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Número de publicaciónUSD445096 S1
Tipo de publicaciónConcesión
Número de solicitud29/085,918
Fecha de publicación17 Jul 2001
Fecha de presentación1 Abr 1998
Fecha de prioridad1 Abr 1998
Número de publicación085918, 29085918, US D445096 S1, US D445096S1, US-S1-D445096, USD445096 S1, USD445096S1
InventoresRobert F. Wallace
Cesionario originalSandisk Corporation
Enlaces externos: USPTO, Cesión de USPTO, Espacenet
Removable memory card for use with portable electronic devices
US D445096 S1
Imágenes(3)
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Reclamaciones
  1. The ornamental design for a removable memory card for use with portable electronic devices, as shown and described.
Descripción

FIG. 1 is an isometric view of a removable memory card for use with portable electronic devices that incorporates a first embodiment of the new design, showing the card's top, front side and left side;

FIG. 2 is a top plan view of the memory card first embodiment;

FIG. 3 is a left side elevational view of the memory card first embodiment;

FIG. 4 is a front side elevational view of the memory card first embodiment;

FIG. 5 is a bottom plan view of the memory card first embodiment;

FIG. 6 is a right side elevational view of the memory card first embodiment;

FIG. 7 is a rear side elevational view of the memory card first embodiment;

FIG. 8 is an isometric view of a removable memory card for use with portable electronic devices that incorporates a second embodiment of the new design, showing the card's top, front side and left side;

FIG. 9 is a bottom plan view of the memory card second embodiment;

FIG. 10 is a right side elevational view of the memory card second embodiment;

FIG. 11 is a front side elevational view of the memory card second embodiment;

FIG. 12 is a top plan view of the memory card second embodiment;

FIG. 13 is a left side elevational view of the memory card second embodiment; and,

FIG. 14 is a rear side elevational view of the memory card second embodiment.

