| Patente citante | Fecha de presentación | Fecha de publicación | Solicitante | Título |
|---|
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| US6816032 | 3 Sep 2002 | 9 Nov 2004 | Amkor Technology, Inc. | Laminated low-profile dual filter module for telecommunications devices and method therefor |
| US6900527 | 19 Sep 2001 | 31 May 2005 | Amkor Technology, Inc. | Lead-frame method and assembly for interconnecting circuits within a circuit module |
| US6910635 | 8 Oct 2002 | 28 Jun 2005 | Amkor Technology, Inc. | Die down multi-media card and method of making same |
| US6911718 | 3 Jul 2003 | 28 Jun 2005 | Amkor Technology, Inc. | Double downset double dambar suspended leadframe |
| US6967124 | 19 Jun 2001 | 22 Nov 2005 | Amkor Technology, Inc. | Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate |
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| US7011251 | 19 Abr 2005 | 14 Mar 2006 | Amkor Technology, Inc. | Die down multi-media card and method of making same |
| US7019387 | 14 Feb 2002 | 28 Mar 2006 | Amkor Technology, Inc. | Lead-frame connector and circuit module assembly |
| US7032827 | 18 Jun 2004 | 25 Abr 2006 | Super Talent Electronics, Inc. | Combination SD/MMC flash memory card with thirteen contact pads |
| US7074654 | 21 Abr 2004 | 11 Jul 2006 | Amkor Technology, Inc. | Tape supported memory card leadframe structure |
| US7102214 | 20 Ago 2004 | 5 Sep 2006 | Amkor Technology, Inc. | Pre-molded leadframe |
| US7102891 | 23 Jul 2003 | 5 Sep 2006 | Amkor Technology, Inc. | Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor |
| US7112875 | 17 Feb 2005 | 26 Sep 2006 | Amkor Technology, Inc. | Secure digital memory card using land grid array structure |
| US7145238 | 5 May 2004 | 5 Dic 2006 | Amkor Technology, Inc. | Semiconductor package and substrate having multi-level vias |
| US7173826 | 8 Mar 2004 | 6 Feb 2007 | Super Talent Electronics, Inc. | PC card assembly with frame having longitudinal slot |
| US7185426 | 23 Mar 2004 | 6 Mar 2007 | Amkor Technology, Inc. | Method of manufacturing a semiconductor package |
| US7193305 | 3 Nov 2004 | 20 Mar 2007 | Amkor Technology, Inc. | Memory card ESC substrate insert |
| US7201327 | 18 Oct 2004 | 10 Abr 2007 | Amkor Technology, Inc. | Memory card and its manufacturing method |
| US7220915 | 17 Feb 2005 | 22 May 2007 | Amkor Technology, Inc. | Memory card and its manufacturing method |
| US7235423 | 5 Nov 2004 | 26 Jun 2007 | Super Talent Electronics, Inc. | Molded memory card production using carrier strip |
| US7293716 | 2 May 2005 | 13 Nov 2007 | Amkor Technology, Inc. | Secure digital memory card using land grid array structure |
| US7297562 | 24 Jun 2005 | 20 Nov 2007 | Amkor Technology, Inc. | Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns |
| US7306160 | 28 Sep 2004 | 11 Dic 2007 | Sandisk Corporation | Memory card with adapter |
| US7306161 | 23 Nov 2004 | 11 Dic 2007 | Sandisk Corporation | Memory card with chamfer |
| US7307848 | 20 Feb 2004 | 11 Dic 2007 | Sandisk Corporation | Memory card with raised portion |
| US7312103 | 22 Dic 2004 | 25 Dic 2007 | Amkor Technology, Inc. | Method for making an integrated circuit substrate having laser-embedded conductive patterns |
| US7334326 | 11 Mar 2005 | 26 Feb 2008 | Amkor Technology, Inc. | Method for making an integrated circuit substrate having embedded passive components |
| US7336498 | 28 Sep 2004 | 26 Feb 2008 | Sandisk Corporation | Memory card with push-push connector |
| US7358600 | 16 Nov 2004 | 15 Abr 2008 | Amkor Technology, Inc. | Interposer for interconnecting components in a memory card |
| US7359204 | 15 Feb 2006 | 15 Abr 2008 | Amkor Technology, Inc. | Multiple cover memory card |
| US7365006 | 26 Sep 2006 | 29 Abr 2008 | Amkor Technology, Inc. | Semiconductor package and substrate having multi-level vias fabrication method |
| US7375975 | 31 Oct 2005 | 20 May 2008 | Amkor Technology, Inc. | Enhanced durability memory card |
| US7399661 | 22 Sep 2004 | 15 Jul 2008 | Amkor Technology, Inc. | Method for making an integrated circuit substrate having embedded back-side access conductors and vias |
| US7416132 | 20 May 2004 | 26 Ago 2008 | Sandisk Corporation | Memory card with and without enclosure |
| US7433196 | 14 Abr 2004 | 7 Oct 2008 | Super Talent Electronics, Inc. | Card-type electronic apparatus assembly using ultrasonic joining |
| US7485491 | 29 Jun 2006 | 3 Feb 2009 | Amkor Technology, Inc. | Secure digital memory card using land grid array structure |
| US7485501 | 2 Nov 2005 | 3 Feb 2009 | Sandisk Corporation | Method of manufacturing flash memory cards |
| US7501338 | 25 Sep 2006 | 10 Mar 2009 | Amkor Technology, Inc. | Semiconductor package substrate fabrication method |
