US6503433B2 - Liquid transfer molding system for encapsulating semiconductor integrated circuits - Google Patents
Liquid transfer molding system for encapsulating semiconductor integrated circuits Download PDFInfo
- Publication number
- US6503433B2 US6503433B2 US09/827,607 US82760701A US6503433B2 US 6503433 B2 US6503433 B2 US 6503433B2 US 82760701 A US82760701 A US 82760701A US 6503433 B2 US6503433 B2 US 6503433B2
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- US
- United States
- Prior art keywords
- mold
- liquid
- mold unit
- pot
- encapsulation material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/70—Completely encapsulating inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention concerns integrated circuits and pertains particularly to a liquid transfer molding system for encapsulating semiconductor integrated circuits.
- the wafers are typically sawn into individual die. Each die is then attached onto a substrate (for example a leadframe), and bonding wires are used to provide electrical connection from the die to the outside world.
- a substrate for example a leadframe
- transfer molding is the most widely-used method of encapsulating semiconductor devices because of the versatility and high throughput of such systems.
- the encapsulation materials used in transfer molding systems normally come in solid form. They are made by. pelletizing fine powder of a mixture of resin, filler, hardener, catalyst, carbon black, etc. Some of the disadvantages of using these pelletized mold compounds are dust (escaping from pellets), non-uniform density across the pellets, and moisture absorption.
- Liquid encapsulating materials do not have the problems associated with pageetized powder. They do not produce dust and are very uniform in density and other properties. Most of the encapsulating materials for optoelectronics come in liquid form. Thus they cannot be used directly in a transfer mold system. One way that is commonly used is to turn the liquid materials into solid by partially curing (called B-stage) the materials to a certain degree and forming it into pellet form. However, in this partially cured state, the material has a higher viscosity and thus a degraded flow behavior. In addition, the partially cured state results in poorer adhesion to substrates.
- B-stage partially curing
- the material has a higher viscosity and thus a degraded flow behavior.
- the partially cured state results in poorer adhesion to substrates.
- an encapsulation system is used to encapsulate semiconductor products.
- a bottom mold unit includes a mold pot and a mold piston.
- a substrate loader loads a substrate into a cavity in the bottom mold unit.
- a liquid dispenser dispenses encapsulation material into the mold pot. The encapsulation material is in an uncured liquid state when placed into the mold pot.
- a top mold unit is then clamped to the bottom mold unit.
- the present invention allows the use of liquid encapsulating materials to replace the solid mold compounds in many applications.
- the present invention also facilitates high volume production at lower cost for optoelectronic devices stun as light emitting diode (LED) displays or infrared devices.
- LED light emitting diode
- liquid encapsulating material results in better quality products produced at lower cost than is possible using B-stage (partially cured) materials. This is because additional processes are required to produce B-stage materials, resulting in higher costs of the final product.
- liquid materials opens up new applications for transfer mold such as in the optoelectronics, where many of the optoelectronic devices are encapsulated using cast process.
- cast process has longer cycle time, lower throughput, and is less automated.
- liquid materials within a transfer mold system it is possible to have lower molding temperature if necessary. This is possible because of much lower viscosity of liquid materials as opposed to solid mold compounds, which take relatively more time to melt and have higher viscosity. Besides lower viscosity, liquid encapsulating materials have less air and moisture content as opposed to the pelletized mold compounds. This results in fewer air entrapment or defect in final cured material.
- an automatic liquid dispensing system allows the amount of liquid material dispensed to be controlled or adjusted with greater flexibility. This is especially helpful during initial process optimization or debug. The amount of waste material can thus be reduced. Such adjustment is difficult, if not impossible, with pellet mold compounds since that would mean a different pellet size, something that the compound manufacturer would have to provide.
- FIG. 1 is a simplified block diagram of a bottom plunger mold system with a liquid dispensing unit forming a liquid transfer mold system in accordance with a referred embodiment of the present invention.
- FIG. 2 is a simplified block diagram which illustrates substrate loading of the liquid transfer mold system shown in FIG. 1 in accordance with a preferred embodiment of the present invention.
- FIG. 3 is a simplified block diagram which illustrates liquid encapsulant dispensing within the liquid transfer mold system shown in FIG. 1 in accordance with a preferred embodiment of the present invention.
