| Patente citante | Fecha de presentación | Fecha de publicación | Solicitante | Título |
|---|
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| US8026587 | 10 Jun 2010 | 27 Sep 2011 | Amkor Technology, Inc. | Semiconductor package including top-surface terminals for mounting another semiconductor package |
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| US8222538 | 12 Jun 2009 | 17 Jul 2012 | Amkor Technology, Inc. | Stackable via package and method |
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| US8300423 | 25 May 2010 | 30 Oct 2012 | Amkor Technology, Inc. | Stackable treated via package and method |
| US8316536 | 9 May 2008 | 27 Nov 2012 | Amkor Technology, Inc. | Multi-level circuit substrate fabrication method |
| US8322030 | 1 Nov 2007 | 4 Dic 2012 | Amkor Technology, Inc. | Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns |
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| US8337657 | 27 Oct 2010 | 25 Dic 2012 | Amkor Technology, Inc. | Mechanical tape separation package and method |
| US8338229 | 30 Jul 2010 | 25 Dic 2012 | Amkor Technology, Inc. | Stackable plasma cleaned via package and method |
| US8341835 | 5 May 2009 | 1 Ene 2013 | Amkor Technology, Inc. | Buildup dielectric layer having metallization pattern semiconductor package fabrication method |