US5265114A - System and method for selectively laser processing a target structure of one or more materials of a multimaterial, multilayer device - Google Patents
System and method for selectively laser processing a target structure of one or more materials of a multimaterial, multilayer device Download PDFInfo
- Publication number
- US5265114A US5265114A US07/943,875 US94387592A US5265114A US 5265114 A US5265114 A US 5265114A US 94387592 A US94387592 A US 94387592A US 5265114 A US5265114 A US 5265114A
- Authority
- US
- United States
- Prior art keywords
- laser
- laser output
- target structure
- wavelength
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
- H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/14—Titanium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
- B23K2103/26—Alloys of Nickel and Cobalt and Chromium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0401—Arrangements for thermal management of optical elements being part of laser resonator, e.g. windows, mirrors, lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
- H01S3/09415—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode the pumping beam being parallel to the lasing mode of the pumped medium, e.g. end-pumping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
- H01S3/1123—Q-switching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/1601—Solid materials characterised by an active (lasing) ion
- H01S3/1603—Solid materials characterised by an active (lasing) ion rare earth
- H01S3/1611—Solid materials characterised by an active (lasing) ion rare earth neodymium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/163—Solid materials characterised by a crystal matrix
- H01S3/1645—Solid materials characterised by a crystal matrix halide
- H01S3/1653—YLiF4(YLF, LYF)
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/94—Laser ablative material removal
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lasers (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (26)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07943875 US5265114C1 (en) | 1992-09-10 | 1992-09-10 | System and method for selectively laser processing a target structure of one or more materials of a multimaterial multilayer device |
TW082107386A TW236032B (en) | 1992-09-10 | 1993-09-09 | |
KR1019950700946A KR100231811B1 (en) | 1992-09-10 | 1993-09-10 | System and method for selectively laser processing a target structure of materials of a multimaterial, multilayer device |
PCT/US1993/008484 WO1994006182A1 (en) | 1992-09-10 | 1993-09-10 | System and method for selectively laser processing a target structure of materials of a multimaterial, multilayer device |
JP6507530A JP2625261B2 (en) | 1992-09-10 | 1993-09-10 | System and method for selective laser processing of object structures in multi-material, multi-layer device materials |
SG9601370A SG81853A1 (en) | 1992-09-10 | 1993-09-10 | System and method for selectively laser processing a target structure of one or more materials of a multimaterial, multilayer device |
GB9500774A GB2283859B (en) | 1992-09-10 | 1993-09-10 | System and method for selectively laser processing a target structure of materials of a multimaterial, multilayer device |
US08/343,779 US5569398A (en) | 1992-09-10 | 1994-11-22 | Laser system and method for selectively trimming films |
US08/343,778 US5473624A (en) | 1992-09-10 | 1994-11-22 | Laser system and method for selectively severing links |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07943875 US5265114C1 (en) | 1992-09-10 | 1992-09-10 | System and method for selectively laser processing a target structure of one or more materials of a multimaterial multilayer device |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/343,779 Continuation-In-Part US5569398A (en) | 1992-09-10 | 1994-11-22 | Laser system and method for selectively trimming films |
US08/343,778 Continuation-In-Part US5473624A (en) | 1992-09-10 | 1994-11-22 | Laser system and method for selectively severing links |
Publications (2)
Publication Number | Publication Date |
---|---|
US5265114A true US5265114A (en) | 1993-11-23 |
US5265114C1 US5265114C1 (en) | 2001-08-21 |
Family
ID=25480409
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07943875 Expired - Lifetime US5265114C1 (en) | 1992-09-10 | 1992-09-10 | System and method for selectively laser processing a target structure of one or more materials of a multimaterial multilayer device |
