US4888135A - Electrically conductive powder and electrically conductive composition using the same - Google Patents
Electrically conductive powder and electrically conductive composition using the same Download PDFInfo
- Publication number
- US4888135A US4888135A US06/913,030 US91303086A US4888135A US 4888135 A US4888135 A US 4888135A US 91303086 A US91303086 A US 91303086A US 4888135 A US4888135 A US 4888135A
- Authority
- US
- United States
- Prior art keywords
- electrically conductive
- weight
- copper particles
- powder
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
Definitions
- the present invention relates to an electrically conductive powder and an electrically conductive composition using the same, which may be used for forming, for example, a conductor film in an electronic circuit.
- Silver conductive pastes which are widely used as electrically conductive materials for electronic circuits, have several drawbacks such as their high production costs and their tendencies of electrochemical migration in which electrode materials are ionized and move toward the counter electrode.
- the copper powder itself is not subjected to anti-oxidant treatment, the copper powder or the paste containing such non-treated copper powder becomes unstable after it is stored for a long time.
- the cured film has insufficient resistivity against heat and the wet.
- the conductor film is formed by the use of the reductive resins of the restricted kinds, it is hardly used in the multi-functional devices.
- the Method (ii) requires much amount of silver (20% by weight in the case of the JPOA No. 78/135495, 10% by volume in the case of the JPOA No. 81/8892). Therefore, the composite copper powder becomes expensive and is lacking in anti-migratory action as well.
- the electrically conductive powder of the present invention which comprises copper particles, a silver coating material coating a part or the total of the surface of copper particles and a titanate coupling agent combined to the copper particles and/or the silver coating material.
- an electrically conductive composition containing as chief ingredients an electrically conductive powder consisting of copper particles, a silver coating material coating a part or the total of the surface of the copper particles and a titanate coupling agent combined to the copper particles and/or the silver coating material, and a binder resin.
- the copper particles to be used in the present invention may be any type of the known powder particles such as dendritic powder, spherical powder and flaky powder.
- the size of the copper particle may be chosen from the sizes of the known copper particles used for an electrically conductive powder. That is, the mean particle diameter of the copper particles may be 0.5-40 ⁇ m, preferably 2-15 ⁇ m.
- the silver coating material to be used in the present invention may be any type of silver-containing material which is capable of adhering to and coating the surface of the copper particles.
- the silver-containing material to be used as the silver coating material may consist essentially of silver or a silver compound such as a silver complex salt.
- any known method for adhering a silver coating material to the surface of copper particles may be used any known method for adhering a silver coating material to the surface of copper particles.
- Illustrative examples of such methods include the conventional methods of producing composite powder, a method comprising electrolytically replacing the surface portion of copper particles with silver in a solution of complex salt of silver as described in the JPOA No. 53-135495, a method comprising coating (plating) the surface of powder particles with a precious metal as described in the JPOA No. 55-54502, and a method comprising obtaining silver-coated powder particles in a solution of complex salt of silver and heating thus obtained silver-coated powder particles in hydrogen gas and/or an inert gas.
- the amount of the silver coating material to be used may voluntarily be determined in consideration of specific surface of copper particles, thickness of silver coating material to be adhered and the proportion thereof to the size of copper particles. Since the silver coating material used in combination with the titanate coupling agent is more effective than used alone, it may be used in such a small amount as 0.1 to 8% by weight (with 0.01 to 5% by weight of the titanate coupling agent), in particular 0.1 to 5% by weight (with 0.01 to 2% by weight of the titanate coupling agent) of the electrically conductive powder of the present invention, and may bring good stability against oxidation, good electrical conductivity, good anti-migratory action and low cost to the electrically conductive powder of the present invention.
- the titanate coupling agent to be used in the present invention is a coupling agent containing as an efficacious component a complex salt of titanium which is capable of being combined with the copper particles and/or the silver coating material.
- the complex salt of titanium having hydrophilic group and oleophilic group combined to the central titanium atom, in particular those having one or more hydrophilic groups selected from monoalkoxy group, radical of oxy acetic acid, radical of ethylene glycol and phosphite group, may preferably be used as the titanate coupling agent.
- titanate coupling agent examples include titanate coupling agent containing isopropyl triisostearoyl titanate (coming into the market as the trade name of KR-TTS, manufactured by Ajinomoto Co., Inc.), bis(dioctyl pyrophosphate)oxyacetate titanate (coming into the market as trade name of KR-138S, manufactured by Ajinomoto Co., Inc.), bis(dioctyl pyrophosphate)ethylene titanate (coming into the market as trade name of KR-238S, manufactured by Ajinomoto Co., Inc.).
- the amount of the titanate coupling agent to be used may preferably be 0.01 to 5% by weight, more preferably 0.01 to 2% by weight, still more preferably 0.05 to 1% by weight of the electrically conductive powder.
- the amount of the titanate coupling agent surpasses 5% by weight, the electrical conductivity of the electrically conductive powder become unsatisactory.
