US6351368B1 - Lead-through type filter with built-in rectangular elements - Google Patents

Lead-through type filter with built-in rectangular elements Download PDF

Info

Publication number
US6351368B1
US6351368B1 US09/556,191 US55619100A US6351368B1 US 6351368 B1 US6351368 B1 US 6351368B1 US 55619100 A US55619100 A US 55619100A US 6351368 B1 US6351368 B1 US 6351368B1
Authority
US
United States
Prior art keywords
lead
case
type filter
ceramic
angular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US09/556,191
Inventor
Sung Youl Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Expantech Co Ltd
Original Assignee
Expantech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Expantech Co Ltd filed Critical Expantech Co Ltd
Assigned to EXPANTECH. CO., LTD. reassignment EXPANTECH. CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, SUNG YOUL
Application granted granted Critical
Publication of US6351368B1 publication Critical patent/US6351368B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • H01F17/06Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10Housing; Encapsulation
    • H01G2/106Fixing the capacitor in a housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/35Feed-through capacitors or anti-noise capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • H01F17/06Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H01F2017/065Core mounted around conductor to absorb noise, e.g. EMI filter
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/027Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/24Magnetic cores
    • H01F27/26Fastening parts of the core together; Fastening or mounting the core on casing or support
    • H01F27/266Fastening or mounting the core on casing or support
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H1/0007Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0014Capacitor filters, i.e. capacitors whose parasitic inductance is of relevance to consider it as filter
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021Constructional details
    • H03H2001/0085Multilayer, e.g. LTCC, HTCC, green sheets