- FIG. 4 is a simplified block diagram that illustrates clamping of the mold within the liquid transfer mold system shown in FIG. 1 in accordance with a preferred embodiment of the present invention.
- FIG. 5 is a simplified block diagram which illustrates mold cavity filling within the liquid transfer mold system shown in FIG. 1 in accordance with a preferred embodiment of the present invention.
- a liquid dispensing system is incorporated within a transfer mold process in order to allow the use of liquid encapsulating materials in place of the solid molding compounds.
- the resulting liquid transfer mold system has the high throughput characteristic of transfer mold,systems and also the superior flow and adhesion characteristics of liquid encapsulant systems.
- the present invention allows expansion of the use of transfer mold process within the manufacture of many other semiconductor devices (such as optoelectronics) whose encapsulating materials are currently available only in liquid form.
- FIG. 1 shows a bottom plunger mold system having a top mold unit 11 and a bottom mold unit 12 . Mold cavities 13 are formed when top mold unit 11 is clamped to bottom mold unit 12 . A mold piston/plunger (piston) 14 is used to force liquid encapsulant within a mold pot 15 up into mold cavities 13 during the mold process. While FIG. 1 shows only a single mold piston 14 , the bottom plunger mold system may include two or more pistons each in a separate mold pot.
- Top mold unit 11 and bottom mold unit 12 are molds such as are available from Intercon Tools, Inc., having a business address of 280 Cochrane Circle, Morgan Hill, Calif. 95037, from Diehard Engineering having a business address of 7070-D Commerce Circle, Pleasanton, Calif. 94588, or from another manufacturer of molds.
- a bottom plunger mold system that utilizes pelletized mold compounds may be obtained from several manufactures, for example from ASM America, Inc, having a business address of 97 E. Brokaw Road, Suite 100, San Jose, Calif. 95112-4209.
- a substrate loader 16 is used to load substrates and lead frames onto bottom mold unit 12 at the location of mold cavities 13 .
- a liquid dispensing system 17 replaces a pelletized mold compound loader found in standard transfer mold machines.
- Liquid dispensing system 17 includes a liquid encapsulant reservoir 19 that is filled with liquid encapsulation molding material.
- the liquid encapsulation material is a mixture of resin, filler, hardener, catalyst, carbon black, etc.
- a retractable arm 20 is used to mount a dispensing head 21 .
- An auto-retractable pan 18 is utilized, if necessary to collect any dripping liquid from dispensing head 21 . While FIG. 1 shows only a single dispensing head 21 , typically, there is a separate dispensing head for each piston.
- Liquid dispensing system 17 is, for example, a pump and valve system where the pump is located in liquid encapsulant reservoir 19 and a valve is located in dispensing head 21 .
- liquid dispensing system 17 can be another type of liquid dispensing device from the many kinds of liquid dispensing devices which are readily available commercially.
- a refrigeration unfit can be incorporated in liquid dispensing system 17 to increase the work life of liquid encapsulant, if necessary.
- FIG. 2 illustrates substrate loader 16 performing substrate and lead frame loading.
- the substrate and lead frames is placed onto bottom mold unit 12 at the location of mold cavities 13 .
- FIG. 3 illustrates liquid dispensing system 17 used to dispense liquid encapsulation material from liquid encapsulant reservoir 19 .
- Retractable arm 20 extends placing dispensing head 21 into position to dispense the liquid encapsulation material into mold pot 15 .
- bottom mold unit 12 is clamped to top-mold unit 11 .
- mold piston 14 is then moved upwards in order to transfer liquid encapsulation material from mold pot 15 into cavities 13 . This is illustrated by an arrow 51 .
- the liquid encapsulation material is cured, for example, at high pressure to eliminate bubbles. This process can also be used in conjunction with vacuum to further increase yield.
Abstract
An encapsulation system is used to encapsulate semiconductor products. A bottom mold unit includes a mold pot and a mold piston. A substrate loader loads a substrate into a cavity in the bottom mold unit. A liquid dispenser dispenses encapsulation material into the mold pot. The encapsulation material is in an uncured liquid state when placed into the mold pot. A top mold unit is clamped to the bottom mold unit.
Description
This is a divisional of application Ser. No. 09/354,291 filed Jul. 15. 1999.
