USD615504S1 - Emitter package - Google Patents
Emitter package Download PDFInfo
- Publication number
- USD615504S1 USD615504S1 US29/292,900 US29290007F USD615504S US D615504 S1 USD615504 S1 US D615504S1 US 29290007 F US29290007 F US 29290007F US D615504 S USD615504 S US D615504S
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- US
- United States
- Prior art keywords
- emitter package
- view
- package shown
- elevation view
- emitter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Description
The broken line showing in the embodiments of FIGS. 1–6 , 13–18, 19–24 and 25–30 are for illustrative purposes only and forms no part of the claimed design. The external surface having stippling or irregular lines in the embodiments of FIGS. 25–30 and 31–36 indicate a rough visual appearance of the side surfaces of the emitter package. The top layer can have be visually transparent or translucent as shown in the embodiments of FIGS. 1–6 , 13–18, 19–24 and 25–30, and in some embodiments can optically distort the layer below.
Claims (1)
- The ornamental design for an emitter package, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/292,900 USD615504S1 (en) | 2007-10-31 | 2007-10-31 | Emitter package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/292,900 USD615504S1 (en) | 2007-10-31 | 2007-10-31 | Emitter package |
Publications (1)
Publication Number | Publication Date |
---|---|
USD615504S1 true USD615504S1 (en) | 2010-05-11 |
Family
ID=42139755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/292,900 Active USD615504S1 (en) | 2007-10-31 | 2007-10-31 | Emitter package |
Country Status (1)
Country | Link |
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US (1) | USD615504S1 (en) |
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US20100133554A1 (en) * | 2009-06-05 | 2010-06-03 | Cree, Inc. | Solid state lighting device |
US20110031865A1 (en) * | 2009-01-12 | 2011-02-10 | Hussell Christopher P | Light emitting device packages with improved heat transfer |
US20110186873A1 (en) * | 2009-06-05 | 2011-08-04 | Emerson David T | Light emitting device packages, systems and methods |
USD656906S1 (en) | 2008-01-10 | 2012-04-03 | Cree Hong Kong Limited | LED package |
US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
USD667801S1 (en) | 2010-07-16 | 2012-09-25 | Cree, Inc. | Package for light emitting diode (LED) lighting |
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US8492777B2 (en) | 2010-04-09 | 2013-07-23 | Everlight Electronics Co., Ltd. | Light emitting diode package, lighting device and light emitting diode package substrate |
US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
US8696159B2 (en) | 2010-09-20 | 2014-04-15 | Cree, Inc. | Multi-chip LED devices |
US9053958B2 (en) | 2011-01-31 | 2015-06-09 | Cree, Inc. | Light emitting diode (LED) arrays including direct die attach and related assemblies |
USD735683S1 (en) * | 2013-05-03 | 2015-08-04 | Cree, Inc. | LED package |
USD738832S1 (en) * | 2006-04-04 | 2015-09-15 | Cree, Inc. | Light emitting diode (LED) package |
USD741821S1 (en) | 2014-04-10 | 2015-10-27 | Kingbright Electronics Co., Ltd. | LED component |
USD746240S1 (en) * | 2013-12-30 | 2015-12-29 | Cree, Inc. | LED package |
USD749051S1 (en) * | 2012-05-31 | 2016-02-09 | Cree, Inc. | Light emitting diode (LED) package |
USD753612S1 (en) * | 2012-09-07 | 2016-04-12 | Cree, Inc. | Light emitter device |
US9349929B2 (en) | 2012-05-31 | 2016-05-24 | Cree, Inc. | Light emitter packages, systems, and methods |
USD758976S1 (en) * | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