Abstract

A lead-through type filter used in a dc line for removing noises is disclosed. The lead-through type filter having angular elements according to the present invention includes a case 25 to be used as an external grounding terminal. A central conductive line 21 supplies a dc power and serves as IN/OUT terminals. At least one angular filtering element made of an angular ceramic stock is accommodated within the case. One side electrode is attached on a face of the ceramic stock and is electrically connected to the case 25. Another side electrode is attached on another face of the ceramic stock and is electrically connected to the central conductive line 21. An epoxy resin is filled into the interior of the case 25. Instead of the conventional lead-through type capacitor, polygonal capacitors are used in the present invention, and therefore, the capacitance control becomes easy, while the errors can be minimized. Further, the voltage withstanding characteristic is improved, and the workability is also improved during the manufacture.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a lead-through type filter used in a dc line for removing noises. Particularly, the present invention relates to a lead-through type filter with a built-in rectangular element, in which instead of the conventional lead-through type capacitor, the capacitor of the lead-through type filter of the present invention is made polygonal, so that the capacitance of the capacitor can be easily managed, that the errors can be minimized, that the voltage withstanding capability is made high, and that the workability can be improved.
2. Description of the Prior Art
Generally, EMI (electro magnetic interference) noise filter can be classified based on the functions into: a low pass filter (LPF) for passing only low bands; a high pass filter (HPF) for passing only high bands; a band pass filter (BPF) for passing only a particular band; and a band rejection filter (BRF) for removing only a particular band. Further, the filters can be classified based on the constituent elements into: a passive filter composed of a combination of passive elements such as inductor, capacitor and varistor; and an active filter composed of a combination of an active element such as transistor and passive elements such as capacitor and varistor.
The general lead-through type filter which is illustrated in FIG. 1 belongs to a low pass filter if it is classified functionally, and belongs to an EMI filter if it is classified constitutionally. Such a lead-through type filter is composed of a combination of a lead-through type inductor and a lead-through type capacitor, and depending on the combinations of the elements, the filter can be formed into an a π type, T type, or LC noise filter.
Meanwhile, the noises of various frequencies which are generated in the oscillations of the communication facilities, the broadcasting facilities and the magnetrons are released through the power supply line to be propagated into the space, and to cause noises and malfunctions in the surrounding apparatuses. The lead-through type filter is used to eliminate the noises which are released through the power supply line.
FIG. 2 is a longitudinal sectional view showing the internal constitution of the conventional lead-through type filter. Referring to FIG. 2, this conventional lead-through type filter includes a lead-through type capacitor and a lead-through type inductor, or includes only a lead-through type capacitor. That is, within a case 15 which serves as a ground terminal, a lead-through type inductor 12 made of a ferrite magnetic material and a lead-through type capacitor 13 made of a ceramic material are installed on a conductive line 11 which passes through the mentioned elements 12 and 13. Further, an epoxy resin 14 is coated on the whole device. Further, IN/OUT terminals extend to the outside of the case 15, while the case 15 is grounded to be installed on a circuit board.
As to the manufacturing process for this lead-through type filter, first the lead-through type inductor 12 and the lead-trough type capacitor 13 are manufactured. Then a conductive line 11 is made to pass through the lead-through type inductor 12 and the lead-through type capacitor 13. Then the conductive line 11 is soldered to an internal electrode 13 c of the lead-trough type capacitor 13. Then the cylindrical case 15 is fitted to it, and the case 15 is soldered to an external electrode 13 b of the lead-through type capacitor 13. Then the epoxy resin 14 is filled into a vacant space within the cylindrical case 15. As shown in the equivalent circuit of FIG. 4, this lead-through type filter serves as an LC low pass filter. In FIG. 5, reference code 27 indicates an electrically connected portion such as a soldered portion.
As shown in FIGS. 3a and 3 b, in the lead-through type (cylindrical type) capacitor, its external circumferential surface form the external electrode 13 b to be bypassingly grounded, while its internal circumferential surface form an internal electrode 13 c to serve as a dc line terminal.
However, in this conventional lead-through type filter, there are roughly three problems due to the lead-through type capacitor. First, the error control becomes difficult due to the geometric contour of the lead-through type capacitor. Second, the manufacturing work becomes fastidious due to its geometric contour. Third, the thicknesses between the external and internal circumferences are not constant, and therefore, the voltage withstanding capability which is based on the thinner portion is weak. These will be described in detail below.
First the difficulty of controlling the errors will be described. In this conventional lead-through type capacitor, regardless of the step of the external circumferential surface, the external and internal circumferential surfaces are round, and there is a great difference between the areas of the two surfaces. Therefore, the capacitance management which directly affects the filtering band of the capacitor becomes difficult. Accordingly, the error control among the products becomes difficult. Therefore, if an error occurs in the form of a too large a capacitance, one end of the lead-through type capacitor is trimmed, thereby attaining to the desired capacitance value. On the other hand, if an error occurs in the form of too small a capacitance, then the product is discarded as a defective one.
Second, the manufacturing difficulty will be described. In the conventional lead-through type capacitor of the filter as shown in FIG. 3, a specially prepared die is used to manufacture the stepped external electrode of the capacitor, and therefore, the manufacturing process is difficult. Further, the diameter of the internal electrode of the capacitor has to be varied according to the diameter of the conductive line used, thereby making the manufacture difficult. Further, the electrical connection between the conductive line and the internal electrode of the capacitor has to be done by carrying out a cream-soldering into the tiny gap between the conductive line and the internal electrode of the capacitor, thereby making it difficult to manufacture the lead-through type capacitor.
Finally, the weakness of the voltage withstanding will be described, If a voltage surge occurs, an insulator breakdown can occur due to the small thickness between the external and internal electrodes of the capacitor.