- any known method for combining the titanate coupling agent to the copper particles and/or the silver coating material includes a method comprising subjecting a solution of complex salt of titanium to be in contact with a composite powder comprising the copper particles and the silver coating material coating a part or the total of the surface of the copper particles, and a method comprising simultaneously taking place the adhesion of the silver coating material and combination of complex salt of titanium by subjecting a solution containing complex salt of titanium and the silver covering agent to be in contact with the copper particles.
- the electrically conductive composition of the present invention may comprise an electrically conductive powder of the present invention and a binder resin and may be in the form of a conductive paste used for the formation of coating film consisting of electrically conductive powder and a resin matrix.
- a binder resin used for the formation of coating film consisting of electrically conductive powder and a resin matrix.
- agent used in addition to the binder resin.
- Illustrative examples of such agents include curing agent (hardener), cross-linking agent, catalyst, solvent, filler, colorant, an agent for improving processability of film-applying, an agent for improving processability of screen printing and the like.
- the binder resin to be used in the electrically conductive composition of the present invention may be selected from the thermo-setting and thermoplastic resins (including modified resins) which may be used as a vehicle resin to form a coating film.
- Preferred examples of the binder resin include phenolic resins, epoxy resins, acrylic resins, polyester resins and olefin resins.
- the ingredients other than the binder resin such as a curing agent and a solvent and energy source used for taking place curing (cross-linking) reaction may voluntarily be chosen in consideration of the type of the biner resin to be used.
- the proportion of the amounts of the electrically conductive powder and the binder resin to be used in the electrically conductive composition of the present invention may be chosen from rather broad range in accordance with the use of the electrically conductive composition. It is, however, preferred to choose the amount of 5 to 50 parts by weight, more preferably 25 to 40 parts by weight of the solid content of the binder resin to 100 parts by weight of the electrically conductive powder.
- Electrically conductive powders were prepared by using dendritic copper powder (mean particle diameter 4 ⁇ m, manufactured by Mitsui Mining & Smelting Co., Ltd.), silver covering material (electrolytically replacing the copper surface) and the titanate coupling agent (Trade name: KR-138S, manufactured by Ajinomoto Co., Inc.) in the amounts as shown in Table I.
- the film-forming compositions were prepared by mixing 52 parts by weight of each of thus obtained electrically conductive powder, 37 parts by weight of alcohol-soluble phenolic resin (Trade Name: PL-2210, manufactured by Gunei Kagaku Kabushikikaisha, Solid resin content: 60% by weight) and 11 parts by weight of butyl cellosolve, and kneading thus prepared mixture by means of a roller mill.
- alcohol-soluble phenolic resin (Trade Name: PL-2210, manufactured by Gunei Kagaku Kabushikikaisha, Solid resin content: 60% by weight) and 11 parts by weight of butyl cellosolve, and kneading thus prepared mixture by means of a roller mill.
- the electron microanalysis of the electrically conductive powder prepared in Example 4 shows uniform dispersion of Ag and Ti on the surface of the copper particles.
Abstract
An electrically conductive powder having good stability against oxidation, good storage stability, good in anti-migratory action and capable of constituting electrically conductive composition having high electrical conductivity and good resistance to heat and the wet, may be constituted by copper particles, a silver coating material coating a part or the total of the copper particles and a titanate coupling agent combined to the copper particles and/or the silver coating material.
Description
The present invention relates to an electrically conductive powder and an electrically conductive composition using the same, which may be used for forming, for example, a conductor film in an electronic circuit.
Silver conductive pastes which are widely used as electrically conductive materials for electronic circuits, have several drawbacks such as their high production costs and their tendencies of electrochemical migration in which electrode materials are ionized and move toward the counter electrode.
To remove these drawbacks, there is proposed the use of copper conductive paste instead of silver conductive paste. Since, the copper paste, however, is easily oxidized, it requires an anti-oxidant treatment such as follows.
Method (i): The addition of the reductive substance capable of reducing oxide cover film of copper powder or the use of the reductive resin [the Japanese Patent Open-laid Applications (hereinafter referred to as JPOA) Nos. 81/103260, 82/96401, 82/34060].
Method (ii) Coating of copper powder with silver (the JPOA Nos. 78/135495, 81/8892).
Since, however, in the Method (i), the copper powder itself is not subjected to anti-oxidant treatment, the copper powder or the paste containing such non-treated copper powder becomes unstable after it is stored for a long time. In the presence of a reductive substance, the cured film has insufficient resistivity against heat and the wet. When the conductor film is formed by the use of the reductive resins of the restricted kinds, it is hardly used in the multi-functional devices.
On the other hand, the Method (ii) requires much amount of silver (20% by weight in the case of the JPOA No. 78/135495, 10% by volume in the case of the JPOA No. 81/8892). Therefore, the composite copper powder becomes expensive and is lacking in anti-migratory action as well.
