US6566745B1 - Image sensor ball grid array package and the fabrication thereof - Google Patents
Image sensor ball grid array package and the fabrication thereof Download PDFInfo
- Publication number
- US6566745B1 US6566745B1 US09/538,385 US53838500A US6566745B1 US 6566745 B1 US6566745 B1 US 6566745B1 US 53838500 A US53838500 A US 53838500A US 6566745 B1 US6566745 B1 US 6566745B1
- Authority
- US
- United States
- Prior art keywords
- substrate
- layer
- recited
- glass
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title description 5
- 239000000758 substrate Substances 0.000 claims abstract description 184
- 239000004065 semiconductor Substances 0.000 claims abstract description 25
- 239000011521 glass Substances 0.000 claims description 61
- 229910000679 solder Inorganic materials 0.000 claims description 51
- 230000003287 optical effect Effects 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 238000001465 metallisation Methods 0.000 claims description 15
- 239000010410 layer Substances 0.000 claims 8
- 239000011247 coating layer Substances 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 44
- 238000007789 sealing Methods 0.000 abstract description 29
- 238000004806 packaging method and process Methods 0.000 abstract description 26
- 235000012431 wafers Nutrition 0.000 description 62
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 18
- 239000004593 Epoxy Substances 0.000 description 17
- 239000003292 glue Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 16
- 238000003384 imaging method Methods 0.000 description 14
- 238000000151 deposition Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 230000008021 deposition Effects 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 7
- 238000012805 post-processing Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
Abstract
Description
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/538,385 US6566745B1 (en) | 1999-03-29 | 2000-03-29 | Image sensor ball grid array package and the fabrication thereof |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12673799P | 1999-03-29 | 1999-03-29 | |
US12698099P | 1999-03-29 | 1999-03-29 | |
US09/538,385 US6566745B1 (en) | 1999-03-29 | 2000-03-29 | Image sensor ball grid array package and the fabrication thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
US6566745B1 true US6566745B1 (en) | 2003-05-20 |
Family
ID=27383473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/538,385 Expired - Lifetime US6566745B1 (en) | 1999-03-29 | 2000-03-29 | Image sensor ball grid array package and the fabrication thereof |
Country Status (1)
Country | Link |
---|---|
US (1) | US6566745B1 (en) |
Cited By (158)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010052642A1 (en) * | 2000-06-16 | 2001-12-20 | Wood Alan G. | Semiconductor device package and method |
US20020163589A1 (en) * | 2001-02-26 | 2002-11-07 | Masahiko Yukawa | Solid-state image pickup device and method of producing the same |
US20030094706A1 (en) * | 2001-08-30 | 2003-05-22 | Howarth James J. | Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly |
US20040041282A1 (en) * | 2002-08-29 | 2004-03-04 | Kinsman Larry D. | Flip-chip image sensor packages and methods of fabrication |
US20040046169A1 (en) * | 2000-12-29 | 2004-03-11 | Perillat Patrick Daniel | Optical semiconductor device with transparent support |
US20040065952A1 (en) * | 2002-02-06 | 2004-04-08 | Christophe Prior | Optical semiconductor device and method of manufacture |
US6730532B1 (en) * | 2001-02-27 | 2004-05-04 | Cypress Semiconductor Corporation | Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process |
US20040164981A1 (en) * | 2003-02-06 | 2004-08-26 | Kazuya Fujita | Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication |
US20040191963A1 (en) * | 2003-03-31 | 2004-09-30 | Osram Opto Semiconductors Gmbh | Encapsulation of thin-film electronic devices |
US20040256349A1 (en) * | 2001-08-24 | 2004-12-23 | Jurgen Leib | Method for producing electronic componets |
US20040257460A1 (en) * | 2003-06-18 | 2004-12-23 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device and method for producing the same |
US20050056944A1 (en) * | 2001-02-27 | 2005-03-17 | Chippac, Inc. | Super-thin high speed flip chip package |
US20050063033A1 (en) * | 2003-09-18 | 2005-03-24 | Kinsman Larry D. | Microelectronic devices and methods for packaging microelectronic devices |
US20050073017A1 (en) * | 2003-10-01 | 2005-04-07 | Deok-Hoon Kim | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
US20050077603A1 (en) * | 2003-10-08 | 2005-04-14 | Dylan Yu | Method and structure for a wafer level packaging |
US20050082490A1 (en) * | 2000-12-29 | 2005-04-21 | Perillat Patrick D. | Optical semiconductor housing with transparent chip and method for making same |
US20050089283A1 (en) * | 2003-10-23 | 2005-04-28 | Don Michael | System and method for hermetically sealing a package |
US20050093178A1 (en) * | 2003-11-04 | 2005-05-05 | Chen-Tung Huang | Package structure with a retarding structure and method of making same |
US20050098802A1 (en) * | 2003-10-01 | 2005-05-12 | Kim Deok H. | Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof |
US20050101059A1 (en) * | 2003-10-24 | 2005-05-12 | Xhp Microsystems, Inc. | Method and system for hermetically sealing packages for optics |
US20050110889A1 (en) * | 2003-11-26 | 2005-05-26 | Tuttle Mark E. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20050151272A1 (en) * | 2004-01-06 | 2005-07-14 | Street Bret K. | Die package having an adhesive flow restriction area |
US20050168306A1 (en) * | 2000-11-29 | 2005-08-04 | Cohn Michael B. | MEMS device with integral packaging |
US20050184219A1 (en) * | 2004-02-23 | 2005-08-25 | Kirby Kyle K. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20050189632A1 (en) * | 2004-03-01 | 2005-09-01 | Patrick Morrow | Sealed three dimensional metal bonded integrated circuits |
US6943424B1 (en) | 2004-05-06 | 2005-09-13 | Optopac, Inc. | Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof |
US20050205762A1 (en) * | 2001-03-06 | 2005-09-22 | Digital Optics Corporation | Integrated optical transceiver and related methods |
US20050224938A1 (en) * | 2004-04-12 | 2005-10-13 | Deok-Hoon Kim | Electronic package having a sealing structure on predetermined area, and the method thereof |
US20050236708A1 (en) * | 2004-04-27 | 2005-10-27 | Farnworth Warren M | Microelectronic imaging devices and methods of packaging microelectronic imaging devices |
US20050253213A1 (en) * | 2004-05-13 | 2005-11-17 | Tongbi Jiang | Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers |
US20050254133A1 (en) * | 2004-05-13 | 2005-11-17 | Salman Akram | Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers |
US20050275049A1 (en) * | 2004-06-10 | 2005-12-15 | Kirby Kyle K | Packaged microelectronic imagers and methods of packging microelectronic imagers |
US20050275048A1 (en) * | 2004-06-14 | 2005-12-15 | Farnworth Warren M | Microelectronic imagers and methods of packaging microelectronic imagers |
US20050275051A1 (en) * | 2004-06-14 | 2005-12-15 | Farnworth Warren M | Prefabricated housings for microelectronic imagers and methods for packaging microelectronic imagers |
US20050275750A1 (en) * | 2004-06-09 | 2005-12-15 | Salman Akram | Wafer-level packaged microelectronic imagers and processes for wafer-level packaging |
US20050287783A1 (en) * | 2004-06-29 | 2005-12-29 | Kirby Kyle K | Microelectronic devices and methods for forming interconnects in microelectronic devices |
US20050285016A1 (en) * | 2004-06-29 | 2005-12-29 | Yung-Cheol Kong | Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure |
US20050285154A1 (en) * | 2004-06-29 | 2005-12-29 | Salman Akram | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US6984866B1 (en) * | 2003-03-17 | 2006-01-10 | National Semiconductor Corporation | Flip chip optical semiconductor on a PCB |
US20060011809A1 (en) * | 2004-07-19 | 2006-01-19 | Farnworth Warren M | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
US20060014313A1 (en) * | 2004-07-16 | 2006-01-19 | Hall Frank L | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060023107A1 (en) * | 2004-08-02 | 2006-02-02 | Bolken Todd O | Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers |
US20060024856A1 (en) * | 2004-07-28 | 2006-02-02 | Derderian James M | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060035402A1 (en) * | 2004-08-10 | 2006-02-16 | Street Bret K | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060040421A1 (en) * | 2004-08-19 | 2006-02-23 | Farnworth Warren M | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers |
US20060038183A1 (en) * | 2004-08-19 | 2006-02-23 | Oliver Steven D | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers |
US20060043599A1 (en) * | 2004-09-02 | 2006-03-02 | Salman Akram | Through-wafer interconnects for photoimager and memory wafers |
US20060043262A1 (en) * | 2004-08-30 | 2006-03-02 | Micron Technology, Inc. | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
US20060043509A1 (en) * | 2004-08-24 | 2006-03-02 | Watkins Charles M | Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices |
US20060044433A1 (en) * | 2004-08-31 | 2006-03-02 | Micron Technology, Inc. | Microelectronic imagers having front side contacts and methods of packaging such microelectronic imagers |
US20060043513A1 (en) * | 2004-09-02 | 2006-03-02 | Deok-Hoon Kim | Method of making camera module in wafer level |
US20060043512A1 (en) * | 2004-08-24 | 2006-03-02 | Oliver Steven D | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers |
US20060046332A1 (en) * | 2004-08-26 | 2006-03-02 | Derderian James M | Microelectronic Imaging units and methods of manufacturing microelectronic imaging units |
US7038321B1 (en) * | 2005-04-29 | 2006-05-02 | Delphi Technologies, Inc. | Method of attaching a flip chip device and circuit assembly formed thereby |
US20060097335A1 (en) * | 2004-11-08 | 2006-05-11 | Deok-Hoon Kim | Electronic package for image sensor, and the packaging method thereof |
US7045901B2 (en) * | 2000-05-19 | 2006-05-16 | Megic Corporation | Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board |
