USD576574S1 - Light emitting diode module - Google Patents
Light emitting diode module Download PDFInfo
- Publication number
- USD576574S1 USD576574S1 US29/294,524 US29452408F USD576574S US D576574 S1 USD576574 S1 US D576574S1 US 29452408 F US29452408 F US 29452408F US D576574 S USD576574 S US D576574S
- Authority
- US
- United States
- Prior art keywords
- light emitting
- emitting diode
- diode module
- view
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
Claims (1)
- I claim the ornamental design for a light emitting diode module, as shown.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007019321 | 2007-07-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD576574S1 true USD576574S1 (en) | 2008-09-09 |
Family
ID=39734668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/294,524 Expired - Lifetime USD576574S1 (en) | 2007-07-17 | 2008-01-15 | Light emitting diode module |
Country Status (1)
Country | Link |
---|---|
US (1) | USD576574S1 (en) |
Cited By (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060278882A1 (en) * | 2005-06-10 | 2006-12-14 | Cree, Inc. | Power lamp package |
US20070235845A1 (en) * | 2006-03-28 | 2007-10-11 | Cotco Holdings Limited, A Hong Kong Corporation | Apparatus, system and method for use in mounting electronic elements |
US20070252250A1 (en) * | 2006-04-26 | 2007-11-01 | Cotco Holdings Limited, A Hong Kong Corporation | Apparatus and method for use in mounting electronic elements |
US20080041625A1 (en) * | 2006-08-16 | 2008-02-21 | Cotco Holdings Limited, A Hong Kong Corporation | Apparatus, system and method for use in mounting electronic elements |
US20090283781A1 (en) * | 2008-05-16 | 2009-11-19 | Cree Hong Kong Limited | Mini V SMD |
USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
US20100155748A1 (en) * | 2009-01-14 | 2010-06-24 | Cree Hong Kong Limited | Aligned multiple emitter package |
US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
US20110001151A1 (en) * | 2009-07-06 | 2011-01-06 | Cree, Inc. | Led packages with scattering particle regions |
USD633631S1 (en) | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
USD634863S1 (en) | 2008-01-10 | 2011-03-22 | Cree Hong Kong Limited | Light source of light emitting diode |
US20110186865A1 (en) * | 2010-01-29 | 2011-08-04 | Cree Hong Kong Limited | Wide angle oval light emitting diode package |
US8455882B2 (en) | 2010-10-15 | 2013-06-04 | Cree, Inc. | High efficiency LEDs |
US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
US8598809B2 (en) | 2009-08-19 | 2013-12-03 | Cree, Inc. | White light color changing solid state lighting and methods |
US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
USD735683S1 (en) | 2013-05-03 | 2015-08-04 | Cree, Inc. | LED package |
USD758976S1 (en) | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
USD758977S1 (en) * | 2015-06-05 | 2016-06-14 | Kingbright Electronics Co. Ltd. | LED component |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
USD766471S1 (en) * | 2013-03-28 | 2016-09-13 | Tridonic Jennersdorf Gmbh | LED module |
US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
USD770062S1 (en) * | 2015-02-03 | 2016-10-25 | KAISTAR Lighting (Xiamen) Co., Ltd | Light-Emitting Unit |
USD777122S1 (en) | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
USD783547S1 (en) | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
USD790486S1 (en) | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
USD845252S1 (en) * | 2017-02-24 | 2019-04-09 | Citizen Electronics Co., Ltd. | Switch |
US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
USD912303S1 (en) * | 2015-04-07 | 2021-03-02 | Flos S.P.A. | Table lamp |
US11210971B2 (en) | 2009-07-06 | 2021-12-28 | Cree Huizhou Solid State Lighting Company Limited | Light emitting diode display with tilted peak emission pattern |
USD996378S1 (en) * | 2022-03-09 | 2023-08-22 | Creeled, Inc. | Light-emitting diode package |
USD996377S1 (en) | 2022-02-17 | 2023-08-22 | Creeled, Inc. | Light-emitting diode package |
-
2008
- 2008-01-15 US US29/294,524 patent/USD576574S1/en not_active Expired - Lifetime
Cited By (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110012143A1 (en) * | 2005-01-10 | 2011-01-20 | Cree, Inc. | Solid state lighting component |
US8217412B2 (en) | 2005-01-10 | 2012-07-10 | Cree, Inc. | Solid state lighting component |
US8698171B2 (en) | 2005-01-10 | 2014-04-15 | Cree, Inc. | Solid state lighting component |
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US9076940B2 (en) | 2005-01-10 | 2015-07-07 | Cree, Inc. | Solid state lighting component |
US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