It is one object of the present invention to provide an electrically conductive powder which has good stability against oxidation as well as good storage stability, and is capable of maintaining high conductivity for a long time.
It is another object of the present invention to provide an electrically conductive powder which is inexpensive.
It is still another object of the present invention to provide an electrically conductive composition containing the electrically conductive powder having the above-mentioned advantages and good in resistivity against heat and the wet and free from electrochemical migration of the conductive powder contained.
The above objects of the present invention are accomplished by the electrically conductive powder of the present invention which comprises copper particles, a silver coating material coating a part or the total of the surface of copper particles and a titanate coupling agent combined to the copper particles and/or the silver coating material.
In accordance with the present invention, there is also provided an electrically conductive composition containing as chief ingredients an electrically conductive powder consisting of copper particles, a silver coating material coating a part or the total of the surface of the copper particles and a titanate coupling agent combined to the copper particles and/or the silver coating material, and a binder resin.
The copper particles to be used in the present invention may be any type of the known powder particles such as dendritic powder, spherical powder and flaky powder. The size of the copper particle may be chosen from the sizes of the known copper particles used for an electrically conductive powder. That is, the mean particle diameter of the copper particles may be 0.5-40 μm, preferably 2-15 μm.
The silver coating material to be used in the present invention may be any type of silver-containing material which is capable of adhering to and coating the surface of the copper particles. The silver-containing material to be used as the silver coating material may consist essentially of silver or a silver compound such as a silver complex salt.
It may be used any known method for adhering a silver coating material to the surface of copper particles. Illustrative examples of such methods include the conventional methods of producing composite powder, a method comprising electrolytically replacing the surface portion of copper particles with silver in a solution of complex salt of silver as described in the JPOA No. 53-135495, a method comprising coating (plating) the surface of powder particles with a precious metal as described in the JPOA No. 55-54502, and a method comprising obtaining silver-coated powder particles in a solution of complex salt of silver and heating thus obtained silver-coated powder particles in hydrogen gas and/or an inert gas.
The amount of the silver coating material to be used may voluntarily be determined in consideration of specific surface of copper particles, thickness of silver coating material to be adhered and the proportion thereof to the size of copper particles. Since the silver coating material used in combination with the titanate coupling agent is more effective than used alone, it may be used in such a small amount as 0.1 to 8% by weight (with 0.01 to 5% by weight of the titanate coupling agent), in particular 0.1 to 5% by weight (with 0.01 to 2% by weight of the titanate coupling agent) of the electrically conductive powder of the present invention, and may bring good stability against oxidation, good electrical conductivity, good anti-migratory action and low cost to the electrically conductive powder of the present invention. When the content of the silver coating material surpasses 8% by weight, anti-migratory action of the electrically conductive powder weakens. When the content of the silver coating material is less than 0.1% by weight, stability of the electrically conductive powder against oxidation is insufficient.
The titanate coupling agent to be used in the present invention is a coupling agent containing as an efficacious component a complex salt of titanium which is capable of being combined with the copper particles and/or the silver coating material. The complex salt of titanium having hydrophilic group and oleophilic group combined to the central titanium atom, in particular those having one or more hydrophilic groups selected from monoalkoxy group, radical of oxy acetic acid, radical of ethylene glycol and phosphite group, may preferably be used as the titanate coupling agent.
Preferable examples of the titanate coupling agent include titanate coupling agent containing isopropyl triisostearoyl titanate (coming into the market as the trade name of KR-TTS, manufactured by Ajinomoto Co., Inc.), bis(dioctyl pyrophosphate)oxyacetate titanate (coming into the market as trade name of KR-138S, manufactured by Ajinomoto Co., Inc.), bis(dioctyl pyrophosphate)ethylene titanate (coming into the market as trade name of KR-238S, manufactured by Ajinomoto Co., Inc.).
The amount of the titanate coupling agent to be used may preferably be 0.01 to 5% by weight, more preferably 0.01 to 2% by weight, still more preferably 0.05 to 1% by weight of the electrically conductive powder. When the amount of the titanate coupling agent surpasses 5% by weight, the electrical conductivity of the electrically conductive powder become unsatisactory.
It may be used any known method for combining the titanate coupling agent to the copper particles and/or the silver coating material. Illustrative examples of such methods include a method comprising subjecting a solution of complex salt of titanium to be in contact with a composite powder comprising the copper particles and the silver coating material coating a part or the total of the surface of the copper particles, and a method comprising simultaneously taking place the adhesion of the silver coating material and combination of complex salt of titanium by subjecting a solution containing complex salt of titanium and the silver covering agent to be in contact with the copper particles.
The electrically conductive composition of the present invention may comprise an electrically conductive powder of the present invention and a binder resin and may be in the form of a conductive paste used for the formation of coating film consisting of electrically conductive powder and a resin matrix. There may be used any usual agent used in addition to the binder resin. Illustrative examples of such agents include curing agent (hardener), cross-linking agent, catalyst, solvent, filler, colorant, an agent for improving processability of film-applying, an agent for improving processability of screen printing and the like.