US9401103B2 (en) | 2011-02-04 | 2016-07-26 | Cree, Inc. | LED-array light source with aspect ratio greater than 1 |
US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
US9515055B2 (en) | 2012-05-14 | 2016-12-06 | Cree, Inc. | Light emitting devices including multiple anodes and cathodes |
USD777122S1 (en) | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
USD778848S1 (en) * | 2015-04-07 | 2017-02-14 | Cree, Inc. | Solid state light emitter component |
USD783547S1 (en) | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
US9627361B2 (en) | 2010-10-07 | 2017-04-18 | Cree, Inc. | Multiple configuration light emitting devices and methods |
US9634209B2 (en) | 2011-03-02 | 2017-04-25 | Cree, Inc. | Miniature surface mount device |
US9640737B2 (en) | 2011-01-31 | 2017-05-02 | Cree, Inc. | Horizontal light emitting diodes including phosphor particles |
US9673363B2 (en) | 2011-01-31 | 2017-06-06 | Cree, Inc. | Reflective mounting substrates for flip-chip mounted horizontal LEDs |
US9685592B2 (en) | 2009-01-14 | 2017-06-20 | Cree Huizhou Solid State Lighting Company Limited | Miniature surface mount device with large pin pads |
USD790486S1 (en) | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
US9735198B2 (en) | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
US9780268B2 (en) | 2006-04-04 | 2017-10-03 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
US9831220B2 (en) | 2011-01-31 | 2017-11-28 | Cree, Inc. | Light emitting diode (LED) arrays including direct die attach and related assemblies |
US9859471B2 (en) | 2011-01-31 | 2018-01-02 | Cree, Inc. | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
US10134961B2 (en) | 2012-03-30 | 2018-11-20 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
US10222032B2 (en) | 2012-03-30 | 2019-03-05 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
USD844183S1 (en) | 2016-08-19 | 2019-03-26 | Citizen Electronics Co., Ltd. | Light emitting diode |
USD844576S1 (en) | 2017-07-25 | 2019-04-02 | Citizen Electronics Co., Ltd. | Light emitting diode |
US10439112B2 (en) | 2012-05-31 | 2019-10-08 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
US10683971B2 (en) | 2015-04-30 | 2020-06-16 | Cree, Inc. | Solid state lighting components |
USD892066S1 (en) * | 2014-12-11 | 2020-08-04 | Cree, Inc. | LED package |
USD926714S1 (en) * | 2019-10-30 | 2021-08-03 | Creeled, Inc. | Light emitting diode package |
US11101408B2 (en) | 2011-02-07 | 2021-08-24 | Creeled, Inc. | Components and methods for light emitting diode (LED) lighting |
USD996377S1 (en) * | 2022-02-17 | 2023-08-22 | Creeled, Inc. | Light-emitting diode package |
USD1000400S1 (en) | 2021-04-16 | 2023-10-03 | Creeled, Inc. | Light emitting diode package |
Citations (82)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3760237A (en) | 1972-06-21 | 1973-09-18 | Gen Electric | Solid state lamp assembly having conical light director |
US4307297A (en) | 1978-09-12 | 1981-12-22 | U.S. Philips Corporation | Opto-electronic device |
US4511425A (en) | 1983-06-13 | 1985-04-16 | Dennison Manufacturing Company | Heated pad decorator |
US5040868A (en) | 1989-05-31 | 1991-08-20 | Siemens Aktiengesellschaft | Surface-mountable opto-component |
US5130761A (en) | 1990-07-17 | 1992-07-14 | Kabushiki Kaisha Toshiba | Led array with reflector and printed circuit board |
US5167556A (en) | 1990-07-03 | 1992-12-01 | Siemens Aktiengesellschaft | Method for manufacturing a light emitting diode display means |
