US4879629A - Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation - Google Patents
Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation Download PDFInfo
- Publication number
- US4879629A US4879629A US07/264,749 US26474988A US4879629A US 4879629 A US4879629 A US 4879629A US 26474988 A US26474988 A US 26474988A US 4879629 A US4879629 A US 4879629A
- Authority
- US
- United States
- Prior art keywords
- chips
- compliant member
- substrate
- seamless
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4332—Bellows
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- This invention relates to multi-chip liquid cooled integrated circuit modules.
- Two U.S. Pats. which are representative of the prior art on these modules are 4,138,692 to Meeker et al and 4,561,040 to Eastman et al.
- a substrate is provided on which several integrated circuit chips are mounted, and patterned conductors in the substrate electrically interconnect the chips. Also, a liquid cooling apparatus is provided which transfers heat from the chips.
- the present inventors have analyzed this cooling apparatus and have discovered that it ha certain deficiencies.
- each of these bellows-shaped tubes carry a liquid coolant to and from each of the chips.
- Each of these bellows-shaped tubes has one end which is attached to a solid thermally conductive end plate which makes contact with a chip, and it has an opposite end that attaches to a manifold which is the source of the liquid coolant.
- each of the bellows is indicated by reference numeral 21.
- One end of each bellows 21 is joined to a stud 22B, while the opposite end of each bellows 21 is joined to a plate 16B which is part of a manifold that supplies the liquid coolant. If the seam at either end of any one of these bellows 21 has a leak, then all of the chips 10 in the entire module will be submerged in the liquid coolant.
- FIG. 1 in which the bellows-shaped tubes are indicated by reference numeral 32.
- Reference numeral 32A indicates a flange on one end of the bellows 32 which makes a seam with a cooling plate 24.
- Each bellows 32 also makes a seam at its opposite end as can be seen from FIG. 4.
- a primary object of the invention is to provide a multi-chip liquid cooling module in which all of the above problems are overcome.
- a liquid cooled integrated circuit module includes a substrate and a plurality of chips mounted on the substrate. Electrical conductors are integrated into the substrate to interconnect the chips.
- the module includes a compliant member which is completely seamless and which overlies all of the chips.
- This seamless compliant member is hermetically sealed at its perimeter to the substrate around all of the chips. Between this seamless compliant member and the chips are thermally conductive studs, and they carry heat by conduction from the chips to the compliant member.
- a rigid cover which overlies the compliant member, and it is attached to the substrate at its perimeter.
- ribs Within the cover are several parallel spaced apart ribs. These ribs project towards and press against the compliant member in the spaces between the chips, and they form channels for a liquid coolant which carries heat away from the compliant member.
- FIG. 1 is a top view of the exterior of a liquid cooled integrated circuit module which is constructed according to the invention
- FIG. 2 is a side view of the exterior of the FIG. 1 module
- FIG. 3 is an enlarged sectional view of a portion of the FIG. 1 module
- FIG. 4 is a pictorial view of a compliant member which is a key component in the FIG. 1 module;
- FIGS. 5A, 5B, and 5C illustrate the steps of a process for forming the FIG. 4 compliant member
- FIG. 6 illustrates a process for forming an alternative embodiment of the compliant member.
- FIGS. 1, 2 and 3 a preferred embodiment of a liquid cooled integrated circuit module which is constructed in accordance with the invention will be described in detail.
- This embodiment of the module is shown by an exterior top view in FIG. 1, and it is shown by an exterior side view in FIG. 2, and it is shown from the interior via an enlarged sectional view in FIG. 3.
- the module includes a substrate 10 on which a plurality of integrated circuit chips 11 are disposed in a spaced apart fashion. These chips 11 are electrically interconnected by electrical conductors 12 which are integrated into the substrate 10 and which extend from the substrate so that signals may be sent to and received from the chips.
- Those remaining components include a compliant member 20, a plurality of thermally conductive studs 21, a rigid cover 22, a pair of seal rings 23 and 24, a pair of gaskets 25 and 26, and a plurality of heat sinks 27. All of these components 20-27 are interconnected as shown in FIGS. 1 thru 3; and they operate to cool the chips 11 and to protect them from contamination.