SUMMARY OF THE INVENTION
The present invention is intended to overcome the above described disadvantages of the conventional technique.
Therefore it is an object of the present invention to provide a lead-through type filter with a built-in rectangular element, in which instead of the conventional lead-through type capacitor, the capacitor of the lead-through type filter is made polygonal, so that the capacitance of the capacitor can be easily managed, that the errors can be minimized, that the voltage withstanding capability is made high, and that the workability can be improved.
It is another object of the present invention to provide a lead-through type filter with a built-in rectangular element, in which the lead-through type filter having the polygonal capacitor is manufactured in an array form, so that the workability can be improved, the manufacture can be made simple, and the material used can be saved, thereby curtailing the manufacturing cost.
In achieving the above objects, the lead-through type filter having angular elements according to the present invention includes: a case to be used as an external grounding terminal; a central conductive line for supplying a dc power; at least one angular filtering element accommodated within the case and made of an angular ceramic stock, with one side electrode being attached on a face of the ceramic stock and being electrically connected to the case, and with another side electrode being attached on another face of the ceramic stock and being electrically connected to the central conductive line; and an epoxy resin layer filled into an interior of the case.
In another aspect of the present invention, the lead-trough type filter having angular elements according to the present invention includes: a multi-case having at least two element accommodating rooms and to be used as an external grounding terminal; a central conductive line for supplying a dc power; at least one angular filtering element made of an angular ceramic stock, with one side electrode being attached on a face of the ceramic stock and being electrically connected to the element accommodating rooms of the multi-case, and with another side electrode being attached on another face of the ceramic stock and being electrically connected to the central conductive line, so as to be accommodated within the element accommodating rooms of the multi-case; and an epoxy resin layer filled into an interior of the multi-case.
BRIEF DESCRIPTION OF THE DRAWINGS
The above objects and other advantages of the present invention will become more apparent by describing in detail the preferred embodiment of the present invention with reference to the attached drawings in which:
FIG. 1 is a perspective view of the general lead-through type filter;
FIG. 2 is a longitudinal sectional view showing the internal constitution of the conventional lead-through type filter;
FIG. 3 is a longitudinal sectional view showing the internal constitution of the conventional lead-through type capacitor;
FIG. 4 is a perspective view of the lead-through type capacitor of FIG. 2;
FIG. 5 is a longitudinal sectional view showing the internal constitution of a first embodiment of the lead-through type filter according to the present invention;
FIG. 6 is a plan view of the filter of FIG. 5;
FIG. 7 is a partly cut-out view of the filter of FIG. 5;
FIG. 8 is a partly cut-out view showing another internal structure of the filter of FIG. 5;
FIG. 9a is a side view of the angular capacitor of FIG. 5;
FIG. 9b is a perspective view of the angular capacitor of FIG. 5;
FIG. 10a is a side view of the stacked type capacitor of FIG. 5;
FIG. 10b is a perspective view of the stacked type capacitor of FIG. 5;
FIGS. 11a, 11 b and 11 c are equivalent circuits of the filter of FIG. 5;
FIG. 12a illustrates a first modified example of the first embodiment of FIG. 5;
FIG. 12b is an equivalent circuit of FIG. 12a;
FIG. 13a illustrates a second modified example of the first embodiment of FIG. 5;
FIG. 13b is an equivalent circuit of FIG. 13a;
FIG. 14a illustrates a third modified example of the first embodiment of FIG. 5;
FIG. 14b is an equivalent circuit of FIG. 14a;
FIG. 15a illustrates a fourth modified example of the first embodiment of FIG. 5;
FIG. 15b is an equivalent circuit of FIG. 15a;
FIG. 16 illustrates still another modified example of the filter of FIG. 12;
FIG. 17 is a sectional view showing a second embodiment of the lead-through type filter according to the present invention;
FIG. 18 is a plan view of FIG. 17;
FIG. 19 illustrates a first modified example of the second embodiment of FIG. 17;
FIG. 20 illustrates a second modified example of the second embodiment of FIG. 17; and
FIG. 21 illustrates a third modified example of the second embodiment of FIG. 17.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention will be described in detail referring to the attached drawings.
In the lead-through type filter having polygonal filtering elements according to the present invention, at least a polygonal capacitor is used so that the capacitance of the capacitor can be easily managed, that the errors can be minimized, that the voltage withstanding capability can be made high, and that the workability can be improved. Accordingly, the noises can be effectively removed at the desired band. Further, inductors and angular or polygonal capacitors can be arrayed in an easy manner, and in accordance with the array method, a π T type, T type or LC noise filter can be easily manufactured. Further, a plurality of the lead-through type filters can be formed within a single case in an array form, thereby curtailing the manufacturing cost.
FIG. 5 is a longitudinal sectional view showing the internal constitution of a first embodiment of the lead-through type filter according to the present invention. FIG. 6 is a plan view of the filter of FIG. 5. Referring to FIGS. 5 and 6, the lead-trough type filter having angular elements according to the present invention includes: a case 25 to be used as an external grounding terminal; a central conductive line 21 for supplying a dc power and serving as IN/OUT terminals; at least one angular filtering element accommodated within the case and made of an angular ceramic stock, with one side electrode being attached on a face of the ceramic stock and being electrically connected to the case 25, and with another side electrode being attached on another face of the ceramic stock and being electrically connected to the central conductive line 21; and an epoxy resin layer 24 filled into an interior of the case 25.
The case 25 includes a large diameter interior space, and a small diameter interior space. A filtering element which is accommodated within the large diameter interior space of the case 25 is an angular ceramic stock 23 a. A one side electrode 23 b is attached on one face of the ceramic stock and is electrically connected to the inside of the case 25. Another side electrode 23 c is attached to another face of the ceramic stock and is electrically connected to the central conductive line 21. Thus within the large diameter interior space of the case 25, there is accommodated at least one angular capacitor 23. For example, in the case where one single angular capacitor is provided, the equivalent circuit is as shown in FIG. 11a. In this equivalent circuit, a capacitor C23 is for removing the noises.
