|Número de publicación||US7105103 B2|
|Tipo de publicación||Concesión|
|Número de solicitud||US 10/383,573|
|Fecha de publicación||12 Sep 2006|
|Fecha de presentación||10 Mar 2003|
|Fecha de prioridad||11 Mar 2002|
|También publicado como||CA2478329A1, CA2478329C, CN1298292C, CN1646245A, EP1490191A1, EP1490191A4, EP1490191B1, US7906437, US8409462, US20030199165, US20070045229, US20110192819, WO2003078091A1|
|Número de publicación||10383573, 383573, US 7105103 B2, US 7105103B2, US-B2-7105103, US7105103 B2, US7105103B2|
|Inventores||Joseph Francis Keenan, Vadim Mark Daskal, James Joseph Hughes|
|Cesionario original||Becton, Dickinson And Company|
|Exportar cita||BiBTeX, EndNote, RefMan|
|Citas de patentes (104), Otras citas (5), Citada por (10), Clasificaciones (27), Eventos legales (7)|
|Enlaces externos: USPTO, Cesión de USPTO, Espacenet|
Related subject matter is disclosed in co-pending U.S. provisional patent applications, Ser. No. 60/362,999, filed Mar. 11, 2002, and Ser. No. 60/430,332, filed Dec. 3, 2002, now abandoned, the entire contents of which are expressly incorporated herein by reference.
The invention relates to a system and method for the manufacture of surgical instruments. More particularly, the invention relates to a system and method for the manufacture of surgical-quality blades manufactured from silicon and other crystalline materials.
Existing surgical blades are manufactured via several different methodologies, each method having its own peculiar advantages and disadvantages. The most common method of manufacture is to mechanically grind stainless steel. The blade is subsequently honed (through a variety of different methods such as ultrasonic slurrying, mechanical abrasion and lapping) or is electrochemically polished to achieve a sharp edge. The advantage of these methods is that they are proven, economical processes to make disposable blades in high volume. The greatest disadvantage of these processes is that the edge quality is variable, in that achieving superior sharpness consistency is still a challenge. This is primarily due to the inherent limitations of the process itself. Blade edge radii can range from 30 nm to 1000 nm.
A relatively new method of blade manufacture employs coining of the stainless steel in lieu of grinding. The blade is subsequently electrochemically polished to achieve a sharp edge. This process has been found to be more economical than the grinding method. It has also been found to produce blades with better sharpness consistency. The disadvantage of this method is that the sharpness consistency is still less than that achieved by the diamond blade manufacturing process. The use of metal blades in soft tissue surgery is prevalent today due to their disposable cost and their improved quality.
Diamond blades are the gold standard in sharpness in many surgical markets, especially in the ophthalmic surgery market. Diamond blades are known to be able to cleanly cut soft tissue with minimal tissue resistance. The use of diamond blades is also desired due to their consistent sharpness, cut after cut. Most high-volume surgeons will use diamond blades since the ultimate sharpness and sharpness variability of metal blades is inferior to that of diamond. The manufacturing process used to make diamond blades employs a lapping process to achieve an exquisitely sharp and consistent edge radius. The resultant blade edge radii range from 5 nm to 30 nm. The disadvantage of this process is that it is slow and as a direct result, the cost to manufacture such diamond blades ranges from $500 to $5000. Therefore, these blades are sold for reuse applications. This process is currently used on other, less hard materials, such as rubies and sapphires, to achieve the same sharpness at a lesser cost. However, while less expensive than diamonds, ruby and/or sapphire surgical quality blades still suffer from the disadvantage that the cost of manufacture is relatively high, ranging from $50 to $500, and their edges only last through about two hundred cases. Therefore, these blades are sold for reuse and limited reuse applications.
There have been a few proposals for the manufacture of surgical blades using silicon. However, in one form or another, these processes are limited in their ability to manufacture blades in various configurations and at a disposable cost. Many of the silicon blade patents are based on anisotropic etching of silicon. The anisotropic etching process is one where the etching is highly directional, with different etch rates in different directions. This process can produce a sharp cutting edge. However, due to the nature of the process, it is limited by the blade shapes and included bevel angles that can be attained. Wet bulk anisotropic etching processes, such as those employing potassium hydroxide (KOH), ethylene-diamine/pyrcatechol (EDP) and trimethyl-2 -hydroxethylammonium hydroxide (TMAH) baths, etch along a particular crystalline plane to achieve a sharp edge. This plane, typically the (111) plane in silicon <100>, is angled 54.7° from the surface plane in the silicon wafers. This creates a blade with an included bevel angle of 54.7°, which has been found to be clinically unacceptable in most surgical applications as too obtuse. This application is even worse when this technique is applied to making double bevel blades, for the included bevel angle is 109.4°. The process is further limited to the blade profiles that it can produce. The etch planes are arranged 90° to each other in the wafer. Therefore, only blades with rectangular profiles can be produced.
Thus, a need exists to manufacture blades that address the shortcomings of the methods discussed above. This system and method of the present invention can make blades with the sharpness of diamond blades at the disposable cost of the stainless steel methods. In addition, the system and method of the present invention can produce blades in high volume and with tight process control.
The above described disadvantages are overcome and a number of advantages are realized by the present invention which relates to a system and method for the manufacturing of surgical blades from a crystalline or poly-crystalline material, such as silicon, which provides for the machining of trenches in a crystalline or poly-crystalline wafer, by various means, at any desired bevel angle or blade configuration. The machined crystalline or poly-crystalline wafers are then immersed in an isotropic etching solution which uniformly removes layer after layer of molecules of the wafer material, in order to form a cutting edge of uniform radius, and of sufficient quality for soft tissue surgery applications. The system and method of the invention provides a very inexpensive means for the manufacture of such high quality surgical blades.
