US6265762B1 - Lead frame and semiconductor device using the lead frame and method of manufacturing the same - Google Patents
Lead frame and semiconductor device using the lead frame and method of manufacturing the same Download PDFInfo
- Publication number
- US6265762B1 US6265762B1 US08/820,228 US82022897A US6265762B1 US 6265762 B1 US6265762 B1 US 6265762B1 US 82022897 A US82022897 A US 82022897A US 6265762 B1 US6265762 B1 US 6265762B1
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- Prior art keywords
- semiconductor chip
- leads
- lead
- supporting body
- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 222
- 238000004519 manufacturing process Methods 0.000 title description 12
- 239000011295 pitch Substances 0.000 claims description 68
- 239000011347 resin Substances 0.000 claims description 53
- 229920005989 resin Polymers 0.000 claims description 53
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims 2
- 239000004416 thermosoftening plastic Substances 0.000 claims 2
- 238000000034 method Methods 0.000 description 17
- 230000005855 radiation Effects 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 230000003247 decreasing effect Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000010354 integration Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 241000272168 Laridae Species 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000010485 coping Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 239000010953 base metal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
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Abstract
Description
Claims (18)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US09/904,839 US6909179B2 (en) | 1996-03-18 | 2001-07-16 | Lead frame and semiconductor device using the lead frame and method of manufacturing the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8-060421 | 1996-03-18 | ||
JP6042196 | 1996-03-18 | ||
JP9-008964 | 1997-01-21 | ||
JP9008964A JPH09312375A (en) | 1996-03-18 | 1997-01-21 | Lead frame, semiconductor device and manufacture thereof |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/904,839 Continuation US6909179B2 (en) | 1996-03-18 | 2001-07-16 | Lead frame and semiconductor device using the lead frame and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US6265762B1 true US6265762B1 (en) | 2001-07-24 |
Family
ID=26343600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/820,228 Expired - Lifetime US6265762B1 (en) | 1996-03-18 | 1997-03-18 | Lead frame and semiconductor device using the lead frame and method of manufacturing the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US6265762B1 (en) |
JP (1) | JPH09312375A (en) |
KR (2) | KR100475265B1 (en) |
CN (2) | CN1156910C (en) |
MY (1) | MY121618A (en) |
TW (1) | TW347585B (en) |
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US20030067067A1 (en) * | 2000-02-18 | 2003-04-10 | Yoshinori Miyaki | Semiconductor integrated circuit device and method of manufacturing the same |
US20030141579A1 (en) * | 2002-01-28 | 2003-07-31 | Yoshinori Oda | Lead frame for resin-molded semiconductor device |
US20040051167A1 (en) * | 2000-10-20 | 2004-03-18 | Hitachi, Ltd. | Semiconductor device and its manufacturing method |
US6713850B1 (en) * | 2000-11-10 | 2004-03-30 | Siliconware Precision Industries Co., Ltd. | Tape carrier package structure with dummy pads and dummy leads for package reinforcement |
US20040113280A1 (en) * | 2002-12-16 | 2004-06-17 | Kim Tae-Hun | Multi-chip package |
US20040159922A1 (en) * | 1996-12-26 | 2004-08-19 | Yoshinori Miyaki | Plastic molded type semiconductor device and fabrication process thereof |
US20040195699A1 (en) * | 2003-04-04 | 2004-10-07 | Massingill Thomas Joel | Semiconductor package with recess for die |
US6821822B1 (en) * | 1998-03-26 | 2004-11-23 | Seiko Epson Corporation | Method of manufacturing semiconductor device, molding device for semiconductor device, and semiconductor device |
US6975021B1 (en) * | 1999-09-03 | 2005-12-13 | Micron Technology, Inc. | Carrier for substrate film |
US7009283B1 (en) * | 1999-04-14 | 2006-03-07 | Amkor Technology, Inc. | Nonexposed heat sink for semiconductor package |
US20060134826A1 (en) * | 2004-04-15 | 2006-06-22 | Kheng Lee T | Methods of forming semiconductor packages |