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Patente citante Fecha de presentación Fecha de publicación Solicitante Título
US657082521 Ago 200127 May 2003Amkor Technology, Inc.Method and circuit module package for automated switch actuator insertion
US663299713 Jun 200114 Oct 2003Amkor Technology, Inc.Personalized circuit module package and method for packaging circuit modules
US6634561 *7 Jun 200021 Oct 2003Sandisk CorporationMemory card electrical contact structure
US671782220 Sep 20026 Abr 2004Amkor Technology, Inc.Lead-frame method and circuit module assembly including edge stiffener
US68160323 Sep 20029 Nov 2004Amkor Technology, Inc.Laminated low-profile dual filter module for telecommunications devices and method therefor
US690052719 Sep 200131 May 2005Amkor Technology, Inc.Lead-frame method and assembly for interconnecting circuits within a circuit module
US69106358 Oct 200228 Jun 2005Amkor Technology, Inc.Die down multi-media card and method of making same
US69117183 Jul 200328 Jun 2005Amkor Technology, Inc.Double downset double dambar suspended leadframe
US696712419 Jun 200122 Nov 2005Amkor Technology, Inc.Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate
US700824016 Abr 20047 Mar 2006Super Talent Electronics, Inc.PC card assembly
US700984630 Jul 20047 Mar 2006Super Talent Electronics, Inc.13-Pin socket for combination SD/MMC flash memory system
US701125119 Abr 200514 Mar 2006Amkor Technology, Inc.Die down multi-media card and method of making same
US701938714 Feb 200228 Mar 2006Amkor Technology, Inc.Lead-frame connector and circuit module assembly
US703282718 Jun 200425 Abr 2006Super Talent Electronics, Inc.Combination SD/MMC flash memory card with thirteen contact pads
US707465421 Abr 200411 Jul 2006Amkor Technology, Inc.Tape supported memory card leadframe structure
US710221420 Ago 20045 Sep 2006Amkor Technology, Inc.Pre-molded leadframe
US710289123 Jul 20035 Sep 2006Amkor Technology, Inc.Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor
US711287517 Feb 200526 Sep 2006Amkor Technology, Inc.Secure digital memory card using land grid array structure
US71452385 May 20045 Dic 2006Amkor Technology, Inc.Semiconductor package and substrate having multi-level vias
US71738268 Mar 20046 Feb 2007Super Talent Electronics, Inc.PC card assembly with frame having longitudinal slot
US718542623 Mar 20046 Mar 2007Amkor Technology, Inc.Method of manufacturing a semiconductor package
US71933053 Nov 200420 Mar 2007Amkor Technology, Inc.Memory card ESC substrate insert
US720132718 Oct 200410 Abr 2007Amkor Technology, Inc.Memory card and its manufacturing method
US722091517 Feb 200522 May 2007Amkor Technology, Inc.Memory card and its manufacturing method
US72354235 Nov 200426 Jun 2007Super Talent Electronics, Inc.Molded memory card production using carrier strip
US72937162 May 200513 Nov 2007Amkor Technology, Inc.Secure digital memory card using land grid array structure
US729756224 Jun 200520 Nov 2007Amkor Technology, Inc.Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns
US730616028 Sep 200411 Dic 2007Sandisk CorporationMemory card with adapter
US730616123 Nov 200411 Dic 2007Sandisk CorporationMemory card with chamfer
US730784820 Feb 200411 Dic 2007Sandisk CorporationMemory card with raised portion
US731210322 Dic 200425 Dic 2007Amkor Technology, Inc.Method for making an integrated circuit substrate having laser-embedded conductive patterns
US733432611 Mar 200526 Feb 2008Amkor Technology, Inc.Method for making an integrated circuit substrate having embedded passive components
US733649828 Sep 200426 Feb 2008Sandisk CorporationMemory card with push-push connector
US735860016 Nov 200415 Abr 2008Amkor Technology, Inc.Interposer for interconnecting components in a memory card
US735920415 Feb 200615 Abr 2008Amkor Technology, Inc.Multiple cover memory card
US736500626 Sep 200629 Abr 2008Amkor Technology, Inc.Semiconductor package and substrate having multi-level vias fabrication method
US737597531 Oct 200520 May 2008Amkor Technology, Inc.Enhanced durability memory card
US739966122 Sep 200415 Jul 2008Amkor Technology, Inc.Method for making an integrated circuit substrate having embedded back-side access conductors and vias
US741613220 May 200426 Ago 2008Sandisk CorporationMemory card with and without enclosure
US743319614 Abr 20047 Oct 2008Super Talent Electronics, Inc.Card-type electronic apparatus assembly using ultrasonic joining
US748549129 Jun 20063 Feb 2009Amkor Technology, Inc.Secure digital memory card using land grid array structure
US74855012 Nov 20053 Feb 2009Sandisk CorporationMethod of manufacturing flash memory cards
US750133825 Sep 200610 Mar 2009Amkor Technology, Inc.Semiconductor package substrate fabrication method
US754723411 Ago 200316 Jun 2009Sandisk CorporationMemory card electrical contact structure
US75484301 Ago 200616 Jun 2009Amkor Technology, Inc.Buildup dielectric and metallization process and semiconductor package
US755085716 Nov 200623 Jun 2009Amkor Technology, Inc.Stacked redistribution layer (RDL) die assembly package
US755698621 Jun 20067 Jul 2009Amkor Technology, Inc.Tape supported memory card leadframe structure
US75893984 Oct 200615 Sep 2009Amkor Technology, Inc.Embedded metal features structure
US763376328 Ene 200415 Dic 2009Amkor Technology, Inc.Double mold memory card and its manufacturing method
US76337655 Dic 200515 Dic 2009Amkor Technology, Inc.Semiconductor package including a top-surface metal layer for implementing circuit features
US767096219 Sep 20072 Mar 2010Amkor Technology, Inc.Substrate having stiffener fabrication method
US76714579 Nov 20062 Mar 2010Amkor Technology, Inc.Semiconductor package including top-surface terminals for mounting another semiconductor package
US767308013 Ago 20042 Mar 2010Super Talent Electronics, Inc.Differential data transfer for flash memory card
US771984520 Abr 200618 May 2010Amkor Technology, Inc.Chamfered memory card module and method of making same
US775025022 Dic 20066 Jul 2010Amkor Technology, Inc.Blind via capture pad structure
US77527529 Ene 200713 Jul 2010Amkor Technology, Inc.Method of fabricating an embedded circuit pattern
US78255205 May 20092 Nov 2010Amkor Technology, Inc.Stacked redistribution layer (RDL) die assembly package
US783712029 Nov 200523 Nov 2010Amkor Technology, Inc.Modular memory card and method of making same
US784476329 Oct 200930 Nov 2010Super Talent Electronics, Inc.Differential data transfer for flash memory card
US786454031 Oct 20074 Ene 2011Sandisk CorporationPeripheral card with sloped edges
US79110375 Ago 200922 Mar 2011Amkor Technology, Inc.Method and structure for creating embedded metal features
US79419168 Jul 200417 May 2011Super Talent Electronics, Inc.Manufacturing method for memory card
US79608279 Abr 200914 Jun 2011Amkor Technology, Inc.Thermal via heat spreader package and method
US801806828 Oct 200913 Sep 2011Amkor Technology, Inc.Semiconductor package including a top-surface metal layer for implementing circuit features
US802658710 Jun 201027 Sep 2011Amkor Technology, Inc.Semiconductor package including top-surface terminals for mounting another semiconductor package
US810265719 Sep 200824 Ene 2012Super Talent Electronics, Inc.Single shot molding method for COB USB/EUSB devices with contact pad ribs
US810265829 Dic 200924 Ene 2012Super Talent Electronics, Inc.Micro-SD to secure digital adaptor card and manufacturing method
US81109095 Ene 20107 Feb 2012Amkor Technology, Inc.Semiconductor package including top-surface terminals for mounting another semiconductor package
US814124028 Dic 200727 Mar 2012Super Talent Electronics, Inc.Manufacturing method for micro-SD flash memory card
US820320327 Sep 201019 Jun 2012Amkor Technology, Inc.Stacked redistribution layer (RDL) die assembly package
US822253812 Jun 200917 Jul 2012Amkor Technology, Inc.Stackable via package and method
US82273381 Ago 201124 Jul 2012Amkor Technology, Inc.Semiconductor package including a top-surface metal layer for implementing circuit features
US82541348 Ene 201028 Ago 2012Super Talent Electronics, Inc.Molded memory card with write protection switch assembly
US830042325 May 201030 Oct 2012Amkor Technology, Inc.Stackable treated via package and method
US83165369 May 200827 Nov 2012Amkor Technology, Inc.Multi-level circuit substrate fabrication method
US83220301 Nov 20074 Dic 2012Amkor Technology, Inc.Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns
US832377115 Ago 20074 Dic 2012Amkor Technology, Inc.Straight conductor blind via capture pad structure and fabrication method
US833765727 Oct 201025 Dic 2012Amkor Technology, Inc.Mechanical tape separation package and method
US833822930 Jul 201025 Dic 2012Amkor Technology, Inc.Stackable plasma cleaned via package and method
US83418355 May 20091 Ene 2013Amkor Technology, Inc.Buildup dielectric layer having metallization pattern semiconductor package fabrication method
Clasificaciones
Clasificación de EE.UU.D14/436