It is therefore an object of the invention to provide a method for manufacturing a surgical blade, comprising the steps of mounting a silicon or other crystalline or poly-crystalline wafer on a mounting assembly, machining one or more trenches on a first side of the crystalline or poly-crystalline wafer, etching the first side of the crystalline or poly-crystalline wafer to form one or more surgical blades, singulating the surgical blades, and assembling the surgical blades.
It is a further object of the invention to provide a method for manufacturing a surgical blade, comprising the steps of mounting a crystalline or poly-crystalline wafer on a mounting assembly, machining one or more trenches on a first side of the crystalline or poly-crystalline wafer, coating the first side of the crystalline or poly-crystalline wafer with a coating, dismounting the crystalline or poly-crystalline wafer from the mounting assembly, and remounting the first side of the crystalline or poly-crystalline wafer on the mounting assembly, machining a second side of the crystalline or poly-crystalline wafer, etching the second side of the crystalline or poly-crystalline wafer to form one or more surgical blades, singulating the surgical blades, and assembling the surgical blades.
It is still a further object of the invention to provide a method for manufacturing a surgical blade, comprising the steps of mounting a crystalline or poly-crystalline wafer on a mounting assembly, machining one or more trenches on a first side of the crystalline or poly-crystalline wafer, dismounting the crystalline or poly-crystalline wafer from the mounting assembly, and remounting the first side of the crystalline or poly-crystalline wafer on the mounting assembly, machining a second side of the crystalline or poly-crystalline wafer, etching the second side of the crystalline or poly-crystalline wafer to form one or more surgical blades, converting a layer of the crystalline or poly-crystalline material to form a hardened surface, singulating the surgical blades, and assembling the surgical blades.
The novel features and advantages of the present invention will best be understood by reference to the detailed description of the preferred embodiments which follows, when read in conjunction with the accompanying drawings, in which:
The various features of the preferred embodiments will now be described with reference to the drawing figures, in which like parts are identified with the same reference characters. The following description of the presently contemplated best mode of practicing the invention is not to be taken in a limiting sense, but is provided merely for the purpose of describing the general principles of the invention.
The system and method of the present invention provides for the manufacture of surgical blades to be used for incising soft tissue. Although the preferred embodiment is shown to be a surgical blade, numerous cutting devices can also be fabricated in accordance with the methods discussed in detail below. Therefore, it will be apparent to one skilled in the art of the invention that although reference is made to “surgical blades” throughout these discussions, numerous other types of cutting devices can be fabricated, including, for example, medical razors, lancets, hypodermic needles, sample collection cannula and other medical sharps.
The preferred base material that the blades will be manufactured from is crystalline silicon with a preferred crystal orientation. However, other orientations of silicon are suitable, as well as other materials that can be isotropically etched. For example, silicon wafers with orientation <110> and <111> can also be used, as well as silicon wafers doped at various resistivity and oxygen content levels. Also, wafers made of other materials can be used, such as silicon nitride and gallium arsenide. Wafer form is the preferred format for the base material. In addition to crystalline materials, poly-crystalline materials can also be used to manufacture surgical blades. Examples of these poly-crystalline materials include polycrystalline silicon. It will be understood that the term “crystalline” as used herein will be used to refer to both crystalline and poly-crystalline materials.
Therefore, it will be apparent to one skilled in the art of the invention that although reference is made to “silicon wafers” throughout these discussions, any of the aforementioned materials in combination with various orientations can be used in accordance with the various embodiments of the present invention, as well as other suitable materials and orientations that might become available.
The method of
Referring again to
Silicon wafer 202 is ablated by the laser beam 404 upon silicon wafer 202. The ability of the laser beam 404 to ablate the silicon wafer 202 is related to the laser's wavelength λ. In the preferred embodiment, which uses a silicon wafer, the wavelength that yields the best results is 1064 nano-meters, typically provided by a YaG laser, though other types of lasers can be used as well. If a different crystalline or poly-crystalline material is used, then other wavelengths and laser types will be more appropriate.
The resultant through-hole fiducials 406 (a plurality of holes can be cut in this manner) can be used as guides for machining trenches (discussed in detail with respect to step 1008 below), especially if a dicing saw blade is to be used to machine the trenches. Through-hole fiducials 406 can also be cut by any laser beam (e.g., an excimer laser or laser waterjet 402) for the same purpose. The pre-cut through-hole fiducials are typically cut in the shape of a plus “+” or a circle. However, the choice of through-hole fiducial shape is directed by the specific manufacturing tools and environment, and thus need not be limited to just the two aforementioned shapes.
In addition to the use of a laser beam to pre-cut through-hole fiducials, other mechanical machining methods can also be used. These include, for example, but are not limited to, drilling tools, mechanical grinding tools and an ultra-sonic machining tool 100. While use of the devices is novel with respect to the preferred embodiments of the invention, the devices and their general use are well known to those skilled in the art.