US08/343,779 Expired - Lifetime US5569398A (en) | 1992-09-10 | 1994-11-22 | Laser system and method for selectively trimming films |
US08/343,778 Expired - Fee Related US5473624A (en) | 1992-09-10 | 1994-11-22 | Laser system and method for selectively severing links |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/343,779 Expired - Lifetime US5569398A (en) | 1992-09-10 | 1994-11-22 | Laser system and method for selectively trimming films |
US08/343,778 Expired - Fee Related US5473624A (en) | 1992-09-10 | 1994-11-22 | Laser system and method for selectively severing links |
Country Status (7)
Country | Link |
---|---|
US (3) | US5265114C1 (en) |
JP (1) | JP2625261B2 (en) |
KR (1) | KR100231811B1 (en) |
GB (1) | GB2283859B (en) |
SG (1) | SG81853A1 (en) |
TW (1) | TW236032B (en) |
WO (1) | WO1994006182A1 (en) |
Cited By (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5473624A (en) * | 1992-09-10 | 1995-12-05 | Electro Scientific Industries, Inc. | Laser system and method for selectively severing links |
US5590141A (en) * | 1992-04-24 | 1996-12-31 | Electro Scientific Industries, Inc. | Method and apparatus for generating and employing a high density of excited ions in a lasant |
US5685995A (en) * | 1994-11-22 | 1997-11-11 | Electro Scientific Industries, Inc. | Method for laser functional trimming of films and devices |
WO1998031049A1 (en) * | 1997-01-06 | 1998-07-16 | Electro Scientific Industries, Inc. | Laser based method and system for integrated circuit repair or reconfiguration |
US5961861A (en) * | 1996-01-15 | 1999-10-05 | The University Of Tennessee Research Corporation | Apparatus for laser alloying induced improvement of surfaces |
US5998759A (en) * | 1996-12-24 | 1999-12-07 | General Scanning, Inc. | Laser processing |
WO1999063592A1 (en) * | 1998-06-05 | 1999-12-09 | Electro Scientific Industries, Inc. | Method of severing electrically conductive links with ultraviolet laser output |
US6046429A (en) * | 1997-06-12 | 2000-04-04 | International Business Machines Corporation | Laser repair process for printed wiring boards |
US6057221A (en) * | 1997-04-03 | 2000-05-02 | Massachusetts Institute Of Technology | Laser-induced cutting of metal interconnect |
WO2000035623A1 (en) * | 1998-12-16 | 2000-06-22 | General Scanning, Inc. | Laser processing |
US6172325B1 (en) | 1999-02-10 | 2001-01-09 | Electro Scientific Industries, Inc. | Laser processing power output stabilization apparatus and method employing processing position feedback |
US6173886B1 (en) | 1999-05-24 | 2001-01-16 | The University Of Tennessee Research Corportion | Method for joining dissimilar metals or alloys |
US6229111B1 (en) | 1999-10-13 | 2001-05-08 | The University Of Tennessee Research Corporation | Method for laser/plasma surface alloying |
WO2001051243A2 (en) * | 2000-01-10 | 2001-07-19 | Electro Scientific Industries, Inc. | Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths |
US6281471B1 (en) | 1999-12-28 | 2001-08-28 | Gsi Lumonics, Inc. | Energy-efficient, laser-based method and system for processing target material |
US6284067B1 (en) | 1999-07-02 | 2001-09-04 | The University Of Tennessee Research Corporation | Method for producing alloyed bands or strips on pistons for internal combustion engines |
US6294225B1 (en) | 1999-05-10 | 2001-09-25 | The University Of Tennessee Research Corporation | Method for improving the wear and corrosion resistance of material transport trailer surfaces |
US6299707B1 (en) | 1999-05-24 | 2001-10-09 | The University Of Tennessee Research Corporation | Method for increasing the wear resistance in an aluminum cylinder bore |
US6328026B1 (en) | 1999-10-13 | 2001-12-11 | The University Of Tennessee Research Corporation | Method for increasing wear resistance in an engine cylinder bore and improved automotive engine |
WO2002005345A1 (en) * | 2000-07-12 | 2002-01-17 | Electro Scientific Industries, Inc. | Uv laser system and method for single pulse severing of ic fuses |
US6350326B1 (en) | 1996-01-15 | 2002-02-26 | The University Of Tennessee Research Corporation | Method for practicing a feedback controlled laser induced surface modification |
US20020052069A1 (en) * | 2000-06-12 | 2002-05-02 | Seiko Epson Corporation | Fabrication method of thin-film semiconductor device |
US6423162B1 (en) | 1999-07-02 | 2002-07-23 | The University Of Tennesse Research Corporation | Method for producing decorative appearing bumper surfaces |
