US6226179B1 - Mounting structure of a semiconductor device module for a computer system - Google Patents
Mounting structure of a semiconductor device module for a computer system Download PDFInfo
- Publication number
- US6226179B1 US6226179B1 US09/419,298 US41929899A US6226179B1 US 6226179 B1 US6226179 B1 US 6226179B1 US 41929899 A US41929899 A US 41929899A US 6226179 B1 US6226179 B1 US 6226179B1
- Authority
- US
- United States
- Prior art keywords
- circuit board
- printed circuit
- plate
- semiconductor unit
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 83
- 230000002093 peripheral effect Effects 0.000 claims abstract description 18
- 230000008878 coupling Effects 0.000 claims description 14
- 238000010168 coupling process Methods 0.000 claims description 14
- 238000005859 coupling reaction Methods 0.000 claims description 14
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 2
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/142—Spacers not being card guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1429—Housings for circuits carrying a CPU and adapted to receive expansion cards
- H05K7/1431—Retention mechanisms for CPU modules
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR98-43526 | 1998-10-17 | ||
KR10-1998-0043526A KR100521339B1 (en) | 1998-10-17 | 1998-10-17 | Mounting structure of semiconductor device module for a computer system |
Publications (1)
Publication Number | Publication Date |
---|---|
US6226179B1 true US6226179B1 (en) | 2001-05-01 |
Family
ID=19554413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/419,298 Expired - Lifetime US6226179B1 (en) | 1998-10-17 | 1999-10-15 | Mounting structure of a semiconductor device module for a computer system |
Country Status (2)
Country | Link |
---|---|
US (1) | US6226179B1 (en) |
KR (1) | KR100521339B1 (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6377454B1 (en) * | 1999-04-28 | 2002-04-23 | Fujitsu Limited | Heat conducting apparatus and electronic apparatus having the same |
US20020172022A1 (en) * | 1999-07-15 | 2002-11-21 | Incep Technologies, Inc. | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
US6487995B2 (en) * | 2000-11-30 | 2002-12-03 | Detroit Diesel Corporation | Engine controller and enclosure assembly |
US20030057548A1 (en) * | 1999-07-15 | 2003-03-27 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
US6542366B2 (en) * | 2000-12-28 | 2003-04-01 | Gateway, Inc. | Circuit board support |
US6574101B2 (en) * | 2000-05-12 | 2003-06-03 | Fujitsu Limited | Portable electronic device capable of efficiently cooling heat-generation electronic component |
US20030214800A1 (en) * | 1999-07-15 | 2003-11-20 | Dibene Joseph Ted | System and method for processor power delivery and thermal management |
US6724620B1 (en) | 2002-10-31 | 2004-04-20 | Hewlett-Packard Development Company, L.P. | Low profile tool-less mounting adapter |
US20040179345A1 (en) * | 2003-02-28 | 2004-09-16 | Kabushiki Kaisha Toshiba | Electronic apparatus having removable circuit board to connect expansion card |
US20050078460A1 (en) * | 2003-10-14 | 2005-04-14 | Richard Owen T. | Printed circuit board assembly mounting system |
US20050185380A1 (en) * | 2004-02-24 | 2005-08-25 | Wen-Shu Lee | Dissipation structure and method for backlight inverter |
US20060044764A1 (en) * | 2004-08-26 | 2006-03-02 | Asustek Computer Inc. | Auxiliary supporting structure of circuit board and assembling method for the same |
US7336496B1 (en) * | 2006-09-14 | 2008-02-26 | Inventec Corporation | Fixing structure for computer mainboard |
US20080187407A1 (en) * | 2007-02-02 | 2008-08-07 | Compal Electronics, Inc. | Fastening structure for reducing surface temperature of housing |
EP2802196A3 (en) * | 2013-05-07 | 2015-04-01 | Honeywell International Inc. | Radiation shield standoff |
US11195779B2 (en) | 2019-08-09 | 2021-12-07 | Raytheon Company | Electronic module for motherboard |
