US4943606A - Resin composition for printed circuit board - Google Patents
Resin composition for printed circuit board Download PDFInfo
- Publication number
- US4943606A US4943606A US07/236,721 US23672188A US4943606A US 4943606 A US4943606 A US 4943606A US 23672188 A US23672188 A US 23672188A US 4943606 A US4943606 A US 4943606A
- Authority
- US
- United States
- Prior art keywords
- fiber
- weight
- composition according
- resin composition
- carbonate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 32
- 229920000728 polyester Polymers 0.000 claims abstract description 50
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 25
- -1 alkaline earth metal carbonate Chemical class 0.000 claims abstract description 21
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims abstract description 16
- 239000000835 fiber Substances 0.000 claims description 38
- 239000003365 glass fiber Substances 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 29
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 28
- 239000010459 dolomite Substances 0.000 claims description 28
- 229910000514 dolomite Inorganic materials 0.000 claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 14
- 125000003118 aryl group Chemical group 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 12
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 8
- 239000001095 magnesium carbonate Substances 0.000 claims description 8
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 229910018404 Al2 O3 Inorganic materials 0.000 claims description 6
- 229910052681 coesite Inorganic materials 0.000 claims description 6
- 229910052906 cristobalite Inorganic materials 0.000 claims description 6
- 229910052682 stishovite Inorganic materials 0.000 claims description 6
- 229910052905 tridymite Inorganic materials 0.000 claims description 6
- 229910052882 wollastonite Inorganic materials 0.000 claims description 5
- 239000010456 wollastonite Substances 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000004962 Polyamide-imide Substances 0.000 claims description 2
- 239000004697 Polyetherimide Substances 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 2
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- 239000002216 antistatic agent Substances 0.000 claims description 2
- 239000010425 asbestos Substances 0.000 claims description 2
- 229910052788 barium Inorganic materials 0.000 claims description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 239000011575 calcium Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 239000012760 heat stabilizer Substances 0.000 claims description 2
- 239000000314 lubricant Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920002312 polyamide-imide Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 2
- 229910052895 riebeckite Inorganic materials 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 229910052712 strontium Inorganic materials 0.000 claims description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical group 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 38
- 238000007747 plating Methods 0.000 description 38
- 238000000034 method Methods 0.000 description 19
- 239000000758 substrate Substances 0.000 description 16
- 238000005476 soldering Methods 0.000 description 10
- 238000013329 compounding Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000011591 potassium Substances 0.000 description 6
- 229910052700 potassium Inorganic materials 0.000 description 6
- 239000011541 reaction mixture Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- GDBUZIKSJGRBJP-UHFFFAOYSA-N 4-acetoxy benzoic acid Chemical compound CC(=O)OC1=CC=C(C(O)=O)C=C1 GDBUZIKSJGRBJP-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 210000002268 wool Anatomy 0.000 description 3
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 1
- NFTLBCXRDNIJMI-UHFFFAOYSA-N 6-acetyloxynaphthalene-2-carboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(OC(=O)C)=CC=C21 NFTLBCXRDNIJMI-UHFFFAOYSA-N 0.000 description 1
- 102100021625 Ankyrin repeat and SOCS box protein 3 Human genes 0.000 description 1
- 101710183431 Ankyrin repeat and SOCS box protein 3 Proteins 0.000 description 1
- 102100021617 Ankyrin repeat and SOCS box protein 4 Human genes 0.000 description 1
- 101710183425 Ankyrin repeat and SOCS box protein 4 Proteins 0.000 description 1
- 235000010893 Bischofia javanica Nutrition 0.000 description 1
- 240000005220 Bischofia javanica Species 0.000 description 1
- 241000790917 Dioxys <bee> Species 0.000 description 1
- 102220476667 Interleukin-1 receptor-associated kinase 3_H60N_mutation Human genes 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 1
- 101100386054 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CYS3 gene Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004974 Thermotropic liquid crystal Substances 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- 235000012241 calcium silicate Nutrition 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- RUZYUOTYCVRMRZ-UHFFFAOYSA-N doxazosin Chemical compound C1OC2=CC=CC=C2OC1C(=O)N(CC1)CCN1C1=NC(N)=C(C=C(C(OC)=C2)OC)C2=N1 RUZYUOTYCVRMRZ-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229940085805 fiberall Drugs 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 101150035983 str1 gene Proteins 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0251—Non-conductive microfibers
Definitions
- the present invention relates to a resin composition for printed circuit board and particularly to a resin composition for printed circuit board comprising a liquid crystal polyester, an inorganic fibrous or acicular material and an alkaline earth metal carbonate.
- Printed circuit boards now in use are generally produced by subjecting the so-called copper-clad laminate obtained by bonding an electroconductive copper foil to an insulating substrate [e.g., a paper (base material)phenolic resin laminate, or a glass cloth (base material)epoxy resin laminate], to a series of treatments such as resist pattern formation, etching, resist pattern removal and the like to form a desired electric circuit.
- an insulating substrate e.g., a paper (base material)phenolic resin laminate, or a glass cloth (base material)epoxy resin laminate
- resist pattern formation etching
- resist pattern removal resist pattern removal and the like
- Printed circuit boards are finding their applications in all industrial fields with the technological progress in the electronics industry. Therefore, it is desired to develop a process for producing a printed circuit board which is more rationalized than the above conventional process requiring troublesome mechanical processings.
- a process comprising molding an insulating substrate already having a desired shape (e.g. holes) necessary for the fixation of circuit components, according to an injection molding method as used for resins, then plating the insulating substrate with an electroconductive material consisting of copper, and thereafter subjecting the copper-plated substrate to a series of treatments such as resist pattern formation, etching, resist pattern removal and the like to form a desired electric circuit.
- a liquid crystal polyester As a material used for obtaining an insulating substrate as mentioned above according to the injection molding method, a liquid crystal polyester is noteworthy because it has excellent heat resistance particularly in soldering step (the heat resistance in soldering step is hereinafter referred to as "soldering heat resistance") and excellent mechanical properties and further has good fluidity sufficient to obtain a thin molded article under appropriate molding conditions.
- liquid crystal polyester there can be cited, for example, (a) a polyester obtained by polycondensation of an oxybenzoyl compound (e.g., p-hydroxybenzoic acid), an aromatic dicarboxy compound (e.g., terephthalic acid) and an aromatic dioxy compound (e.g., 4,4'-dihydroxydiphenyl), disclosed in Japanese Patent Publication No. 47870/1972 relating to a process for producing a heat-resistant polyester, and (b) a polyester obtained by polycondensation of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, disclosed in Japanese Patent Application Kokai (Laid-Open) No. 77691/1979 relating to a novel polyester.
- an oxybenzoyl compound e.g., p-hydroxybenzoic acid
- aromatic dicarboxy compound e.g., terephthalic acid
- aromatic dioxy compound e.g., 4,4'-dihydroxydiphenyl
- liquid crystal polyesters have excellent heat resistance and mechanical properties and moreover good fluidity under appropriate molding conditions. However, they cause warpage when shaped into a thin molded article such as an insulating substrate, because of a large anisotropy in physical properties, and furthermore they have a very small adhesion strength between an insulating substrate and a plating layer when the insulating substrate is plated with an electroconductive material such as copper (the adhesion strength between an insulating substrate and a plating layer is hereinafter referred to as "plating adhesion strength"). Consequently, the above liquid crystal polyesters are insufficient as a material for the insulating substrate of printed circuit board.
- the above problem of warpage can be solved by a known method comprising adding to the liquid crystal polyester a long glass fiber called "chopped strands" or a potassium titanate fiber to supress the orientation of the polyester molecules and to reduce the anisotropy of its physical properties.
- chopped strands cannot solve the problem of plating adhesion strength and moreover invites a new problem of surface smoothness that the surface of a molded article produced from the chopped strands-added polyester is not smooth sufficient for the molded article to be used in a printed circuit board.
- a potassium titanate fiber is added to the above liquid crystal polyester, the warpage problem is solved as mentioned above and moreover the above problem of surface smoothness does not appear.
- the problem of plating adhesion strength remains unsolved as in the case of the addition of chopped strands.
- the object of the present invention is to provide a resin composition for printed circuit board which is free from the above-mentioned problems of warpage, plating adhesion strength and surface smoothness, while retaining the excellent heat resistance (particularly, soldering heat resistance), mechanical properties and fluidity possessed by liquid crystal polyesters.
- the present inventors continued a study on a resin material which can be subjected to injection molding to obtain an insulating substrate for printed circuit board having a desired shape (e.g. holes) for enabling the fixation of circuit components and capable of being well plated with an electroconductive material such as copper.
- a resin composition comprising a liquid crystal polyester, an inorganic fibrous or acicular material having a particular size and an alkaline earth metal carbonate provides an excellent insulating substrate. The finding has led to the completion of the present invention.
- the present invention provides a resin composition for printed circuit board comprising:
- the liquid crystal polyester used in the present invention [hereinafter referred to also as the component (A)] is not amorphous but anisotropic even in a molten state, and is orientated highly, and it is generally called a thermotropic liquid crystal polymer. It is composed of an aromatic dicarboxylic acid and an aromatic diol, or of an aromatic hydroxycarboxylic acid, or of an aromatic dicarboxylic acid, an aromatic diol and an aromatic hydroxycarboxylic acid, and becomes an anisotropic melt at 250° to 400° C. under shear.