The filtering element is accommodated within the large diameter interior space of the case 25. This filtering element which is accommodated within the large diameter interior space of the case 25 is an angular ceramic stock 29 a. A one side electrode 29 b is attached on one face of the ceramic stock and is electrically connected to the inside of the case 25. Another side electrode 29 c is attached to another face of the ceramic stock and is electrically connected to the central conductive line 21. Thus within the large diameter interior space of the case 25, there is accommodated at least one angular varistor 29.
The filtering elements may include at least one angular capacitor and at least one angular varistor. For example, in the case where one angular capacitor and one angular varistor are provided, the equivalent circuit is as shown in FIG. 11b. In this equivalent circuit, a capacitor C23 removes the noises, while a varistor R29 blocks any over-voltage or over-current due to a surge, thereby protecting the applied apparatus.
Further, the lead-through type filter may include a cylindrical ferrite magnetic body (major ingredients: NiO, ZnO, Fe) having an axial through hole, thereby forming at least one lead-through type inductor 22. The conductive line 21 is inserted through the axial through hole of the magnetic body, and the magnetic body is accommodated within the small diameter interior space of the case 25. For example, in the case where the filter includes one angular capacitor, one angular varistor and one inductor, the equivalent circuit is as shown in FIG. 11c. In this equivalent circuit, the capacitor C23 and the inductor L22 remove noises, while the varistor R29 blocks any over-voltage or over-current due to a surge or the like.
Meanwhile, the filtering element may consist of a polygonal capacitor. For example, it may be of a rectangular shape as shown in FIGS. 9a and 9 b, or it may be a stacked type capacitor as shown in FIGS. 10a and 10 b.
Meanwhile, the angular capacitor may consist of a plurality of capacitors, and in the case where a plurality of capacitors are provided, the dielectric constants of the ceramic stocks of the capacitors may be same to one another, or they may be different from one another.
Further, in order to prevent the epoxy resin 24 from flowing out during its injection, the lead-through type filter 20 includes a tubular insulator 26 within the entrance of the case 25.
In the case 25, a stepped portion is formed within the large diameter interior space of the case 25 along the corner portion of the small diameter interior space, so that the central conductive line 21 can be prevented from being short-circuited with the other end electrode of the connected element. This short-circuit preventing stepped portion may consist of an insulator or an inductor.
FIG. 7 is a partly cut-out view of the filter of FIG. 5. FIG. 8 is a partly cut-out view showing another internal structure of the filter of FIG. 5. Referring to FIG. 7, a stepped portion 25 a is formed within the large diameter interior space of the case 25 along the corner portion of the small diameter interior space, so that the inside of the case 25 can be prevented from being short-circuited with one electrode 23 b of the angular capacitor 23. This stepped portion may be formed integrally with the case 25 during its manufacture, or a separate short-circuit preventing insulator piece 28 may be inserted into the case 25 after its manufacture as shown in FIG. 8. As shown in FIG. 8, the short-circuit preventing insulator piece 28 may be made of any kind of insulator, or may be an insulating inductor. In the case where an inductor is used, the required short-circuit prevention is ensured, and at the same time, it serves as an additional inductor, so that the filter may act as a wide band filter.
The capacitor 23 is a simple angular type, and therefore, it does not require a die unlike in the conventional method. Further, it does not have a special geometric contour, and therefore, its manufacture is easy in view of the thickness and area managements. Further, the area of the bypassing ground terminal electrode is almost same as the area of the dc line terminal electrode, with the result that the errors are minimized. Accordingly, defective products are almost eliminated. Further, the angular capacitor 23 has a thickness larger than that of the thick and thin portions of the conventional lead-through type capacitor, and therefore, the voltage withstanding capability is superior in the relative terms.
In forming the lead-through type capacitor, if one or more of the tubular insulator is inserted into between the cylindrical ground terminal and the central terminal, the insulation between the two terminals are strengthened, and the workability is improved during the injection of the epoxy resin.
As described above, the lead-through type filter having angular elements according to the present invention includes at least one angular capacitor, and at least one inductor additionally. The diversified modifications of the present invention will be described below, and in all of these modified examples of the lead-through type filter, the electrical connection method and the manufacturing processes are same. Only, the position and the number of the inductors and capacitors are modified, and thus, a π type, T type and LC noise filters can be embodied.
FIG. 9a is a side view of the angular capacitor of FIG. 5. FIG. 9b is a perspective view of the angular capacitor of FIG. 5. Referring to FIGS. 9a and 9 b, the angular capacitor 23 which is accommodated within the case 25 of the lead-through type filter 20 is manufactured in the following manner. That is, a wafer of a ceramic stock 23 a having a proper thickness is prepared. Then electrodes 23 b and 23 c are formed on the top and bottom of the ceramic stock, and then, the wafer is cut into pieces such that they can be respectively accommodated within the case, and that they would have the required capacitance respectively. Alternatively, the angular capacitors 23 may be manufactured individually, and thus, the manufacturing method for the angular capacitor is not limited at any case. Meanwhile, the lead-through type filter of FIG. 5 acts as an LC low pass filter as shown in the equivalent circuit of FIG. 11.
FIG. 10a is a side view of the stacked type capacitor of FIG. 5. FIG. 10b is a perspective view of the stacked type capacitor of FIG. 5. Referring to FIGS. 10a and 10 b, the angular capacitor 23 which is accommodated within the case 25 of the lead-through type filter 20 may be a ceramic capacitor or a multi-layer capacitor, i.e., a stacked type capacitor.
FIG. 12a illustrates a first modified example of the first embodiment of FIG. 5. FIG. 12b is an equivalent circuit of FIG. 12a. Referring to FIG. 12a, the first modified example of the first embodiment of the lead-through type filter includes: two lead-through type inductors 32 a and 32 b; and two angular capacitors 33-1 and 33-2 disposed between the two inductors 32 a and 32 b. The lead-through type filter of FIG. 12a acts as a T type noise filter in which the angular capacitors 33-1 and 33-2 are disposed at the center, and the inductors 32 a and 32 b are disposed at the both sides of the former as shown in FIG. 12b.