US20220087072A1 (en) * | 2020-09-16 | 2022-03-17 | Kioxia Corporation | Semiconductor storage device |
Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4084242A (en) | 1976-11-10 | 1978-04-11 | Pitney-Bowes, Inc. | Electronic postage weighing scale |
US4658332A (en) * | 1983-04-04 | 1987-04-14 | Raytheon Company | Compliant layer printed circuit board |
US4748495A (en) | 1985-08-08 | 1988-05-31 | Dypax Systems Corporation | High density multi-chip interconnection and cooling package |
EP0279996A1 (en) * | 1985-06-24 | 1988-08-31 | Digital Equipment Corporation | Multiple chip interconnection system and package |
US5074799A (en) * | 1991-03-27 | 1991-12-24 | Amp Incorporated | Gel connector of laminar construction |
US5287617A (en) | 1992-08-11 | 1994-02-22 | Advanced Interconnections Corporation | Apparatus for extracting an integrated circuit package installed in a socket on a circuit board |
US5369879A (en) | 1992-06-05 | 1994-12-06 | Eaton Corporation | Method of mounting a semiconductor device to a heat sink |
US5424913A (en) * | 1994-01-11 | 1995-06-13 | Dell Usa, L.P. | Heat sink/component access door for portable computers |
US5430609A (en) * | 1993-09-02 | 1995-07-04 | Kikinis; Dan | Microprocessor cooling in a portable computer |
US5444298A (en) * | 1993-02-04 | 1995-08-22 | Intel Corporation | Voltage converting integrated circuit package |
US5473510A (en) * | 1994-03-25 | 1995-12-05 | Convex Computer Corporation | Land grid array package/circuit board assemblies and methods for constructing the same |
US5526229A (en) * | 1992-02-26 | 1996-06-11 | Seiko Epson Corporation | Temperature control for add-on electronic devices |
US5619399A (en) * | 1995-02-16 | 1997-04-08 | Micromodule Systems, Inc. | Multiple chip module mounting assembly and computer using same |
US5703753A (en) * | 1995-02-16 | 1997-12-30 | Micromodule Systems Inc. | Mounting assembly for multiple chip module with more than one substrate and computer using same |
US5705932A (en) | 1995-10-10 | 1998-01-06 | Xilinx, Inc. | System for expanding space provided by test computer to test multiple integrated circuits simultaneously |
US5880930A (en) * | 1997-06-18 | 1999-03-09 | Silicon Graphics, Inc. | Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism |
US5919359A (en) | 1997-11-11 | 1999-07-06 | Bisseker; Robin | Portable pool skimmer |
US5926370A (en) | 1998-10-29 | 1999-07-20 | Hewlett-Packard Company | Method and apparatus for a modular integrated apparatus for multi-function components |
JPH11273816A (en) * | 1998-03-20 | 1999-10-08 | Fujitsu Ltd | Semiconductor component and semiconductor mounting device |
US6058012A (en) * | 1996-08-26 | 2000-05-02 | Compaq Computer Corporation | Apparatus, method and system for thermal management of an electronic system having semiconductor devices |
US6075700A (en) * | 1999-02-02 | 2000-06-13 | Compaq Computer Corporation | Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures |
US6084178A (en) * | 1998-02-27 | 2000-07-04 | Hewlett-Packard Company | Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU) |
US6144559A (en) * | 1999-04-08 | 2000-11-07 | Agilent Technologies | Process for assembling an interposer to probe dense pad arrays |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2825353B2 (en) * | 1991-01-17 | 1998-11-18 | 三菱電機株式会社 | Control device with shielding function |
SE509594C2 (en) * | 1996-01-26 | 1999-02-15 | Sandvik Ab | Indexing of inserts |
US5766022A (en) * | 1996-05-21 | 1998-06-16 | International Business Machines Corporation | Electrical assembly |
KR19990010812U (en) * | 1997-08-30 | 1999-03-25 | 송기선 | Chip type L.D.M heat sink assembly structure |
KR100530869B1 (en) * | 1998-04-24 | 2006-02-28 | 삼성전자주식회사 | Computer system with the apparatus for mounting semiconductor device module on board |
-
1998
- 1998-10-17 KR KR10-1998-0043526A patent/KR100521339B1/en not_active IP Right Cessation