US5703401A (en) | 1995-05-10 | 1997-12-30 | U.S. Philips Corporation | Miniature semiconductor device for surface mounting |
US5706177A (en) | 1994-12-24 | 1998-01-06 | Temic Telefunken Microelectronic Gmbh | Multi-terminal surface-mounted electronic device |
US5790298A (en) | 1994-05-03 | 1998-08-04 | Gentex Corporation | Method of forming optically transparent seal and seal formed by said method |
US5813753A (en) | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
US5907151A (en) | 1996-05-24 | 1999-05-25 | Siemens Aktiengesellschaft | Surface mountable optoelectronic transducer and method for its production |
US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
US6061160A (en) * | 1996-05-31 | 2000-05-09 | Dowa Mining Co., Ltd. | Component device for optical communication |
US6066861A (en) | 1996-09-20 | 2000-05-23 | Siemens Aktiengesellschaft | Wavelength-converting casting composition and its use |
EP1005085A2 (en) | 1998-11-19 | 2000-05-31 | Matsushita Electronics Corporation | Resin-encapsulated electronic device |
JP2000223752A (en) | 1999-01-29 | 2000-08-11 | Nichia Chem Ind Ltd | Optical semiconductor device and its forming method |
US6183100B1 (en) | 1997-10-17 | 2001-02-06 | Truck-Lite Co., Inc. | Light emitting diode 360° warning lamp |
US6259608B1 (en) | 1999-04-05 | 2001-07-10 | Delphi Technologies, Inc. | Conductor pattern for surface mount devices and method therefor |
US6296367B1 (en) | 1999-10-15 | 2001-10-02 | Armament Systems And Procedures, Inc. | Rechargeable flashlight with step-up voltage converter and recharger therefor |
EP1187228A1 (en) | 2000-02-09 | 2002-03-13 | Nippon Leiz Corporation | Light source |
EP1187226A1 (en) | 2000-09-01 | 2002-03-13 | Citizen Electronics Co., Ltd. | Surface-mount type light emitting diode and method of manufacturing same |
US6359236B1 (en) | 1992-07-24 | 2002-03-19 | Tessera, Inc. | Mounting component with leads having polymeric strips |
US6376902B1 (en) | 1997-07-29 | 2002-04-23 | Osram Opto Semiconductors Gmbh & Co. Ohg | Optoelectronic structural element |
US20020061174A1 (en) | 2000-01-21 | 2002-05-23 | Hans Hurt | Electro-optical data transfer module |
US20020123163A1 (en) | 2000-04-24 | 2002-09-05 | Takehiro Fujii | Edge-emitting light-emitting semiconductor device and method of manufacture thereof |
US6454437B1 (en) | 1999-07-28 | 2002-09-24 | William Kelly | Ring lighting |
US20020163001A1 (en) | 2001-05-04 | 2002-11-07 | Shaddock David Mulford | Surface mount light emitting device package and fabrication method |
US20020171911A1 (en) | 2001-05-17 | 2002-11-21 | Mamoru Maegawa | Method for adjusting the hue of the light emitted by a light-emitting diode |
US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
US20020195935A1 (en) | 1999-12-30 | 2002-12-26 | Harald Jager | Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source |
US6610563B1 (en) | 1997-12-15 | 2003-08-26 | Osram Opto Semiconductors Gmbh & Co. Ohg | Surface mounting optoelectronic component and method for producing same |
US6614058B2 (en) | 2001-07-12 | 2003-09-02 | Highlink Technology Corporation | Light emitting semiconductor device with a surface-mounted and flip-chip package structure |
US6624491B2 (en) | 1998-06-30 | 2003-09-23 | Osram Opto Semiconductors Gmbh & Co. | Diode housing |
US20030183852A1 (en) | 2002-03-20 | 2003-10-02 | Sharp Kabushiki Kaisha | Light emitting device and manufacturing method thereof |
US6680490B2 (en) | 2001-06-15 | 2004-01-20 | Toyoda Gosei Co., Ltd. | Light-emitting device |
US6686609B1 (en) | 2002-10-01 | 2004-02-03 | Ultrastar Limited | Package structure of surface mounting led and method of manufacturing the same |