US20060121693A1 (en) * | 2004-12-08 | 2006-06-08 | Miradia Inc. | Method and device for wafer scale packaging of optical devices using a scribe and break process |
US20060131709A1 (en) * | 2004-12-21 | 2006-06-22 | Caron Michael R | Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate |
US20060148250A1 (en) * | 2004-12-30 | 2006-07-06 | Micron Technology, Inc. | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
US20060172867A1 (en) * | 2005-02-03 | 2006-08-03 | Lung-Huei Lee | Foldable exerciser |
US20060177959A1 (en) * | 2005-02-10 | 2006-08-10 | Micron Technology, Inc. | Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces |
US20060175532A1 (en) * | 2005-02-08 | 2006-08-10 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060177999A1 (en) * | 2005-02-10 | 2006-08-10 | Micron Technology, Inc. | Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces |
US20060186492A1 (en) * | 2005-02-18 | 2006-08-24 | Micron Technology, Inc. | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers |
EP1699082A1 (en) * | 2005-03-02 | 2006-09-06 | Sharp Kabushiki Kaisha | Solid-state image sensing device |
US20060211233A1 (en) * | 2005-03-21 | 2006-09-21 | Skyworks Solutions, Inc. | Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure |
US20060213804A1 (en) * | 2005-03-24 | 2006-09-28 | Hsiu-Mei Yu | Cavity structure for semiconductor structures |
US20060220173A1 (en) * | 2005-04-01 | 2006-10-05 | Skyworks Solutions, Inc. | Wafer level package including a device wafer integrated with a passive component |
US20060255435A1 (en) * | 2005-03-24 | 2006-11-16 | Edward Fuergut | Method for encapsulating a semiconductor device and semiconductor device |
US20060255102A1 (en) * | 2005-05-11 | 2006-11-16 | Snyder Rick B | Technique for defining a wettable solder joint area for an electronic assembly substrate |
US20060290001A1 (en) * | 2005-06-28 | 2006-12-28 | Micron Technology, Inc. | Interconnect vias and associated methods of formation |
US20060289968A1 (en) * | 2005-06-28 | 2006-12-28 | Micron Technology, Inc. | Conductive interconnect structures and formation methods using supercritical fluids |
WO2007012992A1 (en) * | 2005-07-28 | 2007-02-01 | Nxp B.V. | A package and manufacturing method for a microelectronic component |
US20070045515A1 (en) * | 2005-09-01 | 2007-03-01 | Micron Technology, Inc. | Microelectronic imaging devices and associated methods for attaching transmissive elements |
US20070045858A1 (en) * | 2005-09-01 | 2007-03-01 | Micron Technology, Inc. | Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
US20070051885A1 (en) * | 2005-09-08 | 2007-03-08 | Gentex Corporation | Automotive vehicle image sensor |
US20070063145A1 (en) * | 2005-09-21 | 2007-03-22 | Oliver Kierse | Radiation sensor device and method |
US20070090503A1 (en) * | 2005-10-21 | 2007-04-26 | Cheng-Wei Huang | Semiconductor package having an optical device and the method of making the same |
US20070108579A1 (en) * | 2003-09-17 | 2007-05-17 | Bolken Todd O | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor |
US20070148807A1 (en) * | 2005-08-22 | 2007-06-28 | Salman Akram | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
US20070166867A1 (en) * | 2006-01-04 | 2007-07-19 | Chow Seng G | Integrated circuit package system with image sensor system |
US20070181781A1 (en) * | 2001-03-06 | 2007-08-09 | Digital Optics Corporation | Integrated optical transceiver |
US20070222048A1 (en) * | 2006-03-24 | 2007-09-27 | Advanced Semiconductor Engineering, Inc. | Package structure |
US7276789B1 (en) | 1999-10-12 | 2007-10-02 | Microassembly Technologies, Inc. | Microelectromechanical systems using thermocompression bonding |
US20070236591A1 (en) * | 2006-04-11 | 2007-10-11 | Tam Samuel W | Method for mounting protective covers over image capture devices and devices manufactured thereby |
US20080048312A1 (en) * | 2005-03-09 | 2008-02-28 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and method for manufacturing the same |
WO2008044675A1 (en) | 2006-10-11 | 2008-04-17 | Hamamatsu Photonics K.K. | Solid-state imaging device |
EP1929519A2 (en) * | 2005-09-29 | 2008-06-11 | Skyworks Solutions, Inc. | Pakaged electronic devices and process of manufacturing same |
US20080138957A1 (en) * | 2005-05-31 | 2008-06-12 | Miradia Inc. | Triple alignment substrate method and structure for packaging devices |
US20080179729A1 (en) * | 2005-03-31 | 2008-07-31 | Il Kwon Shim | Encapsulant cavity integrated circuit package system |
US20080191343A1 (en) * | 2007-02-13 | 2008-08-14 | Xintec Inc. | Integrated circuit package having large conductive area and method for fabricating the same |
US20080217708A1 (en) * | 2007-03-09 | 2008-09-11 | Skyworks Solutions, Inc. | Integrated passive cap in a system-in-package |
US20080296572A1 (en) * | 2000-12-29 | 2008-12-04 | Stmicroelectronics Sa | Optical semiconductor device with sealing spacer |
WO2009006477A1 (en) * | 2007-07-02 | 2009-01-08 | Micron Technology, Inc. | Method of forming molded standoff structures on integrated circuit devices |
US7480006B1 (en) * | 2004-04-13 | 2009-01-20 | Pixim, Inc. | Optical package for image sensor with integrated heater |
US20090039455A1 (en) * | 2007-08-08 | 2009-02-12 | Xintec Inc. | Image sensor package with trench insulator and fabrication method thereof |
US20090045478A1 (en) * | 2007-08-17 | 2009-02-19 | Yeh Hsin Hui | CMOS image sensor package structure |
US20090050789A1 (en) * | 2000-03-06 | 2009-02-26 | Tessera North America | Optoelectronic package, camera including the same and related methods |
US20090075431A1 (en) * | 2006-08-02 | 2009-03-19 | Skyworks Solutions, Inc. | Wafer level package with cavities for active devices |
US20090096589A1 (en) * | 2007-10-10 | 2009-04-16 | International Business Machines Corporation | Packaging a semiconductor wafer |
US20090206349A1 (en) * | 2006-08-25 | 2009-08-20 | Hiroshi Yamada | Semiconductor device and method of manufacturing the same |
US20090218492A1 (en) * | 2005-09-21 | 2009-09-03 | Oliver Kierse | Radiation sensor device and method |
US20090224386A1 (en) * | 2008-03-07 | 2009-09-10 | Stats Chippac, Ltd. | Optical Semiconductor Device Having Pre-Molded Leadframe with Window and Method Therefor |
US20090243082A1 (en) * | 2008-03-26 | 2009-10-01 | Zigmund Ramirez Camacho | Integrated circuit package system with planar interconnect |
US20090294887A1 (en) * | 2008-05-29 | 2009-12-03 | Takashi Hirano | Semiconductor device |
US20090321903A1 (en) * | 2006-08-25 | 2009-12-31 | Sanyo Electric Co., Ltd. | Semiconductor device and manufacturing method thereof |
US7652376B2 (en) | 2006-01-04 | 2010-01-26 | Stats Chippac Ltd. | Integrated circuit package system including stacked die |
US20100052131A1 (en) * | 2008-08-26 | 2010-03-04 | Lionel Chien Hui Tay | Integrated circuit package system with redistribution layer |
US20100065929A1 (en) * | 2006-08-25 | 2010-03-18 | Kazuo Okada | Semiconductor device |
US7687315B2 (en) | 2005-04-29 | 2010-03-30 | Stats Chippac Ltd. | Stacked integrated circuit package system and method of manufacture therefor |
US7692521B1 (en) | 2005-05-12 | 2010-04-06 | Microassembly Technologies, Inc. | High force MEMS device |
US7698015B1 (en) | 2001-02-27 | 2010-04-13 | Cypress Semiconductor Corporation | Integrated back-end integrated circuit manufacturing assembly |
US20100093133A1 (en) * | 2005-01-31 | 2010-04-15 | Fujitsu Limited | Electronic device and method for fabricating the same |
US20100105160A1 (en) * | 2007-06-08 | 2010-04-29 | Harpuneet Singh | Techniques for Glass Attachment in an Image Sensor Package |
US20100105168A1 (en) * | 2008-10-29 | 2010-04-29 | Freescale Semiconductor, Inc. | Microelecronic assembly and method for forming the same |
US7750482B2 (en) | 2006-02-09 | 2010-07-06 | Stats Chippac Ltd. | Integrated circuit package system including zero fillet resin |
US7768125B2 (en) | 2006-01-04 | 2010-08-03 | Stats Chippac Ltd. | Multi-chip package system |
US20100194465A1 (en) * | 2009-02-02 | 2010-08-05 | Ali Salih | Temperature compensated current source and method therefor |
US20100244161A1 (en) * | 2007-11-30 | 2010-09-30 | Skyworks Solutions, Inc. | Wafer level packaging using flip chip mounting |
US7818085B1 (en) | 2001-02-27 | 2010-10-19 | Cypress Semiconductor Corporation | System for controlling the processing of an integrated circuit chip assembly line |
US7829991B2 (en) | 1998-06-30 | 2010-11-09 | Micron Technology, Inc. | Stackable ceramic FBGA for high thermal applications |
US20100283144A1 (en) * | 2007-12-26 | 2010-11-11 | Steve Xin Liang | In-situ cavity circuit package |
US20100301468A1 (en) * | 2009-05-27 | 2010-12-02 | Elpida Memory, Inc. | Semiconductor device and method of manufacturing the same |
US20110037886A1 (en) * | 2009-08-14 | 2011-02-17 | Harpuneet Singh | Wafer level camera module with molded housing and method of manufacturing |
EP2287596A1 (en) * | 2009-08-11 | 2011-02-23 | Sensirion AG | Sensor with glob-top and method for manufacturing the same |
US20110074028A1 (en) * | 2004-10-07 | 2011-03-31 | Stats Chippac, Ltd. | Semiconductor Device and Method of Dissipating Heat From Thin Package-on-Package Mounted to Substrate |
US20110193231A1 (en) * | 2010-02-08 | 2011-08-11 | Optopac Co., Ltd. | Electronic device package and method for fabricating the same |
US20110221017A1 (en) * | 2008-11-07 | 2011-09-15 | Sumitomo Bakelite Company, Ltd. | Photosensitive resin composition, photosensitive adhesive film, and light-receiving device |
US8072082B2 (en) | 2008-04-24 | 2011-12-06 | Micron Technology, Inc. | Pre-encapsulated cavity interposer |
US20120306072A1 (en) * | 2011-06-06 | 2012-12-06 | International Rectifier Corporation | Semiconductor Wafer with Reduced Thickness Variation and Method for Fabricating Same |
US8456560B2 (en) | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
USRE44438E1 (en) | 2001-02-27 | 2013-08-13 | Stats Chippac, Ltd. | Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate |
CN103337504A (en) * | 2013-05-31 | 2013-10-02 | 南通富士通微电子股份有限公司 | A packaging method for an image sensor |
US8605208B2 (en) | 2007-04-24 | 2013-12-10 | Digitaloptics Corporation | Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly |
CN103715210A (en) * | 2012-10-09 | 2014-04-09 | 胜开科技股份有限公司 | Structure and manufacturing method for high resolution camera module |
US8704349B2 (en) | 2006-02-14 | 2014-04-22 | Stats Chippac Ltd. | Integrated circuit package system with exposed interconnects |
US8772919B2 (en) | 2007-08-08 | 2014-07-08 | Wen-Cheng Chien | Image sensor package with trench insulator and fabrication method thereof |
US20140252642A1 (en) * | 2013-03-07 | 2014-09-11 | Xintec Inc. | Chip package and method for forming the same |
US20150028446A1 (en) * | 2013-05-22 | 2015-01-29 | Wei-Sheng Lei | Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach |
US20150115448A1 (en) * | 2013-10-30 | 2015-04-30 | Infineon Technologies Ag | Method for processing wafer |
US20150179828A1 (en) * | 2009-09-24 | 2015-06-25 | Msg Lithoglas Ag | Arrangement with a component on a carrier substrate, an arrangement and a semi-finished product |
US9368535B2 (en) * | 2014-02-28 | 2016-06-14 | Semiconductor Components Industries, Llc | Imaging systems with flip chip ball grid arrays |
US20170095870A1 (en) * | 2013-07-19 | 2017-04-06 | Materion Corporation | Metal cap assembly for optical communications |
US20170154913A1 (en) * | 2015-12-01 | 2017-06-01 | Hyunsu Jun | Semiconductor package |
WO2017176506A1 (en) * | 2016-04-05 | 2017-10-12 | University Of Florida Research Foundation, Incorporated | Flush-mount micromachined transducers |
KR20180055385A (en) * | 2016-11-17 | 2018-05-25 | 장경규 | Semiconductor package for photo-sensing |
US20190229139A1 (en) * | 2018-01-19 | 2019-07-25 | Samsung Electro-Mechanics Co., Ltd. | Fan-out sensor package |
US10522505B2 (en) * | 2017-04-06 | 2019-12-31 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method for manufacturing the same |
TWI685926B (en) * | 2019-06-04 | 2020-02-21 | 勝麗國際股份有限公司 | Stacked sensor package structure |
US10600835B2 (en) | 2016-12-12 | 2020-03-24 | Samsung Electro-Mechanics Co., Ltd. | Electronic module and method of manufacturing the same |
US10629641B2 (en) * | 2017-10-19 | 2020-04-21 | Samsung Electronics Co., Ltd. | Fan-out sensor package and optical-type fingerprint sensor module including the same |
US20200235153A1 (en) * | 2019-01-22 | 2020-07-23 | Advanced Semiconductor Engineering, Inc. | Optical package structure and method for manufacturing the same |
CN112038299A (en) * | 2019-06-04 | 2020-12-04 | 胜丽国际股份有限公司 | Stacked sensor package structure |
US10978597B2 (en) * | 2016-10-06 | 2021-04-13 | Osram Oled Gmbh | Sensor |
US11211300B2 (en) * | 2017-01-31 | 2021-12-28 | Sony Semiconductor Solutions Corporation | Electronic component and camera module |
US20220181223A1 (en) * | 2020-12-09 | 2022-06-09 | Texas Instruments Incorporated | Covers for semiconductor package components |
US20220415823A1 (en) * | 2019-04-19 | 2022-12-29 | Skyworks Solutions, Inc. | Shielded radio-frequency devices |
US11869823B2 (en) * | 2019-11-08 | 2024-01-09 | Octavo Systems Llc | System in a package modifications |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4558171A (en) * | 1984-10-12 | 1985-12-10 | General Electric Company | Hermetic enclosure for electronic components with an optionally transparent cover and a method of making the same |
US4894707A (en) * | 1987-02-12 | 1990-01-16 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having a light transparent window and a method of producing same |
WO1998003990A1 (en) * | 1996-07-23 | 1998-01-29 | Seiko Epson Corporation | Method for mounting encapsulated body on mounting board and optical converter |
US6117705A (en) * | 1997-04-18 | 2000-09-12 | Amkor Technology, Inc. | Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate |
US6130448A (en) * | 1998-08-21 | 2000-10-10 | Gentex Corporation | Optical sensor package and method of making same |
US6255741B1 (en) * | 1998-03-17 | 2001-07-03 | Denso Corporation | Semiconductor device with a protective sheet to affix a semiconductor chip |
-
2000
- 2000-03-29 US US09/538,385 patent/US6566745B1/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4558171A (en) * | 1984-10-12 | 1985-12-10 | General Electric Company | Hermetic enclosure for electronic components with an optionally transparent cover and a method of making the same |
US4894707A (en) * | 1987-02-12 | 1990-01-16 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having a light transparent window and a method of producing same |
WO1998003990A1 (en) * | 1996-07-23 | 1998-01-29 | Seiko Epson Corporation | Method for mounting encapsulated body on mounting board and optical converter |
US6144507A (en) * | 1996-07-23 | 2000-11-07 | Seiko Epson Corporation | Method of mounting a sealed assembly on a mounting substrate and optical transducer |
US6117705A (en) * | 1997-04-18 | 2000-09-12 | Amkor Technology, Inc. | Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate |
US6255741B1 (en) * | 1998-03-17 | 2001-07-03 | Denso Corporation | Semiconductor device with a protective sheet to affix a semiconductor chip |
US6130448A (en) * | 1998-08-21 | 2000-10-10 | Gentex Corporation | Optical sensor package and method of making same |
Non-Patent Citations (4)
Title |
---|
Abstract-Shweky, et al, A CSP Optoelectronic Package for Imaging and Light Detection Applications, 1998 International Symposium on Microelectronics; Nov. 1-4, 1998, San Diego Convention Center, San Diego, California, Sponsored by International Microelectronics and Packaging Society. |
Abstract—Shweky, et al, A CSP Optoelectronic Package for Imaging and Light Detection Applications, 1998 International Symposium on Microelectronics; Nov. 1-4, 1998, San Diego Convention Center, San Diego, California, Sponsored by International Microelectronics and Packaging Society. |
Abstract-Wu, et al, Active Pixel Sensor (APS) Package, 1999 International Conference on High Density Packaging and MCMs;Apr. 6-9, 1999, The Adam's Mark Hotel, Denver, Colorado; Sponsored by International Microelectronics and Packaging Society. |
Abstract—Wu, et al, Active Pixel Sensor (APS) Package, 1999 International Conference on High Density Packaging and MCMs;Apr. 6-9, 1999, The Adam's Mark Hotel, Denver, Colorado; Sponsored by International Microelectronics and Packaging Society. |
Cited By (404)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7829991B2 (en) | 1998-06-30 | 2010-11-09 | Micron Technology, Inc. | Stackable ceramic FBGA for high thermal applications |
US7276789B1 (en) | 1999-10-12 | 2007-10-02 | Microassembly Technologies, Inc. | Microelectromechanical systems using thermocompression bonding |
US7750462B1 (en) | 1999-10-12 | 2010-07-06 | Microassembly Technologies, Inc. | Microelectromechanical systems using thermocompression bonding |
US7842914B2 (en) | 2000-03-06 | 2010-11-30 | Tessera North America, Inc. | Optoelectronic package, camera including the same and related methods |
US20090152450A1 (en) * | 2000-03-06 | 2009-06-18 | Feldman Michael R | Integrated optical transceiver |
US20090050789A1 (en) * | 2000-03-06 | 2009-02-26 | Tessera North America | Optoelectronic package, camera including the same and related methods |
US20100272390A1 (en) * | 2000-03-06 | 2010-10-28 | Tessera North America, Inc. | Integrated optical transceiver |
US7750289B2 (en) | 2000-03-06 | 2010-07-06 | Tessera North America, Inc. | Integrated optical device including an optoelectronic element and a sealing substrate with an optical element having optical power thereon |
US8148806B2 (en) | 2000-05-19 | 2012-04-03 | Megica Corporation | Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
US7045901B2 (en) * | 2000-05-19 | 2006-05-16 | Megic Corporation | Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board |
US20010052642A1 (en) * | 2000-06-16 | 2001-12-20 | Wood Alan G. | Semiconductor device package and method |
US6911737B2 (en) | 2000-06-16 | 2005-06-28 | Micron Technology, Inc. | Semiconductor device package and method |
US7214566B1 (en) * | 2000-06-16 | 2007-05-08 | Micron Technology, Inc. | Semiconductor device package and method |
US8179215B2 (en) | 2000-11-29 | 2012-05-15 | Microassembly Technologies, Inc. | MEMS device with integral packaging |
US20080272867A1 (en) * | 2000-11-29 | 2008-11-06 | Microassembly Technologies, Inc. | Mems device with integral packaging |
US20050168306A1 (en) * | 2000-11-29 | 2005-08-04 | Cohn Michael B. | MEMS device with integral packaging |
US20050082490A1 (en) * | 2000-12-29 | 2005-04-21 | Perillat Patrick D. | Optical semiconductor housing with transparent chip and method for making same |
US7214996B2 (en) * | 2000-12-29 | 2007-05-08 | Stmicroelectronics S.A. | Optical semiconductor housing with transparent chip and method for making same |
US20040046169A1 (en) * | 2000-12-29 | 2004-03-11 | Perillat Patrick Daniel | Optical semiconductor device with transparent support |
US20080296572A1 (en) * | 2000-12-29 | 2008-12-04 | Stmicroelectronics Sa | Optical semiconductor device with sealing spacer |
US20020163589A1 (en) * | 2001-02-26 | 2002-11-07 | Masahiko Yukawa | Solid-state image pickup device and method of producing the same |
US7818085B1 (en) | 2001-02-27 | 2010-10-19 | Cypress Semiconductor Corporation | System for controlling the processing of an integrated circuit chip assembly line |
US7698015B1 (en) | 2001-02-27 | 2010-04-13 | Cypress Semiconductor Corporation | Integrated back-end integrated circuit manufacturing assembly |
USRE44438E1 (en) | 2001-02-27 | 2013-08-13 | Stats Chippac, Ltd. | Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate |
US8941235B2 (en) | 2001-02-27 | 2015-01-27 | Stats Chippac, Ltd. | Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate |
US20050056944A1 (en) * | 2001-02-27 | 2005-03-17 | Chippac, Inc. | Super-thin high speed flip chip package |
US6730532B1 (en) * | 2001-02-27 | 2004-05-04 | Cypress Semiconductor Corporation | Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process |
US7375315B2 (en) * | 2001-03-06 | 2008-05-20 | Tessera North America, Inc. | Integrated optical transceiver and related methods |
US20070181781A1 (en) * | 2001-03-06 | 2007-08-09 | Digital Optics Corporation | Integrated optical transceiver |
US20050205762A1 (en) * | 2001-03-06 | 2005-09-22 | Digital Optics Corporation | Integrated optical transceiver and related methods |