US8669572B2 (en) | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
US20060278882A1 (en) * | 2005-06-10 | 2006-12-14 | Cree, Inc. | Power lamp package |
US20070235845A1 (en) * | 2006-03-28 | 2007-10-11 | Cotco Holdings Limited, A Hong Kong Corporation | Apparatus, system and method for use in mounting electronic elements |
US7675145B2 (en) | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
US9035439B2 (en) | 2006-03-28 | 2015-05-19 | Cree Huizhou Solid State Lighting Company Limited | Apparatus, system and method for use in mounting electronic elements |
US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US7635915B2 (en) | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
US20070252250A1 (en) * | 2006-04-26 | 2007-11-01 | Cotco Holdings Limited, A Hong Kong Corporation | Apparatus and method for use in mounting electronic elements |
US20100052126A1 (en) * | 2006-04-26 | 2010-03-04 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
US8362605B2 (en) | 2006-04-26 | 2013-01-29 | Cree Huizhou Opto Limited | Apparatus and method for use in mounting electronic elements |
US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
US8367945B2 (en) | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US20080041625A1 (en) * | 2006-08-16 | 2008-02-21 | Cotco Holdings Limited, A Hong Kong Corporation | Apparatus, system and method for use in mounting electronic elements |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
US10892383B2 (en) | 2007-10-31 | 2021-01-12 | Cree, Inc. | Light emitting diode package and method for fabricating same |
USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
US11791442B2 (en) | 2007-10-31 | 2023-10-17 | Creeled, Inc. | Light emitting diode package and method for fabricating same |
USD662902S1 (en) | 2007-12-14 | 2012-07-03 | Cree Hong Kong Limited | LED package |
USD633631S1 (en) | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
USD671661S1 (en) | 2008-01-10 | 2012-11-27 | Cree Hong Kong Limited | LED package |
USD656906S1 (en) | 2008-01-10 | 2012-04-03 | Cree Hong Kong Limited | LED package |
USD634863S1 (en) | 2008-01-10 | 2011-03-22 | Cree Hong Kong Limited | Light source of light emitting diode |
US8049230B2 (en) * | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
US20090283781A1 (en) * | 2008-05-16 | 2009-11-19 | Cree Hong Kong Limited | Mini V SMD |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
US20100155748A1 (en) * | 2009-01-14 | 2010-06-24 | Cree Hong Kong Limited | Aligned multiple emitter package |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
US8415692B2 (en) | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
US11210971B2 (en) | 2009-07-06 | 2021-12-28 | Cree Huizhou Solid State Lighting Company Limited | Light emitting diode display with tilted peak emission pattern |
US20110001151A1 (en) * | 2009-07-06 | 2011-01-06 | Cree, Inc. | Led packages with scattering particle regions |
US8598809B2 (en) | 2009-08-19 | 2013-12-03 | Cree, Inc. | White light color changing solid state lighting and methods |
US8350370B2 (en) | 2010-01-29 | 2013-01-08 | Cree Huizhou Opto Limited | Wide angle oval light emitting diode package |
US20110186865A1 (en) * | 2010-01-29 | 2011-08-04 | Cree Hong Kong Limited | Wide angle oval light emitting diode package |
US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
US8455882B2 (en) | 2010-10-15 | 2013-06-04 | Cree, Inc. | High efficiency LEDs |
US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
USD766471S1 (en) * | 2013-03-28 | 2016-09-13 | Tridonic Jennersdorf Gmbh | LED module |
USD735683S1 (en) | 2013-05-03 | 2015-08-04 | Cree, Inc. | LED package |
US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
USD758976S1 (en) | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
USD790486S1 (en) | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
USD770062S1 (en) * | 2015-02-03 | 2016-10-25 | KAISTAR Lighting (Xiamen) Co., Ltd | Light-Emitting Unit |
USD777122S1 (en) | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
USD912303S1 (en) * | 2015-04-07 | 2021-03-02 | Flos S.P.A. | Table lamp |
USD912880S1 (en) * | 2015-04-07 | 2021-03-09 | Flos S.P.A. | Table lamp |
USD783547S1 (en) | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
USD758977S1 (en) * | 2015-06-05 | 2016-06-14 | Kingbright Electronics Co. Ltd. | LED component |
USD845252S1 (en) * | 2017-02-24 | 2019-04-09 | Citizen Electronics Co., Ltd. | Switch |
USD996377S1 (en) | 2022-02-17 | 2023-08-22 | Creeled, Inc. | Light-emitting diode package |
USD996378S1 (en) * | 2022-03-09 | 2023-08-22 | Creeled, Inc. | Light-emitting diode package |
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