- the above aromatic dicarboxylic acid, aromatic diol and aromatic hydroxycarboxylic acid can be replaced by the respective ester-forming derivatives.
- the repeating structural units of the above liquid crystal polyester the undermentioned units can be shown, for example. However, the repeating units are not restricted to them.
- Liquid crystal polyesters which are particularly preferable from the standpoint of heat resistance, are those having one of the following combinations (I) to (IV) of repeating units: ##STR4##
- liquid crystal polyesters having the repeating unit combinations (I), (II), (III) and (IV) are mentioned in, for example, Japanese Patent Publication No. 47870/1972, Japanese Patent Application Kokai (Laid-Open) No. 77691/1979, Japanese Patent Application Kokai (Laid-Open) No. 50594/1979 and Japanese Patent Publication No. 40976/1983, respectively.
- the inorganic fibrous or acicular material having an average diameter of 15 ⁇ m or below and an average length of 200 ⁇ m or below which is used in the present invention
- the material is hereinafter referred to also as "the component (B)"
- a glass fiber, a potassium titanate fiber, wallastonite, a ceramic fiber composed mainly of Al 2 O 3 and SiO 2 , a boron fiber, a silicon carbide fiber, an alkali metal metaphosphate fiber and an asbestos fiber all having the above average diameter and average length are particularly preferable of these are a glass fiber, a potassium titanate fiber, wollastonite and a ceramic fiber composed mainly of Al 2 O 3 and SiO 2 . They can be used alone or as an admixture of two or more.
- glass fiber there can be cited, for example, EFDE-50-31 and EFDE-75-31 which are products of Central Glass Co., as well as REV-8 which is a product of Japan Glass Fiber Co.
- the potassium titanate fiber has a basic chemical composition of K 2 O.6TiO 2 or K 2 O.6TiO 2 .1/2H 2 O, and is an acicular crystal, and it is a kind of high strength single-crystal fibers (whiskers). It has a typical melting point of 1,300-1,350° C., an ordinary fiber diameter of 0.1-1.0 ⁇ m and a fiber length of 10-120 ⁇ m.
- TISMO.sup.® D and TISMO.sup.® D101 which are products of Ohtsuka Kagaku Yakuhin K. K.
- HT 200 and HT 300 which are products of Titanium Industry Co.
- the potassium titanate fiber used in the present invention contains free potassium in an amount of 0.25% by weight or less.
- the amount of free potassium is more than 0.25% by weight and if such a potassium titanate fiber is added to the liquid crystal polyester in a large proportion, the resulting resin composition has reduced heat stability when melted and causes problems of gas generation, etc., whereby the molded article produced therefrom tends to give a rough surface.
- Wollastonite is a calcium metasilicate produced naturally. It is a white acicular mineral having a chemical composition represented by CaSiO 3 and has a specific gravity of 2.9 and a melting point of 1,540° C.
- NYAD® 400 and NYAD.sup.® 325 which are marketed by NAGASE & CO., LTD.
- KEMOLIT.sup.® ASB-3 and KEMOLIT.sup.® ASB-4 which are marketed by Maruwa Biochemical Co.
- TW-HAR-10 which is marketed by K. K. Tatsumori.
- the ceramic fiber composed mainly of Al 2 O 3 and SiO 2 can generally be obtained by electrically melting a roughly 50-50 mixture of high purity silica and alumina to produce a melt and then blowing off a fine stream of the melt with a high pressure air to form a ceramic fiber.
- Its average fiber diameter is as small as 1.8-3.0 ⁇ m and its highest working temperature is as high as 1,260° C., as compared with the glass fiber.
- IBI WOOL.sup.® CP-U 11 and IBI WOOL.sup.® CP-U 3 which are products of IBIDEN CO., LTD.
- inorganic fibrous or acicular materials are used without being subjected to any treatment.
- they may be subjected, before being mixed with the polyester, to a surface treatment with a coupling agent such as an aminosilane, an epoxysilane or the like to such an extent as the objects and effects of the present invention are not impaired.
- the alkaline earth metal of the alkaline earth metal carbonate used in the present invention [the carbonate is hereinafter referred to also as “the component (C)"]
- the component (C) there can be cited, for example, magnesium, calcium, strontium and barium.
- Preferable alkaline earth metal carbonates are calcium carbonate, magnesium carbonate, and an eutectoid of calcium carbonate and magnesium carbonate, i.e., dolomite. They can be used alone or as an admixture of two or more.
- the total amount is within the range of 10 to 70% by weight, if the amount of the component (B) is less than 3% by weight based on the total resin composition, the resulting composition has too large anisotropy in physical properties and accordingly the thin molded article produced therefrom causes warpage; and on the contrary if the amount of the component (B) is more than 50% by weight based on the total resin composition, the molded article produced from the resulting resin composition and the plating layer formed on the article have poor appearances.
- the resulting resin composition has insufficient plating adhesion strength; and on the contrary if the amount of the component (C) is more than 30% by weight, the resulting resin composition possesses remarkably reduced mechanical properties (particularly strength) and heat stability during molding.
- the more preferable compounding proportions of the components (B) and (C) based on the total resin composition are 10-40% by weight and 5-20% by weight, respectively.
- the means for compounding the components (A), (B) and (C) to obtain a resin composition of the present invention has no restriction.
- the compounding can be conducted by feeding each component separately into a melt mixer.
- the components may be premixed in a mortar, a Henschel mixer, a ball mill, a ribbon blender or the like and then fed into a melt mixer.
- the resin composition of the present invention can comprise at least one of the conventional additives such as an antioxidant, a heat stabilizer, an ultraviolet absorber, a lubricant, a releasing agent, a coloring agent (e.g., dye and pigment), a flame retardant, a flameretarding aid, an antistatic agent and the like to such an extent as the object of the present invention is not impaired.
- the conventional additives such as an antioxidant, a heat stabilizer, an ultraviolet absorber, a lubricant, a releasing agent, a coloring agent (e.g., dye and pigment), a flame retardant, a flameretarding aid, an antistatic agent and the like to such an extent as the object of the present invention is not impaired.
- the present composition can further comprise at least one of thermoplastic resins (e.g., polyamide, polyester, polyphenylene sulfide, polyetherketone, polycarbonate, modified polyphenylene oxide, polysulfone, polyetherimide, and polyamideimide) and thermosetting resins (e.g., phenolic resin, epoxy resin, and polyimide resin) in small amounts.
- thermoplastic resins e.g., polyamide, polyester, polyphenylene sulfide, polyetherketone, polycarbonate, modified polyphenylene oxide, polysulfone, polyetherimide, and polyamideimide
- thermosetting resins e.g., phenolic resin, epoxy resin, and polyimide resin
- the molded article produced from the present resin composition can generally be plated according to a method similar to that suitable for compositions comprising a polyalkylene terephthalate.
- the pre-etching is preferably conducted in an aqueous alkali solution. The plating procedures of the molded article are explained below.
- a molded article to be plated is annealed at 150 -200° C. for 3-5 hours in a circulating hot air dryer, because in some cases the molded article has caused molding strain (residual stress) depending upon the shape.
- the annealed molded article is subjected to solvent or alkali washing to remove the dusts, organic substances, stains, fingerprints, etc. adhering thereto.
- the degreased molded article is immersed in an about 5 N aqueous sodium hydroxide solution at 60-80° C. for 15-30 minutes to selectively dissolve the skin layer and to expose the inorganic fibrous or acicular material and the alkaline earth metal carbonate contained in the molded article.
- the pre-etched molded article is immersed in a mixture consisting of 400 g/l of chromic anhydride and 200 ml/l of concentrated sulfuric acid at 40-80° C. for 5-30 minutes to dissolve the exposed alkaline earth metal carbonate and to form unevenness on the surface.
- the alkali residue on the surface of the etched molded article is treated with hydrochloric acid in order to later effect good catalyst adhesion and smooth electroless plating.
- the resulting molded article is immersed in a mixed solution of hydrochloric acid and stannous chloride at 20-35° C. for 2-5 minutes to bond a catalyst layer to the etched surface.
- the catalyzed molded article is immersed in a mixed solution of palladium chloride and hydrochloric acid at 30-50° C. for 2-5 minutes to remove the tin component of the catalyst adsorbed on the surface and to activate the surface with palladium.
- the catalyzed and accelerated molded article is immersed in a solution composed mainly of nickel sulfate or copper sulfate at 30-50° C. for 10-15 minutes to form a nickel or copper film of 0.3-0.5 ⁇ m in thickness.
- the electroless-plated molded article obtained above, as a negative electrode, and a phosphorus-containing copper as a positive electrode are placed in a copper sulfate solution, and an electric current is passed between the two electrodes at a current density of 3 A/dm 2 for 40-80 minutes to form a plating film of 30-50 ⁇ m in thickness on the surface of the molded article.
- the formation of an electric circuit on the insulating substrate produced from the composition can be effected by various methods which have been proposed heretofore.
- the formation of an electric circuit by, for example, the semi-additive method can be achieved according to the following steps.