Precutting can be performed to silicon wafer 202 prior to machining trenches in order for silicon wafer 202 to maintain its integrity and not fall apart during the etching process. A laser beam (e.g., a laser waterjet 402 or excimer laser) can be used to scroll in elliptical through-hole slots for the dicing blade 502 (discussed in detail in reference to
Referring again to
The methods for machining can employ either a dicing saw blade, laser system, an ultrasonic machining tool or a hot-forging process. Other methods for machining can also be used. Each will be discussed in turn. The trench that is machined by any of these methods provides the angle (bevel angle) of the surgical blade. As the trench machine operates on silicon wafer 202, silicon material is removed, either in the shape of the dicing saw blade, the pattern formed by the excimer laser, or the pattern formed by an ultrasonic machining tool, in the desired shape of the surgical blade preform. In the case of a dicing saw blade, the silicon surgical blades will have only straight edges; in the latter two methods, the blades can be essentially any shape desired. In the case of a hot-forging process, the silicon wafer is heated to make it malleable, then pressed between two die, each one having a three dimensional form of the desired trenches to be “molded” into the heated, malleable silicon wafer. For purposes of this discussion, “machining” trenches encompasses all methods of manufacturing trenches in a silicon wafer, including those mentioned specifically, whether by a dicing saw blade, excimer laser, ultrasonic machine or a hot-forging process, and equivalent methods not mentioned. These methods of machining the trenches will now be discussed in detail.
Although each of the dicing saw blades 502, 504, 506 and 508 illustrated in
A special dicing saw blade is used to machine channels in the first side 304 of the silicon wafer 202. The dicing saw blade composition is specifically chosen to provide the best resultant surface finish while maintaining acceptable wear life. The edge of the dicing saw blade is shaped with a profile that will shape the resultant channel in silicon wafer 202. This shape will correlate to the resultant blade bevel configuration. For instance, surgical blades typically have included bevel angles that range from 15° to 45° for single bevel blades and half included bevel angles that range from 15° to 45° for double bevel blades. Selection of a dicing saw blade in conjunction with etch conditions provides precise control of bevel angle.
As discussed above, slots can also be cut into the silicon wafer 202, especially if a dicing saw blade will be used to machine the trenches. Slots can be cut into the silicon wafer 202 in a fashion similar to the through-hole fiducials, i.e., with the laser water-jet or excimer laser, but serve a very different purpose. Recall that the through-hole fiducials are used by the trench machine in order to accurately position the silicon wafer 202 on the trench machine. This is especially useful when making double bevel blades, because the second machining (on the opposite side of the silicon wafer 202) must be accurately positioned to ensure a properly manufactured double bevel blade. Slots, however, are used for a different purpose. Slots allow the dicing saw blade to begin cutting the silicon wafer 202 away from the edge (as shown in
When machining trenches with the laser machine assembly 900, the silicon wafer 202 is mounted on the mounting assembly 204 which also is adaptable to be manipulated by multi-axis control mechanisism 906. Through the use of laser machining assembly 900 and various light beam masking techniques, an array of blade profiles can be machined. The light beam mask is located inside laser 902, and through careful design, prevents laser 902 from ablating silicon material where it is not intended. For double bevel blades, the opposing side is machined the same way using the pre-cut chamfers 206A, 206B or fiducials 406 for alignment.
Laser 902 is used to accurately and precisely machine trench patterns (also referred to as an “ablation profile” in reference to use of a laser) into either first side 304 or second side 306 of silicon wafer 202 in preparation of the wet isotropic etching step (which is discussed in detail with reference to
Ultrasonic machining is used to accurately and precisely machine trench patterns into the silicon wafer 202 surface in preparation for the wet isotropic etching step. Ultrasonic machining is performed by ultrasonically vibrating a mandrel/tool (tool) 104. Tool 104 does not come in contact with silicon wafer 202, but is in close proximity to silicon wafer 202 and excites abrasive slurry 102 by operation of ultrasonic waves emitted by tool 104. The ultrasonic waves emitted by tool 104 force abrasive slurry 102 to erode silicon wafer 202 to the corresponding pattern that is machined on tool 104.
Tool 104 is machined, via milling, grinding or electrostatic discharge machining (EDM), to create the trench pattern. The resultant pattern on the machined silicon wafer 202 corresponds to that which was machined on tool 104. The advantage of using an ultrasonic machining method over an excimer laser is that an entire side of silicon wafer 202 can have numerous blade trench patterns ultrasonically machined at the same time. Thus, the process is fast and relatively inexpensive. Also, like the excimer laser machining process, various curvilinear profile patterns can be achieved via this process.
Silicon wafer 202 is pre-heated in a heat chamber, or can be heated completely by operation of heated base member 1054, upon which silicon wafer 202 sits. After sufficient time at elevated temperatures has passed, silicon wafer 202 will become malleable. Then, heated die 1052 is forced down upon silicon wafer 202 with sufficient pressure to impress the negative image of heated die 1052 into first side 304 of silicon wafer 202. The design of die 1052 can be such that there are numerous trenches of various bevel angles, depths, lengths and profiles, in order to create virtually any blade design imaginable. The diagram illustrated in
Having discussed the several methods for machining trenches, attention is again redirected to
After coating 1102 has been applied in optional step 2002, the next step is step 2003, dismounting and remounting (step 2003 can also follow step 1008 if no coating was applied). In step 2003, silicon wafer 202 is dismounted from tape 308 utilizing the same standard mounting machine. The machine dismounts silicon wafer 202 by radiating ultra-violet (UV) light onto the UV sensitive tape 308 to reduce its tackiness. Low tack or heat release tape can also be used in lieu of UV sensitive tape 308. After sufficient UV light exposure, silicon wafer 202 can be easily lifted from the tape mounting. Silicon wafer 202 is then remounted, with second side 306 facing up, in preparation for machine trenching of second side 306.
Step 2004 is then performed on silicon wafer 202. In step 2004, trenches are machined into second side 306 of silicon wafer 202, as was done in step 1008, in order to create double bevel silicon based surgical blades.
