USD517025S1 - Light emitting diode - Google Patents

Light emitting diode Download PDF

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Publication number
USD517025S1
USD517025S1 US29/189,963 US18996303F USD517025S US D517025 S1 USD517025 S1 US D517025S1 US 18996303 F US18996303 F US 18996303F US D517025 S USD517025 S US D517025S
Authority
US
United States
Prior art keywords
light emitting
emitting diode
view
ornamental design
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/189,963
Inventor
Hideo Asakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Nichias Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Assigned to NICHIAK CORPORATION reassignment NICHIAK CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ASAKAWA, HIDEO
Application granted granted Critical
Publication of USD517025S1 publication Critical patent/USD517025S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, left perspective view of the light emitting diode showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a left side view thereof, the right side view being a mirror image thereof.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for a light emitting diode, as shown and described.
US29/189,963 2003-03-17 2003-09-15 Light emitting diode Expired - Lifetime USD517025S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003007048 2003-03-17

Publications (1)

Publication Number Publication Date
USD517025S1 true USD517025S1 (en) 2006-03-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/189,963 Expired - Lifetime USD517025S1 (en) 2003-03-17 2003-09-15 Light emitting diode

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060278882A1 (en) * 2005-06-10 2006-12-14 Cree, Inc. Power lamp package
US20080218973A1 (en) * 2007-02-12 2008-09-11 Cotco Luminant Device, Ltd. Apparatus, system and method for use in mounting electronic elements
US20090072251A1 (en) * 2007-09-14 2009-03-19 Cotco Luminant Device Limited LED surface-mount device and LED display incorporating such device
US20100117099A1 (en) * 2008-11-07 2010-05-13 Jacob Chi Wing Leung Multi-chip light emitting diode modules
US20100133002A1 (en) * 2006-03-28 2010-06-03 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US20100252851A1 (en) * 2007-10-31 2010-10-07 Cree, Inc. Led package with increased feature sizes
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
US20110042698A1 (en) * 2006-04-24 2011-02-24 Cree, Inc. Emitter package with angled or vertical led
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
USD731987S1 (en) * 2012-12-28 2015-06-16 Nichia Corporation Light emitting diode
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060278882A1 (en) * 2005-06-10 2006-12-14 Cree, Inc. Power lamp package
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US20100133002A1 (en) * 2006-03-28 2010-06-03 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US20110042698A1 (en) * 2006-04-24 2011-02-24 Cree, Inc. Emitter package with angled or vertical led
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US20080218973A1 (en) * 2007-02-12 2008-09-11 Cotco Luminant Device, Ltd. Apparatus, system and method for use in mounting electronic elements
US20180301438A1 (en) * 2007-09-14 2018-10-18 Cree Huizhou Opto Limited Led surface-mount device and led display incorporating such device
US20090072251A1 (en) * 2007-09-14 2009-03-19 Cotco Luminant Device Limited LED surface-mount device and LED display incorporating such device
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US11791442B2 (en) 2007-10-31 2023-10-17 Creeled, Inc. Light emitting diode package and method for fabricating same
US10892383B2 (en) 2007-10-31 2021-01-12 Cree, Inc. Light emitting diode package and method for fabricating same
US20100252851A1 (en) * 2007-10-31 2010-10-07 Cree, Inc. Led package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US20100117099A1 (en) * 2008-11-07 2010-05-13 Jacob Chi Wing Leung Multi-chip light emitting diode modules
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
USD731987S1 (en) * 2012-12-28 2015-06-16 Nichia Corporation Light emitting diode
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces

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