The binder resin to be used in the electrically conductive composition of the present invention may be selected from the thermo-setting and thermoplastic resins (including modified resins) which may be used as a vehicle resin to form a coating film. Preferred examples of the binder resin include phenolic resins, epoxy resins, acrylic resins, polyester resins and olefin resins. The ingredients other than the binder resin such as a curing agent and a solvent and energy source used for taking place curing (cross-linking) reaction may voluntarily be chosen in consideration of the type of the biner resin to be used.
The proportion of the amounts of the electrically conductive powder and the binder resin to be used in the electrically conductive composition of the present invention may be chosen from rather broad range in accordance with the use of the electrically conductive composition. It is, however, preferred to choose the amount of 5 to 50 parts by weight, more preferably 25 to 40 parts by weight of the solid content of the binder resin to 100 parts by weight of the electrically conductive powder.
The present invention is described more in detail by the following Examples and Comparative Examples.
Electrically conductive powders were prepared by using dendritic copper powder (mean particle diameter 4 μm, manufactured by Mitsui Mining & Smelting Co., Ltd.), silver covering material (electrolytically replacing the copper surface) and the titanate coupling agent (Trade name: KR-138S, manufactured by Ajinomoto Co., Inc.) in the amounts as shown in Table I.
Then the film-forming compositions were prepared by mixing 52 parts by weight of each of thus obtained electrically conductive powder, 37 parts by weight of alcohol-soluble phenolic resin (Trade Name: PL-2210, manufactured by Gunei Kagaku Kabushikikaisha, Solid resin content: 60% by weight) and 11 parts by weight of butyl cellosolve, and kneading thus prepared mixture by means of a roller mill.
Thus obtained ten film-forming compositions were subjected to screen printing using 250 mesh stainless screen to form coating films in the form of a conductor circuit. Then the coating film were heated and cured at 150° C. for 30 minutes in the atmosphere.
The thus obtained cured films were subjected to measurements of specific resistance (primary stage, after wet treatment (aging) at 60° C., 95% RH for 1000 hours). In addition, the above-mentioned electrically conductive powders as prepared were subjected to measurements of color and specific resistance thereof after the wet treatment at 40° C., 95% RH for 96 hours, contact resistance thereof (*1), and a time before the starting of migration (*2). The results were shown in Table I.
(*1) Two cured films were formed so as to cross perpendicular to each other. Then the specific resistance (ρ) across the Ag electrodes and the specific resistance (ρCu) on the cured film were measured. The contact resistance RC was calculated based on the following equation. ##EQU1##
(*2) The time from dropping of 10 μl deionized water and charging of 15 VDC between two cured films parallel to each other (pitch: 1.2 mm) till occurrence of shortage.
TABLE I
__________________________________________________________________________
Comparative Example No.
Example No.
1 2 3 4 1 2 3 4 5 6
__________________________________________________________________________
Electrically
Ag (%) 0 0 1 20 0.5 0.5 1 1 3 3
Conductive
Titanate
0 0.5 0 0 0.1 0.5 0.1 0.5 0.1 0.5
Powder Coupling
Agent (%)
Specific
Primary
>10.sup.4
>10.sup.4
1.5 2.8 2.3 3.3 1.8 2.6 2.1 2.9
Resistance
Stage
of Cured
After >10.sup.4
>10.sup.4
2.8 3.0 3.6 3.7 2.1 2.8 2.6 3.3
Film Aging (*1)
(10.sup.-4 Ω cm)
Wet Color of
Black
Un- Black
Un- Slightly
Un- Un- Un- Un- Un-
Treatment of
Electrically
changed changed
changed
changed
changed
changed
changed
changed
Electrically
Conductive
Conductive
Powder
Powder (*2)
Specific
>10.sup.4
>10.sup.4
>10.sup.4
3.1 6.4 6.6 3.2 4.2 2.7 3.5
Resistance
of Cured
Film
(10.sup.-4 Ω cm)
Contact Resistance ρAg/ρCu
-- -- 0.9 1.0 1.1 1.3 1.0 1.3 1.0 1.2
Time before the Starting
-- -- 420 190 510 520 430 430 390 395
of Migration (sec)
__________________________________________________________________________
(*1) 60° C., 95% RH, 1000 hr.
(*2) 40° C., 95% RH, 96 hr.
In addition, the electron microanalysis of the electrically conductive powder prepared in Example 4 shows uniform dispersion of Ag and Ti on the surface of the copper particles.