Following machine trench step 2004, a decision must be made in decision step 2005, as to whether to etch the double machine trenched silicon wafer 202 in step 1018, or dice the double machine trenched silicon wafer 202 in step 1016. Dicing step 1016 can be performed by a dicing saw blade, laser beam (e.g., an excimer laser, or laser waterjet 402). Dicing provides for the resultant strips to be etched (in step 1018) in custom fixtures in lieu of wafer boats (discussed in detail below).
The etching process will uniformly etch both sides of silicon wafer 202 and its respective trenches until the opposing trench profiles intersect. Silicon wafer 202 will be immediately removed from etchant 1402 and rinsed once this occurs. The expected cutting edge radius attained by this process ranges from 5 nm to 500 nm.
Isotropic chemical etching is a process that is used to remove silicon in a uniform manner. In the manufacturing process according to an embodiment of the present invention, the wafer surface profile that was produced with the machining described above is uniformly brought down to intersect with the profile on the opposing side of the wafer (if single bevel blades are desired, the non-machined opposing silicon wafer surface will be intersected). Isotropic etching is used in order to achieve the desired blade sharpness while preserving the blade angle. Attempts to intersect the wafer profiles by machining alone fail because the desired edge geometry is too delicate to withstand the machining mechanical and thermal forces. Each of the acidic components of isotropic etchant (etchant) 1402 has a specific function in isotropic acid bath 1400. First, nitric acid oxidizes the exposed silicon, and secondly, hydrofluoric acid removes the oxidized silicon. Acetic acid acts as a diluent during this process. Precise control of composition, temperature and agitation is necessary to achieve repeatable results.
Another benefit of using optional step 2002, applying coating 1102 to first side 304 of silicon wafer 202, is that the cutting edge (the first machined trench side) is composed of coating 1102 (which is preferrably comprised of a layer of silicon nitride) that possesses stronger material properties than the base silicon material. Therefore, the process of applying coating 1102 results in a cutting edge that is stronger and more durable. Coating 1102 also provides a wear-barrier to the blade surface which can be desirable for blades that come in contact with steel in electromechanical reciprocating blade devices. Table I illustrates typical strength-indicating specifications of a silicon based surgical blade manufactured without coating 1102 (silicon) and with coating 1102 (silicon nitride).
Young's Modulus (GPa)
Yield Strength (GPa)
Young's Modulus (also known as the modulus of elasticity) is a measurement of a material's inherent stiffness. The higher the modulus, the stiffer the material. Yield strength is the point at which a material, under load, will transition from elastic to plastic deformation. In other words, it is the point at which the material will no longer flex, but will permanently warp or break. After etching (with or without coating 1102), the etched silicon wafer 202 is thoroughly rinsed and cleaned to remove all residual etchant 1402 chemicals.
Following mounting step 1020, the silicon based surgical blades (silicon blades) can be singulated in step 1022, which means that each silicon blade is cut apart through use of a dicing saw blade, laser beam (e.g., laser waterjet 402 or an excimer laser), or other suitable means to separate the silicon blades from each other. As one skilled in the art can appreciate, lasers with certain wavelengths within the range of 150 nm to 11,000 nm can also be used. An example of a laser in this wavelength range is an excimer laser. The uniqueness of the laser waterjet (a YAG laser) is that it can scroll curvilinear, interrupted patterns in the wafer. This provides the manufacturer the flexibility to make virtually an unlimited number of non-cutting edge blade profiles. The laser waterjet uses a stream of water as a waveguide that allows the laser to cut like a band saw. This cannot be achieved with the current state of the art dicing machines, which, as mentioned above, can only dice in continuous, straight-line patterns.
In step 1024 the singulated surgical silicon blades are picked and placed on blade handle assemblies, according to the particular desires of the customers. Prior to actual “picking and placing” however, the etched silicon wafers 202 (being mounted on either tape and frame or on a tape/wafer frame) are radiated by ultraviolet (UV) light in the wafer mounting machine to reduce tape 308 tackiness. Silicon wafers 202, still on the “reduced tackiness” tape and frame, or tape/wafer frame, are then loaded into a commercially available die-attach assembly system. Recall from above it was discussed that the order of certain steps can be interchanged according to various manufacturing environments. One such example are the steps of singulation and radiation by UV light: these steps can be interchanged if necessary.
The die-attach assembly system will remove the individual etched silicon surgical blades from the “reduced tackiness” tape and wafer or tape/wafer frame, and will attach the silicon surgical blades to their respective holders within the desired tolerance. An epoxy or adhesive will be used to mount the two components. Other assembly methods can be used to attach the silicon surgical blade to its respective substrate, including heat staking, ultrasonic staking, ultrasonic welding, laser welding or eutectic bonding. Lastly in step 1026, the fully assembled silicon surgical blades with handles, are packaged to ensure sterility and safety, and transported for use according to the design of the silicon surgical blade.
Another assembly method that can be used to mount the surgical blade to its holder involves another use of slots. Slots, as discussed above, can be created by the laser water-jet or excimer laser, and were used to provide an opening for the dicing saw blade to engage the silicon wafer 202 when machining trenches. An additional use of slots can be to provide a receptacle in the blade for one or more posts in a holder.
Having described the manufacturing process for a double bevel silicon-based surgical blade, attention is turned to
Following step 1008 decision step 1010 determines whether the machined silicon wafer 202 will be dismounted from silicon wafer mounting assembly 204. If the single trench silicon wafers 202 were to be dismounted (in step 1012), then a further option is to dice the single trench wafers in step 1016. In optional dismounting step 1012, the silicon wafer 202 is dismounted from tape 308 utilizing the same standard mounting machine.
