US8678739B2 - Carrier supporting apparatus - Google Patents
Carrier supporting apparatus Download PDFInfo
- Publication number
- US8678739B2 US8678739B2 US11/628,843 US62884305A US8678739B2 US 8678739 B2 US8678739 B2 US 8678739B2 US 62884305 A US62884305 A US 62884305A US 8678739 B2 US8678739 B2 US 8678739B2
- Authority
- US
- United States
- Prior art keywords
- carrier
- lowermost
- supporting
- lifting member
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-191402 | 2004-06-29 | ||
JP2004191402A JP4509669B2 (en) | 2004-06-29 | 2004-06-29 | Loading mechanism and method for carrying out object to be processed |
PCT/JP2005/011255 WO2006001246A1 (en) | 2004-06-29 | 2005-06-20 | Carrier support device |
Publications (2)
Publication Number | Publication Date |
---|---|
US20090245979A1 US20090245979A1 (en) | 2009-10-01 |
US8678739B2 true US8678739B2 (en) | 2014-03-25 |
Family
ID=35780168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/628,843 Active 2028-06-01 US8678739B2 (en) | 2004-06-29 | 2005-06-20 | Carrier supporting apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US8678739B2 (en) |
JP (1) | JP4509669B2 (en) |
KR (1) | KR100874287B1 (en) |
CN (1) | CN100452343C (en) |
TW (1) | TW200603325A (en) |
WO (1) | WO2006001246A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10504762B2 (en) * | 2018-02-06 | 2019-12-10 | Applied Materials, Inc. | Bridging front opening unified pod (FOUP) |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3902615A (en) * | 1973-03-12 | 1975-09-02 | Computervision Corp | Automatic wafer loading and pre-alignment system |
US5183370A (en) * | 1989-12-29 | 1993-02-02 | Commissariat A L'energie Atomique | Apparatus for placing or storing flat articles in a cassette with intermediate racks |
US5275521A (en) * | 1991-07-03 | 1994-01-04 | Tokyo Electron Sagami Limited | Wafer transfer device |
US5626456A (en) * | 1993-03-18 | 1997-05-06 | Tokyo Electron Limited | Transfer device |
US5697748A (en) * | 1993-07-15 | 1997-12-16 | Applied Materials, Inc. | Wafer tray and ceramic blade for semiconductor processing apparatus |
US5888048A (en) * | 1995-07-10 | 1999-03-30 | Amtech Systems, Inc. | Automatic wafer boat loading |
JPH11233998A (en) | 1998-02-09 | 1999-08-27 | Sony Corp | Substrate positioning device |
US5989346A (en) * | 1995-12-12 | 1999-11-23 | Tokyo Electron Limited | Semiconductor processing apparatus |
JP2001284838A (en) | 2000-04-03 | 2001-10-12 | Alpine Electronics Inc | Electronic equipment |
US6337257B1 (en) * | 1999-02-09 | 2002-01-08 | Sharp Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
US20020044859A1 (en) * | 2000-08-28 | 2002-04-18 | Shinsung Eng Corporation | FOUP loading apparatus for FOUP opener |
JP2002261145A (en) | 2001-03-02 | 2002-09-13 | Kanayama Seiki Co Ltd | Wafer taking-out and storing device |
US20030002961A1 (en) * | 1996-03-26 | 2003-01-02 | Semitool, Inc. | Semiconductor wafer processing apparatus having improved wafer input/output handling system |
JP2003309165A (en) | 2002-04-18 | 2003-10-31 | Matsushita Electric Ind Co Ltd | Feeding device for wafer |
US6641348B1 (en) * | 1998-03-27 | 2003-11-04 | Brooks Automation Gmbh | Docking station for substrate transport containers |
US6676356B2 (en) * | 2000-09-18 | 2004-01-13 | Tokyo Electron Limited | Device for attaching target substrate transfer container to semiconductor processing apparatus |
US20040197174A1 (en) * | 2003-04-02 | 2004-10-07 | Van Den Berg Jannes Remco | Method and apparatus for loading a batch of wafers into a wafer boat |
US6814507B2 (en) * | 2002-03-28 | 2004-11-09 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
US6852608B2 (en) * | 2001-11-30 | 2005-02-08 | Disco Corporation | Production method for semiconductor chip |
-
2004
- 2004-06-29 JP JP2004191402A patent/JP4509669B2/en not_active Expired - Fee Related
-
2005
- 2005-06-20 CN CNB2005800220458A patent/CN100452343C/en active Active
- 2005-06-20 KR KR1020077002126A patent/KR100874287B1/en active IP Right Grant
- 2005-06-20 WO PCT/JP2005/011255 patent/WO2006001246A1/en active Application Filing
