed circuit boards |
US4868350A (en) * | 1988-03-07 | 1989-09-19 | International Business Machines Corporation | High performance circuit boards |
EP0374272A1 (en) * | 1987-10-19 | 1990-06-27 | E.I. Du Pont De Nemours And Company | Multilayer circuit board with fluoropolymer interlayers |
US5034801A (en) * | 1989-07-31 | 1991-07-23 | W. L. Gore & Associates, Inc. | Intergrated circuit element having a planar, solvent-free dielectric layer |
EP0449292A2 (en) * | 1990-03-30 | 1991-10-02 | Hitachi, Ltd. | Multilayer printed circuit board and production thereof |
US5065280A (en) * | 1990-08-30 | 1991-11-12 | Hewlett-Packard Company | Flex interconnect module |
US5072075A (en) * | 1989-06-28 | 1991-12-10 | Digital Equipment Corporation | Double-sided hybrid high density circuit board and method of making same |
EP0490211A2 (en) * | 1990-12-07 | 1992-06-17 | International Business Machines Corporation | Electronic circuit packages with tear resistant organic cores |
US5136123A (en) * | 1987-07-17 | 1992-08-04 | Junkosha Co., Ltd. | Multilayer circuit board |
EP0498677A2 (en) * | 1991-02-08 | 1992-08-12 | Graphico Co. Ltd. | Improvement in or relating to a printed-circuit board |
US5287619A (en) * | 1992-03-09 | 1994-02-22 | Rogers Corporation | Method of manufacture multichip module substrate |
US5367764A (en) * | 1991-12-31 | 1994-11-29 | Tessera, Inc. | Method of making a multi-layer circuit assembly |
US5373109A (en) * | 1992-12-23 | 1994-12-13 | International Business Machines Corporation | Electrical cable having flat, flexible, multiple conductor sections |
US5418690A (en) * | 1993-06-11 | 1995-05-23 | International Business Machines Corporation | Multiple wiring and X section printed circuit board technique |
US5440805A (en) * | 1992-03-09 | 1995-08-15 | Rogers Corporation | Method of manufacturing a multilayer circuit |
US5469324A (en) * | 1994-10-07 | 1995-11-21 | Storage Technology Corporation | Integrated decoupling capacitive core for a printed circuit board and method of making same |
US5473119A (en) * | 1993-02-05 | 1995-12-05 | W. L. Gore & Associates, Inc. | Stress-resistant circuit board |
US5570504A (en) * | 1991-12-31 | 1996-11-05 | Tessera, Inc. | Multi-Layer circuit construction method and structure |
US5619018A (en) * | 1995-04-03 | 1997-04-08 | Compaq Computer Corporation | Low weight multilayer printed circuit board |
US5711679A (en) * | 1995-01-06 | 1998-01-27 | Berg Technology, Inc. | Shielded memory card connector |
US5713747A (en) * | 1995-01-06 | 1998-02-03 | Berg Technology, Inc. | Memory card connector |
US5734560A (en) * | 1994-12-01 | 1998-03-31 | International Business Machines Corporation | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap |
US5888631A (en) * | 1996-11-08 | 1999-03-30 | W. L. Gore & Associates, Inc. | Method for minimizing warp in the production of electronic assemblies |
WO1999028127A1 (en) * | 1997-12-01 | 1999-06-10 | Polyeitan Composites Ltd. | Ultrahigh molecular weight polyethylene composite for printed circuit board and antenna base material |
US5948533A (en) * | 1990-02-09 | 1999-09-07 | Ormet Corporation | Vertically interconnected electronic assemblies and compositions useful therefor |
US5965848A (en) * | 1997-07-22 | 1999-10-12 | Randice-Lisa Altschul | Disposable portable electronic devices and method of making |
US6061580A (en) * | 1997-02-28 | 2000-05-09 | Randice-Lisa Altschul | Disposable wireless telephone and method for call-out only |
US6110576A (en) * | 1998-10-16 | 2000-08-29 | Lucent Technologies Inc. | Article comprising molded circuit |
US6164522A (en) * | 1998-06-29 | 2000-12-26 | Delphi Technologies, Inc. | Method of manufacturing a thick film circuit with constrained adhesive spreading |
US6168855B1 (en) | 1997-12-01 | 2001-01-02 | Polyeitan Composites Ltd. | Polyolefin composites for printed circuit board and antenna base material |
US6287143B1 (en) | 1993-03-23 | 2001-09-11 | Berg Technology, Inc. | Multi-storage deck connector apparatus |
US6297459B1 (en) * | 1994-05-23 | 2001-10-02 | General Electric Company | Processing low dielectric constant materials for high speed electronics |
US6405031B1 (en) | 1997-02-28 | 2002-06-11 | Dieceland Technologies Corp. | Wireless telephone system, telephone and method |