- a resin composition of the present invention is molded into a desired shape by injection molding; the entire surface of the molded article on which an electric circuit is to be formed, is copper-plated in a thickness of about 0.3-0.5 ⁇ m according to an electroless copper plating method; a negative image of a desired circuit pattern is printed on the copper-plated surface with a resist ink; the entire surface (excluding the resist ink-printed portions) is copper-plated in a thickness of about 50 ⁇ m according to an electroplating method; the resist ink is removed with a resist ink-peeling solution; lastly, the portions of the electroless-plated copper film beneath the resist ink-printed portions are removed with an etching solution to form a desired circuit.
- Flow temperature is a temperature at which a molten resin obtained by heating at a temperature elevation rate of 4° C./min shows a melt viscosity of 48,000 poises when the molten resin is extruded from a nozzle of 1 mm in the inside diameter and 10 mm in the length under a load of 100 kg/cm 2
- a resin of lower flow temperature has higher fluidity.
- the optical anisotropy of a resin in a molten state was measured by heating the powdery resin on a heating stage under a polarized light at a rate of 25 ° C./min and observing the molten resin by visual inspection.
- a molded article was measured for dimensions in a flow direction (MD) and a direction orthogonal to the flow direction (TD), and these dimensions were expressed as ratios to the respective mold dimensions.
- test piece for measurement of soldering heat resistance by cutting the molded article form measurement of anisotropy in degree of shrinkage in a width of 10 mm in the length direction, and the test piece was immersed in a solder bath H60A consisting of 60% of tin and 40% of lead, of 260° C., and then the solder bath temperature was elevated at intervals of 10° C. by keeping each temperature stage for 20 seconds. The highest temperature at which the test piece gave no foaming or no distortion under the above temperature elevation condition was recorded as the soldering heat resistance of the test piece. For instance, when a test piece gave foaming or distortion for the first time at 310° C., the soldering heat resistance of the test piece is 300° C.
- the yield of the reaction mixture was 10.1 kg, which was 96.2% of the theoretical yield.
- the reaction mixture was pulverized in the same manner as in Referential Example 1 and treated under a nitrogen gas atmosphere in a rotary kiln at 260° C. for 5 hours to obtain a fully aromatic polyester of particulate form having a flow temperature of 260° C. (the polyester is hereinafter referred to as "the liquid crystal polyester C").
- This polymer showed an optical anisotropy at 340° C. or above.
- Three-component mixing was effected according to a compounding recipe as shown in Table 1, using as the component (A) the liquid crystal polyester A; as the component (B), one member selected from the group consisting of a glass fiber having an average diameter of 6 ⁇ m and an average length of 50 ⁇ m (EFDE-50-31 produced by Central Glass Co.), a potassium titanate fiber having a diameter of 0.3-1.0 ⁇ m and a length of 20-120 ⁇ m (HT-200 produced by Titanium Industry Co.), wallastonite having a diameter of 10 ⁇ m or below and a length of 50 ⁇ m or below (NYAD.sup.® 400 marketed by NAGASE & CO., LTD.) and a ceramic fiber composed mainly of Al 2 O 3 and SiO 2 and having an average diameter of 1.8 ⁇ m and an average length of 100 ⁇ m (IBI WOOL.sup.® CP-U 3 produced by IBIDEN CO., LTD.); and as the component (C), one member selected from the group consisting
- the pellets were molded using an injection molding machine (NETSTAL.sup.® 47/28 manufactured by SUMITOMO HEAVY INDUSTRILES, LTD.; cylinder temperature: 330-350° C.; die temperature: 130° C.) to obtain a test piece for anisotropy in degree of molding shrinkage (64 mm in length, 64 mm in width and 1 mm in thickness, film gate), a test piece for tensile strength, a test piece for elastic modulus in bending and a test piece for heat distortion temperature.
- NETSTAL.sup.® 47/28 manufactured by SUMITOMO HEAVY INDUSTRILES, LTD.
- cylinder temperature 330-350° C.
- die temperature 130° C.
- test piece for plating properties (a disc of 100 mm in diameter and 1.6 mm in thickness), and this test piece was subjected to a plating treatment according to the abovementioned steps, and then the plated test piece was measured for the appearance of plating layer by visual inspection, as well as for the adhesion strength of plating layer.
- circuits having a line width of 0.2 mm were formed using the respective plated test pieces, according to the above-mentioned method. Good circuits were obtained in all of the cases.
- compositions comprising a glass fiber, a potassium titanate fiber, wallastonite or a ceramic fiber in an amount of less than 3% by weight (Comparative Examples 1, 5, 6 and 7) gave a very large anisotropy in degree of shrinkage and some of them caused warpage.
- a composition comprising a glass fiber in an amount of more than 50% by weight (Comparative Example 2)
- the appearances of the molded article and the plating layer were very poor.
- a composition comprising an alkaline earth metal carbonate in an amount of less than 3% by weight (Comparative Example 3) showed an insufficient plating adhesion strength.
- a composition comprising an alkaline earth metal carbonate in an amount of more than 30% by weight (Comparative Example 4) showed poor heat stability during processing, gave silver streaks on the surface of the molded article and had poor mechanical properties.
- Example 1 to 10 The procedures of Examples 1 to 10 were repeated except that the liquid crystal polyester (C) was used as the component (A) and the cylinder temperature was set at 290° C.
- the results are shown in Table 3.
- the results of Examples 16 to 22 were similar to those of Examples 1 to 10, and the results of Comparative Examples 8 to 11 were similar to those of Comparative Examples 1 to 7.
- circuits having a line width of 0.2 mm were formed using the plated test pieces, according to the above-mentioned method. Good circuits were obtained.
- the liquid crystal polyester A, B or C was mixed with a glass fiber having an average diameter of 13 ⁇ m and an average length of 3 mm (CSO3MAPXI produced by Asahi Fiber Glass Co.) and dolomite according to the compounding recipe shown in Table 4.
- a glass fiber having an average diameter of 13 ⁇ m and an average length of 3 mm CSO3MAPXI produced by Asahi Fiber Glass Co.
- dolomite according to the compounding recipe shown in Table 4.
- Table 4 There were prepared various test pieces from each resulting composition in the same manner as in Examples 1 to 10, and they were measured for various test items.
- the anisotropy in degree of shrinkage was low and no warpage was seen, and furthermore the mechanical properties and heat resistance were excellent.
- the plating layer had a very poor appearance, and when made into a printed circuit board, the circuit had merely a line width of about 1 mm.
Abstract
A resin composition for printed circuit board comprising:
(A) 30-90% by weight of a liquid crystal polyester,
(B) 3-50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 μm or below and an average length of 200 μm or below, and
(C) 3-30% by weight of an alkaline earth metal carbonate.
Description
The present invention relates to a resin composition for printed circuit board and particularly to a resin composition for printed circuit board comprising a liquid crystal polyester, an inorganic fibrous or acicular material and an alkaline earth metal carbonate.
Printed circuit boards now in use are generally produced by subjecting the so-called copper-clad laminate obtained by bonding an electroconductive copper foil to an insulating substrate [e.g., a paper (base material)phenolic resin laminate, or a glass cloth (base material)epoxy resin laminate], to a series of treatments such as resist pattern formation, etching, resist pattern removal and the like to form a desired electric circuit. This conventional process, however, requires troublesome mechanical processings such as drilling, beveling, blanking and external shape formation in order to enable the fixation of circuit components.
Printed circuit boards are finding their applications in all industrial fields with the technological progress in the electronics industry. Therefore, it is desired to develop a process for producing a printed circuit board which is more rationalized than the above conventional process requiring troublesome mechanical processings. As one of such production processes, there is desired a process comprising molding an insulating substrate already having a desired shape (e.g. holes) necessary for the fixation of circuit components, according to an injection molding method as used for resins, then plating the insulating substrate with an electroconductive material consisting of copper, and thereafter subjecting the copper-plated substrate to a series of treatments such as resist pattern formation, etching, resist pattern removal and the like to form a desired electric circuit.
As a material used for obtaining an insulating substrate as mentioned above according to the injection molding method, a liquid crystal polyester is noteworthy because it has excellent heat resistance particularly in soldering step (the heat resistance in soldering step is hereinafter referred to as "soldering heat resistance") and excellent mechanical properties and further has good fluidity sufficient to obtain a thin molded article under appropriate molding conditions.
As such a liquid crystal polyester, there can be cited, for example, (a) a polyester obtained by polycondensation of an oxybenzoyl compound (e.g., p-hydroxybenzoic acid), an aromatic dicarboxy compound (e.g., terephthalic acid) and an aromatic dioxy compound (e.g., 4,4'-dihydroxydiphenyl), disclosed in Japanese Patent Publication No. 47870/1972 relating to a process for producing a heat-resistant polyester, and (b) a polyester obtained by polycondensation of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, disclosed in Japanese Patent Application Kokai (Laid-Open) No. 77691/1979 relating to a novel polyester.
These liquid crystal polyesters have excellent heat resistance and mechanical properties and moreover good fluidity under appropriate molding conditions. However, they cause warpage when shaped into a thin molded article such as an insulating substrate, because of a large anisotropy in physical properties, and furthermore they have a very small adhesion strength between an insulating substrate and a plating layer when the insulating substrate is plated with an electroconductive material such as copper (the adhesion strength between an insulating substrate and a plating layer is hereinafter referred to as "plating adhesion strength"). Consequently, the above liquid crystal polyesters are insufficient as a material for the insulating substrate of printed circuit board.