If silicon wafer 202 was dismounted in step 1012, then optionally the silicon wafer 202 can be diced (i.e., silicon wafer 202 cut apart into strips) in step 1016. Dicing step 1016 can be performed by a dicing blade, excimer laser 902, or laser waterjet 402. Dicing provides for the resultant strips to be etched (in step 1018) in custom fixtures in lieu of wafer boats (discussed in detail below). Following either the dicing step of 1016, the dismounting step of 1012, or the machine trench step of 1008, the next step in the method for manufacturing a single bevel silicon based surgical blade is step 1018. Step 1018 is the etching step, which has already been discussed in detail above. Thereafter, steps 1020, 1022, 1024 and 1026 follow, all of which have been described in detail above in reference to the manufacture of a double bevel silicon based surgical blade, and therefore do not need to be discussed again.
Following the coating step 2002, the silicon wafer 202 is dismounted and remounted in step 2003. This step is also identical as was previously discussed in reference to
A single crystal substrate material that has been converted at the surface also exhibits superior fracture and wear resistance than a non converted blade. By changing the surface to a harder material the tendency of the substrate to form crack initiation sites and cleave along crystalline planes is reduced.
A further example of a manufacturing step that can be performed with some interchangeability is the matte-finish step. Often, especially when manufactured in the preferred embodiment of surgical blades, the silicon surface of the blade will be highly reflective. This can be distracting to the surgeon if the blade is being used under a microscope with a source of illumination. Therefore, the surface of the blade can be provided with a matte finish that diffuses incident light (from a high-intensity lamp used during surgical procedure, for example), making it appear dull, as opposed to shiny. The matte finish is created by radiating the blade surface with a suitable laser, to ablate regions in the blade surface according to specific patterns and densities. The ablated regions are made in the shape of a circle because that is generally the shape of the emitted laser beam, though that need not be the case. The dimension of the circular ablated regions ranges from 25–50 microns in diameter, and again is dependent upon the manufacturer and type of laser used. The depth of the circular ablated regions ranges from 10–25 microns.
The “density” of circular ablated regions refers to the total percentage surface area covered by the circular ablated regions. An “ablated region density” of about 5% dulls the blade noticeably, from its normally smooth, mirror-like appearance. However, co-locating all the ablated regions does not affect the mirror-like effect of the balance of the blade. Therefore, the circular ablated regions are applied throughput the surface area of the blade, but in a random fashion. In practice, a graphic file can be generated that randomly locates the depressions, but achieves the desired effect of a specific ablated region density and randomness to the pattern. This graphic file can be created manually, or automatically by a program in a computer. An additional feature that can be implemented is the inscription of serial numbers, manufacturer logos, or the surgeon's or hospital's name on the blade itself.
Typically, a gantry laser can be used to create the matte finish on the blades, or a galvo-head laser machine. The former is slow, but extremely accurate, and the latter is fast, but not as accurate as the gantry. Since the overall accuracy is not vital, and speed of manufacturing directly affects cost, the galvo-head laser machine is the preferred tool. It is capable of moving thousands of millimeters per second, providing an overall ablated region etch time of about five seconds for a typical surgical blade.
The present invention has been described with reference to certain exemplary embodiments thereof. However, it will be readily apparent to those skilled in the art that it is possible to embody the invention in specific forms other than those of the exemplary embodiments described above. This may be done without departing from the spirit and scope of the invention. The exemplary embodiment is merely illustrative and should not be considered restrictive in any way. The scope of the invention is defined by the appended claims and their equivalents, rather than by the preceding description.
|Patente citada||Fecha de presentación||Fecha de publicación||Solicitante||Título|
|US3543402||15 Abr 1968||1 Dic 1970||Coors Porcelain Co||Ceramic cutting blade|
|US3803963||20 Oct 1971||16 Abr 1974||Int Paper Co||Cutter with stripper|
|US3831466||8 Feb 1972||27 Ago 1974||J Hicks||Glass blade and glass blade blank|
|US3834265||16 Feb 1973||10 Sep 1974||Gillette Co||Ceramic cutting instruments|