US6609294B1 (en) * | 2000-09-27 | 2003-08-26 | Polyclad Laminates, Inc. | Method of bulk fabricating printed wiring board laminates |
WO2003090308A1 (en) * | 2002-04-17 | 2003-10-30 | Silicon Pipe, Inc. | Signal transmission line structure with an air dielectric |
US20030214802A1 (en) * | 2001-06-15 | 2003-11-20 | Fjelstad Joseph C. | Signal transmission structure with an air dielectric |
US6656314B2 (en) * | 2001-05-23 | 2003-12-02 | Hewlett-Packard Development Company, L.P. | Method of manufacturing multilayer substrates |
EP1404165A1 (en) * | 2001-07-02 | 2004-03-31 | Nitto Denko Corporation | Method for manufacturing multilayer wiring board |
US20040069527A1 (en) * | 2002-10-14 | 2004-04-15 | Carl Vanhoutte | Laminated bus bar assembly |
US6809608B2 (en) | 2001-06-15 | 2004-10-26 | Silicon Pipe, Inc. | Transmission line structure with an air dielectric |
EP1484949A2 (en) * | 1994-05-23 | 2004-12-08 | General Electric Company | Processing low dielectric constant materials for high speed electronics |
US6834426B1 (en) * | 2000-07-25 | 2004-12-28 | International Business Machines Corporation | Method of fabricating a laminate circuit structure |
US20080311358A1 (en) * | 2005-12-05 | 2008-12-18 | Akira Tomii | Fluorine Resin Laminated Substrate |
US20100025091A1 (en) * | 2007-02-19 | 2010-02-04 | Frank Ferdinandi | Printed Circuit Boards |
RU2467528C2 (en) * | 2007-02-22 | 2012-11-20 | Эрбюс Операсьон (Сас) | Electronic board and aircraft with said electronic board |
US8541686B2 (en) * | 2006-10-10 | 2013-09-24 | Shin-Etsu Polymer Co., Ltd. | Wiring member and method for producing the same |
US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
US9055700B2 (en) | 2008-08-18 | 2015-06-09 | Semblant Limited | Apparatus with a multi-layer coating and method of forming the same |
US10129976B2 (en) | 2015-04-21 | 2018-11-13 | Northrop Grumman Systems Corporation | High performance, ultra low loss, ultra lightweight, multi-layered rigid circuit boards |
US20230298782A1 (en) * | 2022-03-21 | 2023-09-21 | International Business Machines Corporation | Flexible electrical cable with four copper layers |
US11786930B2 (en) | 2016-12-13 | 2023-10-17 | Hzo, Inc. | Protective coating |
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US2955974A (en) * | 1957-06-10 | 1960-10-11 | Int Resistance Co | Metal to plastic laminated article and the method of making the same |
US3244795A (en) * | 1963-05-31 | 1966-04-05 | Riegel Paper Corp | Stacked, laminated printed circuit assemblies |
US3467569A (en) * | 1966-06-03 | 1969-09-16 | Dow Chemical Co | Resin foam-metal laminate composites |
US3486961A (en) * | 1966-07-27 | 1969-12-30 | Minnesota Mining & Mfg | Continuous method for making a polytetrafluoroethylene laminate |
US4423282A (en) * | 1981-06-29 | 1983-12-27 | Hirosuke Suzuki | Flat cable |
US4443657A (en) * | 1980-05-30 | 1984-04-17 | W. L. Gore & Associates, Inc. | Ribbon cable with a two-layer insulation |
US4591659A (en) * | 1983-12-22 | 1986-05-27 | Trw Inc. | Multilayer printed circuit board structure |
US4640866A (en) * | 1984-04-10 | 1987-02-03 | Junkosha Company Ltd. | Printed circuit board |
US4680220A (en) * | 1985-02-26 | 1987-07-14 | W. L. Gore & Associates, Inc. | Dielectric materials |
US4689110A (en) * | 1983-12-22 | 1987-08-25 | Trw Inc. | Method of fabricating multilayer printed circuit board structure |
-
1987
- 1987-04-28 US US07/043,464 patent/US4755911A/en not_active Expired - Lifetime
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US2955974A (en) * | 1957-06-10 | 1960-10-11 | Int Resistance Co | Metal to plastic laminated article and the method of making the same |
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Non-Patent Citations (1)
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Cited By (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5136123A (en) * | 1987-07-17 | 1992-08-04 | Junkosha Co., Ltd. | Multilayer circuit board |
EP0374272A1 (en) * | 1987-10-19 | 1990-06-27 | E.I. Du Pont De Nemours And Company | Multilayer circuit board with fluoropolymer interlayers |
US4868350A (en) * | 1988-03-07 | 1989-09-19 | International Business Machines Corporation | High performance circuit boards |
