USD587222S1 - Attracting plate of an electrostatic chuck for semiconductor manufacturing - Google Patents
Attracting plate of an electrostatic chuck for semiconductor manufacturing Download PDFInfo
- Publication number
- USD587222S1 USD587222S1 US29/276,663 US27666307F USD587222S US D587222 S1 USD587222 S1 US D587222S1 US 27666307 F US27666307 F US 27666307F US D587222 S USD587222 S US D587222S
- Authority
- US
- United States
- Prior art keywords
- semiconductor manufacturing
- electrostatic chuck
- attracting plate
- attracting
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.
Claims (1)
- The ornamental design for an attracting plate of an electrostatic chuck for semiconductor manufacturing, as shown and described.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006020297 | 2006-08-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD587222S1 true USD587222S1 (en) | 2009-02-24 |
Family
ID=40364983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/276,663 Expired - Lifetime USD587222S1 (en) | 2006-08-01 | 2007-02-01 | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
Country Status (1)
Country | Link |
---|---|
US (1) | USD587222S1 (en) |
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100032310A1 (en) * | 2006-08-16 | 2010-02-11 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US20100044236A1 (en) * | 2000-03-27 | 2010-02-25 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US20120087774A1 (en) * | 2006-01-27 | 2012-04-12 | Camtek Ltd | Diced Wafer Adaptor and a Method for Transferring a Diced Wafer |
US8540857B1 (en) | 2008-12-19 | 2013-09-24 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
US8623193B1 (en) | 2004-06-16 | 2014-01-07 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
US9512538B2 (en) | 2008-12-10 | 2016-12-06 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
USD795208S1 (en) * | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
USD802472S1 (en) * | 2015-08-06 | 2017-11-14 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD803802S1 (en) * | 2015-08-18 | 2017-11-28 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
US20180366360A1 (en) * | 2017-06-16 | 2018-12-20 | Tokyo Electron Limited | Electrostatic attraction method |
US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
USD947802S1 (en) | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
USD984972S1 (en) * | 2021-03-29 | 2023-05-02 | Beijing Naura Microelectronics Equipment Co., Ltd. | Electrostatic chuck for semiconductor manufacture |
USD990441S1 (en) * | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
-
2007
- 2007-02-01 US US29/276,663 patent/USD587222S1/en not_active Expired - Lifetime
Cited By (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100044236A1 (en) * | 2000-03-27 | 2010-02-25 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US8475644B2 (en) | 2000-03-27 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US8623193B1 (en) | 2004-06-16 | 2014-01-07 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
US20120087774A1 (en) * | 2006-01-27 | 2012-04-12 | Camtek Ltd | Diced Wafer Adaptor and a Method for Transferring a Diced Wafer |
US20100032310A1 (en) * | 2006-08-16 | 2010-02-11 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US8308931B2 (en) | 2006-08-16 | 2012-11-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US9309604B2 (en) | 2008-11-07 | 2016-04-12 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US8475636B2 (en) | 2008-11-07 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US20100116672A1 (en) * | 2008-11-07 | 2010-05-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US9512538B2 (en) | 2008-12-10 | 2016-12-06 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
US8540857B1 (en) | 2008-12-19 | 2013-09-24 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
US9464361B2 (en) | 2010-07-02 | 2016-10-11 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US9394620B2 (en) | 2010-07-02 | 2016-07-19 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
US10190230B2 (en) | 2010-07-02 | 2019-01-29 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
US10053792B2 (en) | 2011-09-12 | 2018-08-21 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
US10662545B2 (en) | 2012-12-12 | 2020-05-26 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US9834852B2 (en) | 2012-12-12 | 2017-12-05 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US10301739B2 (en) | 2013-05-01 | 2019-05-28 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
US9899230B2 (en) | 2013-05-29 | 2018-02-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
US10923340B2 (en) | 2015-05-14 | 2021-02-16 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
USD802472S1 (en) * | 2015-08-06 | 2017-11-14 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD803802S1 (en) * | 2015-08-18 | 2017-11-28 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD795208S1 (en) * | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
US11047059B2 (en) | 2016-05-24 | 2021-06-29 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
US10832930B2 (en) * | 2017-06-16 | 2020-11-10 | Tokyo Electron Limited | Electrostatic attraction method |
US20180366360A1 (en) * | 2017-06-16 | 2018-12-20 | Tokyo Electron Limited | Electrostatic attraction method |
US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
USD947802S1 (en) | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
USD984972S1 (en) * | 2021-03-29 | 2023-05-02 | Beijing Naura Microelectronics Equipment Co., Ltd. | Electrostatic chuck for semiconductor manufacture |
USD990441S1 (en) * | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
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