US8993055B2 - Enhanced thin film deposition - Google Patents
Enhanced thin film deposition Download PDFInfo
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- US8993055B2 US8993055B2 US11/588,837 US58883706A US8993055B2 US 8993055 B2 US8993055 B2 US 8993055B2 US 58883706 A US58883706 A US 58883706A US 8993055 B2 US8993055 B2 US 8993055B2
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract
Description
(M1Xy+purge+M2R3+purge+deposition-enhancing agent+purge)×m 1
or
(M1Xy+purge+deposition-enhancing agent+purge+M2R3+purge)×m 1,
(TaCl5+purge+trimethylaluminum(TMA) or triethylaluminum(TEA)+purge+C2H2+purge)]×m 2
or
(TaCl5+purge+C2H2+purge+TMA or TEA+purge)]×m 2,
(TEB+purge+Si2H6+purge+WF6+purge)]×m 2,
[n 3×(M1Xy+purge+M2R3+purge)+m 3×(enhanced deposition agent+purge)]×k 3,
(MXy+purge+silicon source chemical+purge+deposition-enhancing agent+purge)×m 1, or
(MXy+purge+deposition-enhancing agent+purge+silicon source chemical+purge)×m 1
(WF6+purge+Si2H6+purge+TEB+purge)]×m 2,
(MXy+purge+oxidizing reactant+purge+deposition-enhancing agent+purge)×m 1
or
(MXy+purge+deposition-enhancing agent+purge+oxidizing reactant+purge)×m 1
2-OH(s)+WCl6(g)→—OWClx(s)+HCl(g)
—OWClx(s)+H2O(g)→—OWOHClx(s)+HCl(g)
—OWClx(s)+C2H2(g)→—WO2(s)+C2H2Cl2(g)
2-OH(s)+WCl6(g)→—OWClx(s)+HCl(g)
—OWClx(s)+C2H2(g)→—OW(s)+HCl(g)
—OW(s)+H2O(g)→—W(OH)2(s)
2-OH(s)+MoCl5(g)→—OMoClx(s)+HCl(g)
—OMoClx(s)+H2O(g)→—OMoOHClx(s)+HCl(g)
OMoClx(s)+C2H2(g)→—MoO2(s)+C2H2Cl2(g)
2-OH(s)+MoCl6(g)→—OMoClx(s)+HCl(g)
—OMoClx(s)+C2H2(g)→—OMo(s)+HCl(g)
—OMo(s)+H2O(g)→—Mo(OH)2(s)
(deposition-enhancing agent+purge+MXy+purge+reducing agent+purge)×m 1,
or
(MXy+purge deposition-enhancing agent+purge+reducing agent+purge)×m 1,
(TEB+purge+WF6+purge+Si2H6+purge)]×m 2
Claims (33)
Priority Applications (5)
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US11/588,837 US8993055B2 (en) | 2005-10-27 | 2006-10-27 | Enhanced thin film deposition |
US13/766,469 US9127351B2 (en) | 2005-10-27 | 2013-02-13 | Enhanced thin film deposition |
US14/812,139 US9831094B2 (en) | 2005-10-27 | 2015-07-29 | Enhanced thin film deposition |
US15/824,143 US10297444B2 (en) | 2005-10-27 | 2017-11-28 | Enhanced thin film deposition |
US16/411,957 US10964534B2 (en) | 2005-10-27 | 2019-05-14 | Enhanced thin film deposition |
Applications Claiming Priority (2)
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US73098605P | 2005-10-27 | 2005-10-27 | |
US11/588,837 US8993055B2 (en) | 2005-10-27 | 2006-10-27 | Enhanced thin film deposition |
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US13/766,469 Continuation US9127351B2 (en) | 2005-10-27 | 2013-02-13 | Enhanced thin film deposition |
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US20070148350A1 US20070148350A1 (en) | 2007-06-28 |
US8993055B2 true US8993055B2 (en) | 2015-03-31 |
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US13/766,469 Active US9127351B2 (en) | 2005-10-27 | 2013-02-13 | Enhanced thin film deposition |
US14/812,139 Active 2027-03-05 US9831094B2 (en) | 2005-10-27 | 2015-07-29 | Enhanced thin film deposition |
US15/824,143 Active US10297444B2 (en) | 2005-10-27 | 2017-11-28 | Enhanced thin film deposition |
US16/411,957 Active 2027-04-06 US10964534B2 (en) | 2005-10-27 | 2019-05-14 | Enhanced thin film deposition |
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US13/766,469 Active US9127351B2 (en) | 2005-10-27 | 2013-02-13 | Enhanced thin film deposition |
US14/812,139 Active 2027-03-05 US9831094B2 (en) | 2005-10-27 | 2015-07-29 | Enhanced thin film deposition |
US15/824,143 Active US10297444B2 (en) | 2005-10-27 | 2017-11-28 | Enhanced thin film deposition |
US16/411,957 Active 2027-04-06 US10964534B2 (en) | 2005-10-27 | 2019-05-14 | Enhanced thin film deposition |
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US20130183445A1 (en) | 2013-07-18 |
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US9127351B2 (en) | 2015-09-08 |
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US20180130666A1 (en) | 2018-05-10 |
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