- Compliant member 20 is completely seamless, and it has a uniform thickness and uniform composition. Also, the compliant member 20 overlies all of the chips 11, and it is held in place at its perimeter by the seal rings 2 and 24. Several screws 31 go through the seal rings 23 and 24 to hold components 10, 20, 23, 24 and 25 together. Thus, a hermetic chamber is formed between the compliant member 20 and substrate 10 which encloses the chips 11 an protects them from contamination.
- thermally conductive studs 21 Lying between the compliant member 20 and the chips 11 are the thermally conductive studs 21. These studs 21 are soldered or brazed to the compliant member 20, and they operate to transfer heat by conduction from the chips 11 to the compliant member 20. Also, the studs 21 operate to give the compliant member 20 room to expand and contract perpendicular to the surface of substrate 10. That expansion and contraction occurs in a plurality of pleated regions 20A in the flexible member, each of which surrounds a stud. This expansion and contraction compensates for height and angle variances among the chips 20 which occur due to various manufacturing tolerances.
- the flatness of substrate 10 will inherently have a certain manufacturing tolerance which, as an example, may be plus or minus 2 mils per inch.
- the precision with which the chips 11 can be mounted even on a perfectly flat substrate will have a certain manufacturing tolerance, such as plus or minus 1 mil.
- the top surfaces of the chips 11 that make contact with the studs 21 will be at different heights and different angles relative to one another; and, it is the pleated regions 20A which compensate for those variations.
- Overlying the compliant member 20 is the rigid cover 22. Its perimeter, and gasket 26 and the perimeter of seal ring 24 are held together with screws 32. Cover 22 also has several parallel spaced apart ribs 22A which project toward the substrate.
- ribs 22A push against the compliant member 20 in the spaces between the studs 21.
- the ribs 22A hold the compliant member 20 tightly against the top of the studs 21 by pushing and expanding the pleated regions 20A over the studs 21.
- the cover 22 together with compliant member 20 form several channels 33 for a liquid coolant. These channels 33 are aligned with the studs 21, and they house the heat sinks 27. Liquid enters the channels 33 through an input port 22B in cover 22; then it passes in the channels 33 past the heat sinks 27 to remove heat from them; and then it exits through an output port 22C.
- FIG. 4 shows additional details of the compliant member 20.
- the pleated regions 20A are arranged in an array of five rows, R1 thru R5, and there are five pleated regions in each row.
- a corresponding cover 22 for this compliant member has ribs 22A which lie between the rows, and those ribs form the sidewalls of the channels for the liquid coolant. Any danger of the coolant leaking into the hermetic cavity which contains the chips 11 (and thereby shorting or contaminating the chips) is eliminated since the compliant member 20 has no seams through which the coolant can leak.
- FIGS. 5A, 5B and 5C it shows a preferred process by which the compliant member 20 is fabricated.
- a mandrel 40 for the compliant member 20 is machined from a bare piece of metal, such as aluminum.
- reference number 41 indicates a rotating grinding wheel whose profile has the same shape as the pleats in member 20. This grinding wheel is positioned up and down and left and right, as it is rotating, to give the surface of the mandrel the same shape as member 20.
- the mandrel 40 After the mandrel 40 is formed, it is placed in an electrolytic or an electroless plating solution 42, as is shown in FIG. 5B. This step forms a thin layer of
- layer 43 is plated until it is 1/2-10 mils thick.
- One suitable material for layer 43 is nickel.
- the mandrel 40 and layer 43 are placed in an acid solution 44, as is shown in FIG. 5C.
- This acid solution 44 is chosen such that it etches the material of which the mandrel 40 is made but does not etch the layer 43. Consequently, all of the mandrel 40 will etch away, and the layer 43 will remain as a shaped foil. This remaining foil 43 is the FIG. 4 compliant member 20.
- the pleated regions 20A in the compliant member 20 can be arranged in various numbers of rows, and there can be various numbers of pleated regions in each row.
- member 20 will have two to twenty rows of pleated regions, and two to twenty pleated regions per row.
- each of the pleated regions 20A can be enlarged such that it covers more than one chip.
- a pleated region can be made rectangular such that it covers two chips per row, or it can be enlarged such that it covers a square shaped pattern of four chips.
- Such modification would reduce the amount of machining that is required in the step of FIG. 5A, but these modified pleated regions would be able to accommodate less variations in the height and angular orientation among the chips 11.