Claims (2)
1. An electrically conductive composition comprising: an electrically conductive powder consisting of copper particles in an amount 87.0-99.89% by weight, a silver coating material coated on a part or the total of the surface of the copper particles in an amount 0.1-8.0% by weight, and a titanate coupling agent combined to the copper particles and silver coating in an amount 0.01-5.0% by weight; and a binder resin in an amount 5.0-50.0% by weight of the amount of the electrically conductive powder, wherein the binder is selected from the group consisting of a phenolic resin, epoxy resin, acrylic resin, polyester resin and olefin resin.
2. The electrically conductive composition as claimed in claim 1, in which said electrically conductive powder contains 93 to 99.89% by weight of said copper particles, 0.1 to 5% by weight of said silver coating material and 0.01 to by weight of said titanate coupling agent.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59186595A JPS6167702A (en) | 1984-09-07 | 1984-09-07 | Electrically conductive powder and electrically conductive composition using said powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US4888135A true US4888135A (en) | 1989-12-19 |
Family
ID=16191298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US06/913,030 Expired - Lifetime US4888135A (en) | 1984-09-07 | 1986-09-29 | Electrically conductive powder and electrically conductive composition using the same |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4888135A (en) |
| JP (1) | JPS6167702A (en) |
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5068150A (en) * | 1988-02-01 | 1991-11-26 | Mitsui Kinzoku Kogyo Kabushiki Kaisha | Copper powder for electroconductive paints and electroconductive paint compositions |
| EP0467575A2 (en) * | 1990-07-16 | 1992-01-22 | MITSUI MINING & SMELTING CO., LTD. | Electrically conductive copper composition |
| US5288769A (en) * | 1991-03-27 | 1994-02-22 | Motorola, Inc. | Thermally conducting adhesive containing aluminum nitride |
| US5327013A (en) * | 1992-04-30 | 1994-07-05 | Motorola, Inc. | Solder bumping of integrated circuit die |
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| US5378533A (en) * | 1989-07-17 | 1995-01-03 | Fujii Kinzoku Kako Co., Ltd. | Electrically conductive exothermic composition comprising non-magnetic hollow particles and heating unit made thereof |
| GB2285987A (en) * | 1994-01-10 | 1995-08-02 | Murata Manufacturing Co | Conductive paste for ceramic capacitors |
| US5736070A (en) * | 1992-10-13 | 1998-04-07 | Tatsuta Electric Wire And Cable Co., Ltd. | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield |
| US5837119A (en) * | 1995-03-31 | 1998-11-17 | International Business Machines Corporation | Methods of fabricating dendritic powder materials for high conductivity paste applications |
| US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
| US5958590A (en) * | 1995-03-31 | 1999-09-28 | International Business Machines Corporation | Dendritic powder materials for high conductivity paste applications |
| EP0965997A1 (en) * | 1998-06-19 | 1999-12-22 | Kyoto Elex Co., Ltd. | Via-filling conductive paste composition |
| US6013203A (en) * | 1998-08-19 | 2000-01-11 | Enthone-Omi, Inc. | Coatings for EMI/RFI shielding |
| DE10000834A1 (en) * | 2000-01-12 | 2001-08-16 | Fraunhofer Ges Forschung | Production of electrically conducting compounds comprises distributing a particulate filler in a polymer matrix, and forming material bridges between the filler particles and the electrically conducting surfaces to be joined |
| US6409815B1 (en) * | 1994-04-06 | 2002-06-25 | Merck Patent Gesellschaft Mit Beschraenkter Haftung | Surface-modified conductive pigment |
| US20050040370A1 (en) * | 2003-08-18 | 2005-02-24 | Gurin Michael H. | Quantum lilypads and amplifiers and methods of use |
| US20060145302A1 (en) * | 2004-12-30 | 2006-07-06 | Kim Sang J | Coating composition for electronic devices |
| US20060226398A1 (en) * | 2001-01-24 | 2006-10-12 | Shigeo Hori | Conductive powder, conductive composition, and producing method of the same |
| US20070024193A1 (en) * | 2005-07-29 | 2007-02-01 | Chul-Hong Kim | Composition, an electrode transfer film including the same, a display panel, and a method of forming an electrode |
| US20070296089A1 (en) * | 2006-03-06 | 2007-12-27 | Umicore Ag & Co. Kg | Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby |
| US20090110815A1 (en) * | 2007-10-28 | 2009-04-30 | Sagie Shanun | Method and composition for recoating toner cartridge developing member |