US7160478B2 (en) * | 2001-08-24 | 2007-01-09 | Schott Ag | Method for producing electronic componets |
US8114304B2 (en) | 2001-08-24 | 2012-02-14 | Wafer-Level Packaging Portfolio Llc | Method for producing electronic components |
US20070063202A1 (en) * | 2001-08-24 | 2007-03-22 | Jurgen Leib | Method for producing electronic components |
US20040256349A1 (en) * | 2001-08-24 | 2004-12-23 | Jurgen Leib | Method for producing electronic componets |
US20030094706A1 (en) * | 2001-08-30 | 2003-05-22 | Howarth James J. | Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly |
US6972497B2 (en) * | 2002-02-06 | 2005-12-06 | Stmicroelectronics S.A. | Optical semiconductor device and method of manufacture |
US20040065952A1 (en) * | 2002-02-06 | 2004-04-08 | Christophe Prior | Optical semiconductor device and method of manufacture |
US20050230844A1 (en) * | 2002-08-29 | 2005-10-20 | Kinsman Larry D | Flip-chip image sensor packages and methods of fabrication |
US20060292732A1 (en) * | 2002-08-29 | 2006-12-28 | Kinsman Larry D | Methods of flip-chip image sensor package fabrication |
US20050233502A1 (en) * | 2002-08-29 | 2005-10-20 | Kinsman Larry D | Methods of fabrication for flip-chip image sensor packages |
US6940141B2 (en) | 2002-08-29 | 2005-09-06 | Micron Technology, Inc. | Flip-chip image sensor packages and methods of fabrication |
US7122390B2 (en) * | 2002-08-29 | 2006-10-17 | Micron Technology, Inc. | Methods of fabrication for flip-chip image sensor packages |
US7443038B2 (en) | 2002-08-29 | 2008-10-28 | Micron Technology, Inc. | Flip-chip image sensor packages |
US6964886B2 (en) | 2002-08-29 | 2005-11-15 | Micron Technology, Inc. | Methods of fabrication for flip-chip image sensor packages |
US8097895B2 (en) | 2002-08-29 | 2012-01-17 | Round Rock Research, Llc | Electronic device package with an optical device |
US20040043540A1 (en) * | 2002-08-29 | 2004-03-04 | Kinsman Larry D. | Methods of fabrication for flip-chip image sensor packages |
US6833612B2 (en) | 2002-08-29 | 2004-12-21 | Micron Technology, Inc. | Flip-chip image sensor packages |
US20040041282A1 (en) * | 2002-08-29 | 2004-03-04 | Kinsman Larry D. | Flip-chip image sensor packages and methods of fabrication |
US6956295B2 (en) | 2002-08-29 | 2005-10-18 | Micron Technology, Inc. | Flip-chip image sensor packages |
US20100052086A1 (en) * | 2002-08-29 | 2010-03-04 | Micron Technology, Inc. | Electronic device packages and methods of fabricating electronic device packages |
US7638813B2 (en) | 2002-08-29 | 2009-12-29 | Micron Technology, Inc. | Methods of fabrication for flip-chip image sensor packages |
US6885107B2 (en) * | 2002-08-29 | 2005-04-26 | Micron Technology, Inc. | Flip-chip image sensor packages and methods of fabrication |
US20080277752A1 (en) * | 2003-02-06 | 2008-11-13 | Sharp Kabushiki Kaisha | Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication |
US20040164981A1 (en) * | 2003-02-06 | 2004-08-26 | Kazuya Fujita | Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication |
US6984866B1 (en) * | 2003-03-17 | 2006-01-10 | National Semiconductor Corporation | Flip chip optical semiconductor on a PCB |
US7365442B2 (en) * | 2003-03-31 | 2008-04-29 | Osram Opto Semiconductors Gmbh | Encapsulation of thin-film electronic devices |
US20040191963A1 (en) * | 2003-03-31 | 2004-09-30 | Osram Opto Semiconductors Gmbh | Encapsulation of thin-film electronic devices |
US20040257460A1 (en) * | 2003-06-18 | 2004-12-23 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device and method for producing the same |
US8624371B2 (en) | 2003-09-17 | 2014-01-07 | Round Rock Research, Llc | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor |
US8008762B2 (en) * | 2003-09-17 | 2011-08-30 | Round Rock Research, Llc | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor |
US20070108579A1 (en) * | 2003-09-17 | 2007-05-17 | Bolken Todd O | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor |
US8426954B2 (en) | 2003-09-17 | 2013-04-23 | Round Rock Research, Llc | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor |
US6934065B2 (en) | 2003-09-18 | 2005-08-23 | Micron Technology, Inc. | Microelectronic devices and methods for packaging microelectronic devices |
US7321455B2 (en) | 2003-09-18 | 2008-01-22 | Micron Technology, Inc. | Microelectronic devices and methods for packaging microelectronic devices |
US20050063033A1 (en) * | 2003-09-18 | 2005-03-24 | Kinsman Larry D. | Microelectronic devices and methods for packaging microelectronic devices |
US20050255628A1 (en) * | 2003-09-18 | 2005-11-17 | Micron Technology, Inc. | Microelectronic devices and methods for packaging microelectronic devices |
US7291518B2 (en) | 2003-10-01 | 2007-11-06 | Optopac, Inc. | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
US20050208702A1 (en) * | 2003-10-01 | 2005-09-22 | Deok-Hoon Kim | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
US7038287B2 (en) | 2003-10-01 | 2006-05-02 | Optopac, Inc. | Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof |
US6943423B2 (en) | 2003-10-01 | 2005-09-13 | Optopac, Inc. | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
US20050098802A1 (en) * | 2003-10-01 | 2005-05-12 | Kim Deok H. | Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof |
US20050073017A1 (en) * | 2003-10-01 | 2005-04-07 | Deok-Hoon Kim | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
US20050077603A1 (en) * | 2003-10-08 | 2005-04-14 | Dylan Yu | Method and structure for a wafer level packaging |
US7276398B2 (en) | 2003-10-23 | 2007-10-02 | Hewlett-Packard Development Company, L.P. | System and method for hermetically sealing a package |
US20050089283A1 (en) * | 2003-10-23 | 2005-04-28 | Don Michael | System and method for hermetically sealing a package |
US7550859B2 (en) | 2003-10-23 | 2009-06-23 | Hewlett-Packard Development Company, L.P. | System and method for hermetically sealing a package |
US20070290309A1 (en) * | 2003-10-23 | 2007-12-20 | Don Michael | System and Method for Hermetically Sealing a Package |
US20070072328A1 (en) * | 2003-10-24 | 2007-03-29 | Miradia Inc. | Method and system for hermetically sealing packages for optics |
US20060284295A1 (en) * | 2003-10-24 | 2006-12-21 | Miradia Inc. | Method and system for hermetically sealing packages for optics |
CN101202272B (en) * | 2003-10-24 | 2010-06-02 | 米拉迪亚公司 | Sealing structure for MEMS devices and method of the same |
US20050101059A1 (en) * | 2003-10-24 | 2005-05-12 | Xhp Microsystems, Inc. | Method and system for hermetically sealing packages for optics |
CN101183675B (en) * | 2003-10-24 | 2010-06-09 | 米拉迪亚公司 | Method and system for wafer-stage package of chip having a number of pieces |
US8022520B2 (en) | 2003-10-24 | 2011-09-20 | Miradia Inc. | System for hermetically sealing packages for optics |
CN101252122B (en) * | 2003-10-24 | 2012-01-25 | 米拉迪亚公司 | mems package for system of air-tight device and wafer-class detection |
US20110186839A1 (en) * | 2003-10-24 | 2011-08-04 | Miradia Inc. | Method and System for Hermetically Sealing Packages for Optics |
US7671461B2 (en) | 2003-10-24 | 2010-03-02 | Miradia Inc. | Method and system for hermetically sealing packages for optics |
US7948000B2 (en) * | 2003-10-24 | 2011-05-24 | Miradia Inc. | Method and system for hermetically sealing packages for optics |
US8288851B2 (en) | 2003-10-24 | 2012-10-16 | Miradia Inc. | Method and system for hermetically sealing packages for optics |
US7303645B2 (en) * | 2003-10-24 | 2007-12-04 | Miradia Inc. | Method and system for hermetically sealing packages for optics |
CN100454535C (en) * | 2003-10-24 | 2009-01-21 | 米拉迪亚公司 | Method and system for hermetically sealing packages for optics |
US20070235852A1 (en) * | 2003-10-24 | 2007-10-11 | Miradia Inc. | Method and system for sealing packages for optics |
US20070128818A1 (en) * | 2003-10-24 | 2007-06-07 | Miradia Inc. | Method and system for hermetically sealing packages for optics |
US20080014682A1 (en) * | 2003-10-24 | 2008-01-17 | Miradia Inc. | Method and system for sealing packages for optics |
US20050205984A1 (en) * | 2003-11-04 | 2005-09-22 | Tai-Saw Technology Co., Ltd. | Package structure with a retarding structure and method of making same |
US7067358B2 (en) * | 2003-11-04 | 2006-06-27 | Tai-Saw Technology Co., Ltd. | Package structure with a retarding structure and method of making same |
US20050093178A1 (en) * | 2003-11-04 | 2005-05-05 | Chen-Tung Huang | Package structure with a retarding structure and method of making same |
US7064452B2 (en) * | 2003-11-04 | 2006-06-20 | Tai-Saw Technology Co., Ltd. | Package structure with a retarding structure and method of making same |
US7583862B2 (en) | 2003-11-26 | 2009-09-01 | Aptina Imaging Corporation | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20050231626A1 (en) * | 2003-11-26 | 2005-10-20 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20050110889A1 (en) * | 2003-11-26 | 2005-05-26 | Tuttle Mark E. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20050156266A1 (en) * | 2004-01-06 | 2005-07-21 | Street Bret K. | Die package having an adhesive flow restriction area |
US20050151272A1 (en) * | 2004-01-06 | 2005-07-14 | Street Bret K. | Die package having an adhesive flow restriction area |
US20070114646A1 (en) * | 2004-01-06 | 2007-05-24 | Street Bret K | Die package having an adhesive flow restriction area |
US7476955B2 (en) * | 2004-01-06 | 2009-01-13 | Micron Technology, Inc. | Die package having an adhesive flow restriction area |
US7491570B2 (en) * | 2004-01-06 | 2009-02-17 | Micron Technology, Inc. | Die package having an adhesive flow restriction area |
US20050184219A1 (en) * | 2004-02-23 | 2005-08-25 | Kirby Kyle K. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7253397B2 (en) | 2004-02-23 | 2007-08-07 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20050189632A1 (en) * | 2004-03-01 | 2005-09-01 | Patrick Morrow | Sealed three dimensional metal bonded integrated circuits |
US7217595B2 (en) * | 2004-03-01 | 2007-05-15 | Intel Corporation | Sealed three dimensional metal bonded integrated circuits |
US20050224938A1 (en) * | 2004-04-12 | 2005-10-13 | Deok-Hoon Kim | Electronic package having a sealing structure on predetermined area, and the method thereof |