FIG. 13a illustrates a second modified example of the first embodiment of FIG. 5. FIG. 13b is an equivalent circuit of FIG. 13a. Referring to FIG. 13a, the lead-through type filter as the second modified example of the first embodiment includes: one lead-through type inductor 42; and two angular capacitors 43-1 and 43-2 disposed at a side of the inductor 42. The lead-through type filter of FIG. 13a acts as a wide band LC noise filter in which the inductor 42 is disposed at a side of the angular capacitors 43-1 and 43-2 as shown in FIG. 13b.
FIG. 14a illustrates a third modified example of the first embodiment of FIG. 5. FIG. 14b is an equivalent circuit of FIG. 14 a. Referring to FIG. 14a, the lead-through type filter as the third modified example of the first embodiment includes: one lead-through type inductor 52; and four angular capacitors 53-1 to 53-4. The lead-through type filter of FIG. 14a acts as a π type noise filter in which the capacitors 53-1 and 53-2 are disposed at a side of the inductor 52, and the capacitors 53-3 and 53-4 are disposed at another side of the inductor 52 as shown in FIG. 14b.
FIG. 15a illustrates a fourth modified example of the first embodiment of FIG. 5. FIG. 15b is an equivalent circuit of FIG. 15a. Referring to FIG. 15a, the lead-through type filter as the fourth modified example of the first embodiment includes only two angular capacitors 63-1 and 63-2. This filter acts as a high band LC noise filter.
FIG. 16 illustrates still another modified example of the filter of FIG. 12. Referring to FIG. 16, the lead-through type filter as still another modified example of FIG. 12 includes: two angular capacitors 33-1 and 33-2; and two inductors 32 a and 32 b, each being disposed at a side of the two angular capacitors 33-1 and 33-2. An annular projection is formed between the inductor 32 a and the capacitors 33-1 and 33-2, and therefore, the workability of inserting to the elements into case is improved.
FIG. 17 is a sectional view showing a second embodiment of the lead-through type filter according to the present invention. FIG. 18 is a plan view of FIG. 17. Referring to FIGS. 17 and 18, the lead-through type filter having angular elements according to the present invention includes: a multi-case having accommodating rooms for at least two elements and to be served as an external ground terminal; a central conductor line 21 for supplying a dc power; at least one angular filtering element having an angular ceramic stock, an electrode being formed on one face of the ceramic stock and being electrically connected to an inside of the accommodating room of the multi-case, and another electrode being formed on another face of the ceramic stock and being electrically connected to the central conductive line 21; and an epoxy resin layer filled into the multi-case.
The multi-case includes a large diameter interior space, and a small diameter interior space. A filtering element which is accommodated within the large diameter interior space of the multi-case is an angular ceramic stock 23 a. A one side electrode 23 b is attached on one face of the ceramic stock and is electrically connected to the inside of the multi-case. Another side electrode 23 c is attached to another face of the ceramic stock and is electrically connected to the central conductive line 21. Thus within the large diameter interior space of the case 25, there is accommodated at least one angular capacitor 23.
The filtering element is accommodated within the large diameter interior space of the multi-case. This filtering element which is accommodated within the large diameter interior space of the multi-case is an angular ceramic stock 29 a. A one side electrode 29 b is attached on one face of the ceramic stock and is electrically connected to the inside of the multi-case. Another side electrode 29 c is attached to another face of the ceramic stock and is electrically connected to the central conductive line 21. Thus within the large diameter interior space of the multi-case 25, there is accommodated at least one angular varistor 29.
The filtering elements may include at least one angular capacitor and at least one angular varistor. Further, the lead-trough type filter may include a cylindrical ferrite magnetic body having an axial through hole, thereby forming at least one lead-through type inductor 22 which is accommodated within the small diameter interior space of the multi-case.
As described above, in this second embodiment of the present invention as an array type lead-through type filter, the contained elements and materials are same as those of the first embodiment. The different feature lies in the fact that one case including a plurality of cylindrical cases (multi-case) forms a plurality of filters. If the second embodiment is applied, the simplification of the manufacturing process, the curtailing of the manufacturing cost, the improvement of the workability, can be attained, thereby realizing a stronger competitiveness.
FIG. 19 illustrates a first modified example of the second embodiment of FIG. 17. Referring to FIG. 19, in order to reduce the thickness of the multi-case 35, the small diameter interior space is minimized.
FIG. 20 illustrates a second modified example of the second embodiment of FIG. 17. Referring to FIG. 20, in order to facilitate the formation of the multi-case 45, the thickness of the multi-case is made thin, and a plurality of element accommodating rooms are formed, thereby realizing array type lead-through type filters.
FIG. 21 illustrates a third modified example of the second embodiment of FIG. 17. Referring to FIG. 21, in order to reduce the thickness of the multi-case 45 of FIG. 20, the small diameter interior space is minimized or eliminated.
According to the present invention as described above, the capacitance control becomes easy by controlling the thickness or areas the elements during the manufacture of the lead-through type filter having the polygonal elements. Further, the withstanding against a surge is superior, and an easily manufactured polygonal capacitors are employed, so that noises can be effectively removed at the desired band. Further, the voltage withstanding characteristic is also superior.
The lead-through type filter having polygonal elements according to the present invention can be easily embodied into π type, T type, or LC noise filters in accordance with the sequence and method of arranging the inductors and capacitors between the ground terminal and the central terminal. Further, when arranging the polygonal elements within the case of the filter, the workability is improved.
Further, if one or more of tubular insulator is inserted into between the cylindrical ground terminal and the central terminal, the insulation between the ground terminal and the central terminal is strengthened, and the epoxy resin can be easily injected.
Particularly, the cylindrical filters can be manufactured in an array form, and therefore, the manufacturing process is simplified, as well as curtailing the manufacturing cost. Thus ultimately a superior competitive power can be secured.
In the above, the present invention was described based on the specific preferred embodiments and the attached drawings, but it should be apparent to those ordinarily skilled in the art that various changes and modifications can be added without departing from the spirit and scope of the present invention which will be defined in the appended claims.