- each pleated region 20A could have just one pleat, and its profile could be less zigzagged than illustrated.
- the pleats in member 20 could actually be eliminated.
- compliancy in member 20 to compensate for small degrees of height and angle variations in the chip 11 would be achieved by making member 20 of a ductile metal, such as aluminum or beryllium copper, and thin enough to be stretched slightly by the ribs 22A.
- springs could be incorporated into the heat sinks which push the heat sinks down and squeeze the studs against the top of the underlying chip 11.
- a thermally conductive grease could also be added between the chips 11 and the studs 21.
- the studs 21 can be integrated into the flexible member 20.
- This embodiment of member 20 is illustrated in FIG. 6 wherein a single piece of metal 50 is machined by a rotating grinding wheel 51 such that it has thick regions 50A which are spaced apart and connected by thin regions 50B. In the completed module, each region 50A would contact a chip 11.
- This embodiment of member 20 has no pleats, and thus it is best suited for use in modules which have a low chip density.
Abstract
Description
Claims (8)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/264,749 US4879629A (en) | 1988-10-31 | 1988-10-31 | Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation |
PCT/US1989/004749 WO1990005381A1 (en) | 1988-10-31 | 1989-10-26 | Liquid cooled multi-chip integrated circuit module |
DE68918442T DE68918442T2 (en) | 1988-10-31 | 1989-10-26 | LIQUID-COOLED INTEGRATED MULTICHIP CIRCUIT MODULE. |
JP1511788A JP2733702B2 (en) | 1988-10-31 | 1989-10-26 | Liquid cooling integrated circuit module |
EP89912580A EP0409918B1 (en) | 1988-10-31 | 1989-10-26 | Liquid cooled multi-chip integrated circuit module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/264,749 US4879629A (en) | 1988-10-31 | 1988-10-31 | Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation |
Publications (1)
Publication Number | Publication Date |
---|---|
US4879629A true US4879629A (en) | 1989-11-07 |
Family
ID=23007436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/264,749 Expired - Lifetime US4879629A (en) | 1988-10-31 | 1988-10-31 | Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation |
Country Status (5)
Country | Link |
---|---|
US (1) | US4879629A (en) |
EP (1) | EP0409918B1 (en) |
JP (1) | JP2733702B2 (en) |
DE (1) | DE68918442T2 (en) |
WO (1) | WO1990005381A1 (en) |
Cited By (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5041903A (en) * | 1990-06-11 | 1991-08-20 | National Semiconductor Corp. | Vertical semiconductor interconnection method and structure |
US5057907A (en) * | 1990-06-11 | 1991-10-15 | National Semiconductor Corp. | Method and structure for forming vertical semiconductor interconnection |
EP0467711A1 (en) * | 1990-07-20 | 1992-01-22 | Minnesota Mining And Manufacturing Company | Flow-through heat transfer apparatus with movable thermal via |
US5132873A (en) * | 1988-09-30 | 1992-07-21 | Microelectronics And Computer Technology Corporation | Diaphragm sealing apparatus |
US5142443A (en) * | 1991-04-29 | 1992-08-25 | Koch Process Systems, Inc. | Cryogenic cooling of circuit boards |
US5268812A (en) * | 1991-08-26 | 1993-12-07 | Sun Microsystems, Inc. | Cooling multi-chip modules using embedded heat pipes |
US5268814A (en) * | 1992-05-20 | 1993-12-07 | International Business Machines Corporation | Module packaging |
GB2271468A (en) * | 1992-10-06 | 1994-04-13 | Hewlett Packard Co | Mechanically floating multi-chip substrate |
US5306866A (en) * | 1991-06-06 | 1994-04-26 | International Business Machines Corporation | Module for electronic package |
US5323292A (en) * | 1992-10-06 | 1994-06-21 | Hewlett-Packard Company | Integrated multi-chip module having a conformal chip/heat exchanger interface |
US5396403A (en) * | 1993-07-06 | 1995-03-07 | Hewlett-Packard Company | Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate |
US5430611A (en) * | 1993-07-06 | 1995-07-04 | Hewlett-Packard Company | Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate |
US5459352A (en) * | 1993-03-31 | 1995-10-17 | Unisys Corporation | Integrated circuit package having a liquid metal-aluminum/copper joint |
US5565716A (en) * | 1995-03-01 | 1996-10-15 | The United States Of America As Represented By The Secretary Of The Navy | Variable resistance, liquid-cooled load bank |
US6252776B1 (en) * | 1998-07-23 | 2001-06-26 | Nec Corporation | Heat radiating member for heat generating device |
US6323665B1 (en) | 1997-10-07 | 2001-11-27 | Reliability Incorporated | Apparatus capable of high power dissipation during burn-in of a device under test |
US6344686B1 (en) * | 1998-11-27 | 2002-02-05 | Alstom Holdings | Power electronic component including cooling means |
US6390475B1 (en) * | 1999-08-31 | 2002-05-21 | Intel Corporation | Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die |
US6421240B1 (en) * | 2001-04-30 | 2002-07-16 | Hewlett-Packard Company | Cooling arrangement for high performance electronic components |
US6528878B1 (en) * | 1999-08-05 | 2003-03-04 | Hitachi, Ltd. | Device for sealing and cooling multi-chip modules |
US6587345B2 (en) | 2001-11-09 | 2003-07-01 | International Business Machines Corporation | Electronic device substrate assembly with impermeable barrier and method of making |
US20040012914A1 (en) * | 2002-07-17 | 2004-01-22 | International Business Machines Corporation | Electronic device substrate assembly with multilayer impermeable barrier and method of making |
US6700396B1 (en) | 2001-05-16 | 2004-03-02 | Ltx Corporation | Integrated micromachine relay for automated test equipment applications |
US6717812B1 (en) | 2002-11-21 | 2004-04-06 | Institute Of Microelectronics | Apparatus and method for fluid-based cooling of heat-generating devices |
US6744269B1 (en) | 1997-10-07 | 2004-06-01 | Reliability Incorporated | Burn-in board with adaptable heat sink device |
US20040179339A1 (en) * | 2003-03-10 | 2004-09-16 | David Mayer | Multiple integrated circuit package module |
US20060227515A1 (en) * | 2005-03-04 | 2006-10-12 | Hitachi, Ltd. | Cooling apparatus for electronic device |
US20070256810A1 (en) * | 2006-05-02 | 2007-11-08 | Clockspeed, Inc. | Cooling apparatus for microelectronic devices |
US7385821B1 (en) * | 2001-12-06 | 2008-06-10 | Apple Inc. | Cooling method for ICS |
US20090133852A1 (en) * | 2007-11-27 | 2009-05-28 | Kenji Ogiro | Cooling apparatus for electronic equipment |
US20100259901A1 (en) * | 2003-10-03 | 2010-10-14 | Osram Sylvania Inc. | Housing for electronic ballast |
NL2005718C2 (en) * | 2010-11-18 | 2012-05-22 | Isaka Ltd | Cooling system for a data centre as well as such a data centre. |
US20120140421A1 (en) * | 2010-12-02 | 2012-06-07 | Micron Technology, Inc. | Assemblies including heat sink elements and methods of assembling |
US8217557B2 (en) | 2010-08-31 | 2012-07-10 | Micron Technology, Inc. | Solid state lights with thermosiphon liquid cooling structures and methods |
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US20130306293A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Extruded matching set radiators |
US20150055299A1 (en) * | 2013-03-08 | 2015-02-26 | International Business Machines Corporation | Fabricating multi-component electronic module with integral coolant-cooling |
US20150098190A1 (en) * | 2013-06-07 | 2015-04-09 | Hamilton Sundstrand Corporation | Heat dissipation |
US20160106003A1 (en) * | 2014-10-14 | 2016-04-14 | Intel Corporation | Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages |
US20160136851A1 (en) * | 2014-11-18 | 2016-05-19 | International Business Machines Corporation | Composite heat sink structures |
CN110662389A (en) * | 2018-06-28 | 2020-01-07 | 华为技术有限公司 | Heat dissipation device and electronic equipment |
US20210392780A1 (en) * | 2020-06-12 | 2021-12-16 | Aptiv Technologies Limited | Cooling Device and Method of Manufacturing the Same |
US11610832B2 (en) * | 2018-05-01 | 2023-03-21 | Semiconductor Components Industries, Llc | Heat transfer for power modules |