US7122874B2 (en) * | 2004-04-12 | 2006-10-17 | Optopac, Inc. | Electronic package having a sealing structure on predetermined area, and the method thereof |
US7480006B1 (en) * | 2004-04-13 | 2009-01-20 | Pixim, Inc. | Optical package for image sensor with integrated heater |
US7632713B2 (en) * | 2004-04-27 | 2009-12-15 | Aptina Imaging Corporation | Methods of packaging microelectronic imaging devices |
US20050236708A1 (en) * | 2004-04-27 | 2005-10-27 | Farnworth Warren M | Microelectronic imaging devices and methods of packaging microelectronic imaging devices |
US6943424B1 (en) | 2004-05-06 | 2005-09-13 | Optopac, Inc. | Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof |
US7253957B2 (en) | 2004-05-13 | 2007-08-07 | Micron Technology, Inc. | Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers |
US20050254133A1 (en) * | 2004-05-13 | 2005-11-17 | Salman Akram | Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers |
US8092734B2 (en) | 2004-05-13 | 2012-01-10 | Aptina Imaging Corporation | Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers |
US20050253213A1 (en) * | 2004-05-13 | 2005-11-17 | Tongbi Jiang | Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers |
US20050275750A1 (en) * | 2004-06-09 | 2005-12-15 | Salman Akram | Wafer-level packaged microelectronic imagers and processes for wafer-level packaging |
US8816463B2 (en) | 2004-06-09 | 2014-08-26 | Round Rock Research, Llc | Wafer-level packaged microelectronic imagers having interconnects formed through terminals |
US20050275049A1 (en) * | 2004-06-10 | 2005-12-15 | Kirby Kyle K | Packaged microelectronic imagers and methods of packging microelectronic imagers |
US8703518B2 (en) | 2004-06-10 | 2014-04-22 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7498647B2 (en) | 2004-06-10 | 2009-03-03 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US8035179B2 (en) | 2004-06-10 | 2011-10-11 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7262405B2 (en) | 2004-06-14 | 2007-08-28 | Micron Technology, Inc. | Prefabricated housings for microelectronic imagers |
US7199439B2 (en) | 2004-06-14 | 2007-04-03 | Micron Technology, Inc. | Microelectronic imagers and methods of packaging microelectronic imagers |
US20050275051A1 (en) * | 2004-06-14 | 2005-12-15 | Farnworth Warren M | Prefabricated housings for microelectronic imagers and methods for packaging microelectronic imagers |
US20050275048A1 (en) * | 2004-06-14 | 2005-12-15 | Farnworth Warren M | Microelectronic imagers and methods of packaging microelectronic imagers |
US20060261340A1 (en) * | 2004-06-14 | 2006-11-23 | Farnworth Warren M | Microelectronic imagers and methods of packaging microelectronic imagers |
US7253390B2 (en) | 2004-06-14 | 2007-08-07 | Micron Technology, Inc. | Methods for packaging microelectronic imagers |
US20060186317A1 (en) * | 2004-06-14 | 2006-08-24 | Farnworth Warren M | Methods for packaging microelectronic imagers |
US7419841B2 (en) | 2004-06-14 | 2008-09-02 | Micron Technology, Inc. | Microelectronic imagers and methods of packaging microelectronic imagers |
US7858429B2 (en) | 2004-06-29 | 2010-12-28 | Round Rock Research, Llc | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7232754B2 (en) | 2004-06-29 | 2007-06-19 | Micron Technology, Inc. | Microelectronic devices and methods for forming interconnects in microelectronic devices |
US20080138973A1 (en) * | 2004-06-29 | 2008-06-12 | Micron Technology, Inc. | Microelectronic devices and methods for forming interconnects in microelectronic devices |
US8053857B2 (en) | 2004-06-29 | 2011-11-08 | Round Rock Research, Llc | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20110089539A1 (en) * | 2004-06-29 | 2011-04-21 | Round Rock Research, Llc | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20060199363A1 (en) * | 2004-06-29 | 2006-09-07 | Micron Technology, Inc. | Microelectronic devices and methods for forming interconnects in microelectronic devices |
US20080020505A1 (en) * | 2004-06-29 | 2008-01-24 | Salman Akram | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7294897B2 (en) | 2004-06-29 | 2007-11-13 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7329943B2 (en) | 2004-06-29 | 2008-02-12 | Micron Technology, Inc. | Microelectronic devices and methods for forming interconnects in microelectronic devices |
US7494292B2 (en) * | 2004-06-29 | 2009-02-24 | Samsung Electronics Co., Ltd. | Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure |
US7829976B2 (en) | 2004-06-29 | 2010-11-09 | Micron Technology, Inc. | Microelectronic devices and methods for forming interconnects in microelectronic devices |
US20050285154A1 (en) * | 2004-06-29 | 2005-12-29 | Salman Akram | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20050287783A1 (en) * | 2004-06-29 | 2005-12-29 | Kirby Kyle K | Microelectronic devices and methods for forming interconnects in microelectronic devices |
US20050285016A1 (en) * | 2004-06-29 | 2005-12-29 | Yung-Cheol Kong | Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure |
US20060014313A1 (en) * | 2004-07-16 | 2006-01-19 | Hall Frank L | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7416913B2 (en) | 2004-07-16 | 2008-08-26 | Micron Technology, Inc. | Methods of manufacturing microelectronic imaging units with discrete standoffs |
US7417294B2 (en) | 2004-07-16 | 2008-08-26 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20070117249A1 (en) * | 2004-07-16 | 2007-05-24 | Hall Frank L | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7265330B2 (en) | 2004-07-19 | 2007-09-04 | Micron Technology, Inc. | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
US20060243889A1 (en) * | 2004-07-19 | 2006-11-02 | Farnworth Warren M | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
US20060011809A1 (en) * | 2004-07-19 | 2006-01-19 | Farnworth Warren M | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
US7709776B2 (en) | 2004-07-19 | 2010-05-04 | Aptina Imaging Corporation | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
US7504615B2 (en) | 2004-07-19 | 2009-03-17 | Aptina Imaging Corporation | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
US7189954B2 (en) | 2004-07-19 | 2007-03-13 | Micron Technology, Inc. | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
US20070170350A1 (en) * | 2004-07-19 | 2007-07-26 | Farnworth Warren M | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
US20090155949A1 (en) * | 2004-07-19 | 2009-06-18 | Farnworth Warren M | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
US20080268563A1 (en) * | 2004-07-28 | 2008-10-30 | Derderian James M | Microelectronic Imaging Units and Methods of Manufacturing Microelectronic Imaging Units |
US20080241985A1 (en) * | 2004-07-28 | 2008-10-02 | Derderian James M | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7402453B2 (en) | 2004-07-28 | 2008-07-22 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060024856A1 (en) * | 2004-07-28 | 2006-02-02 | Derderian James M | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7655507B2 (en) | 2004-07-28 | 2010-02-02 | Micron Technology Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20070034979A1 (en) * | 2004-07-28 | 2007-02-15 | Derderian James M | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7858420B2 (en) | 2004-07-28 | 2010-12-28 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7439598B2 (en) | 2004-07-28 | 2008-10-21 | Micron Technology, Inc. | Microelectronic imaging units |
US20060023107A1 (en) * | 2004-08-02 | 2006-02-02 | Bolken Todd O | Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers |
US20060216850A1 (en) * | 2004-08-10 | 2006-09-28 | Street Bret K | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060035402A1 (en) * | 2004-08-10 | 2006-02-16 | Street Bret K | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7498606B2 (en) | 2004-08-10 | 2009-03-03 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7364934B2 (en) | 2004-08-10 | 2008-04-29 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7723741B2 (en) | 2004-08-19 | 2010-05-25 | Aptina Imaging Corporation | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers |
US20060275941A1 (en) * | 2004-08-19 | 2006-12-07 | Oliver Steven D | Methods for manufacturing microelectronic imagers |
US20080237443A1 (en) * | 2004-08-19 | 2008-10-02 | Oliver Steven D | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers |
US20060040421A1 (en) * | 2004-08-19 | 2006-02-23 | Farnworth Warren M | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers |
US20060038183A1 (en) * | 2004-08-19 | 2006-02-23 | Oliver Steven D | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers |
US7397066B2 (en) | 2004-08-19 | 2008-07-08 | Micron Technology, Inc. | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers |
US20060234422A1 (en) * | 2004-08-19 | 2006-10-19 | Farnworth Warren M | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers |
US7223626B2 (en) | 2004-08-19 | 2007-05-29 | Micron Technology, Inc. | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers |
US20060255418A1 (en) * | 2004-08-24 | 2006-11-16 | Watkins Charles M | Packaged microelectronic imaging devices and methods of packaging microelectronic imaging device |
US20060043512A1 (en) * | 2004-08-24 | 2006-03-02 | Oliver Steven D | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers |
US20060043509A1 (en) * | 2004-08-24 | 2006-03-02 | Watkins Charles M | Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices |
US7993944B2 (en) | 2004-08-24 | 2011-08-09 | Micron Technology, Inc. | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers |
US7115961B2 (en) | 2004-08-24 | 2006-10-03 | Micron Technology, Inc. | Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices |
US7341881B2 (en) | 2004-08-24 | 2008-03-11 | Micron Technology, Inc. | Methods of packaging and testing microelectronic imaging devices |
US7429494B2 (en) | 2004-08-24 | 2008-09-30 | Micron Technology, Inc. | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers |
US20060046332A1 (en) * | 2004-08-26 | 2006-03-02 | Derderian James M | Microelectronic Imaging units and methods of manufacturing microelectronic imaging units |