US20040041222A1 (en) | 2002-09-04 | 2004-03-04 | Loh Ban P. | Power surface mount light emitting die package |
US20040047151A1 (en) | 2000-08-23 | 2004-03-11 | Georg Bogner | Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
US6707069B2 (en) | 2001-12-24 | 2004-03-16 | Samsung Electro-Mechanics Co., Ltd | Light emission diode package |
US6710373B2 (en) | 1999-09-27 | 2004-03-23 | Shih-Yi Wang | Means for mounting photoelectric sensing elements, light emitting diodes, or the like |
US20040080939A1 (en) | 2001-04-23 | 2004-04-29 | Jules Braddell | Illuminator |
US20040079957A1 (en) | 2002-09-04 | 2004-04-29 | Andrews Peter Scott | Power surface mount light emitting die package |
US20040126913A1 (en) * | 2002-12-06 | 2004-07-01 | Loh Ban P. | Composite leadframe LED package and method of making the same |
US6770498B2 (en) * | 2002-06-26 | 2004-08-03 | Lingsen Precision Industries, Ltd. | LED package and the process making the same |
US6774401B2 (en) | 2002-07-12 | 2004-08-10 | Stanley Electric Co., Ltd. | Light emitting diode |
US20040227149A1 (en) | 2003-04-30 | 2004-11-18 | Cree, Inc. | High powered light emitter packages with compact optics |
US20040232435A1 (en) | 2003-02-28 | 2004-11-25 | Osram Opto Semiconductors Gmbh | Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body |
US20050023548A1 (en) | 2003-07-31 | 2005-02-03 | Bhat Jerome C. | Mount for semiconductor light emitting device |
CN1581527A (en) | 2003-08-13 | 2005-02-16 | 西铁城电子股份有限公司 | Luminous diode |
CN1591924A (en) | 2003-07-29 | 2005-03-09 | 西铁城电子股份有限公司 | Surface-mounted LED and light emitting device with same |
US20050051789A1 (en) * | 2003-09-09 | 2005-03-10 | Negley Gerald H. | Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same |
US6872585B2 (en) | 2001-09-03 | 2005-03-29 | Toyoda Gosei Co., Ltd. | LED device and manufacturing method thereof |
US6876149B2 (en) | 2002-01-31 | 2005-04-05 | Citizen Electronics Co., Ltd. | Double-face LED device for an electronic instrument |
EP1521313A2 (en) | 2003-10-03 | 2005-04-06 | LumiLeds Lighting U.S., LLC | Integrated reflector cup for a light emitting device mount |
US20050072981A1 (en) | 2002-02-19 | 2005-04-07 | Ryoma Suenaga | Light-emitting device and process for producing thereof |
US20050077535A1 (en) | 2003-10-08 | 2005-04-14 | Joinscan Electronics Co., Ltd | LED and its manufacturing process |
US20050093005A1 (en) | 2002-06-28 | 2005-05-05 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing it |
US20050127377A1 (en) | 2001-11-30 | 2005-06-16 | Karlheinz Arndt | Optoelectronic component |
US6911678B2 (en) | 2003-05-30 | 2005-06-28 | Stanley Electric Co., Ltd. | Glass-sealed light-emitting diode |
US20050152127A1 (en) | 2003-12-19 | 2005-07-14 | Takayuki Kamiya | LED lamp apparatus |
US20050177320A1 (en) | 2003-07-01 | 2005-08-11 | Northwestern University | Gas flow method for detection of preform defects based on transient pressure measurement |
US20050179376A1 (en) | 2004-02-13 | 2005-08-18 | Fung Elizabeth C.L. | Light emitting diode display device |
US6940704B2 (en) | 2001-01-24 | 2005-09-06 | Gelcore, Llc | Semiconductor light emitting device |
US6975011B2 (en) | 1995-09-29 | 2005-12-13 | Osram Gmbh | Optoelectronic semiconductor component having multiple external connections |
US6995510B2 (en) | 2001-12-07 | 2006-02-07 | Hitachi Cable, Ltd. | Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit |
CN1744335A (en) | 2004-08-31 | 2006-03-08 | 斯坦雷电气株式会社 | Surface mount LED |