| EP2230561A1 (en) * | 2009-03-20 | 2010-09-22 | Wazana Brothers International, Inc., d/b/a Micro Solutions Enterprises | Method and composition for recoating toner cartridge developing member |
| US20100270516A1 (en) * | 2009-04-22 | 2010-10-28 | Industrial Technology Research Institute | Method for forming nanometer scale dot-shaped materials |
| US20130048921A1 (en) * | 2011-07-21 | 2013-02-28 | Hitachi Chemical Co., Ltd. | Conductive material |
| CN103379973A (en) * | 2011-03-31 | 2013-10-30 | 户田工业株式会社 | Silver-coated copper powder and method for producing same, silver-coated copper powder-containing conductive paste, conductive adhesive agent, conductive film, and electric circuit |
| US10388423B2 (en) | 2007-09-13 | 2019-08-20 | Henkel Ag & Co. Kgaa | Electrically conductive composition |
| WO2020149976A1 (en) * | 2019-01-18 | 2020-07-23 | Henkel IP & Holding GmbH | Stretchable electrically conductive ink compositions |
| CN115505299A (en) * | 2022-11-17 | 2022-12-23 | 长春黄金研究院有限公司 | Wear-resistant silver paint for ceramic substrate and preparation method thereof |
| US11565312B2 (en) * | 2019-01-11 | 2023-01-31 | Jx Nippon Mining & Metals Corporation | Surface-treated metal powder and conductive composition |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012164925A1 (en) * | 2011-05-31 | 2012-12-06 | 東洋インキＳｃホールディングス株式会社 | Electrically conductive sheet and process for producing same, and electronic component |
| TWI550650B (en) * | 2012-07-18 | 2016-09-21 | 東洋油墨Ｓｃ控股股份有限公司 | Conductive sheet and electonic parts |
| JP6224933B2 (en) * | 2013-07-16 | 2017-11-01 | Ｄｏｗａエレクトロニクス株式会社 | Silver-coated copper alloy powder and method for producing the same |
| JP6186197B2 (en) * | 2013-07-16 | 2017-08-23 | Ｄｏｗａエレクトロニクス株式会社 | Silver-coated copper alloy powder and method for producing the same |
| KR101874500B1 (en) * | 2014-06-16 | 2018-07-04 | 미쓰이금속광업주식회사 | Copper powder, method for producing same and conductive composition comprising same |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53135495A (en) * | 1977-04-28 | 1978-11-27 | Fujikura Kasei Kk | Method of manufacturing electroconductive composition |
| JPS5554502A (en) * | 1978-10-16 | 1980-04-21 | Nippon Mining Co Ltd | Production of noble metal plated composite powder |
| JPS568892A (en) * | 1979-07-05 | 1981-01-29 | Fujikura Ltd | Printed circuit board conductive paste and printed circuit board using same |
| US4305847A (en) * | 1979-07-26 | 1981-12-15 | Acheson Industries, Inc. | Copper coating composition for shielding electronic equipment and the like |
| JPS5734606A (en) * | 1980-08-08 | 1982-02-25 | Mitsui Toatsu Chemicals | Conductive composition |
| JPS5796401A (en) * | 1980-12-09 | 1982-06-15 | Toyama Prefecture | Conductive paint using lacquer group resin |
| US4521329A (en) * | 1983-06-20 | 1985-06-04 | E. I. Du Pont De Nemours And Company | Copper conductor compositions |
| US4559166A (en) * | 1983-11-30 | 1985-12-17 | Nissan Chemical Industries Ltd. | Electrically conductive composition |
| US4680140A (en) * | 1985-01-31 | 1987-07-14 | Mitsubishi Petrochemical Company Limited | Metal powder-containing compositions |
| US4687597A (en) * | 1986-01-29 | 1987-08-18 | E. I. Du Pont De Nemours And Company | Copper conductor compositions |
| US4705647A (en) * | 1984-07-31 | 1987-11-10 | Mitsubishi Petrochemical Co., Ltd. | Copper-type conductive coating composition |
| US4716081A (en) * | 1985-07-19 | 1987-12-29 | Ercon, Inc. | Conductive compositions and conductive powders for use therein |
-
1984
- 1984-09-07 JP JP59186595A patent/JPS6167702A/en active Granted
-
1986
- 1986-09-29 US US06/913,030 patent/US4888135A/en not_active Expired - Lifetime
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53135495A (en) * | 1977-04-28 | 1978-11-27 | Fujikura Kasei Kk | Method of manufacturing electroconductive composition |
| JPS5554502A (en) * | 1978-10-16 | 1980-04-21 | Nippon Mining Co Ltd | Production of noble metal plated composite powder |
| JPS568892A (en) * | 1979-07-05 | 1981-01-29 | Fujikura Ltd | Printed circuit board conductive paste and printed circuit board using same |
| US4305847A (en) * | 1979-07-26 | 1981-12-15 | Acheson Industries, Inc. | Copper coating composition for shielding electronic equipment and the like |
| JPS5734606A (en) * | 1980-08-08 | 1982-02-25 | Mitsui Toatsu Chemicals | Conductive composition |
| JPS5796401A (en) * | 1980-12-09 | 1982-06-15 | Toyama Prefecture | Conductive paint using lacquer group resin |
| US4521329A (en) * | 1983-06-20 | 1985-06-04 | E. I. Du Pont De Nemours And Company | Copper conductor compositions |
