US5882720A - Monitoring deposited pads - Google Patents
Monitoring deposited pads Download PDFInfo
- Publication number
- US5882720A US5882720A US08/908,770 US90877097A US5882720A US 5882720 A US5882720 A US 5882720A US 90877097 A US90877097 A US 90877097A US 5882720 A US5882720 A US 5882720A
- Authority
- US
- United States
- Prior art keywords
- pad
- dimensional shape
- attributes
- workpiece
- print condition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
- B05B5/08—Plant for applying liquids or other fluent materials to objects
- B05B5/12—Plant for applying liquids or other fluent materials to objects specially adapted for coating the interior of hollow bodies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (38)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/908,770 US5882720A (en) | 1996-02-01 | 1997-08-08 | Monitoring deposited pads |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59548596A | 1996-02-01 | 1996-02-01 | |
US08/908,770 US5882720A (en) | 1996-02-01 | 1997-08-08 | Monitoring deposited pads |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US59548596A Continuation | 1996-02-01 | 1996-02-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
US5882720A true US5882720A (en) | 1999-03-16 |
Family
ID=24383431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/908,770 Expired - Lifetime US5882720A (en) | 1996-02-01 | 1997-08-08 | Monitoring deposited pads |
Country Status (1)
Country | Link |
---|---|
US (1) | US5882720A (en) |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6564987B2 (en) * | 2000-11-16 | 2003-05-20 | Fujitsu Limited | Method, apparatus and computer readable medium for evaluating configuration of solder external terminals of a semiconductor device |
US6587580B1 (en) * | 1999-05-06 | 2003-07-01 | Avaya Technology Corp. | Stencil printing process optimization for circuit pack assembly using neural network modeling |
US6637641B1 (en) * | 2002-05-06 | 2003-10-28 | Emc Corporation | Systems and methods for manufacturing a circuit board |
US6689319B1 (en) * | 1999-10-29 | 2004-02-10 | Agilent Technologies, Ind. | Apparatus for deposition and inspection of chemical and biological fluids |
US20040026100A1 (en) * | 2001-10-26 | 2004-02-12 | Magnus Mattson | Element for electromagnetic shielding and method for manufacturing thereof |
US6691908B2 (en) * | 2000-08-03 | 2004-02-17 | Daishin Industrial Co., Ltd. | Brazing apparatus and brazing method in which the amount of heating is controlled on the basis of temperature of articles to be brazed |
US20040079244A1 (en) * | 2000-07-18 | 2004-04-29 | Kimiyuki Yamasaki | Screen printing apparatus and method of the same |
US20040142099A1 (en) * | 2003-01-17 | 2004-07-22 | Mark Rossmeisl | Electronic substrate printing |
US20040244613A1 (en) * | 2003-06-05 | 2004-12-09 | Barajas Leandro G. | System and methods for data-driven control of manufacturing processes |
US6857553B1 (en) * | 2002-04-17 | 2005-02-22 | The United States Of America As Represented By The United States Department Of Energy | Method and apparatus for in-process sensing of manufacturing quality |
US20050284917A1 (en) * | 2004-06-24 | 2005-12-29 | Checkpoint Systems, Inc. | Die attach area cut-on-fly method and apparatus |
US20070051253A1 (en) * | 2004-02-19 | 2007-03-08 | Speedline Technologies, Inc. | Method and apparatus for performing operations within a stencil printer |
GB2449549A (en) * | 2007-05-22 | 2008-11-26 | Matsushita Electric Ind Co Ltd | Screen printing apparatus and method |
US20090014501A1 (en) * | 2006-03-29 | 2009-01-15 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method |
US20100230472A1 (en) * | 2006-09-11 | 2010-09-16 | Panasonic Corporation | Electronic component mounting system and electronic component mounting method |
US20130204563A1 (en) * | 2012-02-03 | 2013-08-08 | Sony Corporation | Printing inspection apparatus, printing inspection system, statistical method for inspection data, program, and substrate manufacturing method |
US20140210993A1 (en) * | 2013-01-25 | 2014-07-31 | Cyberoptics Corporation | Automatic programming of solder paste inspection system |