US20060049477A1 (en) | 2002-11-29 | 2006-03-09 | Karlheinz Arndt | Optoelectronic component |
US7021797B2 (en) | 2003-05-13 | 2006-04-04 | Light Prescriptions Innovators, Llc | Optical device for repositioning and redistributing an LED's light |
US20060108594A1 (en) | 2004-11-11 | 2006-05-25 | Kazuyuki Iwasaki | LED device and method for manufacturing the same |
WO2006054228A2 (en) | 2004-11-18 | 2006-05-26 | Koninklijke Philips Electronics N.V. | Illuminator and method for producing such illuminator |
US7064907B2 (en) | 2003-06-12 | 2006-06-20 | Seiko Epson Corporation | Optical part and its manufacturing method |
US7066626B2 (en) | 2003-04-09 | 2006-06-27 | Citizen Electronics Co., Ltd. | LED lamp |
US20060157828A1 (en) | 2002-09-17 | 2006-07-20 | Osram Opto Semiconductor Gmbh | Leadframe - based housing, leadframe strip, surface - mounted optoelectronic -component, and production method |
US20060220046A1 (en) | 2005-03-04 | 2006-10-05 | Chuan-Pei Yu | Led |
US7119422B2 (en) | 2004-11-15 | 2006-10-10 | Unity Opto Technology Co., Ltd. | Solid-state semiconductor light emitting device |
US7224000B2 (en) * | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
US7285802B2 (en) | 2004-12-21 | 2007-10-23 | 3M Innovative Properties Company | Illumination assembly and method of making same |
US20070269586A1 (en) | 2006-05-17 | 2007-11-22 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing composition |
US20080074032A1 (en) | 2004-04-19 | 2008-03-27 | Tadashi Yano | Method for Fabricating Led Illumination Light Source and Led Illumination Light Source |
USD572210S1 (en) * | 2006-11-01 | 2008-07-01 | Lg Innotek Co., Ltd. | Light-emitting diode (LED) |
USD572670S1 (en) * | 2006-03-30 | 2008-07-08 | Nichia Corporation | Light emitting diode |
USD576574S1 (en) * | 2007-07-17 | 2008-09-09 | Rohm Co., Ltd. | Light emitting diode module |
-
2007
- 2007-10-31 US US29/292,900 patent/USD615504S1/en active Active
Patent Citations (96)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3760237A (en) | 1972-06-21 | 1973-09-18 | Gen Electric | Solid state lamp assembly having conical light director |
US4307297A (en) | 1978-09-12 | 1981-12-22 | U.S. Philips Corporation | Opto-electronic device |
US4511425A (en) | 1983-06-13 | 1985-04-16 | Dennison Manufacturing Company | Heated pad decorator |
US5040868A (en) | 1989-05-31 | 1991-08-20 | Siemens Aktiengesellschaft | Surface-mountable opto-component |
EP1187227A2 (en) | 1989-05-31 | 2002-03-13 | Osram Opto Semiconductors GmbH & Co. OHG | Surface-mountable optical element and method of fabrication |
US5167556A (en) | 1990-07-03 | 1992-12-01 | Siemens Aktiengesellschaft | Method for manufacturing a light emitting diode display means |
US5130761A (en) | 1990-07-17 | 1992-07-14 | Kabushiki Kaisha Toshiba | Led array with reflector and printed circuit board |
US6359236B1 (en) | 1992-07-24 | 2002-03-19 | Tessera, Inc. | Mounting component with leads having polymeric strips |
US5790298A (en) | 1994-05-03 | 1998-08-04 | Gentex Corporation | Method of forming optically transparent seal and seal formed by said method |
US5706177A (en) | 1994-12-24 | 1998-01-06 | Temic Telefunken Microelectronic Gmbh | Multi-terminal surface-mounted electronic device |
US5703401A (en) | 1995-05-10 | 1997-12-30 | U.S. Philips Corporation | Miniature semiconductor device for surface mounting |
US6975011B2 (en) | 1995-09-29 | 2005-12-13 | Osram Gmbh | Optoelectronic semiconductor component having multiple external connections |
US5907151A (en) | 1996-05-24 | 1999-05-25 | Siemens Aktiengesellschaft | Surface mountable optoelectronic transducer and method for its production |
