USD548705S1 - Attracting disc for an electrostatic chuck for semiconductor production - Google Patents
Attracting disc for an electrostatic chuck for semiconductor production Download PDFInfo
- Publication number
- USD548705S1 USD548705S1 US29/245,047 US24504705F USD548705S US D548705 S1 USD548705 S1 US D548705S1 US 24504705 F US24504705 F US 24504705F US D548705 S USD548705 S US D548705S
- Authority
- US
- United States
- Prior art keywords
- electrostatic chuck
- semiconductor production
- attracting disc
- attracting
- disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Images
Description
Claims (1)
- The ornamental design for an attracting disc for an electrostatic chuck for semiconductor production, as shown and described.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005028309 | 2005-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD548705S1 true USD548705S1 (en) | 2007-08-14 |
Family
ID=38337434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/245,047 Expired - Lifetime USD548705S1 (en) | 2005-09-29 | 2005-12-19 | Attracting disc for an electrostatic chuck for semiconductor production |
Country Status (1)
Country | Link |
---|---|
US (1) | USD548705S1 (en) |
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100032310A1 (en) * | 2006-08-16 | 2010-02-11 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US20100044236A1 (en) * | 2000-03-27 | 2010-02-25 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US8540857B1 (en) | 2008-12-19 | 2013-09-24 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
US8623193B1 (en) | 2004-06-16 | 2014-01-07 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
USD734377S1 (en) * | 2013-03-28 | 2015-07-14 | Hirata Corporation | Top cover of a load lock chamber |
US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
US9512538B2 (en) | 2008-12-10 | 2016-12-06 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
USD790489S1 (en) * | 2015-07-08 | 2017-06-27 | Ebara Corporation | Vacuum contact pad |
USD795208S1 (en) * | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
USD802472S1 (en) * | 2015-08-06 | 2017-11-14 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD803802S1 (en) * | 2015-08-18 | 2017-11-28 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
USD858192S1 (en) * | 2018-04-27 | 2019-09-03 | Applied Materials, Inc. | Gas distribution plate |
USD868993S1 (en) * | 2017-08-31 | 2019-12-03 | Hitachi High-Technologies Corporation | Electrode plate for a plasma processing apparatus |
US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
USD947802S1 (en) | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
USD984972S1 (en) * | 2021-03-29 | 2023-05-02 | Beijing Naura Microelectronics Equipment Co., Ltd. | Electrostatic chuck for semiconductor manufacture |
USD988300S1 (en) * | 2021-03-09 | 2023-06-06 | Thales Dis Ais Deutschland Gmbh | IoT module |
USD988299S1 (en) * | 2021-06-18 | 2023-06-06 | Telit Cinterion Deutschland Gmbh | Cellular module |
-
2005
- 2005-12-19 US US29/245,047 patent/USD548705S1/en not_active Expired - Lifetime
Cited By (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100044236A1 (en) * | 2000-03-27 | 2010-02-25 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US8475644B2 (en) | 2000-03-27 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US8623193B1 (en) | 2004-06-16 | 2014-01-07 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
US20100032310A1 (en) * | 2006-08-16 | 2010-02-11 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US8308931B2 (en) | 2006-08-16 | 2012-11-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US9309604B2 (en) | 2008-11-07 | 2016-04-12 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US8475636B2 (en) | 2008-11-07 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US20100116672A1 (en) * | 2008-11-07 | 2010-05-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US9512538B2 (en) | 2008-12-10 | 2016-12-06 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
US8540857B1 (en) | 2008-12-19 | 2013-09-24 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
US9394620B2 (en) | 2010-07-02 | 2016-07-19 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US10190230B2 (en) | 2010-07-02 | 2019-01-29 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
US9464361B2 (en) | 2010-07-02 | 2016-10-11 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US10053792B2 (en) | 2011-09-12 | 2018-08-21 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
US9834852B2 (en) | 2012-12-12 | 2017-12-05 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US10662545B2 (en) | 2012-12-12 | 2020-05-26 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
USD734377S1 (en) * | 2013-03-28 | 2015-07-14 | Hirata Corporation | Top cover of a load lock chamber |
US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
US10301739B2 (en) | 2013-05-01 | 2019-05-28 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
USD793976S1 (en) | 2013-05-15 | 2017-08-08 | Ebara Corporation | Substrate retaining ring |
USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
US9899230B2 (en) | 2013-05-29 | 2018-02-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
US10923340B2 (en) | 2015-05-14 | 2021-02-16 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
USD790489S1 (en) * | 2015-07-08 | 2017-06-27 | Ebara Corporation | Vacuum contact pad |
USD802472S1 (en) * | 2015-08-06 | 2017-11-14 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD795208S1 (en) * | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD803802S1 (en) * | 2015-08-18 | 2017-11-28 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
US11047059B2 (en) | 2016-05-24 | 2021-06-29 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
USD868993S1 (en) * | 2017-08-31 | 2019-12-03 | Hitachi High-Technologies Corporation | Electrode plate for a plasma processing apparatus |
US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
USD858192S1 (en) * | 2018-04-27 | 2019-09-03 | Applied Materials, Inc. | Gas distribution plate |
USD947802S1 (en) | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
USD988300S1 (en) * | 2021-03-09 | 2023-06-06 | Thales Dis Ais Deutschland Gmbh | IoT module |
USD984972S1 (en) * | 2021-03-29 | 2023-05-02 | Beijing Naura Microelectronics Equipment Co., Ltd. | Electrostatic chuck for semiconductor manufacture |
USD988299S1 (en) * | 2021-06-18 | 2023-06-06 | Telit Cinterion Deutschland Gmbh | Cellular module |
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