US20060223207A1 (en) * | 2004-08-26 | 2006-10-05 | Derderian James M | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7691660B2 (en) | 2004-08-26 | 2010-04-06 | Aptina Imaging Corporation | Methods of manufacturing microelectronic imaging units on a microfeature workpiece |
US20090148969A1 (en) * | 2004-08-26 | 2009-06-11 | Derderian James M | Microelectronic imaging units |
US7511374B2 (en) | 2004-08-26 | 2009-03-31 | Aptina Imaging Corporation | Microelectronic imaging units having covered image sensors |
US7786574B2 (en) | 2004-08-26 | 2010-08-31 | Aptina Imaging Corp. | Microelectronic imaging units |
US7276393B2 (en) | 2004-08-26 | 2007-10-02 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060043262A1 (en) * | 2004-08-30 | 2006-03-02 | Micron Technology, Inc. | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
US7511262B2 (en) | 2004-08-30 | 2009-03-31 | Micron Technology, Inc. | Optical device and assembly for use with imaging dies, and wafer-label imager assembly |
US7547877B2 (en) | 2004-08-30 | 2009-06-16 | Micron Technology, Inc. | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
US7842915B2 (en) | 2004-08-30 | 2010-11-30 | Micron Technology, Inc. | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
US20080293179A1 (en) * | 2004-08-30 | 2008-11-27 | Salman Akram | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
US7646075B2 (en) | 2004-08-31 | 2010-01-12 | Micron Technology, Inc. | Microelectronic imagers having front side contacts |
US20060044433A1 (en) * | 2004-08-31 | 2006-03-02 | Micron Technology, Inc. | Microelectronic imagers having front side contacts and methods of packaging such microelectronic imagers |
US7956443B2 (en) | 2004-09-02 | 2011-06-07 | Micron Technology, Inc. | Through-wafer interconnects for photoimager and memory wafers |
US8502353B2 (en) | 2004-09-02 | 2013-08-06 | Micron Technology, Inc. | Through-wafer interconnects for photoimager and memory wafers |
US20060043513A1 (en) * | 2004-09-02 | 2006-03-02 | Deok-Hoon Kim | Method of making camera module in wafer level |
US8669179B2 (en) | 2004-09-02 | 2014-03-11 | Micron Technology, Inc. | Through-wafer interconnects for photoimager and memory wafers |
US7300857B2 (en) | 2004-09-02 | 2007-11-27 | Micron Technology, Inc. | Through-wafer interconnects for photoimager and memory wafers |
US20060043599A1 (en) * | 2004-09-02 | 2006-03-02 | Salman Akram | Through-wafer interconnects for photoimager and memory wafers |
US7683458B2 (en) | 2004-09-02 | 2010-03-23 | Micron Technology, Inc. | Through-wafer interconnects for photoimager and memory wafers |
US8143108B2 (en) | 2004-10-07 | 2012-03-27 | Stats Chippac, Ltd. | Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate |
US20110074028A1 (en) * | 2004-10-07 | 2011-03-31 | Stats Chippac, Ltd. | Semiconductor Device and Method of Dissipating Heat From Thin Package-on-Package Mounted to Substrate |
US7141869B2 (en) | 2004-11-08 | 2006-11-28 | Optopac, Inc. | Electronic package for image sensor, and the packaging method thereof |
US20060097335A1 (en) * | 2004-11-08 | 2006-05-11 | Deok-Hoon Kim | Electronic package for image sensor, and the packaging method thereof |
WO2006049473A1 (en) * | 2004-11-08 | 2006-05-11 | Optopac, Inc. | Electronic package for image sensor, and the packaging method thereof |
US7344956B2 (en) | 2004-12-08 | 2008-03-18 | Miradia Inc. | Method and device for wafer scale packaging of optical devices using a scribe and break process |
US20060121693A1 (en) * | 2004-12-08 | 2006-06-08 | Miradia Inc. | Method and device for wafer scale packaging of optical devices using a scribe and break process |
US20110012166A1 (en) * | 2004-12-08 | 2011-01-20 | Miradia Inc. | Method and device for wafer scale packaging of optical devices using a scribe and break process |
US7825519B2 (en) | 2004-12-08 | 2010-11-02 | Miradia Inc. | Method and device for wafer scale packaging of optical devices using a scribe and break process |
US9006878B2 (en) | 2004-12-08 | 2015-04-14 | Miradia Inc. | Method and device for wafer scale packaging of optical devices using a scribe and break process |
US20080191221A1 (en) * | 2004-12-08 | 2008-08-14 | Miradia Inc. | Method and device for wafer scale packaging of optical devices using a scribe and break process |
US20060131709A1 (en) * | 2004-12-21 | 2006-06-22 | Caron Michael R | Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate |
WO2006068672A3 (en) * | 2004-12-21 | 2007-12-21 | Tracking Technologies Inc | Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate |
WO2006068672A2 (en) * | 2004-12-21 | 2006-06-29 | Tracking Technologies, Inc. | Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate |
US20060205211A1 (en) * | 2004-12-30 | 2006-09-14 | Micron Technology, Inc. | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
US20060148250A1 (en) * | 2004-12-30 | 2006-07-06 | Micron Technology, Inc. | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
US7271482B2 (en) | 2004-12-30 | 2007-09-18 | Micron Technology, Inc. | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
US20100093133A1 (en) * | 2005-01-31 | 2010-04-15 | Fujitsu Limited | Electronic device and method for fabricating the same |
US7935573B2 (en) * | 2005-01-31 | 2011-05-03 | Fujitsu Limited | Electronic device and method for fabricating the same |
US20060172867A1 (en) * | 2005-02-03 | 2006-08-03 | Lung-Huei Lee | Foldable exerciser |
US20060175532A1 (en) * | 2005-02-08 | 2006-08-10 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060177999A1 (en) * | 2005-02-10 | 2006-08-10 | Micron Technology, Inc. | Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces |
US20060177959A1 (en) * | 2005-02-10 | 2006-08-10 | Micron Technology, Inc. | Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces |
US7303931B2 (en) | 2005-02-10 | 2007-12-04 | Micron Technology, Inc. | Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces |
US20080017943A1 (en) * | 2005-02-10 | 2008-01-24 | Boettiger Ulrich C | Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces |
US7795649B2 (en) | 2005-02-10 | 2010-09-14 | Aptina Imaging Corporation | Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces |
US20070096235A1 (en) * | 2005-02-18 | 2007-05-03 | Boettiger Ulrich C | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers |
US20070120212A1 (en) * | 2005-02-18 | 2007-05-31 | Boettiger Ulrich C | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers |
US7696588B2 (en) | 2005-02-18 | 2010-04-13 | Aptina Imaging Corporation | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers |
US20060186492A1 (en) * | 2005-02-18 | 2006-08-24 | Micron Technology, Inc. | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers |
US7190039B2 (en) | 2005-02-18 | 2007-03-13 | Micron Technology, Inc. | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers |
US7390687B2 (en) | 2005-02-18 | 2008-06-24 | Micron Technology, Inc. | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers |
EP1699082A1 (en) * | 2005-03-02 | 2006-09-06 | Sharp Kabushiki Kaisha | Solid-state image sensing device |
KR100808962B1 (en) * | 2005-03-02 | 2008-03-04 | 샤프 가부시키가이샤 | Solid-state image sensing device |
US20060208182A1 (en) * | 2005-03-02 | 2006-09-21 | Sharp Kabushiki Kaisha | Solid-state image sensing device |
US20080048312A1 (en) * | 2005-03-09 | 2008-02-28 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and method for manufacturing the same |
US20080064142A1 (en) * | 2005-03-21 | 2008-03-13 | Skyworks Solutions, Inc. | Method for fabricating a wafer level package having through wafer vias for external package connectivity |
US20060211233A1 (en) * | 2005-03-21 | 2006-09-21 | Skyworks Solutions, Inc. | Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure |
US7378724B2 (en) | 2005-03-24 | 2008-05-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cavity structure for semiconductor structures |
US20060255435A1 (en) * | 2005-03-24 | 2006-11-16 | Edward Fuergut | Method for encapsulating a semiconductor device and semiconductor device |
US20060213804A1 (en) * | 2005-03-24 | 2006-09-28 | Hsiu-Mei Yu | Cavity structure for semiconductor structures |
US8021924B2 (en) | 2005-03-31 | 2011-09-20 | Stats Chippac Ltd. | Encapsulant cavity integrated circuit package system and method of fabrication thereof |
US20080179729A1 (en) * | 2005-03-31 | 2008-07-31 | Il Kwon Shim | Encapsulant cavity integrated circuit package system |
US7855100B2 (en) | 2005-03-31 | 2010-12-21 | Stats Chippac Ltd. | Integrated circuit package system with an encapsulant cavity and method of fabrication thereof |
US8309397B2 (en) | 2005-03-31 | 2012-11-13 | Stats Chippac Ltd. | Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof |
US20060220173A1 (en) * | 2005-04-01 | 2006-10-05 | Skyworks Solutions, Inc. | Wafer level package including a device wafer integrated with a passive component |
US20080003761A1 (en) * | 2005-04-01 | 2008-01-03 | Skyworks Solutions, Inc. | Method for fabricating a wafer level package with device wafer and passive component integration |
US7576426B2 (en) * | 2005-04-01 | 2009-08-18 | Skyworks Solutions, Inc. | Wafer level package including a device wafer integrated with a passive component |
US7629201B2 (en) | 2005-04-01 | 2009-12-08 | Skyworks Solutions, Inc. | Method for fabricating a wafer level package with device wafer and passive component integration |
WO2006107507A3 (en) * | 2005-04-01 | 2009-04-16 | Skyworks Solutions Inc | Wafer level package including a device wafer integrated with a passive component |
KR100924902B1 (en) * | 2005-04-01 | 2009-11-05 | 스카이워크스 솔루션즈, 인코포레이티드 | Wafer level package including a device wafer integrated with a passive component |
US7687315B2 (en) | 2005-04-29 | 2010-03-30 | Stats Chippac Ltd. | Stacked integrated circuit package system and method of manufacture therefor |
US7038321B1 (en) * | 2005-04-29 | 2006-05-02 | Delphi Technologies, Inc. | Method of attaching a flip chip device and circuit assembly formed thereby |
US20060255102A1 (en) * | 2005-05-11 | 2006-11-16 | Snyder Rick B | Technique for defining a wettable solder joint area for an electronic assembly substrate |
US7692521B1 (en) | 2005-05-12 | 2010-04-06 | Microassembly Technologies, Inc. | High force MEMS device |