The present invention concerns integrated circuits and pertains particularly to a liquid transfer molding system for encapsulating semiconductor integrated circuits.
After the manufacture of integrated circuits on a silicon wafer surface, the wafers are typically sawn into individual die. Each die is then attached onto a substrate (for example a leadframe), and bonding wires are used to provide electrical connection from the die to the outside world.
In general, transfer molding is the most widely-used method of encapsulating semiconductor devices because of the versatility and high throughput of such systems. The encapsulation materials used in transfer molding systems normally come in solid form. They are made by. pelletizing fine powder of a mixture of resin, filler, hardener, catalyst, carbon black, etc. Some of the disadvantages of using these pelletized mold compounds are dust (escaping from pellets), non-uniform density across the pellets, and moisture absorption.
Liquid encapsulating materials, on the other hand, do not have the problems associated with pageetized powder. They do not produce dust and are very uniform in density and other properties. Most of the encapsulating materials for optoelectronics come in liquid form. Thus they cannot be used directly in a transfer mold system. One way that is commonly used is to turn the liquid materials into solid by partially curing (called B-stage) the materials to a certain degree and forming it into pellet form. However, in this partially cured state, the material has a higher viscosity and thus a degraded flow behavior. In addition, the partially cured state results in poorer adhesion to substrates.
In accordance with the preferred embodiment of the present invention an encapsulation system is used to encapsulate semiconductor products. A bottom mold unit includes a mold pot and a mold piston. A substrate loader loads a substrate into a cavity in the bottom mold unit. A liquid dispenser dispenses encapsulation material into the mold pot. The encapsulation material is in an uncured liquid state when placed into the mold pot. A top mold unit is then clamped to the bottom mold unit.
The present invention allows the use of liquid encapsulating materials to replace the solid mold compounds in many applications. The present invention also facilitates high volume production at lower cost for optoelectronic devices stun as light emitting diode (LED) displays or infrared devices.
In addition, the superior adhesion of liquid encapsulating material results in better quality products produced at lower cost than is possible using B-stage (partially cured) materials. This is because additional processes are required to produce B-stage materials, resulting in higher costs of the final product.
Further, using liquid materials opens up new applications for transfer mold such as in the optoelectronics, where many of the optoelectronic devices are encapsulated using cast process. In general, cast process has longer cycle time, lower throughput, and is less automated.
Also, using a liquid materials within a transfer mold system, it is possible to have lower molding temperature if necessary. This is possible because of much lower viscosity of liquid materials as opposed to solid mold compounds, which take relatively more time to melt and have higher viscosity. Besides lower viscosity, liquid encapsulating materials have less air and moisture content as opposed to the pelletized mold compounds. This results in fewer air entrapment or defect in final cured material.
Unlike standard transfer mold, which uses pelletized mold compounds, the use of an automatic liquid dispensing system, as in the present invention, allows the amount of liquid material dispensed to be controlled or adjusted with greater flexibility. This is especially helpful during initial process optimization or debug. The amount of waste material can thus be reduced. Such adjustment is difficult, if not impossible, with pellet mold compounds since that would mean a different pellet size, something that the compound manufacturer would have to provide.
FIG. 1 is a simplified block diagram of a bottom plunger mold system with a liquid dispensing unit forming a liquid transfer mold system in accordance with a referred embodiment of the present invention.
FIG. 2 is a simplified block diagram which illustrates substrate loading of the liquid transfer mold system shown in FIG. 1 in accordance with a preferred embodiment of the present invention.
FIG. 3 is a simplified block diagram which illustrates liquid encapsulant dispensing within the liquid transfer mold system shown in FIG. 1 in accordance with a preferred embodiment of the present invention.
FIG. 4 is a simplified block diagram that illustrates clamping of the mold within the liquid transfer mold system shown in FIG. 1 in accordance with a preferred embodiment of the present invention.
FIG. 5 is a simplified block diagram which illustrates mold cavity filling within the liquid transfer mold system shown in FIG. 1 in accordance with a preferred embodiment of the present invention.