The above problem of warpage can be solved by a known method comprising adding to the liquid crystal polyester a long glass fiber called "chopped strands" or a potassium titanate fiber to supress the orientation of the polyester molecules and to reduce the anisotropy of its physical properties. The addition of chopped strands, however, cannot solve the problem of plating adhesion strength and moreover invites a new problem of surface smoothness that the surface of a molded article produced from the chopped strands-added polyester is not smooth sufficient for the molded article to be used in a printed circuit board. When a potassium titanate fiber is added to the above liquid crystal polyester, the warpage problem is solved as mentioned above and moreover the above problem of surface smoothness does not appear. However, the problem of plating adhesion strength remains unsolved as in the case of the addition of chopped strands.
The object of the present invention is to provide a resin composition for printed circuit board which is free from the above-mentioned problems of warpage, plating adhesion strength and surface smoothness, while retaining the excellent heat resistance (particularly, soldering heat resistance), mechanical properties and fluidity possessed by liquid crystal polyesters.
The present inventors continued a study on a resin material which can be subjected to injection molding to obtain an insulating substrate for printed circuit board having a desired shape (e.g. holes) for enabling the fixation of circuit components and capable of being well plated with an electroconductive material such as copper. As a result, it was found that a resin composition comprising a liquid crystal polyester, an inorganic fibrous or acicular material having a particular size and an alkaline earth metal carbonate provides an excellent insulating substrate. The finding has led to the completion of the present invention.
The present invention provides a resin composition for printed circuit board comprising:
(A) 30-90% by weight of a liquid crystal polyester,
(B) 3-50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 μm or below and an average length of 200 μm or below, and
(C) 3-30% by weight of an alkaline earth metal carbonate.
The liquid crystal polyester used in the present invention [hereinafter referred to also as the component (A)] is not amorphous but anisotropic even in a molten state, and is orientated highly, and it is generally called a thermotropic liquid crystal polymer. It is composed of an aromatic dicarboxylic acid and an aromatic diol, or of an aromatic hydroxycarboxylic acid, or of an aromatic dicarboxylic acid, an aromatic diol and an aromatic hydroxycarboxylic acid, and becomes an anisotropic melt at 250° to 400° C. under shear. The above aromatic dicarboxylic acid, aromatic diol and aromatic hydroxycarboxylic acid can be replaced by the respective ester-forming derivatives. As the repeating structural units of the above liquid crystal polyester, the undermentioned units can be shown, for example. However, the repeating units are not restricted to them.
Liquid crystal polyesters which are particularly preferable from the standpoint of heat resistance, are those having one of the following combinations (I) to (IV) of repeating units: ##STR4##
The liquid crystal polyesters having the repeating unit combinations (I), (II), (III) and (IV) are mentioned in, for example, Japanese Patent Publication No. 47870/1972, Japanese Patent Application Kokai (Laid-Open) No. 77691/1979, Japanese Patent Application Kokai (Laid-Open) No. 50594/1979 and Japanese Patent Publication No. 40976/1983, respectively.
As the inorganic fibrous or acicular material having an average diameter of 15 μm or below and an average length of 200 μm or below, which is used in the present invention [the material is hereinafter referred to also as "the component (B)"], there can be cited, for example, a glass fiber, a potassium titanate fiber, wallastonite, a ceramic fiber composed mainly of Al2 O3 and SiO2, a boron fiber, a silicon carbide fiber, an alkali metal metaphosphate fiber and an asbestos fiber all having the above average diameter and average length. Particularly preferable of these are a glass fiber, a potassium titanate fiber, wollastonite and a ceramic fiber composed mainly of Al2 O3 and SiO2. They can be used alone or as an admixture of two or more.
As the glass fiber, there can be cited, for example, EFDE-50-31 and EFDE-75-31 which are products of Central Glass Co., as well as REV-8 which is a product of Japan Glass Fiber Co.
The potassium titanate fiber has a basic chemical composition of K2 O.6TiO2 or K2 O.6TiO2.1/2H2 O, and is an acicular crystal, and it is a kind of high strength single-crystal fibers (whiskers). It has a typical melting point of 1,300-1,350° C., an ordinary fiber diameter of 0.1-1.0 μm and a fiber length of 10-120 μm. As its commercial products, there can be cited, for example, TISMO.sup.® D and TISMO.sup.® D101 which are products of Ohtsuka Kagaku Yakuhin K. K., as well as HT 200 and HT 300 which are products of Titanium Industry Co. It is preferable that the potassium titanate fiber used in the present invention contains free potassium in an amount of 0.25% by weight or less. When the amount of free potassium is more than 0.25% by weight and if such a potassium titanate fiber is added to the liquid crystal polyester in a large proportion, the resulting resin composition has reduced heat stability when melted and causes problems of gas generation, etc., whereby the molded article produced therefrom tends to give a rough surface.
Wollastonite is a calcium metasilicate produced naturally. It is a white acicular mineral having a chemical composition represented by CaSiO3 and has a specific gravity of 2.9 and a melting point of 1,540° C. As its commercial products, there can be cited, NYAD® 400 and NYAD.sup.® 325 which are marketed by NAGASE & CO., LTD., KEMOLIT.sup.® ASB-3 and KEMOLIT.sup.® ASB-4 which are marketed by Maruwa Biochemical Co., and TW-HAR-10 which is marketed by K. K. Tatsumori.
The ceramic fiber composed mainly of Al2 O3 and SiO2 can generally be obtained by electrically melting a roughly 50-50 mixture of high purity silica and alumina to produce a melt and then blowing off a fine stream of the melt with a high pressure air to form a ceramic fiber. Its average fiber diameter is as small as 1.8-3.0 μm and its highest working temperature is as high as 1,260° C., as compared with the glass fiber. As its commercial products, there are, for example, IBI WOOL.sup.® CP-U11 and IBI WOOL.sup.® CP-U3 which are products of IBIDEN CO., LTD.
These inorganic fibrous or acicular materials are used without being subjected to any treatment. However, in order to have higher affinity with the liquid crystal polyester, they may be subjected, before being mixed with the polyester, to a surface treatment with a coupling agent such as an aminosilane, an epoxysilane or the like to such an extent as the objects and effects of the present invention are not impaired.
As the alkaline earth metal of the alkaline earth metal carbonate used in the present invention [the carbonate is hereinafter referred to also as "the component (C)"], there can be cited, for example, magnesium, calcium, strontium and barium. Preferable alkaline earth metal carbonates are calcium carbonate, magnesium carbonate, and an eutectoid of calcium carbonate and magnesium carbonate, i.e., dolomite. They can be used alone or as an admixture of two or more.
Next, there are explained the compounding proportions of the components (A), (B) and (C). It is effective that the total amount of the components (B) and (C) is 10-70% by weight based on the total resin composition. When the total amount exceeds 70% by weight (that is, the amount of the liquid crystal polyester is less than 30% by weight), the resulting resin composition has insufficient melt fluidity and, even if a molded article can be produced thereform, the molded article is very brittle. When the total amount is less than 10% by weight, the resulting resin composition has insufficient plating adhesion strength. Even when the total amount is within the range of 10 to 70% by weight, if the amount of the component (B) is less than 3% by weight based on the total resin composition, the resulting composition has too large anisotropy in physical properties and accordingly the thin molded article produced therefrom causes warpage; and on the contrary if the amount of the component (B) is more than 50% by weight based on the total resin composition, the molded article produced from the resulting resin composition and the plating layer formed on the article have poor appearances. Further, even when the total amount is within the range of 10 to 70% by weight, if the amount of the component (C) is less than 3% by weight based on the total resin composition, the resulting resin composition has insufficient plating adhesion strength; and on the contrary if the amount of the component (C) is more than 30% by weight, the resulting resin composition possesses remarkably reduced mechanical properties (particularly strength) and heat stability during molding. The more preferable compounding proportions of the components (B) and (C) based on the total resin composition are 10-40% by weight and 5-20% by weight, respectively.
The means for compounding the components (A), (B) and (C) to obtain a resin composition of the present invention has no restriction. The compounding can be conducted by feeding each component separately into a melt mixer. Alternatively, the components may be premixed in a mortar, a Henschel mixer, a ball mill, a ribbon blender or the like and then fed into a melt mixer.
The resin composition of the present invention can comprise at least one of the conventional additives such as an antioxidant, a heat stabilizer, an ultraviolet absorber, a lubricant, a releasing agent, a coloring agent (e.g., dye and pigment), a flame retardant, a flameretarding aid, an antistatic agent and the like to such an extent as the object of the present invention is not impaired. The present composition can further comprise at least one of thermoplastic resins (e.g., polyamide, polyester, polyphenylene sulfide, polyetherketone, polycarbonate, modified polyphenylene oxide, polysulfone, polyetherimide, and polyamideimide) and thermosetting resins (e.g., phenolic resin, epoxy resin, and polyimide resin) in small amounts.
The molded article produced from the present resin composition can generally be plated according to a method similar to that suitable for compositions comprising a polyalkylene terephthalate. Regarding the etching step of the molded article, in particular, the pre-etching is preferably conducted in an aqueous alkali solution. The plating procedures of the molded article are explained below.