US11632855B2 (en) * | 2020-06-30 | 2023-04-18 | Andreas Stihl Ag & Co. Kg | Arrangement for conducting heat away from an electronic component |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US5003429A (en) * | 1990-07-09 | 1991-03-26 | International Business Machines Corporation | Electronic assembly with enhanced heat sinking |
DE4312057A1 (en) * | 1993-04-13 | 1993-10-14 | Siegmund Maettig | Arrangement for cooling highly integrated multi=chip modules for data processing systems with high computing power - contains cooling plate and mechanical heat transfer devices, covering and sealing elastic plate |
DE102009056290A1 (en) | 2009-11-30 | 2011-06-09 | Alphacool Gmbh | Device for cooling e.g. micro processor, arranged on printed circuit board i.e. graphic card, of computer, has connecting unit i.e. blind hole, cooperating with another connecting unit i.e. thread, for removable mounting of coolers |
DE202012001323U1 (en) | 2012-02-09 | 2012-02-29 | Wieland-Werke Ag | Heat sink with cooling plate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4138692A (en) * | 1977-09-12 | 1979-02-06 | International Business Machines Corporation | Gas encapsulated cooling module |
US4381032A (en) * | 1981-04-23 | 1983-04-26 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6092642A (en) * | 1983-10-26 | 1985-05-24 | Mitsubishi Electric Corp | Forced cooling device for semiconductor device |
JPS60160149A (en) * | 1984-01-26 | 1985-08-21 | Fujitsu Ltd | Cooling system for integrated circuit device |
US4730666A (en) * | 1986-04-30 | 1988-03-15 | International Business Machines Corporation | Flexible finned heat exchanger |
-
1988
- 1988-10-31 US US07/264,749 patent/US4879629A/en not_active Expired - Lifetime
-
1989
- 1989-10-26 WO PCT/US1989/004749 patent/WO1990005381A1/en active IP Right Grant
- 1989-10-26 EP EP89912580A patent/EP0409918B1/en not_active Expired - Lifetime
- 1989-10-26 DE DE68918442T patent/DE68918442T2/en not_active Expired - Fee Related
- 1989-10-26 JP JP1511788A patent/JP2733702B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4138692A (en) * | 1977-09-12 | 1979-02-06 | International Business Machines Corporation | Gas encapsulated cooling module |
US4381032A (en) * | 1981-04-23 | 1983-04-26 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
Cited By (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5132873A (en) * | 1988-09-30 | 1992-07-21 | Microelectronics And Computer Technology Corporation | Diaphragm sealing apparatus |
US5057907A (en) * | 1990-06-11 | 1991-10-15 | National Semiconductor Corp. | Method and structure for forming vertical semiconductor interconnection |
US5041903A (en) * | 1990-06-11 | 1991-08-20 | National Semiconductor Corp. | Vertical semiconductor interconnection method and structure |
EP0467711A1 (en) * | 1990-07-20 | 1992-01-22 | Minnesota Mining And Manufacturing Company | Flow-through heat transfer apparatus with movable thermal via |
US5142443A (en) * | 1991-04-29 | 1992-08-25 | Koch Process Systems, Inc. | Cryogenic cooling of circuit boards |
US5306866A (en) * | 1991-06-06 | 1994-04-26 | International Business Machines Corporation | Module for electronic package |
US5268812A (en) * | 1991-08-26 | 1993-12-07 | Sun Microsystems, Inc. | Cooling multi-chip modules using embedded heat pipes |
US5268814A (en) * | 1992-05-20 | 1993-12-07 | International Business Machines Corporation | Module packaging |
GB2271468B (en) * | 1992-10-06 | 1996-12-11 | Hewlett Packard Co | Mechanically floating multi-chip substrate |
GB2271468A (en) * | 1992-10-06 | 1994-04-13 | Hewlett Packard Co | Mechanically floating multi-chip substrate |
US5323292A (en) * | 1992-10-06 | 1994-06-21 | Hewlett-Packard Company | Integrated multi-chip module having a conformal chip/heat exchanger interface |
US5608610A (en) * | 1992-10-06 | 1997-03-04 | Hewlett-Packard Company | Mechanically floating multi-chip substrate |