In accordance with a preferred embodiment of the present invention, a liquid dispensing system is incorporated within a transfer mold process in order to allow the use of liquid encapsulating materials in place of the solid molding compounds. The resulting liquid transfer mold system has the high throughput characteristic of transfer mold,systems and also the superior flow and adhesion characteristics of liquid encapsulant systems. The present invention allows expansion of the use of transfer mold process within the manufacture of many other semiconductor devices (such as optoelectronics) whose encapsulating materials are currently available only in liquid form.
FIG. 1 shows a bottom plunger mold system having a top mold unit 11 and a bottom mold unit 12. Mold cavities 13 are formed when top mold unit 11 is clamped to bottom mold unit 12. A mold piston/plunger (piston) 14 is used to force liquid encapsulant within a mold pot 15 up into mold cavities 13 during the mold process. While FIG. 1 shows only a single mold piston 14, the bottom plunger mold system may include two or more pistons each in a separate mold pot.
A substrate loader 16 is used to load substrates and lead frames onto bottom mold unit 12 at the location of mold cavities 13. A liquid dispensing system 17 replaces a pelletized mold compound loader found in standard transfer mold machines. Liquid dispensing system 17 includes a liquid encapsulant reservoir 19 that is filled with liquid encapsulation molding material. For example the liquid encapsulation material is a mixture of resin, filler, hardener, catalyst, carbon black, etc. A retractable arm 20 is used to mount a dispensing head 21. An auto-retractable pan 18 is utilized, if necessary to collect any dripping liquid from dispensing head 21. While FIG. 1 shows only a single dispensing head 21, typically, there is a separate dispensing head for each piston.
FIG. 2 illustrates substrate loader 16 performing substrate and lead frame loading. During substrate and lead frame loading, the substrate and lead frames is placed onto bottom mold unit 12 at the location of mold cavities 13.
FIG. 3 illustrates liquid dispensing system 17 used to dispense liquid encapsulation material from liquid encapsulant reservoir 19. Retractable arm 20 extends placing dispensing head 21 into position to dispense the liquid encapsulation material into mold pot 15.
As illustrated in FIG. 4 by arrows 41, bottom mold unit 12 is clamped to top-mold unit 11.
As shown in FIG. 5, mold piston 14 is then moved upwards in order to transfer liquid encapsulation material from mold pot 15 into cavities 13. This is illustrated by an arrow 51.
Once placed,into cavities 13, the liquid encapsulation material is cured, for example, at high pressure to eliminate bubbles. This process can also be used in conjunction with vacuum to further increase yield.
Claims (4)
1. A method for encapsulating semiconductor products, the method comprising the following steps:
(a) placing a substrate within a cavity in a bottom mold unit;
(b) dispensing encapsulating material into a mold pot within the bottom mold unit, the encapsulation material being in an uncured liquid state when placed into the mold pot;
wherein dispensing encapsulating material includes:
(b.1) using a retractable arm to place a dispensing head over the mold pot; and
(b.2) dispensing liquid from the dispensing head into the mold pot;
(c) clamping the bottom mold unit to the top mold unit; and,
(d) transferring the encapsulation material to the cavity in the bottom mold unit.
2. A method as in claim 1 , wherein step (b) includes transferring the encapsulation material from a reservoir in which is stored the encapsulation material.
3. A method as in claim 1 , wherein step (d) includes, extending a mold piston located under the mold pot in order to transfer the encapsulation material to the cavity in the bottom mold unit.