US20020162973A1 (en) * | 2001-03-29 | 2002-11-07 | Cordingley James J. | Methods and systems for processing a device, methods and systems for modeling same and the device |
US6497985B2 (en) | 1999-06-09 | 2002-12-24 | University Of Tennessee Research Corporation | Method for marking steel and aluminum alloys |
US6526089B1 (en) | 1999-09-29 | 2003-02-25 | Sunx Limited | Laser marker and method of light spot adjustment therefor |
US6642085B1 (en) | 2000-11-03 | 2003-11-04 | The Regents Of The University Of California | Thin film transistors on plastic substrates with reflective coatings for radiation protection |
US6664500B2 (en) | 2000-12-16 | 2003-12-16 | Anadigics, Inc. | Laser-trimmable digital resistor |
US6703582B2 (en) | 1999-12-28 | 2004-03-09 | Gsi Lumonics Corporation | Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train |
US20040245601A1 (en) * | 2003-05-07 | 2004-12-09 | Kabushiki Kaisha Toshiba | Semiconductor device |
US20040253797A1 (en) * | 2003-06-12 | 2004-12-16 | Industrial Technology Research Institute | Heating plate crystallization method |
US20050041976A1 (en) * | 2003-08-19 | 2005-02-24 | Yunlong Sun | Generating sets of tailored laser pulses |
US20050122124A1 (en) * | 2003-12-03 | 2005-06-09 | Denso Corporation | Semiconductor manufacturing device and semiconductor manufacturing method |
US20050224469A1 (en) * | 2003-06-30 | 2005-10-13 | Cutler Donald R | Efficient micro-machining apparatus and method employing multiple laser beams |
US20060114948A1 (en) * | 2004-11-29 | 2006-06-01 | Lo Ho W | Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams |
US20070170162A1 (en) * | 2004-05-14 | 2007-07-26 | Oliver Haupt | Method and device for cutting through semiconductor materials |
US20070173075A1 (en) * | 2001-03-29 | 2007-07-26 | Joohan Lee | Laser-based method and system for processing a multi-material device having conductive link structures |
US20070272555A1 (en) * | 2006-05-24 | 2007-11-29 | Baird Brian W | Laser processing of workpieces containing low-k dielectric material |
US20080029491A1 (en) * | 2006-07-20 | 2008-02-07 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
US7469831B2 (en) | 2004-06-30 | 2008-12-30 | Gsi Group Corporation | Laser-based method and system for processing targeted surface material and article produced thereby |
US7482551B2 (en) | 2000-01-10 | 2009-01-27 | Electro Scientific Industries, Inc. | Processing a memory link with a set of at least two laser pulses |
US20090141750A1 (en) * | 2007-12-03 | 2009-06-04 | Electro Scientific Industries, Inc. | Systems and methods for link processing with ultrafast and nanosecond laser pulses |
US20090245300A1 (en) * | 2008-03-25 | 2009-10-01 | Electro Scientific Industries, Inc. | Systems and methods for laser pulse equalization |
US7616669B2 (en) | 2003-06-30 | 2009-11-10 | Electro Scientific Industries, Inc. | High energy pulse suppression method |
US20100009550A1 (en) * | 2006-12-08 | 2010-01-14 | Cyber Laser, Inc. | Method and apparatus for modifying integrated circuit by laser |
US7723642B2 (en) | 1999-12-28 | 2010-05-25 | Gsi Group Corporation | Laser-based system for memory link processing with picosecond lasers |
US7838794B2 (en) | 1999-12-28 | 2010-11-23 | Gsi Group Corporation | Laser-based method and system for removing one or more target link structures |
US7871903B2 (en) | 2002-03-27 | 2011-01-18 | Gsi Group Corporation | Method and system for high-speed, precise micromachining an array of devices |
US20120217230A1 (en) * | 2003-08-11 | 2012-08-30 | David Gaudiosi | Methods and systems for trimming circuits |
US8374206B2 (en) | 2008-03-31 | 2013-02-12 | Electro Scientific Industries, Inc. | Combining multiple laser beams to form high repetition rate, high average power polarized laser beam |
US20150027528A1 (en) * | 2009-04-21 | 2015-01-29 | Tetrasun, Inc. | Selective removal of a coating from a metal layer, and solar cell applications thereof |
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Also Published As
Publication number | Publication date |
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GB2283859B (en) | 1996-07-03 |
JP2625261B2 (en) | 1997-07-02 |
SG81853A1 (en) | 2001-07-24 |
US5473624A (en) | 1995-12-05 |
JPH07506221A (en) | 1995-07-06 |
GB2283859A (en) | 1995-05-17 |
WO1994006182A1 (en) | 1994-03-17 |
GB9500774D0 (en) | 1995-03-08 |
US5265114C1 (en) | 2001-08-21 |
TW236032B (en) | 1994-12-11 |
US5569398A (en) | 1996-10-29 |
KR100231811B1 (en) | 1999-12-01 |
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