US6061160A (en) * | 1996-05-31 | 2000-05-09 | Dowa Mining Co., Ltd. | Component device for optical communication |
US6066861A (en) | 1996-09-20 | 2000-05-23 | Siemens Aktiengesellschaft | Wavelength-converting casting composition and its use |
US5813753A (en) | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
US20040238930A1 (en) | 1997-07-29 | 2004-12-02 | Osram Opto Semiconductors Gmbh | Surface-mountable light-emitting diode structural element |
US6573580B2 (en) | 1997-07-29 | 2003-06-03 | Osram Opto Semiconductors Gmbh & Co. Ohg | Surface-mountable light-emitting diode structural element |
US6759733B2 (en) | 1997-07-29 | 2004-07-06 | Osram Opto Semiconductors Gmbh | Optoelectric surface-mountable structural element |
US6469321B2 (en) | 1997-07-29 | 2002-10-22 | Osram Opto Semiconductors Gmbh & Co. Ohg | Surface-mountable light-emitting diode structural element |
US6376902B1 (en) | 1997-07-29 | 2002-04-23 | Osram Opto Semiconductors Gmbh & Co. Ohg | Optoelectronic structural element |
US6183100B1 (en) | 1997-10-17 | 2001-02-06 | Truck-Lite Co., Inc. | Light emitting diode 360° warning lamp |
US6946714B2 (en) | 1997-12-15 | 2005-09-20 | Osram Gmbh | Surface mounting optoelectronic component and method for producing same |
US20060022212A1 (en) | 1997-12-15 | 2006-02-02 | Osram Gmbh, A Germany Corporation | Surface mounting optoelectronic component and method for producing same |
US6610563B1 (en) | 1997-12-15 | 2003-08-26 | Osram Opto Semiconductors Gmbh & Co. Ohg | Surface mounting optoelectronic component and method for producing same |
US6858879B2 (en) | 1998-06-30 | 2005-02-22 | Osram Opto Semiconductors Gmbh | Diode housing |
US6624491B2 (en) | 1998-06-30 | 2003-09-23 | Osram Opto Semiconductors Gmbh & Co. | Diode housing |
US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
EP1005085A2 (en) | 1998-11-19 | 2000-05-31 | Matsushita Electronics Corporation | Resin-encapsulated electronic device |
JP2000223752A (en) | 1999-01-29 | 2000-08-11 | Nichia Chem Ind Ltd | Optical semiconductor device and its forming method |
US6259608B1 (en) | 1999-04-05 | 2001-07-10 | Delphi Technologies, Inc. | Conductor pattern for surface mount devices and method therefor |
US6454437B1 (en) | 1999-07-28 | 2002-09-24 | William Kelly | Ring lighting |
US6710373B2 (en) | 1999-09-27 | 2004-03-23 | Shih-Yi Wang | Means for mounting photoelectric sensing elements, light emitting diodes, or the like |
US6296367B1 (en) | 1999-10-15 | 2001-10-02 | Armament Systems And Procedures, Inc. | Rechargeable flashlight with step-up voltage converter and recharger therefor |
US20020195935A1 (en) | 1999-12-30 | 2002-12-26 | Harald Jager | Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source |
US20020061174A1 (en) | 2000-01-21 | 2002-05-23 | Hans Hurt | Electro-optical data transfer module |
EP1187228A1 (en) | 2000-02-09 | 2002-03-13 | Nippon Leiz Corporation | Light source |
US6919586B2 (en) | 2000-04-24 | 2005-07-19 | Rohm Co., Ltd. | Side-emission type semiconductor light-emitting device and manufacturing method thereof |
US20020123163A1 (en) | 2000-04-24 | 2002-09-05 | Takehiro Fujii | Edge-emitting light-emitting semiconductor device and method of manufacture thereof |
US20040047151A1 (en) | 2000-08-23 | 2004-03-11 | Georg Bogner | Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
EP1187226A1 (en) | 2000-09-01 | 2002-03-13 | Citizen Electronics Co., Ltd. | Surface-mount type light emitting diode and method of manufacturing same |