Claims (30)

What is claimed is:
1. A lead-through type filter having angular elements, comprising:
a case to be used as an external grounding terminal;
a central conductive line for supplying a dc power;
at least one angular filtering element accommodated within said case and made of an angular ceramic stock, with one side electrode being attached on a face of said ceramic stock and being electrically connected to said case, and with another side electrode being attached on another face of said ceramic stock and being electrically connected to said central conductive line; and
an epoxy resin layer filled into an interior of said case;
wherein said case comprises a large diameter interior space and a small diameter interior space.
2. The lead-through type filter as claimed in claim 1, wherein said filtering element is accommodated within said large diameter interior space of said case; and
said filtering element is an angular ceramic stock, one side electrode being attached on one face of said ceramic stock and being electrically connected to an inside of said case, another side electrode being attached to another face of said ceramic stock and being electrically connected to said central conductive line, thus accommodating at least one polygonal capacitor within said large diameter interior space of said case.
3. The lead-through type filter as claimed in claim 1, wherein said filtering element is accommodated within said large diameter interior space of said case; and
said filtering element is an angular ceramic stock, one side electrode being attached on one face of said ceramic stock and being electrically connected to the inside of said case, another side electrode being attached to another face of said ceramic stock and being electrically connected to said central conductive line, thus accommodating at least one angular varistor within said large diameter interior space of said case.
4. The lead-through type filter as claimed in claim 1, wherein said filtering element consists of at least one polygonal capacitor and at least one varistor.
5. The lead-through type filter as claimed in claim 1, wherein said lead-through type filter further comprises at least one lead-through type inductor consisting of a cylindrical ferrite magnetic body with an axial through hole, said conductive line passing through said axial through hole, and said inductor being accommodated within said small diameter interior space of said case.
6. The lead-through type filter as claimed in claim 3, wherein said filtering element is a polygonal capacitor.
7. The lead-through type filter as claimed in claim 3, wherein said filtering element is rectangular.
8. The lead-through type filter as claimed in claim 2, wherein said polygonal capacitor consists of a plurality of capacitors; and the plurality of said capacitors respectively have ceramic stocks with a same dielectric constant.
9. The lead-through type filter as claimed in claim 2, wherein said polygonal capacitor consists of a plurality of capacitors; and the plurality of said capacitors respectively have ceramic stocks with different dielectric constants.
10. The lead-through type filter as claimed in claim 1, further comprising: a tubular insulator inserted into an entrance of said case so as to prevent the epoxy resin from flowing to an outside during a filling of the epoxy resin.
11. The lead-through type filter as claimed in claim 3, wherein a stepped portion is formed within said large diameter interior space of said case along said corner portion of said small diameter interior space, so as to prevent said central conductive line from being short-circuited with another end electrode of a connected element during an insertion of said filtering element.
12. The lead-through type filter as claimed in claim 11, wherein said stepped portion for prevention of a short circuit is an insulator.
13. The lead-through type filter as claimed in claim 12, wherein said stepped portion for prevention of a short circuit is an insulating inductor.
14. The lead-through type filter as claimed in claim 4, wherein said polygonal capacitor consists of a plurality of capacitors; and the plurality of said capacitors respectively have ceramic stocks with a same dielectric constant.
15. The lead-through type filter as claimed in claim 4, wherein said polygonal capacitor consists of a plurality of capacitors; and the plurality of said capacitors respectively have ceramic stocks with different dielectric constants.
16. A lead-through type filter having angular elements, comprising:
a multi-case to be used as an external grounding terminal, wherein said multi-case has at least two element accommodating rooms, and each room has a large diameter interior space and a small diameter interior space;
a central conductive line for supplying a dc power;
at least one angular filtering element made of an angular ceramic stock, with one side electrode being attached on a face of said ceramic stock and being electrically connected to said element accommodating rooms of said multi-case, and with another side electrode being attached on another face of said ceramic stock and being electrically connected to said central conductive line, so as to be accommodated within said element accommodating rooms of said multi-case; and
an epoxy resin layer filled into an interior of said multi-case.
17. The lead-through type filter as claimed in claim 16, wherein said filtering element is accommodated within said large diameter interior space of said multi-case; and
said filtering element is an angular ceramic stock, one side electrode being attached on one face of said ceramic stock and being electrically connected to an inside of said multi-case, another side electrode being attached to another face of said ceramic stock and being electrically connected to said central conductive line, thus accommodating at least one polygonal capacitor within said large diameter interior space of said multi-case.
18. The lead-through type filter as claimed in claim 16, wherein said filtering element is accommodated within said large diameter interior space of said multi-case; and
said filtering element is an angular ceramic stock, one side electrode being attached on one face of said ceramic stock and being electrically connected to the inside of said multi-case, another side electrode being attached to another face of said ceramic stock and being electrically connected to said central conductive line, thus accommodating at least one angular varistor within said large diameter interior space of said multi-case.
19. The lead-through type filter as claimed in claim 16, wherein said filtering element consists of at least one polygonal capacitor and at least one varistor.
20. The lead-through type filter as claimed in claim 16, further comprising at least one lead-through type inductor consisting of a cylindrical ferrite magnetic body with an axial through hole, said conductive line passing through said axial through hole, and said inductor being accommodated within said small diameter interior space of said multi-case.
21. The lead-through type filter as claimed in claim 16, further comprising: a tubular insulator inserted into an entrance of said multi-case so as to prevent the epoxy resin from flowing to an outside during a filling of the epoxy resin.
22. The lead-through type filter as claimed in claim 17, wherein said filtering element is a polygonal capacitor.
23. The lead-through type filter as claimed in claim 17, wherein said filtering element is rectangular.
24. The lead-through type filter as claimed in claim 17, wherein said polygonal capacitor consists of a plurality of capacitors; and the plurality of said capacitors respectively have ceramic stocks with a same dielectric constant.
25. The lead-through type filter as claimed in claim 17, wherein said polygonal capacitor consists of a plurality of capacitors; and the plurality of said capacitors respectively have ceramic stocks with different dielectric constants.
26. The lead-through type filter as claimed in claim 17, wherein a stepped portion is formed within said large diameter interior space of said multi-case along said corner portion of said small diameter interior space, so as to prevent said central conductive line from being short-circuited with another end electrode of a connected element during an insertion of said filtering element.
27. The lead-through type filter as claimed in claim 26, wherein said stepped portion for prevention of a short circuit is an insulator.
28. The lead-through type filter as claimed in claim 27, wherein said stepped portion for prevention of a short circuit is an insulating inductor.
29. The lead-through type filter as claimed in claim 19, wherein said polygonal capacitor consists of a plurality of capacitors; and the plurality of said capacitors respectively have ceramic stocks with a same dielectric constant.
30. The lead-through type filter as claimed in claim 19, wherein said polygonal capacitor consists of a plurality of capacitors; and the plurality of said capacitors respectively have ceramic stocks with different dielectric constants.
US09/556,191 1999-04-23 2000-04-21 Lead-through type filter with built-in rectangular elements Expired - Fee Related US6351368B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR19990014589 1999-04-23
KR99-14589 1999-04-23
KR99-22218 1999-06-15
KR19990022218 1999-06-15
KR2000-15724 2000-03-28
KR10-2000-0015724A KR100495871B1 (en) 1999-04-23 2000-03-28 Lead-through type filter with built-in square shape elements