-
1999
- 1999-10-15 US US09/419,298 patent/US6226179B1/en not_active Expired - Lifetime
Patent Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4084242A (en) | 1976-11-10 | 1978-04-11 | Pitney-Bowes, Inc. | Electronic postage weighing scale |
US4658332A (en) * | 1983-04-04 | 1987-04-14 | Raytheon Company | Compliant layer printed circuit board |
EP0279996A1 (en) * | 1985-06-24 | 1988-08-31 | Digital Equipment Corporation | Multiple chip interconnection system and package |
US4748495A (en) | 1985-08-08 | 1988-05-31 | Dypax Systems Corporation | High density multi-chip interconnection and cooling package |
US5074799A (en) * | 1991-03-27 | 1991-12-24 | Amp Incorporated | Gel connector of laminar construction |
US5526229A (en) * | 1992-02-26 | 1996-06-11 | Seiko Epson Corporation | Temperature control for add-on electronic devices |
US5369879A (en) | 1992-06-05 | 1994-12-06 | Eaton Corporation | Method of mounting a semiconductor device to a heat sink |
US5287617A (en) | 1992-08-11 | 1994-02-22 | Advanced Interconnections Corporation | Apparatus for extracting an integrated circuit package installed in a socket on a circuit board |
US5444298A (en) * | 1993-02-04 | 1995-08-22 | Intel Corporation | Voltage converting integrated circuit package |
US5430609A (en) * | 1993-09-02 | 1995-07-04 | Kikinis; Dan | Microprocessor cooling in a portable computer |
US5424913A (en) * | 1994-01-11 | 1995-06-13 | Dell Usa, L.P. | Heat sink/component access door for portable computers |
US5473510A (en) * | 1994-03-25 | 1995-12-05 | Convex Computer Corporation | Land grid array package/circuit board assemblies and methods for constructing the same |
US5619399A (en) * | 1995-02-16 | 1997-04-08 | Micromodule Systems, Inc. | Multiple chip module mounting assembly and computer using same |
US5703753A (en) * | 1995-02-16 | 1997-12-30 | Micromodule Systems Inc. | Mounting assembly for multiple chip module with more than one substrate and computer using same |
US5705932A (en) | 1995-10-10 | 1998-01-06 | Xilinx, Inc. | System for expanding space provided by test computer to test multiple integrated circuits simultaneously |
US6058012A (en) * | 1996-08-26 | 2000-05-02 | Compaq Computer Corporation | Apparatus, method and system for thermal management of an electronic system having semiconductor devices |
US5880930A (en) * | 1997-06-18 | 1999-03-09 | Silicon Graphics, Inc. | Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism |
US5919359A (en) | 1997-11-11 | 1999-07-06 | Bisseker; Robin | Portable pool skimmer |
US6084178A (en) * | 1998-02-27 | 2000-07-04 | Hewlett-Packard Company | Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU) |
JPH11273816A (en) * | 1998-03-20 | 1999-10-08 | Fujitsu Ltd | Semiconductor component and semiconductor mounting device |
US5926370A (en) | 1998-10-29 | 1999-07-20 | Hewlett-Packard Company | Method and apparatus for a modular integrated apparatus for multi-function components |
US6075700A (en) * | 1999-02-02 | 2000-06-13 | Compaq Computer Corporation | Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures |
US6144559A (en) * | 1999-04-08 | 2000-11-07 | Agilent Technologies | Process for assembling an interposer to probe dense pad arrays |
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6377454B1 (en) * | 1999-04-28 | 2002-04-23 | Fujitsu Limited | Heat conducting apparatus and electronic apparatus having the same |
US6947293B2 (en) * | 1999-07-15 | 2005-09-20 | Incep Technologies | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
US20020172022A1 (en) * | 1999-07-15 | 2002-11-21 | Incep Technologies, Inc. | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
US20030057548A1 (en) * | 1999-07-15 | 2003-03-27 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
US7881072B2 (en) | 1999-07-15 | 2011-02-01 | Molex Incorporated | System and method for processor power delivery and thermal management |