US6940704B2 (en) | 2001-01-24 | 2005-09-06 | Gelcore, Llc | Semiconductor light emitting device |
US20040080939A1 (en) | 2001-04-23 | 2004-04-29 | Jules Braddell | Illuminator |
US20020163001A1 (en) | 2001-05-04 | 2002-11-07 | Shaddock David Mulford | Surface mount light emitting device package and fabrication method |
US20020171911A1 (en) | 2001-05-17 | 2002-11-21 | Mamoru Maegawa | Method for adjusting the hue of the light emitted by a light-emitting diode |
US6680490B2 (en) | 2001-06-15 | 2004-01-20 | Toyoda Gosei Co., Ltd. | Light-emitting device |
US6614058B2 (en) | 2001-07-12 | 2003-09-02 | Highlink Technology Corporation | Light emitting semiconductor device with a surface-mounted and flip-chip package structure |
US6872585B2 (en) | 2001-09-03 | 2005-03-29 | Toyoda Gosei Co., Ltd. | LED device and manufacturing method thereof |
US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
US20050127377A1 (en) | 2001-11-30 | 2005-06-16 | Karlheinz Arndt | Optoelectronic component |
US6995510B2 (en) | 2001-12-07 | 2006-02-07 | Hitachi Cable, Ltd. | Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit |
US6707069B2 (en) | 2001-12-24 | 2004-03-16 | Samsung Electro-Mechanics Co., Ltd | Light emission diode package |
US6876149B2 (en) | 2002-01-31 | 2005-04-05 | Citizen Electronics Co., Ltd. | Double-face LED device for an electronic instrument |
US20050072981A1 (en) | 2002-02-19 | 2005-04-07 | Ryoma Suenaga | Light-emitting device and process for producing thereof |
US20030183852A1 (en) | 2002-03-20 | 2003-10-02 | Sharp Kabushiki Kaisha | Light emitting device and manufacturing method thereof |
US6770498B2 (en) * | 2002-06-26 | 2004-08-03 | Lingsen Precision Industries, Ltd. | LED package and the process making the same |
US6900511B2 (en) | 2002-06-28 | 2005-05-31 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing it |
US20050093005A1 (en) | 2002-06-28 | 2005-05-05 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing it |
US6774401B2 (en) | 2002-07-12 | 2004-08-10 | Stanley Electric Co., Ltd. | Light emitting diode |
US7224000B2 (en) * | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
US20040041222A1 (en) | 2002-09-04 | 2004-03-04 | Loh Ban P. | Power surface mount light emitting die package |
CN1679168A (en) | 2002-09-04 | 2005-10-05 | 克立公司 | Power surface mount light emitting die package |
US20040079957A1 (en) | 2002-09-04 | 2004-04-29 | Andrews Peter Scott | Power surface mount light emitting die package |
US7102213B2 (en) | 2002-09-17 | 2006-09-05 | Osram Opto Semiconductors Gmbh | Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method |
US20060157828A1 (en) | 2002-09-17 | 2006-07-20 | Osram Opto Semiconductor Gmbh | Leadframe - based housing, leadframe strip, surface - mounted optoelectronic -component, and production method |
US6686609B1 (en) | 2002-10-01 | 2004-02-03 | Ultrastar Limited | Package structure of surface mounting led and method of manufacturing the same |
US20060049477A1 (en) | 2002-11-29 | 2006-03-09 | Karlheinz Arndt | Optoelectronic component |
US20040126913A1 (en) * | 2002-12-06 | 2004-07-01 | Loh Ban P. | Composite leadframe LED package and method of making the same |
US20040232435A1 (en) | 2003-02-28 | 2004-11-25 | Osram Opto Semiconductors Gmbh | Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body |
US7066626B2 (en) | 2003-04-09 | 2006-06-27 | Citizen Electronics Co., Ltd. | LED lamp |
US20040227149A1 (en) | 2003-04-30 | 2004-11-18 | Cree, Inc. | High powered light emitter packages with compact optics |