Publications (1)

Publication Number Publication Date
US6351368B1 true US6351368B1 (en) 2002-02-26

Family

ID=27349943

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/556,191 Expired - Fee Related US6351368B1 (en) 1999-04-23 2000-04-21 Lead-through type filter with built-in rectangular elements

Country Status (3)

Country Link
US (1) US6351368B1 (en)
JP (1) JP2000331878A (en)
KR (1) KR100495871B1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6424515B1 (en) * 2000-11-02 2002-07-23 Finnigan Corporation Combined detector capacitor and vacuum feed through
US20030206081A1 (en) * 1998-02-24 2003-11-06 Wems, Inc. Electromagnetic interference filter
US6646523B2 (en) * 2000-08-30 2003-11-11 Nec Tokin Corporation Distributed constant type noise filter
US20060000542A1 (en) * 2004-06-30 2006-01-05 Yongki Min Metal oxide ceramic thin film on base metal electrode
US20060091495A1 (en) * 2004-10-29 2006-05-04 Palanduz Cengiz A Ceramic thin film on base metal electrode
US20060099803A1 (en) * 2004-10-26 2006-05-11 Yongki Min Thin film capacitor
US20070001259A1 (en) * 2005-06-29 2007-01-04 Palanduz Cengiz A Thin film capacitors and methods of making the same
US20070271752A1 (en) * 2004-10-21 2007-11-29 Palanduz Cengiz A Passive device structure
US20080106848A1 (en) * 2005-03-31 2008-05-08 Palanduz Cengiz A iTFC WITH OPTIMIZED C(T)
US20090163980A1 (en) * 2007-12-21 2009-06-25 Greatbatch Ltd. Switch for turning off therapy delivery of an active implantable medical device during mri scans
US7629269B2 (en) 2005-03-31 2009-12-08 Intel Corporation High-k thin film grain size control
US20090316374A1 (en) * 2005-03-31 2009-12-24 Intel Corporation Reduced Porosity High-K Thin Film Mixed Grains for Thin Film Capacitor Applications
US20100318160A1 (en) * 2007-12-21 2010-12-16 Greatbatch Ltd. Multiplexer for selection of an mri compatible bandstop filter placed in series with a particular therapy electrode of an active implantable medical device
US20130058004A1 (en) * 2011-09-01 2013-03-07 Medtronic, Inc. Feedthrough assembly including underfill access channel and electrically insulating material
US8600519B2 (en) 2001-04-13 2013-12-03 Greatbatch Ltd. Transient voltage/current protection system for electronic circuits associated with implanted leads
EP2156450A4 (en) * 2007-05-07 2016-04-06 Spectrum Control Inc Axial dielectric component array and method
CN108270411A (en) * 2018-02-28 2018-07-10 成都宇鑫洪科技有限公司 A kind of microminiature radio frequency interference filter

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100621540B1 (en) * 2001-12-28 2006-09-13 주식회사 플레넷 Blocking filter used for power line communication and filtering system using the same
WO2009081663A1 (en) * 2007-12-21 2009-07-02 Murata Manufacturing Co., Ltd. Band elimination filter and connector provided with band elimination filter
JP5870108B2 (en) * 2010-11-05 2016-02-24 シャフナー・エーエムファウ・アクチェンゲゼルシャフト EMC filter circuit
GB201102459D0 (en) * 2011-02-11 2011-03-30 E2V Tech Uk Ltd Filter for a magnetron power supply lead
JP5881532B2 (en) * 2012-05-24 2016-03-09 三菱電機株式会社 Noise filter for shielded cable
KR101898294B1 (en) * 2012-08-13 2018-09-12 현대모비스 주식회사 Common mode noise filter
KR101380321B1 (en) * 2012-10-16 2014-04-01 익스팬테크주식회사 Emp feed through filter
JP6326615B2 (en) * 2013-12-24 2018-05-23 北川工業株式会社 Noise filter terminal
JP2019033216A (en) * 2017-08-09 2019-02-28 株式会社Soken Film capacitor and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4148003A (en) * 1977-07-08 1979-04-03 Globe-Union Inc. Series feed-through capacitor
US5546058A (en) * 1993-12-24 1996-08-13 Murata Manufacturing Co., Ltd. Feedthrough LC filter with a deformation preventing spring
US5729425A (en) * 1995-05-22 1998-03-17 Tdk Corporation High voltage capacitor and magnetron having porcelain dielectric material
US5896267A (en) * 1997-07-10 1999-04-20 Greatbatch-Hittman, Inc. Substrate mounted filter for feedthrough devices
US5999398A (en) * 1998-06-24 1999-12-07 Avx Corporation Feed-through filter assembly having varistor and capacitor structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03120805A (en) * 1989-10-04 1991-05-23 Tdk Corp Lc filter
KR0122322B1 (en) * 1994-05-27 1997-11-21 배순훈 Feed through type capacitor
KR0136303B1 (en) * 1995-01-20 1998-06-15 이형도 Penetration type filter
JPH09307394A (en) * 1996-05-17 1997-11-28 Tokin Corp Chip type lc filter element
JPH10290136A (en) * 1997-04-15 1998-10-27 Soshin Denki Kk Noise filter

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4148003A (en) * 1977-07-08 1979-04-03 Globe-Union Inc. Series feed-through capacitor
US5546058A (en) * 1993-12-24 1996-08-13 Murata Manufacturing Co., Ltd. Feedthrough LC filter with a deformation preventing spring
US5729425A (en) * 1995-05-22 1998-03-17 Tdk Corporation High voltage capacitor and magnetron having porcelain dielectric material
US5896267A (en) * 1997-07-10 1999-04-20 Greatbatch-Hittman, Inc. Substrate mounted filter for feedthrough devices
US5999398A (en) * 1998-06-24 1999-12-07 Avx Corporation Feed-through filter assembly having varistor and capacitor structure