WO2015047522A1 (en) * | 2013-09-30 | 2015-04-02 | Illinois Tool Works Inc. | Method and apparatus for printing small aspect features |
US9370923B1 (en) | 2015-04-07 | 2016-06-21 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
US9370924B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Dual action stencil wiper assembly for stencil printer |
US9370925B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
US9743527B2 (en) | 2013-08-09 | 2017-08-22 | CyberOptics Corporaiton | Stencil programming and inspection using solder paste inspection system |
US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4688939A (en) * | 1985-12-27 | 1987-08-25 | At&T Technologies, Inc. | Method and apparatus for inspecting articles |
US5495337A (en) * | 1991-11-06 | 1996-02-27 | Machine Vision Products, Inc. | Method of visualizing minute particles |
US5509597A (en) * | 1994-10-17 | 1996-04-23 | Panasonic Technologies, Inc. | Apparatus and method for automatic monitoring and control of a soldering process |
US5586715A (en) * | 1994-08-08 | 1996-12-24 | Hewlett-Packard Company | Method of making solder balls by contained paste deposition |
-
1997
- 1997-08-08 US US08/908,770 patent/US5882720A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4688939A (en) * | 1985-12-27 | 1987-08-25 | At&T Technologies, Inc. | Method and apparatus for inspecting articles |
US5495337A (en) * | 1991-11-06 | 1996-02-27 | Machine Vision Products, Inc. | Method of visualizing minute particles |
US5586715A (en) * | 1994-08-08 | 1996-12-24 | Hewlett-Packard Company | Method of making solder balls by contained paste deposition |
US5509597A (en) * | 1994-10-17 | 1996-04-23 | Panasonic Technologies, Inc. | Apparatus and method for automatic monitoring and control of a soldering process |
Cited By (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6587580B1 (en) * | 1999-05-06 | 2003-07-01 | Avaya Technology Corp. | Stencil printing process optimization for circuit pack assembly using neural network modeling |
US6689319B1 (en) * | 1999-10-29 | 2004-02-10 | Agilent Technologies, Ind. | Apparatus for deposition and inspection of chemical and biological fluids |
US20040079244A1 (en) * | 2000-07-18 | 2004-04-29 | Kimiyuki Yamasaki | Screen printing apparatus and method of the same |
US6907824B2 (en) * | 2000-07-18 | 2005-06-21 | Matsushita Electric Industrial Co., Ltd. | Screen printing apparatus and method of the same |
US6691908B2 (en) * | 2000-08-03 | 2004-02-17 | Daishin Industrial Co., Ltd. | Brazing apparatus and brazing method in which the amount of heating is controlled on the basis of temperature of articles to be brazed |
US6564987B2 (en) * | 2000-11-16 | 2003-05-20 | Fujitsu Limited | Method, apparatus and computer readable medium for evaluating configuration of solder external terminals of a semiconductor device |
US20040026100A1 (en) * | 2001-10-26 | 2004-02-12 | Magnus Mattson | Element for electromagnetic shielding and method for manufacturing thereof |
US6857553B1 (en) * | 2002-04-17 | 2005-02-22 | The United States Of America As Represented By The United States Department Of Energy | Method and apparatus for in-process sensing of manufacturing quality |
US6637641B1 (en) * | 2002-05-06 | 2003-10-28 | Emc Corporation | Systems and methods for manufacturing a circuit board |
US7293691B2 (en) * | 2003-01-17 | 2007-11-13 | Speedline Technologies, Inc. | Electronic substrate printing |
US20040142099A1 (en) * | 2003-01-17 | 2004-07-22 | Mark Rossmeisl | Electronic substrate printing |
US20040244613A1 (en) * | 2003-06-05 | 2004-12-09 | Barajas Leandro G. | System and methods for data-driven control of manufacturing processes |
US7171897B2 (en) | 2003-06-05 | 2007-02-06 | Georgia Tech Research Corporation | System and methods for data-driven control of manufacturing processes |
US20070051253A1 (en) * | 2004-02-19 | 2007-03-08 | Speedline Technologies, Inc. | Method and apparatus for performing operations within a stencil printer |
US7322288B2 (en) * | 2004-02-19 | 2008-01-29 | Speedline Technologies, Inc. | Method and apparatus for performing operations within a stencil printer |