| US7547234 | 11 Ago 2003 | 16 Jun 2009 | Sandisk Corporation | Memory card electrical contact structure |
| US7548430 | 1 Ago 2006 | 16 Jun 2009 | Amkor Technology, Inc. | Buildup dielectric and metallization process and semiconductor package |
| US7550857 | 16 Nov 2006 | 23 Jun 2009 | Amkor Technology, Inc. | Stacked redistribution layer (RDL) die assembly package |
| US7556986 | 21 Jun 2006 | 7 Jul 2009 | Amkor Technology, Inc. | Tape supported memory card leadframe structure |
| US7589398 | 4 Oct 2006 | 15 Sep 2009 | Amkor Technology, Inc. | Embedded metal features structure |
| US7633763 | 28 Ene 2004 | 15 Dic 2009 | Amkor Technology, Inc. | Double mold memory card and its manufacturing method |
| US7633765 | 5 Dic 2005 | 15 Dic 2009 | Amkor Technology, Inc. | Semiconductor package including a top-surface metal layer for implementing circuit features |
| US7670962 | 19 Sep 2007 | 2 Mar 2010 | Amkor Technology, Inc. | Substrate having stiffener fabrication method |
| US7671457 | 9 Nov 2006 | 2 Mar 2010 | Amkor Technology, Inc. | Semiconductor package including top-surface terminals for mounting another semiconductor package |
| US7673080 | 13 Ago 2004 | 2 Mar 2010 | Super Talent Electronics, Inc. | Differential data transfer for flash memory card |
| US7719845 | 20 Abr 2006 | 18 May 2010 | Amkor Technology, Inc. | Chamfered memory card module and method of making same |
| US7750250 | 22 Dic 2006 | 6 Jul 2010 | Amkor Technology, Inc. | Blind via capture pad structure |
| US7752752 | 9 Ene 2007 | 13 Jul 2010 | Amkor Technology, Inc. | Method of fabricating an embedded circuit pattern |
| US7825520 | 5 May 2009 | 2 Nov 2010 | Amkor Technology, Inc. | Stacked redistribution layer (RDL) die assembly package |
| US7837120 | 29 Nov 2005 | 23 Nov 2010 | Amkor Technology, Inc. | Modular memory card and method of making same |
| US7844763 | 29 Oct 2009 | 30 Nov 2010 | Super Talent Electronics, Inc. | Differential data transfer for flash memory card |
| US7864540 | 31 Oct 2007 | 4 Ene 2011 | Sandisk Corporation | Peripheral card with sloped edges |
| US7911037 | 5 Ago 2009 | 22 Mar 2011 | Amkor Technology, Inc. | Method and structure for creating embedded metal features |
| US7941916 | 8 Jul 2004 | 17 May 2011 | Super Talent Electronics, Inc. | Manufacturing method for memory card |
| US7960827 | 9 Abr 2009 | 14 Jun 2011 | Amkor Technology, Inc. | Thermal via heat spreader package and method |
| US8018068 | 28 Oct 2009 | 13 Sep 2011 | Amkor Technology, Inc. | Semiconductor package including a top-surface metal layer for implementing circuit features |
| US8026587 | 10 Jun 2010 | 27 Sep 2011 | Amkor Technology, Inc. | Semiconductor package including top-surface terminals for mounting another semiconductor package |
| US8102657 | 19 Sep 2008 | 24 Ene 2012 | Super Talent Electronics, Inc. | Single shot molding method for COB USB/EUSB devices with contact pad ribs |
| US8102658 | 29 Dic 2009 | 24 Ene 2012 | Super Talent Electronics, Inc. | Micro-SD to secure digital adaptor card and manufacturing method |
| US8110909 | 5 Ene 2010 | 7 Feb 2012 | Amkor Technology, Inc. | Semiconductor package including top-surface terminals for mounting another semiconductor package |
| US8141240 | 28 Dic 2007 | 27 Mar 2012 | Super Talent Electronics, Inc. | Manufacturing method for micro-SD flash memory card |
| US8203203 | 27 Sep 2010 | 19 Jun 2012 | Amkor Technology, Inc. | Stacked redistribution layer (RDL) die assembly package |
| US8222538 | 12 Jun 2009 | 17 Jul 2012 | Amkor Technology, Inc. | Stackable via package and method |
| US8227338 | 1 Ago 2011 | 24 Jul 2012 | Amkor Technology, Inc. | Semiconductor package including a top-surface metal layer for implementing circuit features |
| US8254134 | 8 Ene 2010 | 28 Ago 2012 | Super Talent Electronics, Inc. | Molded memory card with write protection switch assembly |
| US8300423 | 25 May 2010 | 30 Oct 2012 | Amkor Technology, Inc. | Stackable treated via package and method |
| US8316536 | 9 May 2008 | 27 Nov 2012 | Amkor Technology, Inc. | Multi-level circuit substrate fabrication method |
| US8322030 | 1 Nov 2007 | 4 Dic 2012 | Amkor Technology, Inc. | Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns |
| US8323771 | 15 Ago 2007 | 4 Dic 2012 | Amkor Technology, Inc. | Straight conductor blind via capture pad structure and fabrication method |
| US8337657 | 27 Oct 2010 | 25 Dic 2012 | Amkor Technology, Inc. | Mechanical tape separation package and method |
| US8338229 | 30 Jul 2010 | 25 Dic 2012 | Amkor Technology, Inc. | Stackable plasma cleaned via package and method |
| US8341835 | 5 May 2009 | 1 Ene 2013 | Amkor Technology, Inc. | Buildup dielectric layer having metallization pattern semiconductor package fabrication method |