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030206081A1 (en) * 1998-02-24 2003-11-06 Wems, Inc. Electromagnetic interference filter
US6816033B2 (en) * 1998-02-24 2004-11-09 Wems, Inc. Electromagnetic interference filter
US6646523B2 (en) * 2000-08-30 2003-11-11 Nec Tokin Corporation Distributed constant type noise filter
US6424515B1 (en) * 2000-11-02 2002-07-23 Finnigan Corporation Combined detector capacitor and vacuum feed through
US8600519B2 (en) 2001-04-13 2013-12-03 Greatbatch Ltd. Transient voltage/current protection system for electronic circuits associated with implanted leads
US20060000542A1 (en) * 2004-06-30 2006-01-05 Yongki Min Metal oxide ceramic thin film on base metal electrode
US20070271752A1 (en) * 2004-10-21 2007-11-29 Palanduz Cengiz A Passive device structure
US7733626B2 (en) 2004-10-21 2010-06-08 Intel Corporation Passive device structure
US20060099803A1 (en) * 2004-10-26 2006-05-11 Yongki Min Thin film capacitor
US20060091495A1 (en) * 2004-10-29 2006-05-04 Palanduz Cengiz A Ceramic thin film on base metal electrode
US7629269B2 (en) 2005-03-31 2009-12-08 Intel Corporation High-k thin film grain size control
US20080106848A1 (en) * 2005-03-31 2008-05-08 Palanduz Cengiz A iTFC WITH OPTIMIZED C(T)
US20080106844A1 (en) * 2005-03-31 2008-05-08 Palanduz Cengiz A iTFC WITH OPTIMIZED C(T)
US7375412B1 (en) * 2005-03-31 2008-05-20 Intel Corporation iTFC with optimized C(T)
US7755165B2 (en) 2005-03-31 2010-07-13 Intel Corporation iTFC with optimized C(T)
US7656644B2 (en) 2005-03-31 2010-02-02 Intel Corporation iTFC with optimized C(T)
US20090316374A1 (en) * 2005-03-31 2009-12-24 Intel Corporation Reduced Porosity High-K Thin Film Mixed Grains for Thin Film Capacitor Applications
US8499426B2 (en) 2005-06-29 2013-08-06 Intel Corporation Methods of making thin film capacitors
US20080054403A1 (en) * 2005-06-29 2008-03-06 Palanduz Cengiz A Thin film capacitors and methods of making the same
US7547957B2 (en) 2005-06-29 2009-06-16 Intel Corporation Thin film capacitors and methods of making the same
US7453144B2 (en) 2005-06-29 2008-11-18 Intel Corporation Thin film capacitors and methods of making the same
US20080263842A1 (en) * 2005-06-29 2008-10-30 Palanduz Cengiz A Thin film capacitors and methods of making the same
US20070001259A1 (en) * 2005-06-29 2007-01-04 Palanduz Cengiz A Thin film capacitors and methods of making the same
EP2156450A4 (en) * 2007-05-07 2016-04-06 Spectrum Control Inc Axial dielectric component array and method
US20090163980A1 (en) * 2007-12-21 2009-06-25 Greatbatch Ltd. Switch for turning off therapy delivery of an active implantable medical device during mri scans
US20100318160A1 (en) * 2007-12-21 2010-12-16 Greatbatch Ltd. Multiplexer for selection of an mri compatible bandstop filter placed in series with a particular therapy electrode of an active implantable medical device
US8788057B2 (en) 2007-12-21 2014-07-22 Greatbatch Ltd. Multiplexer for selection of an MRI compatible bandstop filter placed in series with a particular therapy electrode of an active implantable medical device
US9002471B2 (en) 2007-12-21 2015-04-07 Greatbatch Ltd. Independently actuatable switch for selection of an MRI compatible bandstop filter placed in series with a particular therapy electrode of an active implantable medical device
US20130058004A1 (en) * 2011-09-01 2013-03-07 Medtronic, Inc. Feedthrough assembly including underfill access channel and electrically insulating material
US8844103B2 (en) 2011-09-01 2014-09-30 Medtronic, Inc. Methods for making feedthrough assemblies including a capacitive filter array
US8849404B2 (en) 2011-09-01 2014-09-30 Medtronic, Inc. Feedthrough assembly including a lead frame assembly
US9061161B2 (en) 2011-09-01 2015-06-23 Medtronic, Inc. Capacitive filtered feedthrough array for implantable medical device
CN108270411A (en) * 2018-02-28 2018-07-10 成都宇鑫洪科技有限公司 A kind of microminiature radio frequency interference filter

Also Published As

Publication number Publication date
KR20010020686A (en) 2001-03-15
JP2000331878A (en) 2000-11-30
KR100495871B1 (en) 2005-06-16

Similar Documents

Publication Publication Date Title
US6351368B1 (en) Lead-through type filter with built-in rectangular elements
US7262681B2 (en) Integrated semiconductor inductor and method therefor
CN1914797B (en) Noise filter and noise filter array
KR100712058B1 (en) Electrostatic countermeasure parts
KR100870631B1 (en) Noise filter and mounted structure of noise filter
US11290078B2 (en) Filter element
JP2999494B2 (en) Laminated LC noise filter and method of manufacturing the same
US6535094B2 (en) Multilayer inductor
US20010022547A1 (en) Multilayer inductor
KR900008362B1 (en) Noise filter and its manufacturing method
US8031460B2 (en) Multilayer capacitor
US6535093B1 (en) Inductor
JP2959787B2 (en) Laminated LC noise filter and manufacturing method thereof
CN109462383B (en) Resonant circuit and filter
US6388863B1 (en) Electronic part
EP0756350A1 (en) Dielectric resonator, dielectric filter using the resonator, and production method of the dielectric filter
US20020017964A1 (en) Nonreciprocal circuit device and communication device using same
CN113393997B (en) Laminated coil component
JP2769346B2 (en) Cylindrical LC noise filter and method of manufacturing the same
US20120262829A1 (en) Protection device against electromagnetic interference
JPH0614459Y2 (en) LC composite parts
KR940011697B1 (en) Chip-type capacitor for eliminating noise according to electromagnetic wave
JP2002009572A (en) Filter
JPH06251945A (en) Laminated element
JPH02299308A (en) Lc noise filter

Legal Events

Date Code Title Description
AS Assignment

Owner name: EXPANTECH. CO., LTD., KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KIM, SUNG YOUL;REEL/FRAME:010747/0969

Effective date: 20000417

FPAY Fee payment

Year of fee payment: 4

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20100226