(1) Preparation of base material
A molded article to be plated is annealed at 150 -200° C. for 3-5 hours in a circulating hot air dryer, because in some cases the molded article has caused molding strain (residual stress) depending upon the shape.
(2) Degreasing
The annealed molded article is subjected to solvent or alkali washing to remove the dusts, organic substances, stains, fingerprints, etc. adhering thereto.
(3) Water washing
(4) Pre-etching
The degreased molded article is immersed in an about 5 N aqueous sodium hydroxide solution at 60-80° C. for 15-30 minutes to selectively dissolve the skin layer and to expose the inorganic fibrous or acicular material and the alkaline earth metal carbonate contained in the molded article.
(5) Etching
The pre-etched molded article is immersed in a mixture consisting of 400 g/l of chromic anhydride and 200 ml/l of concentrated sulfuric acid at 40-80° C. for 5-30 minutes to dissolve the exposed alkaline earth metal carbonate and to form unevenness on the surface.
(6) Water washing
(7) Neutralization
The alkali residue on the surface of the etched molded article is treated with hydrochloric acid in order to later effect good catalyst adhesion and smooth electroless plating.
(8) Water washing
(9) Catalyzing
The resulting molded article is immersed in a mixed solution of hydrochloric acid and stannous chloride at 20-35° C. for 2-5 minutes to bond a catalyst layer to the etched surface.
(10) Water washing
(11) Accelerating
The catalyzed molded article is immersed in a mixed solution of palladium chloride and hydrochloric acid at 30-50° C. for 2-5 minutes to remove the tin component of the catalyst adsorbed on the surface and to activate the surface with palladium.
(12) Water washing
(13) Electroless plating
The catalyzed and accelerated molded article is immersed in a solution composed mainly of nickel sulfate or copper sulfate at 30-50° C. for 10-15 minutes to form a nickel or copper film of 0.3-0.5 μm in thickness.
The electroless-plated molded article obtained above, as a negative electrode, and a phosphorus-containing copper as a positive electrode are placed in a copper sulfate solution, and an electric current is passed between the two electrodes at a current density of 3 A/dm2 for 40-80 minutes to form a plating film of 30-50 μm in thickness on the surface of the molded article.
In applying the resin composition of the present invention to a printed circuit board, the formation of an electric circuit on the insulating substrate produced from the composition can be effected by various methods which have been proposed heretofore. The formation of an electric circuit by, for example, the semi-additive method can be achieved according to the following steps. That is, a resin composition of the present invention is molded into a desired shape by injection molding; the entire surface of the molded article on which an electric circuit is to be formed, is copper-plated in a thickness of about 0.3-0.5 μm according to an electroless copper plating method; a negative image of a desired circuit pattern is printed on the copper-plated surface with a resist ink; the entire surface (excluding the resist ink-printed portions) is copper-plated in a thickness of about 50 μm according to an electroplating method; the resist ink is removed with a resist ink-peeling solution; lastly, the portions of the electroless-plated copper film beneath the resist ink-printed portions are removed with an etching solution to form a desired circuit.
According to the present invention, by compounding (A) a liquid crystal polyester, (B) an inorganic fibrous or acicular material having a size as specified in the claims and (C) an alkaline earth metal carbonate in specified proportions, there can be obtained a resin composition for printed circuit board which is free from the problems associated with warpage, plating adhesion strength and surface smoothness while retaining the excellent heat resistance (particularly, soldering heat resistance), mechanical properties and fluidity possessed by liquid crystal polyesters.
As shown in Comparative Examples which follow, it is impossible to obtain a resin composition for printed circuit board as intended by the present invention, when the compounding proportions of the components (A) to (C) and the size of the component (B) are outside the respective ranges specified in the present invention. In contrast, excellent resin compositions for printed circuit board as intended by the present invention can be obtained in Examples which fall within the scope of the present claims. By subjecting these resin compositions of the present invention to injection molding, thin insulating substrates for printed circuit board can be produced easily, and these insulating substrates, having an excellent plating adhesion strength and excellent surface smoothness, make it possible to form a circuit of fine line width thereon. As a matter of course, the resin composition of the present invention can also be used in various applications requiring plating, other than the insulating substrate for printed circuit board.
The present invention is illustrated in more detail by way of Examples. However, the present invention is not restricted to these Examples.
In the Examples, physical properties were measured according to the following methods.
This was measured using a Koka type flow tester (Model CFT-500 manufactured by Shimadzu Corp). Flow temperature is a temperature at which a molten resin obtained by heating at a temperature elevation rate of 4° C./min shows a melt viscosity of 48,000 poises when the molten resin is extruded from a nozzle of 1 mm in the inside diameter and 10 mm in the length under a load of 100 kg/cm2 A resin of lower flow temperature has higher fluidity.
The optical anisotropy of a resin in a molten state was measured by heating the powdery resin on a heating stage under a polarized light at a rate of 25 ° C./min and observing the molten resin by visual inspection.
A molded article was measured for dimensions in a flow direction (MD) and a direction orthogonal to the flow direction (TD), and these dimensions were expressed as ratios to the respective mold dimensions.
This was measured according to ASTM D 638.
This was measured according to ASTM D 790.
This was measured according to ASTM D 648.
There was prepared a test piece for measurement of soldering heat resistance by cutting the molded article form measurement of anisotropy in degree of shrinkage in a width of 10 mm in the length direction, and the test piece was immersed in a solder bath H60A consisting of 60% of tin and 40% of lead, of 260° C., and then the solder bath temperature was elevated at intervals of 10° C. by keeping each temperature stage for 20 seconds. The highest temperature at which the test piece gave no foaming or no distortion under the above temperature elevation condition was recorded as the soldering heat resistance of the test piece. For instance, when a test piece gave foaming or distortion for the first time at 310° C., the soldering heat resistance of the test piece is 300° C.
This was measured according to JIS C 6481 (90° peeling, peeling rate: 50 mm/min).
Into a polymerization tank equipped with a combshaped impeller were fed 7.2 kg (40 moles) of p-acetoxybenzoic acid, 2.49 kg (15 moles) of terephthalic acid, 0.83 kg (5 moles) of isophthalic acid and 5.45 kg (20.2 moles) of 4,4'-diacetoxydiphenyl. The mixture was heated with stirring in a nitrogen gas atmosphere and polymerized at 330° C. for 3 hours with vigorous stirring while removing acetic acid formed as a by-product. Then, the polymerization system was cooled slowly, and at 200° C., the reaction mixture was taken out of the system. The yield of the reaction mixture was 10.38 kg which was 97.8% of the theoretical yield. It was pulverized with a hammer mill produced by Hosokawa Micron Co. to obtain particles of 2.5 mm or below. The particles were treated under a nitrogen gas atmosphere in a rotary kiln at 280° C. for 5 hours to obtain a fully aromatic polyester of particulate form having a flow temperature of 326° C. (the polyester is hereinafter referred to as "the liquid crystal polyester A"). This polymer showed an optical anisotropy at 350° C. or above.
7.2 kg (40 moles) of p-acetoxybenzoic acid, 3.32 kg (20 moles) of terephtalic acid and 5.45 kg (20.2 moles) of 4,4'-diacetoxydiphenyl were polymerized under the same conditions as in Referential Example 1 to obtain a reaction mixture. The mixture was pulverized in the same manner as in Referential Example 1 and then treated under a nitrogen gas atmosphere in a rotary kiln at 280° C. for 3 hours to obtain a fully aromatic polyester of particulate form having a flow temperature of 325° C. (the polyester is hereinafter referred to as "the liquid crystal polyester B"). This polymer showed an optical anisotropy at 355° C. or above.
Into a polymerization tank equipped with a comb-shaped impeller were fed 8.1 kg (45 moles) of p-acetoxybenzoic acid and 6.9 kg (30 moles) of 6-acetoxy2-naphthoic acid. The mixture was heated with stirring in a nitrogen gas atmosphere and polymerized at 300° C. for 30 minutes, at 320° C. for 30 minutes, and at 320° C. for 2 hours under a reduced pressure of 8.0 Torr. During the polymerization, the acetic acid formed as a by-product was continuously distilled out of the system. Then, the system was cooled slowly, and at 180° C. the reaction mixture was taken out of the system. The yield of the reaction mixture was 10.1 kg, which was 96.2% of the theoretical yield. The reaction mixture was pulverized in the same manner as in Referential Example 1 and treated under a nitrogen gas atmosphere in a rotary kiln at 260° C. for 5 hours to obtain a fully aromatic polyester of particulate form having a flow temperature of 260° C. (the polyester is hereinafter referred to as "the liquid crystal polyester C"). This polymer showed an optical anisotropy at 340° C. or above.
Three-component mixing was effected according to a compounding recipe as shown in Table 1, using as the component (A) the liquid crystal polyester A; as the component (B), one member selected from the group consisting of a glass fiber having an average diameter of 6 μm and an average length of 50 μm (EFDE-50-31 produced by Central Glass Co.), a potassium titanate fiber having a diameter of 0.3-1.0 μm and a length of 20-120 μm (HT-200 produced by Titanium Industry Co.), wallastonite having a diameter of 10 μm or below and a length of 50 μm or below (NYAD.sup.® 400 marketed by NAGASE & CO., LTD.) and a ceramic fiber composed mainly of Al2 O3 and SiO2 and having an average diameter of 1.8 μm and an average length of 100 μm (IBI WOOL.sup.® CP-U3 produced by IBIDEN CO., LTD.); and as the component (C), one member selected from the group consisting of calcium carbonate, magnesium carbonate and dolomite. The mixture was melt-kneaded at 320-350° C. using a twin-screw extruder (PCM-30 manufactured by Ikegai Corp.), and the resulting strands were water-cooled and then cut to obtain pellets.
