US8507805B2 - Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard - Google Patents
Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard Download PDFInfo
- Publication number
- US8507805B2 US8507805B2 US12/362,670 US36267009A US8507805B2 US 8507805 B2 US8507805 B2 US 8507805B2 US 36267009 A US36267009 A US 36267009A US 8507805 B2 US8507805 B2 US 8507805B2
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- land
- substrate
- connection portion
- wiring line
- wiring
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- H—ELECTRICITY
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-021376 | 2008-01-31 | ||
JP2008021376A JP5393986B2 (en) | 2008-01-31 | 2008-01-31 | Semiconductor device wiring board, semiconductor device, electronic device and motherboard |
Publications (2)
Publication Number | Publication Date |
---|---|
US20090196003A1 US20090196003A1 (en) | 2009-08-06 |
US8507805B2 true US8507805B2 (en) | 2013-08-13 |
Family
ID=40931485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/362,670 Expired - Fee Related US8507805B2 (en) | 2008-01-31 | 2009-01-30 | Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard |
Country Status (2)
Country | Link |
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US (1) | US8507805B2 (en) |
JP (1) | JP5393986B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120295454A1 (en) * | 2010-02-01 | 2012-11-22 | Huawei Device Co., Ltd. | Printed circuit board assembly chip package component and soldering component |
US20160372412A1 (en) * | 2015-06-16 | 2016-12-22 | Samsung Electronics Co., Ltd. | Package substrate and semiconductor package including the same |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US20140231993A1 (en) * | 2013-02-21 | 2014-08-21 | Marvell World Trade Ltd. | Package-on-package structures |
JP6230799B2 (en) * | 2013-03-18 | 2017-11-15 | 日立オートモティブシステムズ株式会社 | Control device |
JP6487286B2 (en) * | 2015-07-07 | 2019-03-20 | 日立オートモティブシステムズ株式会社 | Wiring board |
KR102151989B1 (en) * | 2018-09-06 | 2020-09-04 | 주식회사 지로이아이 | single-sided Printed-Circuit-Board of through-hole type with Photo-Solder-Resist |
KR102187538B1 (en) * | 2018-09-17 | 2020-12-07 | 주식회사 지로이아이 | single-sided Printed-Circuit-Board of through-hole type |
JP6772232B2 (en) * | 2018-10-03 | 2020-10-21 | キヤノン株式会社 | Printed circuit boards and electronic devices |
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US20120295454A1 (en) * | 2010-02-01 | 2012-11-22 | Huawei Device Co., Ltd. | Printed circuit board assembly chip package component and soldering component |
US8908386B2 (en) * | 2010-02-01 | 2014-12-09 | Huawei Device Co., Ltd. | Printed circuit board assembly chip package component and soldering component |
US20160372412A1 (en) * | 2015-06-16 | 2016-12-22 | Samsung Electronics Co., Ltd. | Package substrate and semiconductor package including the same |
US9761519B2 (en) * | 2015-06-16 | 2017-09-12 | Samsung Electronics Co., Ltd. | Package substrate and semiconductor package including the same |
Also Published As
Publication number | Publication date |
---|---|
JP2009182236A (en) | 2009-08-13 |
JP5393986B2 (en) | 2014-01-22 |
US20090196003A1 (en) | 2009-08-06 |
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