USD517025S1 - Light emitting diode - Google Patents
Light emitting diode Download PDFInfo
- Publication number
- USD517025S1 USD517025S1 US29/189,963 US18996303F USD517025S US D517025 S1 USD517025 S1 US D517025S1 US 18996303 F US18996303 F US 18996303F US D517025 S USD517025 S US D517025S
- Authority
- US
- United States
- Prior art keywords
- light emitting
- emitting diode
- view
- ornamental design
- design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front, left perspective view of the light emitting diode showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a left side view thereof, the right side view being a mirror image thereof.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.
Claims (1)
- The ornamental design for a light emitting diode, as shown and described.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003007048 | 2003-03-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD517025S1 true USD517025S1 (en) | 2006-03-14 |
Family
ID=35999195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/189,963 Expired - Lifetime USD517025S1 (en) | 2003-03-17 | 2003-09-15 | Light emitting diode |
Country Status (1)
Country | Link |
---|---|
US (1) | USD517025S1 (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060278882A1 (en) * | 2005-06-10 | 2006-12-14 | Cree, Inc. | Power lamp package |
US20080218973A1 (en) * | 2007-02-12 | 2008-09-11 | Cotco Luminant Device, Ltd. | Apparatus, system and method for use in mounting electronic elements |
US20090072251A1 (en) * | 2007-09-14 | 2009-03-19 | Cotco Luminant Device Limited | LED surface-mount device and LED display incorporating such device |
US20100117099A1 (en) * | 2008-11-07 | 2010-05-13 | Jacob Chi Wing Leung | Multi-chip light emitting diode modules |
US20100133002A1 (en) * | 2006-03-28 | 2010-06-03 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
US20100252851A1 (en) * | 2007-10-31 | 2010-10-07 | Cree, Inc. | Led package with increased feature sizes |
US20110037083A1 (en) * | 2009-01-14 | 2011-02-17 | Alex Chi Keung Chan | Led package with contrasting face |
US20110042698A1 (en) * | 2006-04-24 | 2011-02-24 | Cree, Inc. | Emitter package with angled or vertical led |
US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
USD731987S1 (en) * | 2012-12-28 | 2015-06-16 | Nichia Corporation | Light emitting diode |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
-
2003
- 2003-09-15 US US29/189,963 patent/USD517025S1/en not_active Expired - Lifetime
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060278882A1 (en) * | 2005-06-10 | 2006-12-14 | Cree, Inc. | Power lamp package |
US8669572B2 (en) | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
US20100133002A1 (en) * | 2006-03-28 | 2010-06-03 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
US9035439B2 (en) | 2006-03-28 | 2015-05-19 | Cree Huizhou Solid State Lighting Company Limited | Apparatus, system and method for use in mounting electronic elements |
US20110042698A1 (en) * | 2006-04-24 | 2011-02-24 | Cree, Inc. | Emitter package with angled or vertical led |
US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US20080218973A1 (en) * | 2007-02-12 | 2008-09-11 | Cotco Luminant Device, Ltd. | Apparatus, system and method for use in mounting electronic elements |
US20180301438A1 (en) * | 2007-09-14 | 2018-10-18 | Cree Huizhou Opto Limited | Led surface-mount device and led display incorporating such device |
US20090072251A1 (en) * | 2007-09-14 | 2009-03-19 | Cotco Luminant Device Limited | LED surface-mount device and LED display incorporating such device |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
US11791442B2 (en) | 2007-10-31 | 2023-10-17 | Creeled, Inc. | Light emitting diode package and method for fabricating same |
US10892383B2 (en) | 2007-10-31 | 2021-01-12 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US20100252851A1 (en) * | 2007-10-31 | 2010-10-07 | Cree, Inc. | Led package with increased feature sizes |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
US20100117099A1 (en) * | 2008-11-07 | 2010-05-13 | Jacob Chi Wing Leung | Multi-chip light emitting diode modules |
US20110037083A1 (en) * | 2009-01-14 | 2011-02-17 | Alex Chi Keung Chan | Led package with contrasting face |
US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
USD731987S1 (en) * | 2012-12-28 | 2015-06-16 | Nichia Corporation | Light emitting diode |
US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
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