|US3857488||6 Sep 1973||31 Dic 1974||Cren R Le||Dynamic weighing apparatus|
|US3894337||6 Abr 1973||15 Jul 1975||Wilkinson Sword Ltd||Alumina razor blades|
|US3942231||31 Oct 1973||9 Mar 1976||Trw Inc.||Contour formed metal matrix blade plies|
|US4091813||14 Mar 1975||30 May 1978||Robert F. Shaw||Surgical instrument having self-regulated electrical proximity heating of its cutting edge and method of using the same|
|US4122602||3 Jun 1977||31 Oct 1978||The Gillette Company||Processes for treating cutting edges|
|US4219025||16 Nov 1978||26 Ago 1980||Corning Glass Works||Electrically heated surgical cutting instrument|
|US4231371||16 Nov 1978||4 Nov 1980||Corning Glass Works||Electrically heated surgical cutting instrument|
|US4232676||16 Nov 1978||11 Nov 1980||Corning Glass Works||Surgical cutting instrument|
|US4248231||16 Nov 1978||3 Feb 1981||Corning Glass Works||Surgical cutting instrument|
|US4318537||23 Jun 1980||9 Mar 1982||Corning Glass Works||Cutting surface assembly|
|US4409659||15 Dic 1980||11 Oct 1983||Sonobond Ultrasonics, Inc.||Programmable power supply for ultrasonic applications|
|US4413970||27 Feb 1981||8 Nov 1983||Owens-Corning Fiberglas Corporation||Rotary scrapers|
|US4444102||21 Dic 1981||24 Abr 1984||Corning Glass Works||Self aligning doctor/applicator blade assembly|
|US4468282||22 Nov 1982||28 Ago 1984||Hewlett-Packard Company||Method of making an electron beam window|
|US4509651||11 Jul 1983||9 Abr 1985||Corning Glass Works||Versatile knife holder|
|US4534827||26 Ago 1983||13 Ago 1985||Henderson Donald W||Cutting implement and method of making same|
|US4551192||30 Jun 1983||5 Nov 1985||International Business Machines Corporation||Electrostatic or vacuum pinchuck formed with microcircuit lithography|
|US4566465||6 Abr 1984||28 Ene 1986||Universite Rene Descartes Paris V||Probe with variable geometry for measuring the radial strains in a sphincter of a living organism|
|US4579022||7 Oct 1983||1 Abr 1986||Fujikura Cable Works, Ltd.||Making process of a die for stamping out patterns|
|US4581969||5 Jul 1984||15 Abr 1986||Kim George A||Ultramicrotome diamond knife|
|US4587202||14 Dic 1984||6 May 1986||Ethicon, Inc.||Photoetching process for making surgical needles|
|US4611400||31 Ene 1985||16 Sep 1986||Drake Anthony F||Blade and process of making same|
|US4629373||22 Jun 1983||16 Dic 1986||Megadiamond Industries, Inc.||Polycrystalline diamond body with enhanced surface irregularities|
|US4634496||14 Nov 1985||6 Ene 1987||Kabushiki Kaisha Toshiba||Method for planarizing the surface of an interlayer insulating film in a semiconductor device|
|US4671849||6 May 1985||9 Jun 1987||International Business Machines Corporation||Method for control of etch profile|
|US4686980||17 Abr 1986||18 Ago 1987||Alcon Laboratories, Inc.||Disposable bipolar instrument|
|US4688570||9 May 1983||25 Ago 1987||The Regents Of The University Of California||Ophthalmologic surgical instrument|
|US4697489||9 Sep 1985||6 Oct 1987||Kim George A||Ultramicrotome tool|
|US4719915||2 May 1986||19 Ene 1988||Michael Porat||Scalpel|
|US4735202||6 Oct 1986||5 Abr 1988||Alcon Laboratories, Inc.||Microsurgical knife with locking blade guard|
|US4735920||4 Feb 1987||5 Abr 1988||Siemens Aktiengesellschaft||Method for structuring silicon carbide|
|US4740410||28 May 1987||26 Abr 1988||The Regents Of The University Of California||Micromechanical elements and methods for their fabrication|
|US4777096||17 Mar 1987||11 Oct 1988||Ethicon, Inc.||Sheet containing a plurality of surgical needles|
|US4790812||15 Nov 1985||13 Dic 1988||Hawkins Jr Irvin F||Apparatus and method for removing a target object from a body passsageway|
|US4793218||9 Oct 1987||27 Dic 1988||George Jordan||Method of forming knife blades by photo-chemical etching|
|US4798000||13 Feb 1987||17 Ene 1989||Bedner Richard J||Cutting blade assembly|
|US4808260||5 Feb 1988||28 Feb 1989||Ford Motor Company||Directional aperture etched in silicon|
|US4846250||17 Oct 1988||11 Jul 1989||Bedner Richard J||Method of casting a handle for a surgical blade|
|US4850353||8 Ago 1988||25 Jul 1989||Everest Medical Corporation||Silicon nitride electrosurgical blade|
|US4862890||29 Feb 1988||5 Sep 1989||Everest Medical Corporation||Electrosurgical spatula blade with ceramic substrate|
|US4872947||26 Oct 1988||10 Oct 1989||Applied Materials, Inc.||CVD of silicon oxide using TEOS decomposition and in-situ planarization process|
|US4911782||28 Mar 1988||27 Mar 1990||Cyto-Fluidics, Inc.||Method for forming a miniaturized biological assembly|
|US4916002||13 Ene 1989||10 Abr 1990||The Board Of Trustees Of The Leland Jr. University||Microcasting of microminiature tips|
|US4922903||6 Oct 1988||8 May 1990||Everest Medical Corporation||Handle for electro-surgical blade|
|US4934103||11 Oct 1988||19 Jun 1990||Office National D'etudes Et De Recherches Aerospatiales O.N.E.R.A.||Machine for ultrasonic abrasion machining|