US4864722A (en) * | 1988-03-16 | 1989-09-12 | International Business Machines Corporation | Low dielectric printed circuit boards |
US4854038A (en) * | 1988-03-16 | 1989-08-08 | International Business Machines Corporation | Modularized fabrication of high performance printed circuit boards |
US5072075A (en) * | 1989-06-28 | 1991-12-10 | Digital Equipment Corporation | Double-sided hybrid high density circuit board and method of making same |
US5034801A (en) * | 1989-07-31 | 1991-07-23 | W. L. Gore & Associates, Inc. | Intergrated circuit element having a planar, solvent-free dielectric layer |
US5948533A (en) * | 1990-02-09 | 1999-09-07 | Ormet Corporation | Vertically interconnected electronic assemblies and compositions useful therefor |
US5352762A (en) * | 1990-03-30 | 1994-10-04 | Hitachi, Ltd. | Multilayer printed circuit board and production thereof |
EP0449292A3 (en) * | 1990-03-30 | 1994-01-05 | Hitachi Ltd | |
EP0449292A2 (en) * | 1990-03-30 | 1991-10-02 | Hitachi, Ltd. | Multilayer printed circuit board and production thereof |
US5065280A (en) * | 1990-08-30 | 1991-11-12 | Hewlett-Packard Company | Flex interconnect module |
EP0490211A2 (en) * | 1990-12-07 | 1992-06-17 | International Business Machines Corporation | Electronic circuit packages with tear resistant organic cores |
EP0490211A3 (en) * | 1990-12-07 | 1992-12-23 | International Business Machines Corporation | Electronic circuit packages with tear resistant organic cores |
EP0498677A2 (en) * | 1991-02-08 | 1992-08-12 | Graphico Co. Ltd. | Improvement in or relating to a printed-circuit board |
EP0498677A3 (en) * | 1991-02-08 | 1993-03-03 | Graphico Co. Ltd. | Improvement in or relating to a printed-circuit board |
US5558928A (en) * | 1991-12-31 | 1996-09-24 | Tessera, Inc. | Multi-layer circuit structures, methods of making same and components for use therein |
US5367764A (en) * | 1991-12-31 | 1994-11-29 | Tessera, Inc. | Method of making a multi-layer circuit assembly |
US5640761A (en) * | 1991-12-31 | 1997-06-24 | Tessera, Inc. | Method of making multi-layer circuit |
US5583321A (en) * | 1991-12-31 | 1996-12-10 | Tessera, Inc. | Multi-layer circuit construction methods and structures with customization features and components for use therein |
US5570504A (en) * | 1991-12-31 | 1996-11-05 | Tessera, Inc. | Multi-Layer circuit construction method and structure |
US5287619A (en) * | 1992-03-09 | 1994-02-22 | Rogers Corporation | Method of manufacture multichip module substrate |
US5440805A (en) * | 1992-03-09 | 1995-08-15 | Rogers Corporation | Method of manufacturing a multilayer circuit |
US5373109A (en) * | 1992-12-23 | 1994-12-13 | International Business Machines Corporation | Electrical cable having flat, flexible, multiple conductor sections |
US5473119A (en) * | 1993-02-05 | 1995-12-05 | W. L. Gore & Associates, Inc. | Stress-resistant circuit board |
US6287143B1 (en) | 1993-03-23 | 2001-09-11 | Berg Technology, Inc. | Multi-storage deck connector apparatus |
US5418690A (en) * | 1993-06-11 | 1995-05-23 | International Business Machines Corporation | Multiple wiring and X section printed circuit board technique |
US6297459B1 (en) * | 1994-05-23 | 2001-10-02 | General Electric Company | Processing low dielectric constant materials for high speed electronics |
EP1484949A2 (en) * | 1994-05-23 | 2004-12-08 | General Electric Company | Processing low dielectric constant materials for high speed electronics |
EP1484949A3 (en) * | 1994-05-23 | 2004-12-15 | General Electric Company | Processing low dielectric constant materials for high speed electronics |
US5469324A (en) * | 1994-10-07 | 1995-11-21 | Storage Technology Corporation | Integrated decoupling capacitive core for a printed circuit board and method of making same |
US5773195A (en) * | 1994-12-01 | 1998-06-30 | International Business Machines Corporation | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap |
US5734560A (en) * | 1994-12-01 | 1998-03-31 | International Business Machines Corporation | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap |
US6594891B1 (en) | 1994-12-01 | 2003-07-22 | International Business Machines | Process for forming multi-layer electronic structures |
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