USD419959S - Conductive ink traces pattern on a medium - Google Patents

Conductive ink traces pattern on a medium Download PDF

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Publication number
USD419959S
USD419959S US29/096,982 US9698298F USD419959S US D419959 S USD419959 S US D419959S US 9698298 F US9698298 F US 9698298F US D419959 S USD419959 S US D419959S
Authority
US
United States
Prior art keywords
medium
conductive ink
ink traces
traces pattern
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/096,982
Inventor
Eugene C. Amoroso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TENCO LLC
Original Assignee
Amoroso Eugene C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amoroso Eugene C filed Critical Amoroso Eugene C
Priority to US29/096,982 priority Critical patent/USD419959S/en
Application granted granted Critical
Publication of USD419959S publication Critical patent/USD419959S/en
Assigned to TENCO, L.L.C. reassignment TENCO, L.L.C. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AMOROSO, EUGENE C.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front perspective view of a conductive ink traces pattern on a medium, showing my new design therefor, where the medium is of fabric, plastic, Mylar, metal, rubber, or wood and is shown in dotted lines;
FIG. 2 is a frontal view therefor;
FIG. 3 is a rear view therefor (where the medium is transparent);
FIG. 4 is a side view therefor, showing the left side;
FIG. 5 is a side view therefor, showing the right side;
FIG. 6 is a top plan view therefor; and,
FIG. 7 is a bottom plan view therefor.
The broken line showing throughout the drawing views is included for the purpose of illustrating enviromental structure only and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for a conductive ink traces pattern on a medium, as shown and described.
US29/096,982 1998-11-25 1998-11-25 Conductive ink traces pattern on a medium Expired - Lifetime USD419959S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/096,982 USD419959S (en) 1998-11-25 1998-11-25 Conductive ink traces pattern on a medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/096,982 USD419959S (en) 1998-11-25 1998-11-25 Conductive ink traces pattern on a medium

Publications (1)

Publication Number Publication Date
USD419959S true USD419959S (en) 2000-02-01

Family

ID=71781528

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/096,982 Expired - Lifetime USD419959S (en) 1998-11-25 1998-11-25 Conductive ink traces pattern on a medium

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US (1) USD419959S (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3411205A (en) * 1965-01-27 1968-11-19 Methode Electronics Inc Weldable printed circuit making
US3576722A (en) * 1969-03-26 1971-04-27 Bendix Corp Method for metalizing ceramics
US3831270A (en) * 1970-09-28 1974-08-27 Mallory & Co Inc P R Electrical conducting means and method of making same
USD254687S (en) * 1979-01-25 1980-04-08 Mcdonnell Douglas Corporation Biochemical card for use with an automated microbial identification machine
USD255351S (en) * 1978-06-28 1980-06-10 Midgard Electronic Company, Inc. Circuit board
USD262962S (en) * 1978-11-03 1982-02-09 Strumpell Winton C Silicon wafer emitter electrode configuration
US4725478A (en) * 1985-09-04 1988-02-16 W. R. Grace & Co. Heat-miniaturizable printed circuit board
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
US5369220A (en) * 1991-02-25 1994-11-29 Sumitomo Electric Industries Ltd. Wiring board having laminated wiring patterns

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3411205A (en) * 1965-01-27 1968-11-19 Methode Electronics Inc Weldable printed circuit making
US3576722A (en) * 1969-03-26 1971-04-27 Bendix Corp Method for metalizing ceramics
US3831270A (en) * 1970-09-28 1974-08-27 Mallory & Co Inc P R Electrical conducting means and method of making same
USD255351S (en) * 1978-06-28 1980-06-10 Midgard Electronic Company, Inc. Circuit board
USD262962S (en) * 1978-11-03 1982-02-09 Strumpell Winton C Silicon wafer emitter electrode configuration
USD254687S (en) * 1979-01-25 1980-04-08 Mcdonnell Douglas Corporation Biochemical card for use with an automated microbial identification machine
US4725478A (en) * 1985-09-04 1988-02-16 W. R. Grace & Co. Heat-miniaturizable printed circuit board
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
US5369220A (en) * 1991-02-25 1994-11-29 Sumitomo Electric Industries Ltd. Wiring board having laminated wiring patterns

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