US7021797B2 (en) | 2003-05-13 | 2006-04-04 | Light Prescriptions Innovators, Llc | Optical device for repositioning and redistributing an LED's light |
US6911678B2 (en) | 2003-05-30 | 2005-06-28 | Stanley Electric Co., Ltd. | Glass-sealed light-emitting diode |
US7064907B2 (en) | 2003-06-12 | 2006-06-20 | Seiko Epson Corporation | Optical part and its manufacturing method |
US20050177320A1 (en) | 2003-07-01 | 2005-08-11 | Northwestern University | Gas flow method for detection of preform defects based on transient pressure measurement |
CN1591924A (en) | 2003-07-29 | 2005-03-09 | 西铁城电子股份有限公司 | Surface-mounted LED and light emitting device with same |
US20050023548A1 (en) | 2003-07-31 | 2005-02-03 | Bhat Jerome C. | Mount for semiconductor light emitting device |
CN1581527A (en) | 2003-08-13 | 2005-02-16 | 西铁城电子股份有限公司 | Luminous diode |
US20050051789A1 (en) * | 2003-09-09 | 2005-03-10 | Negley Gerald H. | Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same |
EP1521313A2 (en) | 2003-10-03 | 2005-04-06 | LumiLeds Lighting U.S., LLC | Integrated reflector cup for a light emitting device mount |
US20050077535A1 (en) | 2003-10-08 | 2005-04-14 | Joinscan Electronics Co., Ltd | LED and its manufacturing process |
WO2005043627A1 (en) | 2003-10-22 | 2005-05-12 | Cree, Inc. | Power surface mount light emitting die package |
US20050152127A1 (en) | 2003-12-19 | 2005-07-14 | Takayuki Kamiya | LED lamp apparatus |
US20050179376A1 (en) | 2004-02-13 | 2005-08-18 | Fung Elizabeth C.L. | Light emitting diode display device |
US20080074032A1 (en) | 2004-04-19 | 2008-03-27 | Tadashi Yano | Method for Fabricating Led Illumination Light Source and Led Illumination Light Source |
CN1744335A (en) | 2004-08-31 | 2006-03-08 | 斯坦雷电气株式会社 | Surface mount LED |
US20060108594A1 (en) | 2004-11-11 | 2006-05-25 | Kazuyuki Iwasaki | LED device and method for manufacturing the same |
US7119422B2 (en) | 2004-11-15 | 2006-10-10 | Unity Opto Technology Co., Ltd. | Solid-state semiconductor light emitting device |
WO2006054228A2 (en) | 2004-11-18 | 2006-05-26 | Koninklijke Philips Electronics N.V. | Illuminator and method for producing such illuminator |
WO2006054228A3 (en) | 2004-11-18 | 2006-08-03 | Koninkl Philips Electronics Nv | Illuminator and method for producing such illuminator |
US7285802B2 (en) | 2004-12-21 | 2007-10-23 | 3M Innovative Properties Company | Illumination assembly and method of making same |
US20060220046A1 (en) | 2005-03-04 | 2006-10-05 | Chuan-Pei Yu | Led |
USD572670S1 (en) * | 2006-03-30 | 2008-07-08 | Nichia Corporation | Light emitting diode |
US20070269586A1 (en) | 2006-05-17 | 2007-11-22 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing composition |
USD572210S1 (en) * | 2006-11-01 | 2008-07-01 | Lg Innotek Co., Ltd. | Light-emitting diode (LED) |
USD576574S1 (en) * | 2007-07-17 | 2008-09-09 | Rohm Co., Ltd. | Light emitting diode module |
Non-Patent Citations (4)
Title |
---|
JP 2001 060072A , Abstract, Matsushita Electric Ind. Co Ltd., March 6, 222001. |
Kim J.K et al. "Strongly Enhanced Phosphor Efficiency in GaInN White Light-Emitting Diodes Using Remote Phosphor Configuration and Diffuse Reflector Cup" Japanese Journal of Applied Physics, Japan Society of Applied Physics, Tokyo, JP, vol. 44, No. 20-23, Jan. 1, 2005 XP-001236966, pp. 649-651. |
Nicha Corp., White LED Part No. NSPW312BS, Specification for Nichia White Led, Model NSPW312BS. Jan. 14, 2004. |
Nichia Corp. White LED Part No. NSPW300BS, Specification for Nichia White LED , Model NSPW300BS., Jan. 14, 2004. |
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