The pellets were molded using an injection molding machine (NETSTAL.sup.® 47/28 manufactured by SUMITOMO HEAVY INDUSTRILES, LTD.; cylinder temperature: 330-350° C.; die temperature: 130° C.) to obtain a test piece for anisotropy in degree of molding shrinkage (64 mm in length, 64 mm in width and 1 mm in thickness, film gate), a test piece for tensile strength, a test piece for elastic modulus in bending and a test piece for heat distortion temperature. Further, there was molded a test piece for plating properties (a disc of 100 mm in diameter and 1.6 mm in thickness), and this test piece was subjected to a plating treatment according to the abovementioned steps, and then the plated test piece was measured for the appearance of plating layer by visual inspection, as well as for the adhesion strength of plating layer.
As clear from Table 1, in each resin composition, the tensile strength, elastic modulus in bending, heat distortion temperature and soldering heat resistance were high; the anisotropy in degree of shrinkage was low and no warpage was seen; and the plating layer had a fine appearance, a smooth surface and a high plating adhesion strength.
In Examples 5, 7, 8 and 10, circuits having a line width of 0.2 mm were formed using the respective plated test pieces, according to the above-mentioned method. Good circuits were obtained in all of the cases.
Each test piece was obtained and its physical properties were measured in the same manner as in Examples 1 to 10 except that there were used compounding recipes as shown in Table 1.
As clear from Table 1, compositions comprising a glass fiber, a potassium titanate fiber, wallastonite or a ceramic fiber in an amount of less than 3% by weight (Comparative Examples 1, 5, 6 and 7) gave a very large anisotropy in degree of shrinkage and some of them caused warpage. In a composition comprising a glass fiber in an amount of more than 50% by weight (Comparative Example 2), the appearances of the molded article and the plating layer were very poor. A composition comprising an alkaline earth metal carbonate in an amount of less than 3% by weight (Comparative Example 3) showed an insufficient plating adhesion strength. A composition comprising an alkaline earth metal carbonate in an amount of more than 30% by weight (Comparative Example 4) showed poor heat stability during processing, gave silver streaks on the surface of the molded article and had poor mechanical properties.
The procedures of Examples 1 to 10 were repeated except that the liquid crystal polyester B was used as the component (A). The results are shown in Table 2. In all of the cases, the results were similar to those of Examples 1 to 10.
The procedures of Examples 1 to 10 were repeated except that the liquid crystal polyester (C) was used as the component (A) and the cylinder temperature was set at 290° C. The results are shown in Table 3. The results of Examples 16 to 22 were similar to those of Examples 1 to 10, and the results of Comparative Examples 8 to 11 were similar to those of Comparative Examples 1 to 7.
In Examples 18, 19, 21 and 22, circuits having a line width of 0.2 mm were formed using the plated test pieces, according to the above-mentioned method. Good circuits were obtained.
The liquid crystal polyester A, B or C was mixed with a glass fiber having an average diameter of 13 μm and an average length of 3 mm (CSO3MAPXI produced by Asahi Fiber Glass Co.) and dolomite according to the compounding recipe shown in Table 4. There were prepared various test pieces from each resulting composition in the same manner as in Examples 1 to 10, and they were measured for various test items. In any of the compositions, the anisotropy in degree of shrinkage was low and no warpage was seen, and furthermore the mechanical properties and heat resistance were excellent. However, the plating layer had a very poor appearance, and when made into a printed circuit board, the circuit had merely a line width of about 1 mm.
TABLE 1
__________________________________________________________________________
Composition (% by weight)
Liquid Anisotropy
Mechanical properties
crystal Inorganic fibrous or
Carbonate of alkaline
Degree of Elastic
polyester
acicular material
earth metal shrinkage
Tensile
modulus in
Amount Amount Amount
(%) strength
bending
Type
(%) type (%) type (%) MD TD (kg/cm.sup.2)
(kg/cm.sup.2)
__________________________________________________________________________
Example 1
A 85 Glass fiber
10 Magnesium carbonate
5 0.12
0.86
1110 86000
Example 2
A 70 Glass fiber
20 Calcium carbonate
10 0.10
0.75
1060 105000
Example 3
A 60 Glass fiber
20 Calcium carbonate
20 0.12
0.72
950 106000
Example 4
A 50 Glass fiber
40 Calcium carbonate
10 0.08
0.51
980 138000
Example 5
A 60 Glass fiber
30 Calcium carbonate
10 0.09
0.59
1030 105000
Example 6
A 60 Glass fiber
30 Dolomite 10 0.09
0.62
1040 104000
Example 7
A 60 Potassium
30 Dolomite 10 0.10
0.70
1140 110000
titanate fiber
Example 8
A 60 Wallastonite
30 Dolomite 10 0.12
0.72
980 102000
Example 9
A 60 Wallastonite
20 Dolomite 20 0.16
0.77
940 102000
Example 10
A 60 Ceramic fiber
30 Dolomite 10 0.09
0.67
1000 104000
Comparative
A 83 Glass fiber
2 Dolomite 15 0.14
1.15
950 84000
Example 1
Comparative
A 35 Glass fiber
55 Dolomite 10 0.07
0.41
720 172000
Example 2
Comparative
A 68 Glass fiber
30 Dolomite 2 0.10
0.67
1120 104000
Example 3
Comparative
A 55 Glass fiber
10 Dolomite 35 0.18
0.75
650 98000
Example 4
Comparative
A 83 Potassium
2 Calcium carbonate
15 0.16
1.20
900 82000
Example 5 titanate fiber
Comparative
A 83 Wallastonite
2 Calcium carbonate
15 0.18
1.23
890 81000
Example 6
Comparative
A 83 Ceramic fiber
2 Calcium carbonate
15 0.15
1.18
850 85000
Example 7
__________________________________________________________________________
Thermal properties
Heat Solder-
Plating properties
distortion
ing heat
Adhesion
Appearance
temperature
resistance
strength
of plating
(°C.)
(°C.)
(kg/cm)
layer.sup.(1)
__________________________________________________________________________
Example 1
265 290 0.9 ⊚
Example 2
271 300 1.1 ○
Example 3
270 290 1.5 ○
Example 4
275 310 1.6 Δ
Example 5
273 300 1.9 ○
Example 6
273 300 2.0 ○
Example 7
269 300 1.6 ⊚
Example 8
270 300 1.4 ⊚
Example 9
268 290 1.3 ○
Example 10
273 300 1.8 ⊚
Comparative
262 280 0.7 ○
Example 1
Comparative
280 310 1.0 X
Example 2
Comparative
270 300 0.4 Δ
Example 3
Comparative
268 280 1.2 X
Example 4
Comparative
260 280 0.7 ○
Example 5
Comparative
259 280 0.6 ○
Example 6
Comparative
261 280 0.8 ○
Example 7
__________________________________________________________________________
.sup.(1) Appearance of plating layer: Excellent ⊚ >
○ > Δ > X Poor
TABLE 2
__________________________________________________________________________
Composition (% by weight)
Liquid Anisotropy
crystal Inorganic fibrous or
Carbonate of alkaline
Degree of
polyester acicular material
earth metal shrinkage
Amount Amount Amount
(%)
Type
(%) type (%) type (%) MD TD
__________________________________________________________________________
Example 11
B 85 Glass fiber
10 Magnesium carbonate
5 0.13
0.83
Example 12
B 60 Glass fiber
20 Dolomite 20 0.12
0.70
Example 13
B 60 Potassium
30 Dolomite 10 0.10
0.68
titanate fiber
Example 14
B 50 Wallastonite
40 Dolomite 10 0.12
0.71
Example 15
B 60 Ceramic fiber
30 Calcium carbonate
10 0.09
0.64
__________________________________________________________________________
Mechanical properties
Thermal properties
Elastic
Heat Solder-
Plating properties
Tensile
modulus in
distortion
ing heat
Adhesion
Appearance
strength
bending
temperature
resistance
strength
of plating
(kg/cm.sup.2)
(kg/cm.sup.2)
(°C.)
(°C.)