|US4948461||16 Oct 1989||14 Ago 1990||Eastman Kodak Company||Dry-etching method and plasma|
|US4955894||30 Ene 1989||11 Sep 1990||Alcon Laboratories, Inc.||Posterior capsulotomy knife|
|US4958539||2 Jun 1989||25 Sep 1990||Everest Medical Corporation||Method of making an electrosurgical spatula blade|
|US4980021||21 Abr 1989||25 Dic 1990||Shin-Etsu Chemical Co. Ltd.||Method for preparation of edged medical tool|
|US5019035||7 Jun 1989||28 May 1991||Alcon Surgical, Inc.||Cutting assembly for surgical cutting instrument|
|US5021364||31 Oct 1989||4 Jun 1991||The Board Of Trustees Of The Leland Stanford Junior University||Microcantilever with integral self-aligned sharp tetrahedral tip|
|US5032243||6 Sep 1989||16 Jul 1991||The Gillette Company||Method and apparatus for forming or modifying cutting edges|
|US5048191||16 Oct 1990||17 Sep 1991||The Gillette Company||Razor blade technology|
|US5056277||29 Oct 1990||15 Oct 1991||Wilson William P||Preformed chimney flashing|
|US5077901||18 May 1990||7 Ene 1992||Warner Joseph A||Ceramic blades and production methodology therefor|
|US5082254||19 Sep 1989||21 Ene 1992||Triangle Biomedical Sciences, Inc.||Microtome object holder assembly|
|US5100506||4 Dic 1990||31 Mar 1992||Grace Manufacturing Inc.||Chemically machined sheet metal cutting tools and method|
|US5121660||9 Oct 1991||16 Jun 1992||The Gillette Company||Razor blade technology|
|US5142785||26 Ago 1991||1 Sep 1992||The Gillette Company||Razor technology|
|US5143785||20 Ago 1990||1 Sep 1992||Minnesota Mining And Manufacturing Company||Cyanate ester adhesives for electronic applications|
|US5166520||13 May 1991||24 Nov 1992||The Regents Of The University Of California||Universal, microfabricated probe for scanning probe microscopes|
|US5176628||16 May 1991||5 Ene 1993||Alcon Surgical, Inc.||Vitreous cutter|
|US5193311||3 Mar 1992||16 Mar 1993||T&N Technology Limited||Tools for working non-metallic hard materials|
|US5201992||8 Oct 1991||13 Abr 1993||Bell Communications Research, Inc.||Method for making tapered microminiature silicon structures|
|US5217477||10 Feb 1992||8 Jun 1993||Alcon Surgical, Inc.||Dual width surgical knife|
|US5222967||8 Abr 1992||29 Jun 1993||Magnum Diamond Corporation||Keratorefractive diamond blade and surgical method|
|US5258002||25 Nov 1992||2 Nov 1993||Alcon Surgical, Inc.||Dual tapered surgical knife|
|US5266528||9 Sep 1992||30 Nov 1993||Fujitsu Limited||Method of dicing semiconductor wafer with diamond and resin blades|
|US5295305||25 Ene 1993||22 Mar 1994||The Gillette Company||Razor blade technology|
|US5317938||16 Ene 1992||7 Jun 1994||Duke University||Method for making microstructural surgical instruments|
|US5342370||19 Mar 1993||30 Ago 1994||University Of Miami||Method and apparatus for implanting an artifical meshwork in glaucoma surgery|
|US5474532||22 Nov 1994||12 Dic 1995||Alcon Laboratories, Inc.||Cutting blade for a vitreous cutter|
|US5562693||11 Ago 1995||8 Oct 1996||Alcon Laboratories, Inc.||Cutting blade assembly for a surgical scissors|
|US5579583||19 Ene 1995||3 Dic 1996||Micromed, Incorporated||Microfabricated blades|
|US5609778||2 Jun 1995||11 Mar 1997||International Business Machines Corporation||Process for high contrast marking on surfaces using lasers|
|US5619889||11 Oct 1994||15 Abr 1997||Fed Corporation||Method of making microstructural surgical instruments|
|US5627109||15 Sep 1995||6 May 1997||Sassa; Michinari||Method of manufacturing a semiconductor device that uses a sapphire substrate|
|US5634267 *||14 Nov 1994||3 Jun 1997||Micron Technology, Inc.||Method and apparatus for manufacturing known good semiconductor die|
|US5651782||13 Jun 1996||29 Jul 1997||University Of Miami||Method and apparatus for implanting an artificial meshwork in glaucoma surgery|
|US5683592||25 Feb 1994||4 Nov 1997||British Technology Group Limited||Surgical cutting tool|
|US5713915||15 Nov 1996||3 Feb 1998||Rhein Medical, Inc.||Surgical knife blade|
|US5728089||31 Oct 1994||17 Mar 1998||The Regents Of The University Of California||Microfabricated structure to be used in surgery|
|US5742026||26 Jun 1995||21 Abr 1998||Corning Incorporated||Processes for polishing glass and glass-ceramic surfaces using excimer laser radiation|
|US5842387||7 Nov 1994||1 Dic 1998||Marcus; Robert B.||Knife blades having ultra-sharp cutting edges and methods of fabrication|
|US5879326||25 Abr 1997||9 Mar 1999||Godshall; Ned Allen||Method and apparatus for disruption of the epidermis|
|US5888883||24 Abr 1998||30 Mar 1999||Kabushiki Kaisha Toshiba||Method of dividing a wafer and method of manufacturing a semiconductor device|
|US5893846||15 May 1996||13 Abr 1999||Symbiosis Corp.||Ceramic coated endoscopic scissor blades and a method of making the same|
|US5928161||3 Jul 1997||27 Jul 1999||The Regents Of The University Of California||Microbiopsy/precision cutting devices|