| US4559166A (en) * | 1983-11-30 | 1985-12-17 | Nissan Chemical Industries Ltd. | Electrically conductive composition |
| US4705647A (en) * | 1984-07-31 | 1987-11-10 | Mitsubishi Petrochemical Co., Ltd. | Copper-type conductive coating composition |
| US4680140A (en) * | 1985-01-31 | 1987-07-14 | Mitsubishi Petrochemical Company Limited | Metal powder-containing compositions |
| US4716081A (en) * | 1985-07-19 | 1987-12-29 | Ercon, Inc. | Conductive compositions and conductive powders for use therein |
| US4687597A (en) * | 1986-01-29 | 1987-08-18 | E. I. Du Pont De Nemours And Company | Copper conductor compositions |
Cited By (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5068150A (en) * | 1988-02-01 | 1991-11-26 | Mitsui Kinzoku Kogyo Kabushiki Kaisha | Copper powder for electroconductive paints and electroconductive paint compositions |
| US5378533A (en) * | 1989-07-17 | 1995-01-03 | Fujii Kinzoku Kako Co., Ltd. | Electrically conductive exothermic composition comprising non-magnetic hollow particles and heating unit made thereof |
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
| US5830389A (en) * | 1990-02-09 | 1998-11-03 | Toranaga Technologies, Inc. | Electrically conductive compositions and methods for the preparation and use thereof |
| EP0467575A2 (en) * | 1990-07-16 | 1992-01-22 | MITSUI MINING & SMELTING CO., LTD. | Electrically conductive copper composition |
| EP0467575A3 (en) * | 1990-07-16 | 1992-05-13 | Mitsui Mining & Smelting Co., Ltd. | Electrically conductive copper composition |
| US5288769A (en) * | 1991-03-27 | 1994-02-22 | Motorola, Inc. | Thermally conducting adhesive containing aluminum nitride |
| US5327013A (en) * | 1992-04-30 | 1994-07-05 | Motorola, Inc. | Solder bumping of integrated circuit die |
| US5736070A (en) * | 1992-10-13 | 1998-04-07 | Tatsuta Electric Wire And Cable Co., Ltd. | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield |
| GB2285987B (en) * | 1994-01-10 | 1997-08-06 | Murata Manufacturing Co | Conductive paste and its usage |
| US5687055A (en) * | 1994-01-10 | 1997-11-11 | Murata Manufacturing Co., Ltd. | Conductive paste and its usage |
| GB2285987A (en) * | 1994-01-10 | 1995-08-02 | Murata Manufacturing Co | Conductive paste for ceramic capacitors |
| US6409815B1 (en) * | 1994-04-06 | 2002-06-25 | Merck Patent Gesellschaft Mit Beschraenkter Haftung | Surface-modified conductive pigment |
| US5837119A (en) * | 1995-03-31 | 1998-11-17 | International Business Machines Corporation | Methods of fabricating dendritic powder materials for high conductivity paste applications |
| US5958590A (en) * | 1995-03-31 | 1999-09-28 | International Business Machines Corporation | Dendritic powder materials for high conductivity paste applications |
| US6080336A (en) * | 1998-06-19 | 2000-06-27 | Kyoto Elex Co., Ltd. | Via-filling conductive paste composition |
| EP0965997A1 (en) * | 1998-06-19 | 1999-12-22 | Kyoto Elex Co., Ltd. | Via-filling conductive paste composition |
| US6375866B1 (en) * | 1998-08-19 | 2002-04-23 | Enthone, Inc. | Method for applying a conductive paint coating and articles made thereby |
| WO2000011681A1 (en) * | 1998-08-19 | 2000-03-02 | Enthone-Omi, Inc. | Coatings for emi/rfi shielding |
| US6013203A (en) * | 1998-08-19 | 2000-01-11 | Enthone-Omi, Inc. | Coatings for EMI/RFI shielding |
| DE10000834A1 (en) * | 2000-01-12 | 2001-08-16 | Fraunhofer Ges Forschung | Production of electrically conducting compounds comprises distributing a particulate filler in a polymer matrix, and forming material bridges between the filler particles and the electrically conducting surfaces to be joined |
| US20060226398A1 (en) * | 2001-01-24 | 2006-10-12 | Shigeo Hori | Conductive powder, conductive composition, and producing method of the same |
| US7799408B2 (en) * | 2001-01-24 | 2010-09-21 | Kaken Tech Co. Ltd. | Conductive powder, conductive composition, and producing method of the same |
| US20050040370A1 (en) * | 2003-08-18 | 2005-02-24 | Gurin Michael H. | Quantum lilypads and amplifiers and methods of use |
| US7195721B2 (en) * | 2003-08-18 | 2007-03-27 | Gurin Michael H | Quantum lilypads and amplifiers and methods of use |
| US20060145302A1 (en) * | 2004-12-30 | 2006-07-06 | Kim Sang J | Coating composition for electronic devices |
| US7674403B2 (en) * | 2005-07-29 | 2010-03-09 | Samsung Sdi Co., Ltd. | Composition, an electrode transfer film including the same, a display panel, and a method of forming an electrode |
