|Número de publicación||US8129268 B2|
|Tipo de publicación||Concesión|
|Número de solicitud||US 12/619,375|
|Fecha de publicación||6 Mar 2012|
|Fecha de presentación||16 Nov 2009|
|Fecha de prioridad||16 Nov 2009|
|También publicado como||US9059394, US20110115087, US20120139119|
|Número de publicación||12619375, 619375, US 8129268 B2, US 8129268B2, US-B2-8129268, US8129268 B2, US8129268B2|
|Inventores||Matthew J. Breitwisch|
|Cesionario original||International Business Machines Corporation|
|Exportar cita||BiBTeX, EndNote, RefMan|
|Citas de patentes (16), Otras citas (5), Citada por (5), Clasificaciones (15), Eventos legales (4)|
|Enlaces externos: USPTO, Cesión de USPTO, Espacenet|
The present invention relates generally to semiconductor structures, and more specifically, to a method for fabricating a self-aligned lower bottom electrode for a semiconductor structure which does not require a lithographic masking process, is substantially seam free, and which has minimal topography (i.e., is flat).
A memory cell requires a highly scaled portion of the memory cell to be defined. In one conventional method, a mushroom-type phase change memory cell is formed by first forming a flat lower bottom electrode on which a scaled bottom electrode is formed. The lower bottom electrode may be made by forming a lithography-defined hole, filling the hole with a conductive material and then performing a polishing process to polish the conductive material.
There are several problems associated with the conventional method. These problems include the need for an additional lithography process. The lithography process requires additional costs and may result in an undesirable alignment of the of the lower bottom electrode.
The present invention provides a manner in which to minimize the processing costs by minimizing the number of lithographic masking levels used within a memory cell. Therefore, the present invention provides a method for fabricating a mask-less, self-aligned lower bottom electrode for a memory cell.
According to one embodiment a method of fabricating a lower bottom electrode for a memory element is provided. The method includes forming a dielectric layer over a semiconductor substrate having a plurality of conductive contacts formed therein to be connected to access circuitry, forming a dielectric cap layer over exposed portions of the dielectric layer and the conductive contacts, depositing a planarizing material over the dielectric cap layer, etching a via to an upper surface of each conductive contact, removing the planarizing material, depositing electrode material over the dielectric cap layer and within the vias, the electrode material contacting an upper surface of each conductive contact, and planarizing the electrode material to form a lower bottom electrode over each conductive contact.
According to another embodiment of the present invention, a method of fabricating a lower bottom electrode for a memory element is provided. The method includes forming a dielectric layer over a semiconductor substrate having a plurality of conductive contacts formed therein to be connected to access circuitry, forming a dielectric cap layer over exposed portions of the dielectric layer and the conductive contacts, depositing a planarizing material over the dielectric cap layer, etching a via exposing an upper surface and respective side surfaces of each conductive contact along with a portion of an upper surface of the dielectric layer adjacent to the conductive contact, removing the planarizing material, depositing electrode material over the dielectric cap layer and within the vias. The electrode material contacts the upper surface and the respective side surfaces of each conductive contact along with the portion of the upper surface of dielectric layer. The method further includes planarizing the electrode material to form a lower bottom electrode over each conductive contact.
According to another embodiment of the present invention, a semiconductor structure is provided. The semiconductor structure includes a semiconductor substrate having a dielectric layer formed thereon and conductive contacts formed therein to be connected with access circuitry, a dielectric cap layer formed over exposed portions of the dielectric layer, and a lower bottom electrode formed over each conductive contact. The lower bottom electrode is self-aligned to an upper surface of the conductive contact.
Additional features and advantages are realized through the techniques of the present invention. Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention. For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings.
The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The forgoing and other features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
The present invention provides a flat lower bottom electrode for a memory element to be included in advanced CMOS technologies, bi-CMOS technologies and SiGe-based technologies. The fabrication of the flat lower bottom electrode 112 (depicted in
With reference now to
Further, a chemical mechanical polishing (CMP) process may be performed to remove any remaining dielectric cap layer 107 from the upper surface of the conductive contacts 101.
Embodiments of the present invention provide a method of fabricating a maskless, flat lower bottom electrode in a semiconductor structure. Therefore, the present invention provides the advantages of minimizing the number of masking levels and in turn minimizing associated processing costs.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and/or groups thereof.
The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated
The flow diagrams depicted herein are just one example. There may be many variations to this diagram or the steps (or operations) described therein without departing from the spirit of the invention. For instance, the steps may be performed in a differing order or steps may be added, deleted or modified. All of these variations are considered a part of the claimed invention.
While the preferred embodiment to the invention had been described, it will be understood that those skilled in the art, both now and in the future, may make various improvements and enhancements which fall within the scope of the claims which follow. These claims should be construed to maintain the proper protection for the invention first described.
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|Clasificación de EE.UU.||438/626, 257/E21.576, 257/E21.583, 257/E21.575, 438/618, 257/E21.577, 257/E21.58, 438/675, 438/622, 257/E21.585|
|Clasificación cooperativa||H01L45/06, H01L45/16, H01L27/2436|
|16 Nov 2009||AS||Assignment|
Owner name: INTERNATIONAL BUSINESS MACHINES CORPORATION, NEW Y
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BREITWISCH, MATTHEW J.;REEL/FRAME:023523/0807
Effective date: 20091114
|2 Sep 2015||FPAY||Fee payment|
Year of fee payment: 4
|3 Sep 2015||AS||Assignment|
Owner name: GLOBALFOUNDRIES U.S. 2 LLC, NEW YORK
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:INTERNATIONAL BUSINESS MACHINES CORPORATION;REEL/FRAME:036550/0001
Effective date: 20150629
|5 Oct 2015||AS||Assignment|
Owner name: GLOBALFOUNDRIES INC., CAYMAN ISLANDS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GLOBALFOUNDRIES U.S. 2 LLC;GLOBALFOUNDRIES U.S. INC.;REEL/FRAME:036779/0001
Effective date: 20150910