(kg/cm)
layer.sup.(1)
__________________________________________________________________________
Example 11
920 75000 268 290 0.8 ○
Example 12
780 93000 274 300 1.4 ○
Example 13
720 97000 273 310 1.5 ⊚
Example 14
790 116000 273 310 1.2 Δ
Example 15
860 92000 272 310 1.8 ⊚
__________________________________________________________________________
.sup.(1) Appearance of plating layer: Excellent ⊚ >
○ > Δ > X Poor
TABLE 3
__________________________________________________________________________
Composition (% by weight)
Liquid Anisotropy
Mechanical properties
crystal Inorganic fibrous or
Carbonate of alkaline
Degree of Elastic
polyester
acicular material
earth metal shrinkage
Tensile
modulus in
Amount Amount Amount
(%) strength
bending
Type
(%) type (%) type (%) MD TD (kg/cm.sup.2)
(kg/cm.sup.2)
__________________________________________________________________________
Example 16
C 85 Glass fiber
10 Magnesium carbonate
5 0.07
0.51
1420 114000
Example 17
C 60 Glass fiber
20 Dolomite 20 0.10
0.47
1180 160000
Example 18
C 60 Glass fiber
30 Dolomite 10 0.13
0.50
1310 169000
Example 19
C 60 Potassium
30 Dolomite 10 0.10
0.46
1350 158000
titanate fiber
Example 20
C 60 Wallastonite
20 Dolomite 20 0.16
0.55
1140 115000
Example 21
C 50 Wallastonite
40 Dolomite 10 0.18
0.49
1250 179000
Example 22
C 60 Ceramic fiber
30 Calcium carbonate
10 0.14
0.52
1300 14000
Comparative
C 83 Glass fiber
2 Dolomite 15 0.06
0.82
1280 89000
Example 8
Comparative
C 68 Glass fiber
30 Dolomite 2 0.09
0.50
1410 158000
Example 9
Comparative
C 83 Wallastonite
2 Dolomite 15 0.05
0.84
1260 87000
Example 10
Comparative
C 68 Wallastonite
30 Dolomite 2 0.10
0.52
1290 155000
Example 11
__________________________________________________________________________
Thermal properties
Heat Solder-
Plating properties
distortion
ing heat
Adhesion
Appearance
temperature
resistance
strength
of plating
(°C.)
(°C.)
(kg/cm)
layer.sup.(1)
__________________________________________________________________________
Example 16
227 250 0.8 ○
Example 17
229 260 1.4 ○
Example 18
238 260 1.5 ○
Example 19
236 260 1.5 ⊚
Example 20
233 260 1.2 ○
Example 21
239 260 1.3 ○
Example 22
237 260 1.6 ⊚
Comparative
224 250 0.8 ○
Example 8
Comparative
226 260 0.4 Δ
Example 9
Comparative
222 250 0.7 ○
Example 10
Comparative
235 260 0.4 Δ
Example 11
__________________________________________________________________________
.sup.(1) Appearance of plating layer: Excellent ⊚ >
○ > Δ > X Poor
TABLE 4
__________________________________________________________________________
Composition (% by weight)
Liquid Anisotropy
crystal Inorganic fibrous or
Carbonate of alkaline
Degree of
polyester
acicular material
earth metal
shrinkage
Amount Amount Amount
(%)
Type
(%) type (%) type (%) MD TD
__________________________________________________________________________
Comparative
A 60 Glass fiber
30 Dolomite
10 0.08
0.52
Example 12
Comparative
B 60 Glass fiber
30 Dolomite
10 0.07
0.48
Example 13
Comparative
C 60 Glass fiber
30 Dolomite
10 0.09
0.45
Example 14
__________________________________________________________________________
Mechanical properties
Thermal properties
Elastic
Heat Solder-
Plating properties
Tensile
modulus in
distortion
ing heat
Adhesion
Appearance
strength
bending
temperature
resistance
strength
of plating
(kg/cm.sup.2)
(kg/cm.sup.2)
(°C.)
(°C.)
(kg/cm)
layer.sup.(1)
__________________________________________________________________________
Comparative
1100 125000
277 300 1.7 X
Example 12
Comparative
1210 132000
278 300 1.6 X
Example 13
Comparative
1500 165000
240 260 1.4 X
Example 14
__________________________________________________________________________
.sup.(1) Appearance of plating layer: Excellent ⊚ >
○ > Δ > X Poor
Claims (8)
1. A resin composition for printed circuit board comprising:
(A) 30-90% by weight of a liquid crystal polyester having one of the following combinations of repeating units: ##STR5## wherein X is alkyl, halogen or aryl, (B) 3-50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 μm or below and an average length of 200 μm or below, and
(C) 3-30% by weight of an alkaline earth metal carbonate.
2. A composition according to claim 1, wherein the inorganic fibrous or acicular material is selected from the group consisting of a glass fiber, a potassium titanate fiber, wollastonite, a ceramic fiber composed mainly of Al2 O3 and SiO2, a boron fiber, a silicon carbide fiber, an alkali metal metaphosphate fiber and an asbestos fiber.
3. A composition according to claim 1, wherein the inorganic fibrous or acicular material is selected from the group consisting of a glass fiber, a potassium titanate fiber, wollastonite and a ceramic fiber composed mainly of Al2 O3 and SiO2.
4. A composition according to claim 1, wherein the alkaline earth metal of the alkaline earth metal carbonate is selected from the group consisting of magnesium, calcium, strontium and barium.
5. A composition according to claim 1, wherein the alkaline earth metal carbonate is selected from the group consisting of calcium carbonate, magnesium carbonate and an eutectoid of calcium carbonate and magnesium carbonate, i.e., dolomite.
6. A composition according to claim 1, wherein the total amount of the component (B) and the component (C) is 10-70% by weight based on the total resin composition.
7. A composition according to claim 6, wherein the amounts of the component (B) and the component (C) are 10 -40% by weight and 5-20% by weight, respectively, based on the total resin composition.
8. A composition according to claim 1 further comprising at least one member selected from the group consisting of an antioxidant, a heat stabilizer, an ultraviolet absorber, a lubricant, a releasing agent, a dye, a pigment, a flame retardant, a flame-retarding aid, an antistatic agent, thermoplastic resins consisting of a polyamide, a polyester, a polyphenylene sulfide, a polyetherketone, a polycarbonate, a modified polyphenylene oxide, a polysulfone, a polyetherimide and a polyamideimide, and thermosetting resins consisting of a phenolic resin, an epoxy resin and a polyimide resin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-218610 | 1987-09-01 | ||
| JP62218610A JPS6461087A (en) | 1987-09-01 | 1987-09-01 | Resin composition for printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US4943606A true US4943606A (en) | 1990-07-24 |
Family
ID=16722652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/236,721 Expired - Lifetime US4943606A (en) | 1987-09-01 | 1988-08-26 | Resin composition for printed circuit board |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4943606A (en) |
| EP (1) | EP0305846B1 (en) |
| JP (1) | JPS6461087A (en) |
| CA (1) | CA1312160C (en) |
| DE (1) | DE3853456T2 (en) |
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| US5209819A (en) * | 1989-07-03 | 1993-05-11 | Polyplastics Co., Ltd. | Process for producing molding for precision fine-line circuit |
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| US5397502A (en) * | 1993-06-10 | 1995-03-14 | E. I. Du Pont De Nemours And Company | Heat resistant liquid crsytalline polymers |
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| US5409979A (en) * | 1989-02-08 | 1995-04-25 | Polyplastics Co., Ltd. | Liquid-crystal polyester resin composition containing specified mold release agents |
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| US6419981B1 (en) | 1998-03-03 | 2002-07-16 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
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| US6608760B2 (en) | 1998-05-04 | 2003-08-19 | Tpl, Inc. | Dielectric material including particulate filler |
| US6613987B2 (en) * | 1999-04-01 | 2003-09-02 | Ajinomoto Co., Inc. | Insulating resin composition for multilayer printed-wiring board |
| US6616794B2 (en) * | 1998-05-04 | 2003-09-09 | Tpl, Inc. | Integral capacitance for printed circuit board using dielectric nanopowders |
| US20040109298A1 (en) * | 1998-05-04 | 2004-06-10 | Hartman William F. | Dielectric material including particulate filler |
| US20040180202A1 (en) * | 2003-03-10 | 2004-09-16 | Lawton Ernest L. | Resin compatible yarn binder and uses thereof |
| US6916527B2 (en) * | 2001-01-18 | 2005-07-12 | Matsushita Electric Works, Ltd. | Resin moldings |
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| EP1162866A3 (en) * | 2000-06-06 | 2005-11-30 | Matsushita Electric Works, Ltd. | Laminate |
| US20060074166A1 (en) * | 2003-12-19 | 2006-04-06 | Tpl, Inc. Title And Interest In An Application | Moldable high dielectric constant nano-composites |
| US20060074164A1 (en) * | 2003-12-19 | 2006-04-06 | Tpl, Inc. | Structured composite dielectrics |
| US7354641B2 (en) | 2004-10-12 | 2008-04-08 | Ppg Industries Ohio, Inc. | Resin compatible yarn binder and uses thereof |