US5658831A (en) * | 1993-03-31 | 1997-08-19 | Unisys Corporation | Method of fabricating an integrated circuit package having a liquid metal-aluminum/copper joint |
US5459352A (en) * | 1993-03-31 | 1995-10-17 | Unisys Corporation | Integrated circuit package having a liquid metal-aluminum/copper joint |
US5430611A (en) * | 1993-07-06 | 1995-07-04 | Hewlett-Packard Company | Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate |
US5396403A (en) * | 1993-07-06 | 1995-03-07 | Hewlett-Packard Company | Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate |
US5565716A (en) * | 1995-03-01 | 1996-10-15 | The United States Of America As Represented By The Secretary Of The Navy | Variable resistance, liquid-cooled load bank |
US6744269B1 (en) | 1997-10-07 | 2004-06-01 | Reliability Incorporated | Burn-in board with adaptable heat sink device |
US6323665B1 (en) | 1997-10-07 | 2001-11-27 | Reliability Incorporated | Apparatus capable of high power dissipation during burn-in of a device under test |
US6252776B1 (en) * | 1998-07-23 | 2001-06-26 | Nec Corporation | Heat radiating member for heat generating device |
US6344686B1 (en) * | 1998-11-27 | 2002-02-05 | Alstom Holdings | Power electronic component including cooling means |
US6528878B1 (en) * | 1999-08-05 | 2003-03-04 | Hitachi, Ltd. | Device for sealing and cooling multi-chip modules |
US20030103333A1 (en) * | 1999-08-05 | 2003-06-05 | Hitachi, Ltd. | Device for sealing and cooling multi-chip modules |
US6890799B2 (en) * | 1999-08-05 | 2005-05-10 | Hitachi, Ltd. | Device for sealing and cooling multi-chip modules |
US6390475B1 (en) * | 1999-08-31 | 2002-05-21 | Intel Corporation | Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die |
US6421240B1 (en) * | 2001-04-30 | 2002-07-16 | Hewlett-Packard Company | Cooling arrangement for high performance electronic components |
US6903562B1 (en) | 2001-05-16 | 2005-06-07 | Ltx Corporation | Integrated micromachine relay for automated test equipment applications |
US6700396B1 (en) | 2001-05-16 | 2004-03-02 | Ltx Corporation | Integrated micromachine relay for automated test equipment applications |
US6587345B2 (en) | 2001-11-09 | 2003-07-01 | International Business Machines Corporation | Electronic device substrate assembly with impermeable barrier and method of making |
US7385821B1 (en) * | 2001-12-06 | 2008-06-10 | Apple Inc. | Cooling method for ICS |
US20040012914A1 (en) * | 2002-07-17 | 2004-01-22 | International Business Machines Corporation | Electronic device substrate assembly with multilayer impermeable barrier and method of making |
US6940712B2 (en) | 2002-07-17 | 2005-09-06 | International Business Machines Corporation | Electronic device substrate assembly with multilayer impermeable barrier and method of making |
US6717812B1 (en) | 2002-11-21 | 2004-04-06 | Institute Of Microelectronics | Apparatus and method for fluid-based cooling of heat-generating devices |
US20060028801A1 (en) * | 2003-03-10 | 2006-02-09 | David Mayer | Multiple integrated circuit package module |
US7307845B2 (en) | 2003-03-10 | 2007-12-11 | Hewlett-Packard Development Company, L.P. | Multiple integrated circuit package module |
US6972958B2 (en) | 2003-03-10 | 2005-12-06 | Hewlett-Packard Development Company, L.P. | Multiple integrated circuit package module |
US20040179339A1 (en) * | 2003-03-10 | 2004-09-16 | David Mayer | Multiple integrated circuit package module |
US20100259901A1 (en) * | 2003-10-03 | 2010-10-14 | Osram Sylvania Inc. | Housing for electronic ballast |
US8139376B2 (en) * | 2003-10-03 | 2012-03-20 | Osram Sylvania Inc. | Housing for electronic ballast |
US20060227515A1 (en) * | 2005-03-04 | 2006-10-12 | Hitachi, Ltd. | Cooling apparatus for electronic device |
US20070256810A1 (en) * | 2006-05-02 | 2007-11-08 | Clockspeed, Inc. | Cooling apparatus for microelectronic devices |
US7849914B2 (en) | 2006-05-02 | 2010-12-14 | Clockspeed, Inc. | Cooling apparatus for microelectronic devices |
US20090133852A1 (en) * | 2007-11-27 | 2009-05-28 | Kenji Ogiro | Cooling apparatus for electronic equipment |