US20080138957A1 (en) * | 2005-05-31 | 2008-06-12 | Miradia Inc. | Triple alignment substrate method and structure for packaging devices |
US7542195B2 (en) | 2005-05-31 | 2009-06-02 | Miradia Inc. | Triple alignment substrate method and structure for packaging devices |
US7795134B2 (en) | 2005-06-28 | 2010-09-14 | Micron Technology, Inc. | Conductive interconnect structures and formation methods using supercritical fluids |
US20060290001A1 (en) * | 2005-06-28 | 2006-12-28 | Micron Technology, Inc. | Interconnect vias and associated methods of formation |
US8008192B2 (en) | 2005-06-28 | 2011-08-30 | Micron Technology, Inc. | Conductive interconnect structures and formation methods using supercritical fluids |
US20060289968A1 (en) * | 2005-06-28 | 2006-12-28 | Micron Technology, Inc. | Conductive interconnect structures and formation methods using supercritical fluids |
US9293367B2 (en) | 2005-06-28 | 2016-03-22 | Micron Technology, Inc. | Conductive interconnect structures and formation methods using supercritical fluids |
WO2007012992A1 (en) * | 2005-07-28 | 2007-02-01 | Nxp B.V. | A package and manufacturing method for a microelectronic component |
US20090127690A1 (en) * | 2005-07-28 | 2009-05-21 | Nxp B.V. | Package and Manufacturing Method for a Microelectronic Component |
CN101233619B (en) * | 2005-07-28 | 2012-02-15 | Nxp股份有限公司 | A package and manufacturing method for a microelectronic component |
US20070148807A1 (en) * | 2005-08-22 | 2007-06-28 | Salman Akram | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
US7262134B2 (en) | 2005-09-01 | 2007-08-28 | Micron Technology, Inc. | Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
US20070045858A1 (en) * | 2005-09-01 | 2007-03-01 | Micron Technology, Inc. | Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
US20080001068A1 (en) * | 2005-09-01 | 2008-01-03 | Farnworth Warren M | Microelectronic imaging devices and associated methods for attaching transmissive elements |
US7288757B2 (en) | 2005-09-01 | 2007-10-30 | Micron Technology, Inc. | Microelectronic imaging devices and associated methods for attaching transmissive elements |
US20070045515A1 (en) * | 2005-09-01 | 2007-03-01 | Micron Technology, Inc. | Microelectronic imaging devices and associated methods for attaching transmissive elements |
US7915736B2 (en) | 2005-09-01 | 2011-03-29 | Micron Technology, Inc. | Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
US7663096B2 (en) | 2005-09-01 | 2010-02-16 | Aptina Imaging Corporation | Microelectronic imaging devices and associated methods for attaching transmissive elements |
US7417221B2 (en) * | 2005-09-08 | 2008-08-26 | Gentex Corporation | Automotive vehicle image sensor |
US20070051885A1 (en) * | 2005-09-08 | 2007-03-08 | Gentex Corporation | Automotive vehicle image sensor |
US20090218492A1 (en) * | 2005-09-21 | 2009-09-03 | Oliver Kierse | Radiation sensor device and method |
US7897920B2 (en) | 2005-09-21 | 2011-03-01 | Analog Devices, Inc. | Radiation sensor device and method |
EP1926979A2 (en) * | 2005-09-21 | 2008-06-04 | Analog Devices, Inc. | Radiation sensor device and method |
CN101268345A (en) * | 2005-09-21 | 2008-09-17 | 阿纳洛格装置公司 | Radiation sensor device and method |
US8476591B2 (en) | 2005-09-21 | 2013-07-02 | Analog Devices, Inc. | Radiation sensor device and method |
US20070063145A1 (en) * | 2005-09-21 | 2007-03-22 | Oliver Kierse | Radiation sensor device and method |
EP2256471A3 (en) * | 2005-09-21 | 2011-06-01 | Analog Devices, Inc. | Radiation sensor device and method |
EP1926979A4 (en) * | 2005-09-21 | 2009-10-28 | Analog Devices Inc | Radiation sensor device and method |
EP1929519A2 (en) * | 2005-09-29 | 2008-06-11 | Skyworks Solutions, Inc. | Pakaged electronic devices and process of manufacturing same |
EP1929519A4 (en) * | 2005-09-29 | 2011-08-03 | Skyworks Solutions Inc | Pakaged electronic devices and process of manufacturing same |
US7485899B2 (en) * | 2005-10-21 | 2009-02-03 | Advanced Semiconductor Engineering, Inc. | Semiconductor package having an optical device and the method of making the same |
US20070090503A1 (en) * | 2005-10-21 | 2007-04-26 | Cheng-Wei Huang | Semiconductor package having an optical device and the method of making the same |
US7723146B2 (en) * | 2006-01-04 | 2010-05-25 | Stats Chippac Ltd. | Integrated circuit package system with image sensor system |
US20070166867A1 (en) * | 2006-01-04 | 2007-07-19 | Chow Seng G | Integrated circuit package system with image sensor system |
US20100065936A1 (en) * | 2006-01-04 | 2010-03-18 | Seng Guan Chow | Integrated circuit package system with image sensor system |
US20110037136A1 (en) * | 2006-01-04 | 2011-02-17 | Seng Guan Chow | Integrated circuit package system with image sensor system |
US7652376B2 (en) | 2006-01-04 | 2010-01-26 | Stats Chippac Ltd. | Integrated circuit package system including stacked die |
US7768125B2 (en) | 2006-01-04 | 2010-08-03 | Stats Chippac Ltd. | Multi-chip package system |
US7838899B2 (en) * | 2006-01-04 | 2010-11-23 | Stats Chippac Ltd. | Integrated circuit package system with image sensor system |
US8378502B2 (en) * | 2006-01-04 | 2013-02-19 | Stats Chippac Ltd. | Integrated circuit package system with image sensor system |
US7750482B2 (en) | 2006-02-09 | 2010-07-06 | Stats Chippac Ltd. | Integrated circuit package system including zero fillet resin |
US8704349B2 (en) | 2006-02-14 | 2014-04-22 | Stats Chippac Ltd. | Integrated circuit package system with exposed interconnects |
US7429784B2 (en) * | 2006-03-24 | 2008-09-30 | Advanced Semiconductor Engineering, Inc. | Package structure |
US20070222048A1 (en) * | 2006-03-24 | 2007-09-27 | Advanced Semiconductor Engineering, Inc. | Package structure |
WO2007120587A3 (en) * | 2006-04-11 | 2009-01-08 | Flextronics Ap Llc | Method for mounting protective covers on image capture devices and devices manufactured thereby |
US20070236591A1 (en) * | 2006-04-11 | 2007-10-11 | Tam Samuel W | Method for mounting protective covers over image capture devices and devices manufactured thereby |
US20090075431A1 (en) * | 2006-08-02 | 2009-03-19 | Skyworks Solutions, Inc. | Wafer level package with cavities for active devices |
US7635606B2 (en) | 2006-08-02 | 2009-12-22 | Skyworks Solutions, Inc. | Wafer level package with cavities for active devices |
US8653612B2 (en) | 2006-08-25 | 2014-02-18 | Sanyo Semiconductor Co., Ltd. | Semiconductor device |
US20100065929A1 (en) * | 2006-08-25 | 2010-03-18 | Kazuo Okada | Semiconductor device |
US20090321903A1 (en) * | 2006-08-25 | 2009-12-31 | Sanyo Electric Co., Ltd. | Semiconductor device and manufacturing method thereof |
US20090206349A1 (en) * | 2006-08-25 | 2009-08-20 | Hiroshi Yamada | Semiconductor device and method of manufacturing the same |
US9034729B2 (en) | 2006-08-25 | 2015-05-19 | Semiconductor Components Industries, Llc | Semiconductor device and method of manufacturing the same |
US8148811B2 (en) * | 2006-08-25 | 2012-04-03 | Semiconductor Components Industries, Llc | Semiconductor device and manufacturing method thereof |
US8094221B2 (en) | 2006-10-11 | 2012-01-10 | Hamamatsu Photonics K.K. | Solid-state imaging device |
WO2008044675A1 (en) | 2006-10-11 | 2008-04-17 | Hamamatsu Photonics K.K. | Solid-state imaging device |
EP2077581A4 (en) * | 2006-10-11 | 2011-05-25 | Hamamatsu Photonics Kk | Solid-state imaging device |
EP2077581A1 (en) * | 2006-10-11 | 2009-07-08 | Hamamatsu Photonics K.K. | Solid-state imaging device |
US20100053388A1 (en) * | 2006-10-11 | 2010-03-04 | Hamamatsu Photonics K.K. | Solid-state imaging device |
US8456560B2 (en) | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
US20080191343A1 (en) * | 2007-02-13 | 2008-08-14 | Xintec Inc. | Integrated circuit package having large conductive area and method for fabricating the same |
US20080217708A1 (en) * | 2007-03-09 | 2008-09-11 | Skyworks Solutions, Inc. | Integrated passive cap in a system-in-package |
US8605208B2 (en) | 2007-04-24 | 2013-12-10 | Digitaloptics Corporation | Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly |
US8093092B2 (en) | 2007-06-08 | 2012-01-10 | Flextronics Ap, Llc | Techniques for glass attachment in an image sensor package |
US20100105160A1 (en) * | 2007-06-08 | 2010-04-29 | Harpuneet Singh | Techniques for Glass Attachment in an Image Sensor Package |
WO2009006477A1 (en) * | 2007-07-02 | 2009-01-08 | Micron Technology, Inc. | Method of forming molded standoff structures on integrated circuit devices |
US7993977B2 (en) | 2007-07-02 | 2011-08-09 | Micron Technology, Inc. | Method of forming molded standoff structures on integrated circuit devices |
US8772919B2 (en) | 2007-08-08 | 2014-07-08 | Wen-Cheng Chien | Image sensor package with trench insulator and fabrication method thereof |
US20090039455A1 (en) * | 2007-08-08 | 2009-02-12 | Xintec Inc. | Image sensor package with trench insulator and fabrication method thereof |
US20090045478A1 (en) * | 2007-08-17 | 2009-02-19 | Yeh Hsin Hui | CMOS image sensor package structure |
US8368519B2 (en) * | 2007-10-10 | 2013-02-05 | International Business Machines Corporation | Packaging a semiconductor wafer |
US20090096589A1 (en) * | 2007-10-10 | 2009-04-16 | International Business Machines Corporation | Packaging a semiconductor wafer |
US8809116B2 (en) | 2007-11-30 | 2014-08-19 | Skyworks Solutions, Inc. | Method for wafer level packaging of electronic devices |
US8324728B2 (en) | 2007-11-30 | 2012-12-04 | Skyworks Solutions, Inc. | Wafer level packaging using flip chip mounting |
US20100244161A1 (en) * | 2007-11-30 | 2010-09-30 | Skyworks Solutions, Inc. | Wafer level packaging using flip chip mounting |
US9153551B2 (en) | 2007-12-26 | 2015-10-06 | Skyworks Solutions, Inc. | Integrated circuit package including in-situ formed cavity |
US20100283144A1 (en) * | 2007-12-26 | 2010-11-11 | Steve Xin Liang | In-situ cavity circuit package |
US8900931B2 (en) | 2007-12-26 | 2014-12-02 | Skyworks Solutions, Inc. | In-situ cavity integrated circuit package |
US20090224386A1 (en) * | 2008-03-07 | 2009-09-10 | Stats Chippac, Ltd. | Optical Semiconductor Device Having Pre-Molded Leadframe with Window and Method Therefor |