| US20080128961A1 (en) * | 2003-12-19 | 2008-06-05 | Tpl, Inc. | Moldable high dielectric constant nano-composites |
| US20080298036A1 (en) * | 2007-05-31 | 2008-12-04 | Nitto Denko Corporation | Printed circuit board and fuel cell |
| US20090308643A1 (en) * | 2008-06-13 | 2009-12-17 | Cho Chung Kun | Crosslinkable thermoset monomer, composition for producing printed circuit board comprising the thermoset monomer and printed circuit board using the composition |
| US20100047653A1 (en) * | 2008-08-25 | 2010-02-25 | Nitto Denko Corporation | Printed circuit board and fuel cell |
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| JP2513728B2 (en) * | 1987-10-09 | 1996-07-03 | ポリプラスチックス株式会社 | Surface treatment method for liquid crystalline polyester resin moldings |
| JP2714440B2 (en) * | 1989-06-06 | 1998-02-16 | ポリプラスチックス株式会社 | Manufacturing method of substrate for precision fine wire circuit |
| DE3932882A1 (en) * | 1989-10-02 | 1991-04-11 | Siemens Ag | WELL HEAT-CONDUCTING COMPOSITE |
| JP2505643B2 (en) * | 1989-11-06 | 1996-06-12 | 東レ株式会社 | Liquid crystal polyester resin composition |
| JP3074696B2 (en) * | 1990-03-30 | 2000-08-07 | 住友化学工業株式会社 | Liquid crystal polyester resin composition |
| DE4028210A1 (en) * | 1990-09-06 | 1992-03-12 | Basf Ag | METHOD FOR THE SURFACE TREATMENT OF MOLDED BODIES BASED ON LIQUID CRYSTALLINE POLYMERS |
| US5115080A (en) * | 1990-10-24 | 1992-05-19 | E. I. Du Pont De Nemours And Company | Thermotropic liquid crystalline polyesters from 2-methylhydroquinone |
| US5401911A (en) * | 1992-04-03 | 1995-03-28 | International Business Machines Corporation | Via and pad structure for thermoplastic substrates and method and apparatus for forming the same |
| US5847039A (en) * | 1995-06-09 | 1998-12-08 | Sumitomo Chemical Company, Limited | Liquid crystalline polyester resin compositions |
| JP4035861B2 (en) * | 1997-07-08 | 2008-01-23 | 住友化学株式会社 | Aromatic polyester composition |
| BE1011624A4 (en) * | 1997-12-17 | 1999-11-09 | Laude Lucien Diego | Media electrical circuit. |
| JP4753470B2 (en) * | 2000-12-27 | 2011-08-24 | イビデン株式会社 | Capacitor, multilayer printed wiring board, and method for manufacturing multilayer printed wiring board |
| CN109937230B (en) * | 2016-11-18 | 2022-04-22 | 住友化学株式会社 | Foamed molded article and method for producing foamed molded article |
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| US5020883A (en) * | 1985-04-08 | 1991-06-04 | Hitachi, Ltd. | Ferroelectric liquid crystal device |
| US5399374A (en) * | 1987-01-28 | 1995-03-21 | Nissha Printing Co., Ltd. | Color filter and the manufacturing method therefor |
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| US5209819A (en) * | 1989-07-03 | 1993-05-11 | Polyplastics Co., Ltd. | Process for producing molding for precision fine-line circuit |
| US5240753A (en) * | 1989-07-07 | 1993-08-31 | Otsuka Kagaku Kabushiki Kaisha | Molded articles for holding wafers |
| US5397502A (en) * | 1993-06-10 | 1995-03-14 | E. I. Du Pont De Nemours And Company | Heat resistant liquid crsytalline polymers |
| US5965655A (en) * | 1993-08-19 | 1999-10-12 | General Electric Company | Mineral filled moldable thermoplastic composition |
| US5907006A (en) * | 1994-06-03 | 1999-05-25 | Rennie; Stephen | Compositions for the coating of substrates of matt appearance |
| US6190759B1 (en) | 1998-02-18 | 2001-02-20 | International Business Machines Corporation | High optical contrast resin composition and electronic package utilizing same |
| US6337375B1 (en) | 1998-02-18 | 2002-01-08 | International Business Machines Corporation | High optical contrast resin composition and electronic package utilizing same |
| US6187417B1 (en) | 1998-02-18 | 2001-02-13 | International Business Machines Corporation | Substrate having high optical contrast and method of making same |
| US6949289B1 (en) | 1998-03-03 | 2005-09-27 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| US6419981B1 (en) | 1998-03-03 | 2002-07-16 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| US8105690B2 (en) | 1998-03-03 | 2012-01-31 | Ppg Industries Ohio, Inc | Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding |
| US6593255B1 (en) | 1998-03-03 | 2003-07-15 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| US6608760B2 (en) | 1998-05-04 | 2003-08-19 | Tpl, Inc. | Dielectric material including particulate filler |
| US6616794B2 (en) * | 1998-05-04 | 2003-09-09 | Tpl, Inc. | Integral capacitance for printed circuit board using dielectric nanopowders |
| US20040109298A1 (en) * | 1998-05-04 | 2004-06-10 | Hartman William F. | Dielectric material including particulate filler |
| US6613987B2 (en) * | 1999-04-01 | 2003-09-02 | Ajinomoto Co., Inc. | Insulating resin composition for multilayer printed-wiring board |
| US7026054B2 (en) * | 2000-06-06 | 2006-04-11 | Matsushita Electric Works, Ltd. | Laminate utilizing a metal layer activated by nitrogen plasma treatment |
| EP1162866A3 (en) * | 2000-06-06 | 2005-11-30 | Matsushita Electric Works, Ltd. | Laminate |
| US20020061964A1 (en) * | 2000-09-04 | 2002-05-23 | Noriyuki Arai | Thermoplastic resin composition and molding thereof |
| US6916527B2 (en) * | 2001-01-18 | 2005-07-12 | Matsushita Electric Works, Ltd. | Resin moldings |
| US7622516B1 (en) | 2001-06-06 | 2009-11-24 | Henkel Corporation | Composition of epoxy and anhydride components, antioxidant and phosphor material |
| US6989412B2 (en) | 2001-06-06 | 2006-01-24 | Henkel Corporation | Epoxy molding compounds containing phosphor and process for preparing such compositions |
| US20030001140A1 (en) * | 2001-06-06 | 2003-01-02 | Loctite Corporation | Epoxy molding compounds containing phosphor and process for preparing such compositions |
| US20040063840A1 (en) * | 2001-06-06 | 2004-04-01 | Henkel Loctite Corporation | Epoxy molding compounds with resistance to UV light and heat |
| US7125917B2 (en) | 2001-06-06 | 2006-10-24 | Henkel Corporation | Epoxy molding compounds with resistance to UV light and heat |
| US20040180202A1 (en) * | 2003-03-10 | 2004-09-16 | Lawton Ernest L. | Resin compatible yarn binder and uses thereof |
| US8062746B2 (en) | 2003-03-10 | 2011-11-22 | Ppg Industries, Inc. | Resin compatible yarn binder and uses thereof |
| US20060074166A1 (en) * | 2003-12-19 | 2006-04-06 | Tpl, Inc. Title And Interest In An Application | Moldable high dielectric constant nano-composites |
| US20080128961A1 (en) * | 2003-12-19 | 2008-06-05 | Tpl, Inc. | Moldable high dielectric constant nano-composites |
| US20060074164A1 (en) * | 2003-12-19 | 2006-04-06 | Tpl, Inc. | Structured composite dielectrics |
| US7354641B2 (en) | 2004-10-12 | 2008-04-08 | Ppg Industries Ohio, Inc. | Resin compatible yarn binder and uses thereof |
| US20080298036A1 (en) * | 2007-05-31 | 2008-12-04 | Nitto Denko Corporation | Printed circuit board and fuel cell |
| US20090308643A1 (en) * | 2008-06-13 | 2009-12-17 | Cho Chung Kun | Crosslinkable thermoset monomer, composition for producing printed circuit board comprising the thermoset monomer and printed circuit board using the composition |
| US8440313B2 (en) * | 2008-06-13 | 2013-05-14 | Samsung Electronics Co., Ltd. | Crosslinkable thermoset monomer, composition for producing printed circuit board comprising the thermoset monomer and printed circuit board using the composition |
| US20100047653A1 (en) * | 2008-08-25 | 2010-02-25 | Nitto Denko Corporation | Printed circuit board and fuel cell |
| US20110076522A1 (en) * | 2009-09-25 | 2011-03-31 | Nitto Denko Corporation | Printed circuit board and fuel cell |
| EP2302986A1 (en) * | 2009-09-25 | 2011-03-30 | Nitto Denko Corporation | Printed circuit board and fuel cell |
| WO2014081650A1 (en) * | 2012-11-21 | 2014-05-30 | Ticona Llc | Liquid crystalline polymer composition for melt-extruded substrates |
| US11345811B2 (en) | 2016-11-18 | 2022-05-31 | Sumitomo Chemical Company, Limited | Liquid crystal polymer composition for foam molding, method for producing foam molded body, and foam molded body |
| WO2021173693A1 (en) * | 2020-02-26 | 2021-09-02 | Ticona Llc | Electronic device |
| US11702539B2 (en) | 2020-02-26 | 2023-07-18 | Ticona Llc | Polymer composition for an electronic device |
| US11715579B2 (en) | 2020-02-26 | 2023-08-01 | Ticona Llc | Electronic device |
| US11729908B2 (en) | 2020-02-26 | 2023-08-15 | Ticona Llc | Circuit structure |
| US11728065B2 (en) | 2020-07-28 | 2023-08-15 | Ticona Llc | Molded interconnect device |
Also Published As
| Publication number | Publication date |
|---|---|
| CA1312160C (en) | 1992-12-29 |
| EP0305846B1 (en) | 1995-03-29 |
| DE3853456D1 (en) | 1995-05-04 |
| JPS6461087A (en) | 1989-03-08 |
| DE3853456T2 (en) | 1995-09-28 |
| JPH0529155B2 (en) | 1993-04-28 |
| EP0305846A2 (en) | 1989-03-08 |
| EP0305846A3 (en) | 1990-06-20 |
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