| US20070024193A1 (en) * | 2005-07-29 | 2007-02-01 | Chul-Hong Kim | Composition, an electrode transfer film including the same, a display panel, and a method of forming an electrode |
| US20070296089A1 (en) * | 2006-03-06 | 2007-12-27 | Umicore Ag & Co. Kg | Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby |
| US10388423B2 (en) | 2007-09-13 | 2019-08-20 | Henkel Ag & Co. Kgaa | Electrically conductive composition |
| US8926869B2 (en) | 2007-10-28 | 2015-01-06 | Clover Technologies Group, Llc | Method and composition for recoating toner cartridge developing member |
| US20090110815A1 (en) * | 2007-10-28 | 2009-04-30 | Sagie Shanun | Method and composition for recoating toner cartridge developing member |
| EP2230561A1 (en) * | 2009-03-20 | 2010-09-22 | Wazana Brothers International, Inc., d/b/a Micro Solutions Enterprises | Method and composition for recoating toner cartridge developing member |
| US8911821B2 (en) | 2009-04-22 | 2014-12-16 | Industrial Technology Research Institute | Method for forming nanometer scale dot-shaped materials |
| US20100270516A1 (en) * | 2009-04-22 | 2010-10-28 | Industrial Technology Research Institute | Method for forming nanometer scale dot-shaped materials |
| CN103379973A (en) * | 2011-03-31 | 2013-10-30 | 户田工业株式会社 | Silver-coated copper powder and method for producing same, silver-coated copper powder-containing conductive paste, conductive adhesive agent, conductive film, and electric circuit |
| US20130048921A1 (en) * | 2011-07-21 | 2013-02-28 | Hitachi Chemical Co., Ltd. | Conductive material |
| US11565312B2 (en) * | 2019-01-11 | 2023-01-31 | Jx Nippon Mining & Metals Corporation | Surface-treated metal powder and conductive composition |
| WO2020149976A1 (en) * | 2019-01-18 | 2020-07-23 | Henkel IP & Holding GmbH | Stretchable electrically conductive ink compositions |
| US11814530B2 (en) | 2019-01-18 | 2023-11-14 | Henkel Ag & Co, Kgaa | Stretchable electrically conductive ink compositions |
| CN115505299A (en) * | 2022-11-17 | 2022-12-23 | 长春黄金研究院有限公司 | Wear-resistant silver paint for ceramic substrate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6167702A (en) | 1986-04-07 |
| JPH0421721B2 (en) | 1992-04-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4888135A (en) | Electrically conductive powder and electrically conductive composition using the same | |
| JP2013115004A (en) | Water-based copper paste material and formation method for conductive layer | |
| WO1994022174A1 (en) | Coated metal plate for positive electrode can of dry cell and positive electrode can made thereof | |
| US9034417B2 (en) | Photonic sintering of polymer thick film conductor compositions | |
| US8557146B1 (en) | Polymer thick film solder alloy/metal conductor compositions | |
| JP4083631B2 (en) | Zinc polymer thick film composition | |
| US8551367B2 (en) | Polymer thick film solder alloy conductor composition | |
| JP3955805B2 (en) | Conductive paste composition | |
| EP0559109A1 (en) | Tantalum solid electrolytic capacitor | |
| US5049332A (en) | Method of making conductive metal-filled substrates without developing agents | |
| JP2010083952A (en) | Conductive ink composition and solar cell module formed using the same | |
| US5824436A (en) | Electrically conductive polymeric coating for an electrochemical charge storage device | |
| JPS642618B2 (en) | ||
| EP2481060B1 (en) | Polymer thick film silver electrode composition for use as a plating link | |
| US8696860B1 (en) | Lamination of polymer thick film conductor compositions | |
| JPH1166956A (en) | Conductive paste | |
| US8986579B2 (en) | Lamination of polymer thick film conductor compositions | |
| JP3596563B2 (en) | Conductive paste | |
| JP3850725B2 (en) | Conductive paste | |
| JP2638162B2 (en) | Solid electrolytic capacitors | |
| JPS60192319A (en) | Solid electrolytic condenser | |
| JPH09255900A (en) | Thermosetting type carbon-based electroconductive coating material | |
| JPH06336563A (en) | Conductive coating material | |
| JPH01246705A (en) | Conductive paste | |
| DE2502500A1 (en) | CATHODE FOR AN ELECTRIC CELL |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: MITSUI MINING & SMELTING CO., LTD., 1-1, NIHONBASH Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:TSUNAGA, MASAYUKI;YUBA, KAZUAKI;KANEKO, YOUICHI;REEL/FRAME:004618/0871 Effective date: 19860922 |
|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
| FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
| FPAY | Fee payment |
Year of fee payment: 4 |
|
| FPAY | Fee payment |
Year of fee payment: 8 |
|
| FPAY | Fee payment |
Year of fee payment: 12 |