US8586422B2 (en) | 2008-03-07 | 2013-11-19 | Stats Chippac, Ltd. | Optical semiconductor device having pre-molded leadframe with window and method therefor |
US8138027B2 (en) | 2008-03-07 | 2012-03-20 | Stats Chippac, Ltd. | Optical semiconductor device having pre-molded leadframe with window and method therefor |
US9397236B2 (en) | 2008-03-07 | 2016-07-19 | STATS ChipPAC Pte. Ltd. | Optical semiconductor device having pre-molded leadframe with window and method therefor |
US9059074B2 (en) | 2008-03-26 | 2015-06-16 | Stats Chippac Ltd. | Integrated circuit package system with planar interconnect |
US20090243082A1 (en) * | 2008-03-26 | 2009-10-01 | Zigmund Ramirez Camacho | Integrated circuit package system with planar interconnect |
US8399297B2 (en) | 2008-04-24 | 2013-03-19 | Micron Technology, Inc. | Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages |
US8072082B2 (en) | 2008-04-24 | 2011-12-06 | Micron Technology, Inc. | Pre-encapsulated cavity interposer |
US7768089B2 (en) * | 2008-05-29 | 2010-08-03 | Sumitomo Bakelite Company, Ltd. | Semiconductor device |
US20090294887A1 (en) * | 2008-05-29 | 2009-12-03 | Takashi Hirano | Semiconductor device |
US20100052131A1 (en) * | 2008-08-26 | 2010-03-04 | Lionel Chien Hui Tay | Integrated circuit package system with redistribution layer |
US8043894B2 (en) | 2008-08-26 | 2011-10-25 | Stats Chippac Ltd. | Integrated circuit package system with redistribution layer |
US20100105168A1 (en) * | 2008-10-29 | 2010-04-29 | Freescale Semiconductor, Inc. | Microelecronic assembly and method for forming the same |
US20110221017A1 (en) * | 2008-11-07 | 2011-09-15 | Sumitomo Bakelite Company, Ltd. | Photosensitive resin composition, photosensitive adhesive film, and light-receiving device |
US20100194465A1 (en) * | 2009-02-02 | 2010-08-05 | Ali Salih | Temperature compensated current source and method therefor |
US20100301468A1 (en) * | 2009-05-27 | 2010-12-02 | Elpida Memory, Inc. | Semiconductor device and method of manufacturing the same |
EP2287596A1 (en) * | 2009-08-11 | 2011-02-23 | Sensirion AG | Sensor with glob-top and method for manufacturing the same |
US20110037886A1 (en) * | 2009-08-14 | 2011-02-17 | Harpuneet Singh | Wafer level camera module with molded housing and method of manufacturing |
US9419032B2 (en) | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
US10580912B2 (en) * | 2009-09-24 | 2020-03-03 | Msg Lithoglas Ag | Arrangement with a component on a carrier substrate, an arrangement and a semi-finished product |
US20150179828A1 (en) * | 2009-09-24 | 2015-06-25 | Msg Lithoglas Ag | Arrangement with a component on a carrier substrate, an arrangement and a semi-finished product |
US8487437B2 (en) * | 2010-02-08 | 2013-07-16 | Optopac Co., Ltd. | Electronic device package and method for fabricating the same |
US20110193231A1 (en) * | 2010-02-08 | 2011-08-11 | Optopac Co., Ltd. | Electronic device package and method for fabricating the same |
US8987898B2 (en) * | 2011-06-06 | 2015-03-24 | International Rectifier Corporation | Semiconductor wafer with reduced thickness variation and method for fabricating same |
US20120306072A1 (en) * | 2011-06-06 | 2012-12-06 | International Rectifier Corporation | Semiconductor Wafer with Reduced Thickness Variation and Method for Fabricating Same |
CN103715210A (en) * | 2012-10-09 | 2014-04-09 | 胜开科技股份有限公司 | Structure and manufacturing method for high resolution camera module |
US20140252642A1 (en) * | 2013-03-07 | 2014-09-11 | Xintec Inc. | Chip package and method for forming the same |
US9449897B2 (en) * | 2013-03-07 | 2016-09-20 | Xintec Inc. | Chip package and method for forming the same |
US20150028446A1 (en) * | 2013-05-22 | 2015-01-29 | Wei-Sheng Lei | Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach |
CN103337504B (en) * | 2013-05-31 | 2016-06-22 | 南通富士通微电子股份有限公司 | Image sensor package method |
CN103337504A (en) * | 2013-05-31 | 2013-10-02 | 南通富士通微电子股份有限公司 | A packaging method for an image sensor |
US10357841B2 (en) * | 2013-07-19 | 2019-07-23 | Materion Corporation | Metal cap assembly for optical communications |
US20170095870A1 (en) * | 2013-07-19 | 2017-04-06 | Materion Corporation | Metal cap assembly for optical communications |
US20150115448A1 (en) * | 2013-10-30 | 2015-04-30 | Infineon Technologies Ag | Method for processing wafer |
US9490173B2 (en) * | 2013-10-30 | 2016-11-08 | Infineon Technologies Ag | Method for processing wafer |
US9368535B2 (en) * | 2014-02-28 | 2016-06-14 | Semiconductor Components Industries, Llc | Imaging systems with flip chip ball grid arrays |
KR20170064624A (en) * | 2015-12-01 | 2017-06-12 | 삼성전자주식회사 | Semiconductor package |
US20170154913A1 (en) * | 2015-12-01 | 2017-06-01 | Hyunsu Jun | Semiconductor package |
US10008533B2 (en) * | 2015-12-01 | 2018-06-26 | Samsung Electronics Co., Ltd. | Semiconductor package |
US10737933B2 (en) | 2016-04-05 | 2020-08-11 | University Of Florida Research Foundation, Incorporated | Flush-mount micromachined transducers |
WO2017176506A1 (en) * | 2016-04-05 | 2017-10-12 | University Of Florida Research Foundation, Incorporated | Flush-mount micromachined transducers |
US10978597B2 (en) * | 2016-10-06 | 2021-04-13 | Osram Oled Gmbh | Sensor |
KR20180055385A (en) * | 2016-11-17 | 2018-05-25 | 장경규 | Semiconductor package for photo-sensing |
US10600835B2 (en) | 2016-12-12 | 2020-03-24 | Samsung Electro-Mechanics Co., Ltd. | Electronic module and method of manufacturing the same |
US11211300B2 (en) * | 2017-01-31 | 2021-12-28 | Sony Semiconductor Solutions Corporation | Electronic component and camera module |
US10522505B2 (en) * | 2017-04-06 | 2019-12-31 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method for manufacturing the same |
US11682653B2 (en) | 2017-04-06 | 2023-06-20 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method for manufacturing the same |
US10937761B2 (en) | 2017-04-06 | 2021-03-02 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method for manufacturing the same |
US10629641B2 (en) * | 2017-10-19 | 2020-04-21 | Samsung Electronics Co., Ltd. | Fan-out sensor package and optical-type fingerprint sensor module including the same |
US10700110B2 (en) | 2018-01-19 | 2020-06-30 | Samsung Electronics Co., Ltd. | Fan-out sensor package |
US20190229139A1 (en) * | 2018-01-19 | 2019-07-25 | Samsung Electro-Mechanics Co., Ltd. | Fan-out sensor package |
TWI697989B (en) * | 2018-01-19 | 2020-07-01 | 南韓商三星電子股份有限公司 | Fan-out sensor package |
US10998362B2 (en) | 2018-01-19 | 2021-05-04 | Samsung Electronics Co., Ltd. | Fan-out sensor package |
US20200235153A1 (en) * | 2019-01-22 | 2020-07-23 | Advanced Semiconductor Engineering, Inc. | Optical package structure and method for manufacturing the same |
US10872915B2 (en) * | 2019-01-22 | 2020-12-22 | Advanced Semiconductor Engineering, Inc. | Optical package structure and method for manufacturing the same |
US11887939B2 (en) * | 2019-04-19 | 2024-01-30 | Skyworks Solutions, Inc. | Shielded radio-frequency devices |
US20220415823A1 (en) * | 2019-04-19 | 2022-12-29 | Skyworks Solutions, Inc. | Shielded radio-frequency devices |
CN112038299B (en) * | 2019-06-04 | 2022-05-06 | 胜丽国际股份有限公司 | Stacked sensor package structure |
CN112038299A (en) * | 2019-06-04 | 2020-12-04 | 胜丽国际股份有限公司 | Stacked sensor package structure |
TWI685926B (en) * | 2019-06-04 | 2020-02-21 | 勝麗國際股份有限公司 | Stacked sensor package structure |
US11869823B2 (en) * | 2019-11-08 | 2024-01-09 | Octavo Systems Llc | System in a package modifications |
US11784103B2 (en) * | 2020-12-09 | 2023-10-10 | Texas Instruments Incorporated | Covers for semiconductor package components |
US20220181223A1 (en) * | 2020-12-09 | 2022-06-09 | Texas Instruments Incorporated | Covers for semiconductor package components |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6566745B1 (en) | Image sensor ball grid array package and the fabrication thereof | |
EP1041628A2 (en) | An image sensor ball grid array package and the fabrication thereof | |
US7498556B2 (en) | Image sensor module having build-in package cavity and the method of the same | |
CN103021983B (en) | Wafer level chip size package and manufacturing method thereof | |
US8012776B2 (en) | Methods of manufacturing imaging device packages | |
US7321455B2 (en) | Microelectronic devices and methods for packaging microelectronic devices | |
US20090008729A1 (en) | Image sensor package utilizing a removable protection film and method of making the same | |
US20100053407A1 (en) | Wafer level compliant packages for rear-face illuminated solid state image sensors | |
US20080173792A1 (en) | Image sensor module and the method of the same | |
US20090212381A1 (en) | Wafer level packages for rear-face illuminated solid state image sensors | |
CN103000648B (en) | Large chip sized package and manufacture method thereof | |
US11201182B2 (en) | Embedded image sensor semiconductor packages and related methods | |
US20110012220A1 (en) | Wafer-level image sensor module, method of manufacturing the same and camera module | |
CN101211945A (en) | Semiconductor image element package structure with die receiving through-hole and method of the same | |
US20110180891A1 (en) | Conductor package structure and method of the same | |
JP2004179495A (en) | Semiconductor device | |
CN111900181A (en) | Wafer level packaging method for image sensing chip | |
US20220415943A1 (en) | Image sensor packages and related methods | |
US20090179290A1 (en) | Encapsulated imager packaging | |
TW200411945A (en) | Flip chip optical and imaging sensor device | |
TWI258210B (en) | Method for wafer level package of sensor chip | |
US20230064356A1 (en) | Image sensor ball grid array package | |
US20230063200A1 (en) | Sidewall protected image sensor package | |
CN220569663U (en) | Chip packaging structure | |
US20230290710A1 (en) | Manufacturing method of semiconductor device, semiconductor device, and electronic apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: IMEC VZW, BELGIUM Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BEYNE, ERIC;REEL/FRAME:013287/0379 Effective date: 20020911 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FEPP | Fee payment procedure |
Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 12 |