- 2005-06-20 US US11/628,843 patent/US8678739B2/en active Active
- 2005-06-28 TW TW094121663A patent/TW200603325A/en unknown
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3902615A (en) * | 1973-03-12 | 1975-09-02 | Computervision Corp | Automatic wafer loading and pre-alignment system |
US5183370A (en) * | 1989-12-29 | 1993-02-02 | Commissariat A L'energie Atomique | Apparatus for placing or storing flat articles in a cassette with intermediate racks |
US5275521A (en) * | 1991-07-03 | 1994-01-04 | Tokyo Electron Sagami Limited | Wafer transfer device |
US5626456A (en) * | 1993-03-18 | 1997-05-06 | Tokyo Electron Limited | Transfer device |
US5697748A (en) * | 1993-07-15 | 1997-12-16 | Applied Materials, Inc. | Wafer tray and ceramic blade for semiconductor processing apparatus |
US5888048A (en) * | 1995-07-10 | 1999-03-30 | Amtech Systems, Inc. | Automatic wafer boat loading |
US5989346A (en) * | 1995-12-12 | 1999-11-23 | Tokyo Electron Limited | Semiconductor processing apparatus |
US20030002961A1 (en) * | 1996-03-26 | 2003-01-02 | Semitool, Inc. | Semiconductor wafer processing apparatus having improved wafer input/output handling system |
JPH11233998A (en) | 1998-02-09 | 1999-08-27 | Sony Corp | Substrate positioning device |
US6641348B1 (en) * | 1998-03-27 | 2003-11-04 | Brooks Automation Gmbh | Docking station for substrate transport containers |
US6337257B1 (en) * | 1999-02-09 | 2002-01-08 | Sharp Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
JP2001284838A (en) | 2000-04-03 | 2001-10-12 | Alpine Electronics Inc | Electronic equipment |
US20020044859A1 (en) * | 2000-08-28 | 2002-04-18 | Shinsung Eng Corporation | FOUP loading apparatus for FOUP opener |
US6676356B2 (en) * | 2000-09-18 | 2004-01-13 | Tokyo Electron Limited | Device for attaching target substrate transfer container to semiconductor processing apparatus |
JP2002261145A (en) | 2001-03-02 | 2002-09-13 | Kanayama Seiki Co Ltd | Wafer taking-out and storing device |
US6852608B2 (en) * | 2001-11-30 | 2005-02-08 | Disco Corporation | Production method for semiconductor chip |
US6814507B2 (en) * | 2002-03-28 | 2004-11-09 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
JP2003309165A (en) | 2002-04-18 | 2003-10-31 | Matsushita Electric Ind Co Ltd | Feeding device for wafer |
US20040197174A1 (en) * | 2003-04-02 | 2004-10-07 | Van Den Berg Jannes Remco | Method and apparatus for loading a batch of wafers into a wafer boat |
Non-Patent Citations (2)
Title |
---|
PCT International Preliminary Report on Patentability (Form PCT/IPEA/409) dated Apr. 2005 (English translation). |
PCT Notification of Transmittal of Translation of the International Preliminary Examination Report (Form PCT/IB/338) dated Jan. 2004. |
Also Published As
Publication number | Publication date |
---|---|
JP4509669B2 (en) | 2010-07-21 |
TWI371071B (en) | 2012-08-21 |
KR20070038530A (en) | 2007-04-10 |
JP2006013320A (en) | 2006-01-12 |
TW200603325A (en) | 2006-01-16 |
WO2006001246A1 (en) | 2006-01-05 |
CN100452343C (en) | 2009-01-14 |
US20090245979A1 (en) | 2009-10-01 |
KR100874287B1 (en) | 2008-12-18 |
CN1977372A (en) | 2007-06-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
XAS | Not any more in us assignment database |
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OGASAWARA, IKUO;KATO, YOSHIYASU;SIGNING DATES FROM 20061114 TO 20061120;REEL/FRAME:020935/0318 Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OGASAWARA, IKUO;KATO, YOSHIYASU;SIGNING DATES FROM 20061114 TO 20061120;REEL/FRAME:021458/0217 |
|
AS | Assignment |
Owner name: TOKYO ELECTRON LIMITED, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OGASAWARA, IKUO;KATO, YOSHIYASU;REEL/FRAME:021586/0119;SIGNING DATES FROM 20061114 TO 20061120 Owner name: TOKYO ELECTRON LIMITED, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OGASAWARA, IKUO;KATO, YOSHIYASU;SIGNING DATES FROM 20061114 TO 20061120;REEL/FRAME:021586/0119 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551) Year of fee payment: 4 |
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MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 8 |