US20060131706A1 (en) * | 2004-08-31 | 2006-06-22 | Corisis David J | Methods of making and using a floating lead finger on a lead frame |
US20060175687A1 (en) * | 2005-02-04 | 2006-08-10 | Grewal Roopinder S | Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe |
US20060216863A1 (en) * | 2005-03-28 | 2006-09-28 | Renesas Technology Corp. | Method of manufacturing semiconductor device |
US7199477B1 (en) * | 2000-09-29 | 2007-04-03 | Altera Corporation | Multi-tiered lead package for an integrated circuit |
US20090001531A1 (en) * | 2007-06-29 | 2009-01-01 | Byung Tai Do | Integrated circuit package system with integral inner lead and paddle |
US20090283878A1 (en) * | 2008-05-19 | 2009-11-19 | Powertech Technology Inc. | Lead-on-chip semiconductor package and leadframe for the package |
CN102332441A (en) * | 2010-07-12 | 2012-01-25 | 无锡华润安盛科技有限公司 | High-alignment-packaging-type lead frame and packaging structure thereof |
US8450841B2 (en) * | 2011-08-01 | 2013-05-28 | Freescale Semiconductor, Inc. | Bonded wire semiconductor device |
US9209153B2 (en) | 2013-08-28 | 2015-12-08 | Renesas Electronics Corporation | Semiconductor device and method of manufacturing the semiconductor device |
US9337240B1 (en) * | 2010-06-18 | 2016-05-10 | Altera Corporation | Integrated circuit package with a universal lead frame |
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JP2002176131A (en) * | 2000-12-08 | 2002-06-21 | Hitachi Ltd | Manufacturing method for semiconductor device |
US8841758B2 (en) * | 2012-06-29 | 2014-09-23 | Freescale Semiconductor, Inc. | Semiconductor device package and method of manufacture |
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- 1997-01-21 JP JP9008964A patent/JPH09312375A/en active Pending
- 1997-03-05 TW TW086102661A patent/TW347585B/en not_active IP Right Cessation
- 1997-03-12 MY MYPI97001026A patent/MY121618A/en unknown
- 1997-03-14 KR KR1019970008685A patent/KR100475265B1/en not_active IP Right Cessation
- 1997-03-17 CN CNB971033129A patent/CN1156910C/en not_active Expired - Fee Related
- 1997-03-17 CN CNB2004100368185A patent/CN100359678C/en not_active Expired - Fee Related
- 1997-03-18 US US08/820,228 patent/US6265762B1/en not_active Expired - Lifetime
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2004
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US20040159922A1 (en) * | 1996-12-26 | 2004-08-19 | Yoshinori Miyaki | Plastic molded type semiconductor device and fabrication process thereof |
US6943456B2 (en) * | 1996-12-26 | 2005-09-13 | Hitachi Ulsi Systems Co., Ltd. | Plastic molded type semiconductor device and fabrication process thereof |
US6821822B1 (en) * | 1998-03-26 | 2004-11-23 | Seiko Epson Corporation | Method of manufacturing semiconductor device, molding device for semiconductor device, and semiconductor device |
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US20060175687A1 (en) * | 2005-02-04 | 2006-08-10 | Grewal Roopinder S | Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe |
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US20090283878A1 (en) * | 2008-05-19 | 2009-11-19 | Powertech Technology Inc. | Lead-on-chip semiconductor package and leadframe for the package |
US9337240B1 (en) * | 2010-06-18 | 2016-05-10 | Altera Corporation | Integrated circuit package with a universal lead frame |
CN102332441A (en) * | 2010-07-12 | 2012-01-25 | 无锡华润安盛科技有限公司 | High-alignment-packaging-type lead frame and packaging structure thereof |
CN102332441B (en) * | 2010-07-12 | 2014-05-14 | 无锡华润安盛科技有限公司 | High-alignment-packaging-type lead frame and packaging structure thereof |
US8450841B2 (en) * | 2011-08-01 | 2013-05-28 | Freescale Semiconductor, Inc. | Bonded wire semiconductor device |
US9209153B2 (en) | 2013-08-28 | 2015-12-08 | Renesas Electronics Corporation | Semiconductor device and method of manufacturing the semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
KR100475265B1 (en) | 2005-07-01 |
CN1156910C (en) | 2004-07-07 |
MY121618A (en) | 2006-02-28 |
TW347585B (en) | 1998-12-11 |
JPH09312375A (en) | 1997-12-02 |
CN100359678C (en) | 2008-01-02 |
KR970067736A (en) | 1997-10-13 |
CN1595646A (en) | 2005-03-16 |
KR100473261B1 (en) | 2005-03-14 |
CN1164127A (en) | 1997-11-05 |
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