TWI404905B (en) * | 2009-11-11 | 2013-08-11 | Wistron Corp | Fixing jig and fixture module thereof |
US8217557B2 (en) | 2010-08-31 | 2012-07-10 | Micron Technology, Inc. | Solid state lights with thermosiphon liquid cooling structures and methods |
US9057514B2 (en) | 2010-08-31 | 2015-06-16 | Micron Technology, Inc. | Solid state lights with thermosiphon liquid cooling structures and methods |
NL2005718C2 (en) * | 2010-11-18 | 2012-05-22 | Isaka Ltd | Cooling system for a data centre as well as such a data centre. |
US9144149B2 (en) | 2010-12-02 | 2015-09-22 | Micron Technology, Inc. | Heat-dissipating assemblies and methods of assembling heat-dissipating assemblies |
US8467191B2 (en) * | 2010-12-02 | 2013-06-18 | Micron Technology, Inc. | Assemblies including heat sink elements and methods of assembling |
US20120140421A1 (en) * | 2010-12-02 | 2012-06-07 | Micron Technology, Inc. | Assemblies including heat sink elements and methods of assembling |
US20130306293A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Extruded matching set radiators |
US9661784B2 (en) | 2013-03-08 | 2017-05-23 | International Business Machines Corporation | Multi-component electronic module with integral coolant-cooling |
US20150055299A1 (en) * | 2013-03-08 | 2015-02-26 | International Business Machines Corporation | Fabricating multi-component electronic module with integral coolant-cooling |
US9265177B2 (en) * | 2013-03-08 | 2016-02-16 | International Business Machines Corporation | Fabricating multi-component electronic module with integral coolant-cooling |
US9265176B2 (en) | 2013-03-08 | 2016-02-16 | International Business Machines Corporation | Multi-component electronic module with integral coolant-cooling |
US20150098190A1 (en) * | 2013-06-07 | 2015-04-09 | Hamilton Sundstrand Corporation | Heat dissipation |
US20160106003A1 (en) * | 2014-10-14 | 2016-04-14 | Intel Corporation | Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages |
US9743558B2 (en) * | 2014-10-14 | 2017-08-22 | Intel Corporation | Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages |
US9761508B2 (en) * | 2014-11-18 | 2017-09-12 | International Business Machines Corporation | Composite heat sink structures |
US20160143189A1 (en) * | 2014-11-18 | 2016-05-19 | International Business Machines Corporation | Composite heat sink structures |
US20160136851A1 (en) * | 2014-11-18 | 2016-05-19 | International Business Machines Corporation | Composite heat sink structures |
US9865522B2 (en) * | 2014-11-18 | 2018-01-09 | International Business Machines Corporation | Composite heat sink structures |
US20180082926A1 (en) * | 2014-11-18 | 2018-03-22 | International Business Machines Corporation | Composite heat sink structures |
US10249555B2 (en) * | 2014-11-18 | 2019-04-02 | International Business Machines Corporation | Composite heat sink structures |
US10734307B2 (en) | 2014-11-18 | 2020-08-04 | International Business Machines Corporation | Composite heat sink structures |
US11610832B2 (en) * | 2018-05-01 | 2023-03-21 | Semiconductor Components Industries, Llc | Heat transfer for power modules |
CN110662389A (en) * | 2018-06-28 | 2020-01-07 | 华为技术有限公司 | Heat dissipation device and electronic equipment |
US20210392780A1 (en) * | 2020-06-12 | 2021-12-16 | Aptiv Technologies Limited | Cooling Device and Method of Manufacturing the Same |
US11778775B2 (en) * | 2020-06-12 | 2023-10-03 | Aptiv Technologies Limited | Cooling device and method of manufacturing the same |
US11632855B2 (en) * | 2020-06-30 | 2023-04-18 | Andreas Stihl Ag & Co. Kg | Arrangement for conducting heat away from an electronic component |
Also Published As
Publication number | Publication date |
---|---|
JP2733702B2 (en) | 1998-03-30 |
EP0409918B1 (en) | 1994-09-21 |
JPH03502026A (en) | 1991-05-09 |
EP0409918A1 (en) | 1991-01-30 |
WO1990005381A1 (en) | 1990-05-17 |
DE68918442D1 (en) | 1994-10-27 |
DE68918442T2 (en) | 1995-01-19 |
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