US20080066635A1 (en) * | 2004-02-19 | 2008-03-20 | Speedline Technologies, Inc. | Method and apparatus for performing operations within a stencil printer |
US7469635B2 (en) | 2004-02-19 | 2008-12-30 | Speedline Technologies, Inc. | Method and apparatus for performing operations within a stencil printer |
US20050284917A1 (en) * | 2004-06-24 | 2005-12-29 | Checkpoint Systems, Inc. | Die attach area cut-on-fly method and apparatus |
US20100218899A1 (en) * | 2004-06-24 | 2010-09-02 | Checkpoint Systems, Inc. | Die attach area cut-on-fly method and apparatus |
US7709294B2 (en) * | 2004-06-24 | 2010-05-04 | Checkpoint Systems, Inc. | Die attach area cut-on-fly method and apparatus |
US20090014501A1 (en) * | 2006-03-29 | 2009-01-15 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method |
US8240543B2 (en) * | 2006-03-29 | 2012-08-14 | Panasonic Corporation | Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method |
US7870991B2 (en) * | 2006-09-11 | 2011-01-18 | Panasonic Corporation | Electronic component mounting system and electronic component mounting method |
US20100230472A1 (en) * | 2006-09-11 | 2010-09-16 | Panasonic Corporation | Electronic component mounting system and electronic component mounting method |
US8166875B2 (en) | 2007-05-22 | 2012-05-01 | Panasonic Corporation | Screen printing apparatus and screen printing method |
GB2449549B (en) * | 2007-05-22 | 2012-05-09 | Panasonic Corp | Screen printing apparatus and screen printing method |
GB2449549A (en) * | 2007-05-22 | 2008-11-26 | Matsushita Electric Ind Co Ltd | Screen printing apparatus and method |
US20080289518A1 (en) * | 2007-05-22 | 2008-11-27 | Matsushita Electric Industrial Co., Ltd. | Screen printing apparatus and screen printing method |
US20130204563A1 (en) * | 2012-02-03 | 2013-08-08 | Sony Corporation | Printing inspection apparatus, printing inspection system, statistical method for inspection data, program, and substrate manufacturing method |
KR20130090336A (en) * | 2012-02-03 | 2013-08-13 | 소니 주식회사 | Printing inspection apparatus, printing inspection system, statistical method for inspection data, program, and substrate manufacturing method |
KR101997928B1 (en) | 2012-02-03 | 2019-07-08 | 소니 주식회사 | Printing inspection apparatus, printing inspection system, statistical method for inspection data, program, and substrate manufacturing method |
US20140210993A1 (en) * | 2013-01-25 | 2014-07-31 | Cyberoptics Corporation | Automatic programming of solder paste inspection system |
US11176635B2 (en) * | 2013-01-25 | 2021-11-16 | Cyberoptics Corporation | Automatic programming of solder paste inspection system |
US9743527B2 (en) | 2013-08-09 | 2017-08-22 | CyberOptics Corporaiton | Stencil programming and inspection using solder paste inspection system |
WO2015047522A1 (en) * | 2013-09-30 | 2015-04-02 | Illinois Tool Works Inc. | Method and apparatus for printing small aspect features |
US9370925B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
US9370924B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Dual action stencil wiper assembly for stencil printer |
US9868278B2 (en) | 2015-04-07 | 2018-01-16 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
US9370923B1 (en) | 2015-04-07 | 2016-06-21 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SPEEDLINE TECHNOLOGIES, INC., MASSACHUSETTS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MPM CORPORATION;REEL/FRAME:009719/0352 Effective date: 19981231 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
AS | Assignment |
Owner name: SPEEDLINE HOLDINGS I, LLC, NEW YORK Free format text: NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS;ASSIGNOR:SPEEDLINE TECHNOLOGIES, INC.;REEL/FRAME:014943/0593 Effective date: 20040105 |
|
AS | Assignment |
Owner name: KPS SPECIAL SITUATIONS FUND II L.P., NEW YORK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SPEEDLINE TECHNOLOGIES, INC.;REEL/FRAME:015460/0737 Effective date: 20040521 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
AS | Assignment |
Owner name: SPEEDLINE TECHNOLOGIES, INC., MASSACHUSETTS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:SPEEDLINE HOLDINGS I, LLC;REEL/FRAME:018480/0775 Effective date: 20061106 |
|
FPAY | Fee payment |
Year of fee payment: 12 |