US20030214800A1 (en) * | 1999-07-15 | 2003-11-20 | Dibene Joseph Ted | System and method for processor power delivery and thermal management |
US20070268677A1 (en) * | 1999-07-15 | 2007-11-22 | Molex Incorporated | System and method for processor power delivery and thermal management |
US20070004240A1 (en) * | 1999-07-15 | 2007-01-04 | Molex Incorporated | System and method for processor power delivery and thermal management |
US6801431B2 (en) * | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
US20050277310A1 (en) * | 1999-07-15 | 2005-12-15 | Molex Incorporated | System and method for processor power delivery and thermal management |
US6574101B2 (en) * | 2000-05-12 | 2003-06-03 | Fujitsu Limited | Portable electronic device capable of efficiently cooling heat-generation electronic component |
US6487995B2 (en) * | 2000-11-30 | 2002-12-03 | Detroit Diesel Corporation | Engine controller and enclosure assembly |
US6542366B2 (en) * | 2000-12-28 | 2003-04-01 | Gateway, Inc. | Circuit board support |
US6724620B1 (en) | 2002-10-31 | 2004-04-20 | Hewlett-Packard Development Company, L.P. | Low profile tool-less mounting adapter |
US7012804B2 (en) * | 2003-02-28 | 2006-03-14 | Kabushiki Kaisha Toshiba | Electronic apparatus having removable circuit board to connect expansion card |
US20040179345A1 (en) * | 2003-02-28 | 2004-09-16 | Kabushiki Kaisha Toshiba | Electronic apparatus having removable circuit board to connect expansion card |
US20050078460A1 (en) * | 2003-10-14 | 2005-04-14 | Richard Owen T. | Printed circuit board assembly mounting system |
US20050185380A1 (en) * | 2004-02-24 | 2005-08-25 | Wen-Shu Lee | Dissipation structure and method for backlight inverter |
US20060044764A1 (en) * | 2004-08-26 | 2006-03-02 | Asustek Computer Inc. | Auxiliary supporting structure of circuit board and assembling method for the same |
US7352586B2 (en) * | 2004-08-26 | 2008-04-01 | Asustek Computer Inc. | Auxiliary supporting structure of circuit board and assembling method for the same |
US20080068808A1 (en) * | 2006-09-14 | 2008-03-20 | Inventec Corporation | Fixing structure for computer mainboard |
US7336496B1 (en) * | 2006-09-14 | 2008-02-26 | Inventec Corporation | Fixing structure for computer mainboard |
US20080187407A1 (en) * | 2007-02-02 | 2008-08-07 | Compal Electronics, Inc. | Fastening structure for reducing surface temperature of housing |
EP2802196A3 (en) * | 2013-05-07 | 2015-04-01 | Honeywell International Inc. | Radiation shield standoff |
US9521789B2 (en) | 2013-05-07 | 2016-12-13 | Honeywell International, Inc. | Radiation shield standoff |
US11195779B2 (en) | 2019-08-09 | 2021-12-07 | Raytheon Company | Electronic module for motherboard |
US20220087072A1 (en) * | 2020-09-16 | 2022-03-17 | Kioxia Corporation | Semiconductor storage device |
US11744046B2 (en) * | 2020-09-16 | 2023-08-29 | Kioxia Corporation | Semiconductor storage device |
Also Published As
Publication number | Publication date |
---|---|
KR100521339B1 (en) | 2005-12-21 |
KR20000026140A (en) | 2000-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SAMSUNG ELECTRONICS CO., LTD., A CORP. OF KOREA, K Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LEE, SUNG-BAE;REEL/FRAME:010325/0613 Effective date: 19991015 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 4 |
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FPAY | Fee payment |
Year of fee payment: 8 |
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FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
AS | Assignment |
Owner name: TRANSPACIFIC AVARTAR, LLC, DELAWARE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SAMSUNG ELECTRONICS CO., LTD.;REEL/FRAME:022034/0236 Effective date: 20081030 |
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FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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FPAY | Fee payment |
Year of fee payment: 12 |