4. A method as in claim 1 , wherein when clamping the bottom mold unit to the top mold unit, a cavity in the top mold unit is aligned with the cavity in the bottom mold unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/827,607 US6503433B2 (en) | 1999-07-15 | 2001-04-06 | Liquid transfer molding system for encapsulating semiconductor integrated circuits |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/354,291 US6508970B2 (en) | 1999-07-15 | 1999-07-15 | Liquid transfer molding system for encapsulating semiconductor integrated circuits |
US09/827,607 US6503433B2 (en) | 1999-07-15 | 2001-04-06 | Liquid transfer molding system for encapsulating semiconductor integrated circuits |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US09/354,291 Division US6508970B2 (en) | 1999-07-15 | 1999-07-15 | Liquid transfer molding system for encapsulating semiconductor integrated circuits |
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Publication Number | Publication Date |
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US20020153637A1 US20020153637A1 (en) | 2002-10-24 |
US6503433B2 true US6503433B2 (en) | 2003-01-07 |
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US09/354,291 Expired - Lifetime US6508970B2 (en) | 1999-07-15 | 1999-07-15 | Liquid transfer molding system for encapsulating semiconductor integrated circuits |
US09/827,607 Expired - Lifetime US6503433B2 (en) | 1999-07-15 | 2001-04-06 | Liquid transfer molding system for encapsulating semiconductor integrated circuits |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US09/354,291 Expired - Lifetime US6508970B2 (en) | 1999-07-15 | 1999-07-15 | Liquid transfer molding system for encapsulating semiconductor integrated circuits |
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US (2) | US6508970B2 (en) |
DE (1) | DE10033013B4 (en) |
GB (1) | GB2353496B (en) |
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US20050238747A1 (en) * | 2004-04-23 | 2005-10-27 | Vishay Infrared Components, Inc. | Injection casting system for encapsulating semiconductor devices and method of use |
US20090292049A1 (en) * | 2005-10-27 | 2009-11-26 | Takeo Tomiyama | Resin composition and optical member formed from the same |
US20120093954A1 (en) * | 2006-11-02 | 2012-04-19 | Tetsuya Yamada | Compression molding method for electronic component and compression molding apparatus employed therefor |
US9646857B2 (en) | 2015-08-14 | 2017-05-09 | Qorvo Us, Inc. | Low pressure encapsulant for size-reduced semiconductor package |
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DE10117890B4 (en) * | 2001-04-10 | 2007-06-28 | Osram Opto Semiconductors Gmbh | Method for producing a radiation-receiving and / or-emitting semiconductor component and radiation-receiving and / or-emitting semiconductor component |
US7030504B2 (en) * | 2003-05-30 | 2006-04-18 | Asm Technology Singapore Pte Ltd. | Sectional molding system |
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US7285846B1 (en) | 2005-02-22 | 2007-10-23 | Littelfuse, Inc. | Integrated circuit package with ESD protection |
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US7931845B2 (en) * | 2007-05-21 | 2011-04-26 | O & D Manufacturing | Gravity injection of molding material for compression molding and related methods |
US7791177B2 (en) * | 2007-12-10 | 2010-09-07 | Infineon Technologies Ag | Electronic device |
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US9944526B2 (en) | 2015-05-13 | 2018-04-17 | Honeywell International Inc. | Carbon fiber preforms |
US10131113B2 (en) | 2015-05-13 | 2018-11-20 | Honeywell International Inc. | Multilayered carbon-carbon composite |
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US10548228B2 (en) | 2016-03-03 | 2020-01-28 | International Business Machines Corporation | Thermal interface adhesion for transfer molded electronic components |
CN108598221B (en) * | 2017-12-27 | 2020-06-30 | 江西骏川半导体设备有限公司 | Be used for LED encapsulation system of processing |
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US20050238747A1 (en) * | 2004-04-23 | 2005-10-27 | Vishay Infrared Components, Inc. | Injection casting system for encapsulating semiconductor devices and method of use |
US7153462B2 (en) | 2004-04-23 | 2006-12-26 | Vishay Infrared Components, Inc. | Injection casting system for encapsulating semiconductor devices and method of use |
US20090292049A1 (en) * | 2005-10-27 | 2009-11-26 | Takeo Tomiyama | Resin composition and optical member formed from the same |
US20120093954A1 (en) * | 2006-11-02 | 2012-04-19 | Tetsuya Yamada | Compression molding method for electronic component and compression molding apparatus employed therefor |
US8684718B2 (en) * | 2006-11-02 | 2014-04-01 | Towa Corporation | Compression molding method for electronic component and compression molding apparatus employed therefor |
US9646857B2 (en) | 2015-08-14 | 2017-05-09 | Qorvo Us, Inc. | Low pressure encapsulant for size-reduced semiconductor package |
Also Published As
Publication number | Publication date |
---|---|
US20020153637A1 (en) | 2002-10-24 |
DE10033013A1 (en) | 2001-02-01 |
GB0014702D0 (en) | 2000-08-09 |
GB2353496A (en) | 2001-02-28 |
US6508970B2 (en) | 2003-01-21 |
US20020158366A1 (en) | 2002-10-31 |
DE10033013B4 (en) | 2008-04-03 |
GB2353496B (en) | 2004-04-14 |
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