|US5928207||30 Jun 1997||27 Jul 1999||The Regents Of The University Of California||Microneedle with isotropically etched tip, and method of fabricating such a device|
|US5944717||12 May 1997||31 Ago 1999||The Regents Of The University Of California||Micromachined electrical cauterizer|
|US5972154||27 Jun 1996||26 Oct 1999||Sony Corporation||Methods of dicing flat workpieces|
|US5985217||17 Jul 1997||16 Nov 1999||The Regents Of The University Of California||Microfabricated instrument for tissue biopsy and analysis|
|US5993281||10 Jun 1997||30 Nov 1999||The Regents Of The University Of California||Sharpening of field emitter tips using high-energy ions|
|US5998234||28 Mar 1997||7 Dic 1999||Denso Corporation||Method of producing semiconductor device by dicing|
|US6003419||27 Feb 1998||21 Dic 1999||Nikon Corporation||Microcutting device and incising method|
|US6136724 *||18 Feb 1998||24 Oct 2000||Scp Global Technologies||Multiple stage wet processing chamber|
|US6250192 *||12 Nov 1996||26 Jun 2001||Micron Technology, Inc.||Method for sawing wafers employing multiple indexing techniques for multiple die dimensions|
|US6797621 *||9 Mar 2001||28 Sep 2004||Lg.Philips Lcd Co., Ltd.||Etchant composition for molybdenum and method of using same|
|US6838387 *||21 Jun 2001||4 Ene 2005||John Zajac||Fast etching system and process|
|USD405178||7 Ene 1997||2 Feb 1999||Diamond scalpel blade|
|1||Crosby, P., "Get to Know Lasers And Their Roles in Plastics", Plastics Technology, Jun. 2002.|
|2||Http://hackman.mit.edu/6152J/Lecture Notes/6152J.FT01.Lecture 17-1.pdf, Lecture 17, Basics of Etching, Fall Term 2001.|
|3||Venkat, S., "Processing Ceramics With Lasers", Ceramic Industry, Jun. 1, 2001.|
|4||*||Wolf et al., Silicon Processing for the VLSI Era, 1986, vol. 1, p. 531.|
|5||*||Wolf et al., Silicon Processing for the VLSI Era, vol. 1, 1986, pp. 529-531.|
|Patente citante||Fecha de presentación||Fecha de publicación||Solicitante||Título|
|US7387742 *||17 Sep 2004||17 Jun 2008||Becton, Dickinson And Company||Silicon blades for surgical and non-surgical use|
|US7906437 *||31 Jul 2006||15 Mar 2011||Beaver-Visitec International (Us), Inc.||System and method for the manufacture of surgical blades|
|US8409462 *||9 Feb 2011||2 Abr 2013||Beaver-Visitec International (Us), Inc.||System and method for the manufacture of surgical blades|
|US8882792||16 Ago 2010||11 Nov 2014||Ethicon Endo-Surgery, Inc.||Ultrasonic surgical apparatus with silicon waveguide|
|US9114245||16 Ago 2010||25 Ago 2015||Ethicon Endo-Surgery, Inc.||Ultrasonic surgical apparatus and methods for use thereof|
|US20070045229 *||31 Jul 2006||1 Mar 2007||Keenan Joseph F||System and method for the manufacture of surgical blades|
|US20090198264 *||2 Feb 2009||6 Ago 2009||Exogenesis Corporation||Method and System for Improving Surgical Blades by the Application of Gas Cluster Ion Beam Technology and Improved Surgical Blades|
|US20110040212 *||16 Ago 2010||17 Feb 2011||Ethicon Endo-Surgery, Inc.||Ultrasonic Surgical Apparatus and Methods for Use Thereof|
|US20110040213 *||16 Ago 2010||17 Feb 2011||Ethicon Endo-Surgery, Inc.||Ultrasonic Surgical Apparatus with Silicon Waveguide|
|US20110192819 *||9 Feb 2011||11 Ago 2011||Beaver-Vistec International, Inc.||System and method for the manufacture of surgical blades|
|Clasificación de EE.UU.||216/101, 438/745, 438/753, 252/79.2|
|Clasificación internacional||B21K11/00, B21K11/02, A61B17/00, B23K26/40, C23F1/24, C23C30/00, C23F1/12, B23K26/38, A61B17/3211, B28D5/02, C03C15/00, C23F3/00, C23F1/00, A61B17/32, B44C1/00, C03C25/00|
|Clasificación cooperativa||B28D5/022, A61B2017/00526, A61B17/32, A61B17/3211|
|Clasificación europea||B28D5/02C, A61B17/32, A61B17/3211|
|23 May 2003||AS||Assignment|
Owner name: BECTON, DICKINSON AND COMPANY, NEW JERSEY
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KEENAN, JOSEPH F. ET AL.;REEL/FRAME:014106/0227
Effective date: 20030323
|12 Mar 2010||FPAY||Fee payment|
Year of fee payment: 4
|3 Ago 2010||AS||Assignment|
Owner name: BEAVER-VISITEC INTERNATIONAL (US), INC., MASSACHUS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BECTON, DICKINSON AND COMPANY;REEL/FRAME:024776/0755
Effective date: 20100730
|9 Ago 2010||AS||Assignment|
Owner name: GENERAL ELECTRIC CAPITAL CORPORATION, AS ADMINISTR
Free format text: SECURITY AGREEMENT;ASSIGNOR:BEAVER-VISITEC INTERNATIONAL (US), INC.;REEL/FRAME:024804/0362
Effective date: 20100730
|12 Mar 2014||FPAY||Fee payment|
Year of fee payment: 8
|22 Abr 2014||AS||Assignment|
Owner name: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT, MA
Free format text: SECURITY INTEREST;ASSIGNOR:BEAVER-VISITEC INTERNATIONAL (US), INC.;REEL/FRAME:032738/0320
Effective date: 20140422
|18 Nov 2015||AS||Assignment|
Owner name: HEALTHCARE FINANCIAL SOLUTIONS, LLC, AS SUCCESSOR
Free format text: ASSIGNMENT OF INTELLECTUAL PROPERTY SECURITY AGREEMENT;ASSIGNOR:GENERAL ELECTRIC CAPITAL CORPORATION, AS RETIRING AGENT;REEL/FRAME:037145/0503
Effective date: 20151116