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Número de publicaciónUSD402638 S
Tipo de publicaciónConcesión
Número de solicitudUS 29/070,029
Fecha de publicación15 Dic 1998
Fecha de presentación25 Abr 1997
Número de publicación070029, 29070029, US D402638 S, US D402638S, US-S-D402638, USD402638 S, USD402638S
InventoresWarren M. Farnworth, Alan G. Wood, David R. Hembree, Salman Akram
Cesionario originalMicron Technology, Inc.
Exportar citaBiBTeX, EndNote, RefMan
Enlaces externos: USPTO, Cesión de USPTO, Espacenet
Temporary package for semiconductor dice
US D402638 S
Resumen  disponible en
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Reclamaciones(1)
  1. The ornamental design for a temporary package for semiconductor dice, as shown and described.
Descripción

FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing our new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a front side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear side elevation view thereof.

Otras citas
Referencia
11994 DRAM Data Book, Micron Semiconductor, Inc., pp. 7-7 - 7-13, Apr., 1994.
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Clasificaciones
Clasificación de EE.UU.D13/182